CN209525419U - Ageing radiator and aging test system - Google Patents
Ageing radiator and aging test system Download PDFInfo
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- CN209525419U CN209525419U CN201822140726.1U CN201822140726U CN209525419U CN 209525419 U CN209525419 U CN 209525419U CN 201822140726 U CN201822140726 U CN 201822140726U CN 209525419 U CN209525419 U CN 209525419U
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- radiator
- conductive insulating
- heat conductive
- ageing
- insulating plate
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Abstract
The utility model discloses a kind of ageing radiators and a kind of aging test system for being provided with the ageing radiator.The ageing radiator includes radiator and heat conductive insulating plate, and heat conductive insulating plate is used for support target devices, and radiator is set to the lower section of heat conductive insulating plate.The heat conductive insulating plate preferably uses ceramic copper-clad plate.Since heat conductive insulating plate has insulation effect, radiator and aging board will not be enabled to be connected, so that the ageing radiator can be set to the lower section of target devices.During test, the heating region of target devices directly transfers heat to heat conductive insulating plate, and then passes to radiator, since heat conductive insulating plate and radiator have good heat dissipation effect, so as to achieve the purpose that improve radiating efficiency.Compared with the scheme of longer heat dissipation path in the prior art, the utility model has the beneficial effects such as heat transfer direction is controllable, heat conduction path is shorter, path thermal resistance is smaller, radiating efficiency is higher.
Description
Technical field
The utility model relates to power semi-conductor discrete device screening test technical field, in particular to a kind of ageing heat dissipation dress
It sets and a kind of aging test system for being provided with the ageing radiator.
Background technique
In semi-conductor discrete device field, screening test is always the work of the most important thing, and aging test is screening test
In one ring of key.
Referring to Fig. 1, in the prior art, the ageing device for carrying out aging test to semi-conductor discrete device (or is
Aging test platform, aging test system) in, aging board and its conducting system (including spring leaf 04) are respectively positioned on semiconductor deviding device
Below part, and it is conductively connected with it；Radiator 03 is generally metal device, in order to avoid radiator 03 and aging board and its
Conduction is generated between conducting system, radiator 03 is generally all set to the top of aging test system, i.e., by radiator
03 is arranged on upper cover plate 01.
But because the power chip in semi-conductor discrete device is all welded on device outer case bottom surface, the hot-zone of entire device
Domain concentrates on the corresponding chip bonding pad of outer casing bottom, and during test, the radiator that the heat of generation is transmitted to top is needed
To pass through certain path (including air, side wall 02 and upper cover plate 01)；Moreover, upper cover plate 01 is generally all arranged very thin
(0.25mm), surrounding side wall 02 are also all arranged relatively thin (0.5mm).To which radiator 03 be arranged on upper cover plate, have and dissipate
The limitations such as hot path length, low efficiency, device stability difference.
To solve the above problems, the solution used in the prior art includes: the heat dissipation area for increasing radiator；Make
Common constructed of aluminium radiator is substituted with the good steel structure radiator of thermal conductivity.But the increase of heat dissipation area is by upper cover
Plate suqare influences, and the part heat dissipation effect that cannot effectively contact is very poor；Steel structure radiator cost is high.
Also, in order to solve the heat dissipation problem of certain devices during the test, many producers, which take, reduces ageing shell temperature
Method carry out aging test, but in this case, also reduce screening test stress.
Therefore, the radiating efficiency during aging test how is improved, and improves the stability of radiator, is current sheet
Field technical staff technical problem urgently to be resolved.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of aging test system and its radiator, Neng Gouti
Radiating efficiency during high aging test.
To achieve the above object, the utility model provides the following technical solutions:
A kind of ageing radiator, including radiator and heat conductive insulating plate,
The heat conductive insulating plate is used for support target devices,
The radiator is set to the lower section of the heat conductive insulating plate.
Preferably, in above-mentioned ageing radiator, the heat conductive insulating plate is ceramic copper-clad plate, the ceramic copper-clad plate
Including ceramic substrate and copper portion is covered,
The radiator is located at the lower section of the ceramic substrate,
The top covered copper portion and be located at the ceramic substrate, for the conducting wire and the target devices with the aging board
Electrode connection.
Preferably, in above-mentioned ageing radiator, the thickness for covering copper portion is greater than or equal to 0.3mm；
Be provided on the ceramic substrate it is multiple by the lying copper region covering copper portion and constituting, between the different lying copper regions
Gap is constituted, is provided with temperature probe in the gap.
Preferably, in above-mentioned ageing radiator, by thermally conductive exhausted between the radiator and the heat conductive insulating plate
Edge adhesive film bonding.
