CN209562906U - PTFE high frequency dual platen - Google Patents

PTFE high frequency dual platen Download PDF

Info

Publication number
CN209562906U
CN209562906U CN201821759855.2U CN201821759855U CN209562906U CN 209562906 U CN209562906 U CN 209562906U CN 201821759855 U CN201821759855 U CN 201821759855U CN 209562906 U CN209562906 U CN 209562906U
Authority
CN
China
Prior art keywords
layer
substrate
copper
aluminium foil
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821759855.2U
Other languages
Chinese (zh)
Inventor
唐寿林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Ronghui Electronics Co Ltd
Original Assignee
Jiangxi Ronghui Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Ronghui Electronics Co Ltd filed Critical Jiangxi Ronghui Electronics Co Ltd
Priority to CN201821759855.2U priority Critical patent/CN209562906U/en
Application granted granted Critical
Publication of CN209562906U publication Critical patent/CN209562906U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses PTFE high frequency dual platens, including substrate, printed circuit is printed on the substrate, the inner end of the printed circuit is installed with copper post, circular hole is equipped in the substrate, it include layers of copper, aluminium foil, Polycarbonate Layer, rock wool fibers layer and PTFE insulating layer, the outer surface adhered aluminium foil of the layers of copper inside the substrate in the copper post insertion circular hole.Aluminium foil is with respect to layers of copper, its ductility is more preferable, it is not easy to break in the bent state, the inner surface of the outer surface bonding Polycarbonate Layer of aluminium foil, Polycarbonate Layer itself has the characteristics that intensity is high, hardness is big, unpliant, so that side intensity is more preferable in substrate, the inner surface of the outer end face bonding rock wool fibers layer of Polycarbonate Layer, the outer surface for being attached to Polycarbonate Layer is taken off by the fiber of rock wool fibers layer, increase the resistance to fracture of Polycarbonate Layer, then make monolith substrate intensity higher, solve the problems, such as that integral strength is not high.