Preferably, in above-mentioned ageing radiator, the radiator includes horizontal bearing plate and is set to the level
Multiple cooling fins below loading plate,
The top of the horizontal bearing plate is arranged in the heat conductive insulating plate.
Preferably, in above-mentioned ageing radiator, the cooling fin includes:
Multiple first cooling fins；
The second cooling fin for fixing and supporting, second cooling fin are mounted on the aging board.
A kind of aging test system, including aging board, and ageing radiator as described above.
It preferably, further include the fixed dress for being positioned to the target devices in above-mentioned aging test system
It sets, the fixed device includes fixed beam and elastic mechanism, and the fixed beam passes through the elastic mechanism for the target devices
It is fitted on the heat conductive insulating plate.
Preferably, in above-mentioned aging test system, the elastic mechanism includes:
Support rod, the lower end of the support rod are connect with the radiator, and the fixed beam is set on the support rod；
Elastic component, the elastic component are located between the upper end limited cap and the fixed beam of the support rod.
Preferably, in above-mentioned aging test system, the radiator and/or the fixed beam are duralumin material.
It can be seen from the above technical proposal that ageing radiator provided by the utility model and aging test system, by
There is insulation effect in heat conductive insulating plate, radiator and aging board will not be enabled to be connected, so that the ageing radiator can be arranged
In the lower section of target devices.During test, the heating region (i.e. the corresponding chip bonding pad of outer casing bottom) of target devices is direct
Heat conductive insulating plate is transferred heat to, and then passes to radiator, since heat conductive insulating plate and radiator have good heat dissipation
Effect, so as to achieve the purpose that improve radiating efficiency.Compared with the scheme of longer heat dissipation path in the prior art, this is practical
The ageing radiator and aging test system of novel offer, with heat transfer direction is controllable, heat conduction path is shorter, path is hot
Hinder the beneficial effects such as smaller, radiating efficiency is higher.
Also, increases for certain class power-type switching and rectifying diode current flow electric current or pull-down current with environment temperature and be in
The target devices of existing special increase trend can be with using ageing radiator provided by the utility model and aging test system
Heat dissipation problem is solved, guarantees that old mine pit stress meets army's mark requirement in screening test.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of mounting structure schematic diagram of the ageing radiator in the prior art in aging test system；
Fig. 2 is mounting structure signal of the ageing radiator provided by the embodiment of the utility model in aging test system
Figure；
Fig. 3 is the top view of ceramic copper-clad plate provided by the embodiment of the utility model；
Fig. 4 is installation knot of the target devices in aging test system during test provided by the embodiment of the utility model
Structure schematic diagram.
Wherein:
01- upper cover plate, 02- side wall, 03- radiator, 04- spring leaf；1- radiator, the fixed device of 2-, 3- are thermally conductive absolutely
Edge adhesive film, 4- heat conductive insulating plate, 5- target devices, the first cooling fin of 101-, the second cooling fin of 102-, 103- horizontal bearing
Plate, 201- support rod, 202- fixed beam, 203- elastic component, 401- ceramic substrate, 402- cover copper portion.
Specific embodiment
The utility model discloses a kind of aging test system and its radiator, during can be improved aging test
Radiating efficiency.
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please see Fig. 2 to Fig. 4, Fig. 2 is ageing radiator provided by the embodiment of the utility model in aging test system
In mounting structure schematic diagram, Fig. 3 is the top view of ceramic copper-clad plate provided by the embodiment of the utility model, and Fig. 4 is that this is practical
Mounting structure schematic diagram of the target devices in aging test system during the test that new embodiment provides.
Ageing radiator provided by the embodiment of the utility model, including radiator 1 and heat conductive insulating plate 4, heat conductive insulating
Plate 4 is used for the target devices 5 that support is tested, and radiator 1 is set to the lower section of heat conductive insulating plate 4.When test, target devices 5
Electrode and aging board conducting wire electrical connection.
Wherein, aging test includes power ageing and high temperature reverse bias test.Target devices 5 refer to the device tested, tool
Body refers to power semi-conductor discrete device, such as power-type switching and rectifying diode SMD ceramic package device.But do not limit to
In this, target devices 5 can also be other devices for needing to carry out aging test.The utility model is not especially limited this.