Description

PTFE high frequency dual platen
Technical field
The utility model relates to PTFE high frequency dual platens.
Background technique
Dual platen is the two-sided printed circuit board for being all covered with copper for including top layer and bottom, is most common and most general electricity There is conductive pattern on road plate, the two sides of insulating substrate, and the electrical connection on two sides mainly passes through via hole or pad is attached, because For two sides can cabling, greatly reduce the difficulty of wiring, therefore be widely adopted.
Existing PTFE is the English abbreviation of polytetrafluoroethylene (PTFE), has fine toughness and insulating properties, existing PTFE high frequency Dual platen after outer PTFE layers of the side bonds of layers of copper using pressing, and existing shortcoming has: this dual platen actual strength is not It is enough, it is easy to be broken under external force.
Utility model content
The purpose of this utility model is to provide PTFE high frequency dual platens, to solve entirety mentioned above in the background art The not high problem of intensity.
To achieve the above object, the utility model provides the following technical solutions: PTFE high frequency dual platen, including substrate, institute It states and is printed with printed circuit on substrate, the inner end of the printed circuit is installed with copper post, is equipped with circular hole, the copper in the substrate Column is inserted into circular hole, includes layers of copper, aluminium foil, Polycarbonate Layer, rock wool fibers layer and PTFE insulating layer, institute inside the substrate The outer surface adhered aluminium foil of layers of copper is stated, the outer surface of the aluminium foil is pasted with rock wool fibers layer, the appearance of the rock wool fibers layer Bread wraps up in PTFE insulating layer.
Preferably, the layers of copper with a thickness of 1 millimeter, aluminium foil with a thickness of 0.3 millimeter.
Preferably, the inner surface of the outer surface bonding Polycarbonate Layer of the aluminium foil, the outer end face of Polycarbonate Layer are viscous Connect the inner surface of rock wool fibers layer.
Compared with prior art, the utility model has the beneficial effects that layers of copper and aluminium foil have good thermal conductivity, can incite somebody to action Heat derives inside substrate, and aluminium foil is with respect to layers of copper, ductility is more preferable, not easy to break in the bent state, aluminium foil it is outer Surface is bonded the inner surface of Polycarbonate Layer, and Polycarbonate Layer itself has the characteristics that intensity is high, hardness is big, unpliant, makes It is more preferable to obtain side intensity in substrate, protects layers of copper and aluminium foil, the outer end face of Polycarbonate Layer is bonded the inner surface of rock wool fibers layer, The outer surface for being attached to Polycarbonate Layer is taken off by the fiber of rock wool fibers layer, is increased the resistance to fracture of Polycarbonate Layer, is then made It is higher to obtain monolith substrate intensity, solves the problems, such as that integral strength is not high.
Detailed description of the invention
Fig. 1 is the main view local cutting schematic diagram of the utility model;
Fig. 2 is the schematic top plan view of the utility model.
In figure: 1 substrate, 2 printed circuits, 3 copper posts, 4 circular holes, 5 layers of copper, 6 aluminium foils, 7 Polycarbonate Layers, 8 rock wool fibers layers, 9 PTFE insulating layers.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the present invention, it should be understood that term " longitudinal direction ", " transverse direction ", "upper", "lower", " preceding ", The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" be based on Orientation or positional relationship shown in the drawings is merely for convenience of description the utility model, rather than the dress of indication or suggestion meaning It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model Limitation.
Fig. 1 and Fig. 2 are please referred to, the utility model provides a kind of technical solution: PTFE high frequency dual platen, including substrate 1, base It is printed with printed circuit 2 on plate 1, the inner end of resin glue sticking printed circuit 2, the inner end installing of printed circuit 2 are used on substrate 1 There is copper post 3, the inner end of printed circuit 2 is connected the upper surface and lower end surface of copper post 3 by the way of welding, is equipped with circle in substrate 1 Hole 4, copper post 3 are inserted into circular hole 4, and the inner end of copper post 3 connects the top and bottom of layers of copper 5 by the way of welding, passes through layers of copper 5 With the connection of copper post 3 so that the printed circuit 2 of upper and lower side is electrically connected.
It refering to fig. 1, include layers of copper 5, aluminium foil 6, Polycarbonate Layer 7, rock wool fibers layer 8 and PTFE insulation inside substrate 1 Layer 9, the outer surface adhered aluminium foil 6 of layers of copper 5, layers of copper 5 with a thickness of 1 millimeter, aluminium foil 6 with a thickness of 0.3 millimeter, layers of copper 5 and aluminium Foil 6 have good thermal conductivity, can by heat derives substrate 1 inside, and aluminium foil 6 relatively layers of copper 5, ductility is more preferable, In Not easy to break under bending state, the inner surface of the outer surface bonding Polycarbonate Layer 7 of aluminium foil 6, Polycarbonate Layer 7 itself has strong Degree is high, hardness is big, unpliant feature, so that side intensity is more preferable in substrate 1, protects layers of copper 5 and aluminium foil 6, Polycarbonate Layer 7 Outer end face bonding rock wool fibers layer 8 inner surface, taken off by the fiber of rock wool fibers layer 8 and be attached to the outer of Polycarbonate Layer 7 Surface, increases the resistance to fracture of Polycarbonate Layer 7, and PTFE insulating layer 9 has good insulating properties, prevents dual platen upper and lower end face Direct conduction, the outer surface of aluminium foil 6 are pasted with rock wool fibers layer 8, and the outer surface of rock wool fibers layer 8 is connected by the way of bonding Wrap up PTFE insulating layer 9 in the outer surface of the inner surface of PTFE insulating layer 9, rock wool fibers layer 8.
When the utility model is specifically implemented: layers of copper 5 and aluminium foil 6 have good thermal conductivity, it can be by the heat inside substrate 1 Amount export, and the opposite layers of copper 5 of aluminium foil 6, ductility is more preferable, and not easy to break in the bent state, the outer surface bonding of aluminium foil 6 is poly- The inner surface of basis 7, Polycarbonate Layer 7 itself has the characteristics that intensity is high, hardness is big, unpliant, so that in substrate 1 Side intensity is more preferable, protects layers of copper 5 and aluminium foil 6, and the inner surface of the outer end face bonding rock wool fibers layer 8 of Polycarbonate Layer 7 passes through The fiber of rock wool fibers layer 8 takes off the outer surface for being attached to Polycarbonate Layer 7, increases the resistance to fracture of Polycarbonate Layer 7, then makes 1 intensity of monolith substrate is higher.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (3)