It can be seen from the above technical proposal that ageing radiator provided by the embodiment of the utility model, due to thermally conductive exhausted
Listrium 4 has insulation effect, radiator 1 and aging board will not be enabled to be connected, so that the ageing radiator can be set to target
The lower section of device 5.During test, the heating region (i.e. the corresponding chip bonding pad of outer casing bottom) of target devices 5 directly will be warm
Amount passes to heat conductive insulating plate 4, and then passes to radiator 1, since heat conductive insulating plate 4 and radiator 1 have good heat dissipation
Effect, so as to achieve the purpose that improve radiating efficiency.Compared with the scheme of longer heat dissipation path in the prior art, this is practical
The ageing radiator that new embodiment provides, have heat transfer direction is controllable, heat conduction path is shorter, path thermal resistance is smaller,
The beneficial effects such as radiating efficiency is higher.
Also, increases for certain class power-type switching and rectifying diode current flow electric current or pull-down current with environment temperature and be in
The target devices of existing special increase trend can solve heat dissipation using ageing radiator provided by the embodiment of the utility model
Problem guarantees that old mine pit stress meets army's mark requirement in screening test.
In a particular embodiment, above-mentioned heat conductive insulating plate 4 is ceramic copper-clad plate, and ceramic copper-clad plate includes ceramic substrate 401
With cover copper portion 402.Radiator 1 is located at the lower section of ceramic substrate 401；The top that copper portion 402 is located at ceramic substrate 401 is covered, is used for
It is connect with the electrode of the conducting wire of aging board and target devices 5.
Specifically, ceramic substrate 401 is aluminium oxide (such as aluminum oxide), or can also use aluminium nitride ceramics etc.
The insulating materials of other high thermal conductivities；Covering copper portion 402 is high-purity oxygen-free copper, and copper plating nickel on surface is gold-plated again.
Preferably, be provided with multiple lying copper regions constituted by covering copper portion 402 on ceramic substrate 401, different lying copper regions it
Between constitute gap, be provided with temperature probe in gap.Specifically, the temperature probe is by adhesive film (preferably using 506 bondings
Film) it is adhesively fixed.Thickness >=the 0.3mm in copper portion 402, the i.e. depth >=0.3mm in gap are covered, to guarantee that temperature probe acquires
Highest shell temperature on to target devices 5.And temperature probe in the prior art is generally all disposed on the side wall of pilot system,
Obtained temperature and the highest shell temperature difference on target devices 5 are measured away from larger, and is interfered vulnerable to external environment, it is repeatable compared with
Difference causes biggish experimental error.
In a particular embodiment, it is bonded between radiator 1 and heat conductive insulating plate 4 by heat conductive insulating adhesive film 3.It is thermally conductive exhausted
Edge adhesive film 3 preferably uses 506 adhesive films, and thermal conductivity is good, and adhesive strength is high, there is certain elasticity.But not limited to this, at it
Other adhesive films of equal performance can also be used in its specific embodiment, the utility model is not especially limited this.
In a particular embodiment, radiator 1 includes horizontal bearing plate 103 and is set to more below horizontal bearing plate 103
The top of horizontal bearing plate 103 is arranged in a cooling fin, heat conductive insulating plate 4.
Preferably, the cooling fin in radiator 1 includes multiple first cooling fins 101, and for fixing and supporting
Two cooling fins 102, the second cooling fin 102 are mounted on aging board.Such as: there are two the settings of the second cooling fin 102, and each second
The bottom of cooling fin 102 is respectively set there are two screw fixed column, is assembled with facilitating with aging board, and versatility is good.Specific implementation
When, for the installation fixed form between the second cooling fin 102 and aging board there are many selection, the utility model does not limit this specifically
It is fixed.
The utility model specific embodiment additionally provides a kind of aging test system, which includes ageing
Plate and the above ageing radiator.
It further, further include the fixation device 2 for being positioned to target devices 5 in the aging test system.
Preferably, fixed device 2 includes fixed beam 202 and elastic mechanism, and fixed beam 202 passes through elastic mechanism for object machine
Part 5 presses on heat conductive insulating plate 4.
Specifically, as shown in figures 1 and 3, elastic mechanism includes support rod 201 and elastic component 203 (preferably using spring).
The lower end of support rod 201 is connect with radiator 1, and fixed beam 202 is set on support rod 201；Elastic component 203 is located at support rod
Between 201 upper end limited cap and fixed beam 202.
Specifically, there are two the settings of support rod 201, there are two the screws for installing support rod 201 for setting on radiator 1
Hole.
When test, guarantee that target devices 5 are fixed on covering for ceramic copper-clad plate under suitable pressure by fixed device 2
Copper portion 402, and facilitate pick-and-place.
In a particular embodiment, radiator 1 and fixed beam 202 are all made of duralumin material.It, can be with other than duralumin material
Using the thermally conductive and suitably other materials of hardness, the utility model is not especially limited this.
Wherein, duralumin refer in aluminium alloy using Cu as main alloy element a kind of aluminium alloy (containing 2.2-4.9%Cu,
0.2-1.8%Mg, 0.3-0.9%Mn, a small amount of silicon, rest part are aluminium), code name 2XXX, there are commonly 2Al1,2Al2 etc..
When using aging test system provided by the embodiment of the utility model: aging board conducting wire and covering in ceramic copper-clad plate
Copper portion 402 forms electric interconnection；Target devices 5, which are placed on, to be covered in copper portion 402, and fixed using fixed device 2, at this point, target
Copper portion 402 of covering in device 5 and ceramic copper-clad plate forms electric interconnection, and then forms electric interconnection with aging board.
During test, 5 bottom hot zone of target devices is directly contacted with copper portion 402 is covered, so that heat successively be transmitted
To copper portion 402, ceramic substrate 401, heat conductive insulating adhesive film 3, radiator 1 is covered, effective heat dissipation channel is formed.Entire heat dissipation is logical
Road is thick and short, and thermal resistance is small, and the heat dissipation capacity in the unit time is far longer than the calorific value of target devices 5, can effectively meet target
The cooling requirements of device 5 guarantee that old mine pit stress meets army's mark requirement in screening test.
It is special, increase for certain class power-type switching and rectifying diode current flow electric current or pull-down current with environment temperature and
The device of special increase trend is presented, traditional tooling not can effectively solve heat dissipation problem, be provided using the utility model embodiment
Aging test system after, the available solution of heat dissipation problem, guarantee screening test in old mine pit stress meet army mark require.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (10)
1. a kind of ageing radiator, which is characterized in that including radiator (1) and heat conductive insulating plate (4),
The heat conductive insulating plate (4) is used for support target devices (5),
The radiator (1) is set to the lower section of the heat conductive insulating plate (4).
2. ageing radiator according to claim 1, which is characterized in that the heat conductive insulating plate (4) is ceramic copper-clad
Plate, the ceramic copper-clad plate include ceramic substrate (401) and cover copper portion (402),
The radiator (1) is located at the lower section of the ceramic substrate (401),
The top covered copper portion (402) and be located at the ceramic substrate (401), for the conducting wire and the object machine with aging board
The electrode of part (5) connects.
3. ageing radiator according to claim 2, which is characterized in that the thickness for covering copper portion (402) be greater than or
Equal to 0.3mm；
Be provided on the ceramic substrate (401) it is multiple by the lying copper region covering copper portion (402) and constituting, it is different described to cover copper
Gap is constituted between area, is provided with temperature probe in the gap.
4. ageing radiator according to any one of claims 1 to 3, which is characterized in that the radiator (1) and described
It is bonded between heat conductive insulating plate (4) by heat conductive insulating adhesive film (3).
5. ageing radiator according to any one of claims 1 to 3, which is characterized in that the radiator (1) includes water
Flat loading plate (103) and the multiple cooling fins being set to below the horizontal bearing plate (103),
The heat conductive insulating plate (4) is arranged in the top of the horizontal bearing plate (103).
6. ageing radiator according to claim 5, which is characterized in that the cooling fin includes:
Multiple first cooling fins (101)；
The second cooling fin (102) for fixing and supporting, second cooling fin (102) are mounted on aging board.
7. a kind of aging test system, which is characterized in that as claimed in any one of claims 1 to 6 old including aging board, and such as
Refine radiator.
8. aging test system according to claim 7, which is characterized in that further include for the target devices (5)
The fixation device (2) positioned, the fixed device (2) includes fixed beam (202) and elastic mechanism, the fixed beam
(202) target devices (5) are fitted on the heat conductive insulating plate (4) by the elastic mechanism.
9. aging test system according to claim 8, which is characterized in that the elastic mechanism includes:
The lower end of support rod (201), the support rod (201) is connect with the radiator (1), and the fixed beam (202) is arranged
On the support rod (201)；
Elastic component (203), the elastic component (203) be located at the support rod (201) upper end limited cap and the fixed beam
(202) between.
10. aging test system according to claim 8, which is characterized in that the radiator (1) and/or the fixation
Beam (202) is duralumin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822140726.1U CN209525419U (en) | 2018-12-19 | 2018-12-19 | Ageing radiator and aging test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822140726.1U CN209525419U (en) | 2018-12-19 | 2018-12-19 | Ageing radiator and aging test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209525419U true CN209525419U (en) | 2019-10-22 |
Family
ID=68227414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822140726.1U Active CN209525419U (en) | 2018-12-19 | 2018-12-19 | Ageing radiator and aging test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209525419U (en) |
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2018
- 2018-12-19 CN CN201822140726.1U patent/CN209525419U/en active Active
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