1.PTFE high frequency dual platen, including substrate (1), it is characterised in that: be printed with printed circuit (2), institute on the substrate (1) The inner end for stating printed circuit (2) is installed with copper post (3), is equipped with circular hole (4) in the substrate (1), and the copper post (3) is inserted into circular hole (4) in, it includes layers of copper (5), aluminium foil (6), Polycarbonate Layer (7), rock wool fibers layer (8) and PTFE that the substrate (1) is internal The outer surface of insulating layer (9), the outer surface adhered aluminium foil (6) of the layers of copper (5), the aluminium foil (6) is pasted with rock wool fibers layer (8), PTFE insulating layer (9) are wrapped up in the outer surface of the rock wool fibers layer (8).
2. PTFE high frequency dual platen according to claim 1, it is characterised in that: the layers of copper (5) with a thickness of 1 millimeter, Aluminium foil (6) with a thickness of 0.3 millimeter.
3. PTFE high frequency dual platen according to claim 2, it is characterised in that: the outer surface bonding of the aluminium foil (6) is poly- The inner surface of basis (7), the inner surface of outer end face bonding rock wool fibers layer (8) of Polycarbonate Layer (7).
CN201821759855.2U 2018-10-29 2018-10-29 PTFE high frequency dual platen Active CN209562906U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821759855.2U CN209562906U (en) 2018-10-29 2018-10-29 PTFE high frequency dual platen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821759855.2U CN209562906U (en) 2018-10-29 2018-10-29 PTFE high frequency dual platen

Publications (1)

Publication Number Publication Date
CN209562906U true CN209562906U (en) 2019-10-29

Family

ID=68299188

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821759855.2U Active CN209562906U (en) 2018-10-29 2018-10-29 PTFE high frequency dual platen

Country Status (1)

Country Link
CN (1) CN209562906U (en)

Similar Documents

Publication Publication Date Title
WO2009057332A1 (en) Circuit connecting method
TW200644755A (en) Reverse build-up structure of circuit board
CN102543894B (en) Electrical connection pad structure and integrated circuit comprising a plurality of electrical connection pad structures
CN201234406Y (en) Flexible printed circuit board
CN101413655A (en) Heat radiation structure of LED lamp backlight device
CN203072249U (en) Aluminum substrate used for mounting LED lamps
CN209562906U (en) PTFE high frequency dual platen
CN102155634A (en) LED (light emitting diode) lighting module and method for manufacturing LED lighting module
CN206790781U (en) Printed substrate is with covering copper composite plate
CN207869495U (en) Circuit board assemblies
CN202262062U (en) Circuit board silver paste pouring hole conduction structure
CN101483210A (en) Substrate construction for LED
CN202178915U (en) Blind hole double-face heat conducting circuit board
CN213520335U (en) Flat electric connection element and vehicle window glass assembly
CN210519103U (en) Double-sided circuit board
CN107071944A (en) A kind of electrical heating face equipment and preparation method thereof
CN207604001U (en) FPC plates and the electronic equipment with the FPC plates
CN208490034U (en) A kind of soft or hard combination core plate of projector
CN202043385U (en) Modified LED welding structure
CN218735154U (en) Connector for circuit board and circuit board
CN100461982C (en) Circuit board
CN205320368U (en) Flexible circuit board
CN218514581U (en) High-density multilayer ultrahigh heat-conducting metal flexible circuit board
CN110557904A (en) Double-sided circuit board and conduction method thereof
CN218301794U (en) Prevent hot pressing tool bit that conductive particle does not open

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant