CN209514246U - Display device - Google Patents
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- CN209514246U CN209514246U CN201920329337.5U CN201920329337U CN209514246U CN 209514246 U CN209514246 U CN 209514246U CN 201920329337 U CN201920329337 U CN 201920329337U CN 209514246 U CN209514246 U CN 209514246U
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Abstract
A kind of display device has the display unit with display image and surrounds the display panel of the non-display portion of above-mentioned display unit；Above-mentioned display panel has: the 1st substrate, has the 2nd organic insulating film of the 1st organic insulating film, configuration on above-mentioned 1st organic insulating film and the burrock portion in above-mentioned non-display portion with above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film；2nd substrate, it is opposed with above-mentioned 1st substrate；And seal, by above-mentioned 1st substrate and above-mentioned 2nd substrate bonding；Above-mentioned burrock portion has the 1st slit for penetrating through above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film and by the 1st cutting part and the 2nd cutting part of the segmentation of above-mentioned 1st slit；Above-mentioned seal is configured in above-mentioned 1st slit.
Description
The Japanese patent application 2018-050138 CLAIM OF PRIORITY that the application was proposed based on March 16th, 2018,
Entire contents incorporated herein
Technical field
The utility model relates to display devices.
Background technique
In recent years, the various display devices for being built-in with contact sensor are proposed.In one example, a kind of be formed in is disclosed
Multiple electrodes on display panel be contact sensing modes in the case where play the role of sensor electrode, be display pattern
In the case of play the role of the display device of common electrode.As contact sensing mode, using mutual capacitance mode and self-capacitance side
Formula certain.In contact sensing modes, carried out to sensor electrode application by the way that driving voltage will be contacted via signal wire
Sensing.
Utility model content
According to the technical program 1, a kind of display device is provided, have the display unit with display image and is surrounded above-mentioned aobvious
Show the display panel of the non-display portion in portion；Above-mentioned display panel has: the 1st substrate, has the 1st organic insulating film, configuration upper
State the 2nd organic insulating film on the 1st organic insulating film and have in above-mentioned non-display portion above-mentioned 1st organic insulating film and
The burrock portion of above-mentioned 2nd organic insulating film；2nd substrate, it is opposed with above-mentioned 1st substrate；And seal, by above-mentioned 1st substrate
With above-mentioned 2nd substrate bonding；Above-mentioned burrock portion has above-mentioned 1st organic insulating film and the perforation of above-mentioned 2nd organic insulating film
1st slit and the 1st cutting part and the 2nd cutting part divided by above-mentioned 1st slit；It is narrow that above-mentioned seal is configured in the above-mentioned 1st
In seam.
Display device as described in technical solution 1, which is characterized in that above-mentioned 1st substrate has in above-mentioned non-display portion will
Above-mentioned 1st organic insulating film and the groove portion of above-mentioned 2nd organic insulating film perforation, above-mentioned burrock portion is located at the end of above-mentioned display panel
Between portion and above-mentioned groove portion.
Display device as described in technical solution 2, which is characterized in that above-mentioned 1st substrate is also equipped with: switch element has
Drain electrode；Metal electrode, in the 1st through hole that above-mentioned 1st organic insulating film is penetrated into above-mentioned drain electrode with above-mentioned electric leakage
Pole contact；And pixel electrode, it is electrically connected with above-mentioned metal electrode.
Display device as described in technical solution 3, which is characterized in that above-mentioned 1st substrate is also equipped with: transparent electrode is being incited somebody to action
Above-mentioned 2nd organic insulating film is penetrated into the 2nd through hole of above-mentioned metal electrode and is contacted with above-mentioned metal electrode；And it is inorganic exhausted
Velum is located on above-mentioned 2nd organic insulating film, has the 3rd through hole for penetrating into above-mentioned transparent electrode, pixel electrodes
On above-mentioned inorganic insulating membrane, contacted in above-mentioned 3rd through hole with above-mentioned transparent electrode.
Display device as described in technical solution 1, which is characterized in that above-mentioned 1st organic insulating film of above-mentioned 1st cutting part
Width it is bigger than the width of above-mentioned 2nd organic insulating film of above-mentioned 1st cutting part, the above-mentioned 1st of above-mentioned 2nd cutting part it is organic absolutely
The width of velum is bigger than the width of above-mentioned 2nd organic insulating film of above-mentioned 2nd cutting part.
Display device as described in technical solution 1, which is characterized in that in above-mentioned 1st slit by above-mentioned 2nd organic insulation
The width of the part of film perforation is bigger than the width of the part by the perforation of above-mentioned 1st organic insulating film in above-mentioned 1st slit.
Display device as described in technical solution 1, which is characterized in that the side of above-mentioned 1st slit is organic exhausted the above-mentioned 1st
There is step between velum and above-mentioned 2nd organic insulating film.
Display device as described in technical solution 1, which is characterized in that above-mentioned display panel, which has, to be stretched out along the 1st direction
1st end and the 2nd end, the 3rd end along the 2nd direction stretching intersected with above-mentioned 1st direction and the 4th end and above-mentioned
Mounting portion between display unit and above-mentioned 1st end, above-mentioned 1st slit between above-mentioned 2nd end and above-mentioned display unit, on
It states between the 3rd end and above-mentioned display unit and between above-mentioned 4th end and above-mentioned display unit.
Display device as described in technical solution 1, which is characterized in that above-mentioned burrock portion has above-mentioned 1st organic insulation
The 2nd slit that film and above-mentioned 2nd organic insulating film penetrate through and the 3rd cutting part divided by above-mentioned 2nd slit, above-mentioned sealing
Body is configured in above-mentioned 2nd slit.
Display device as described in technical solution, which is characterized in that above-mentioned burrock portion has above-mentioned 2nd organic insulating film
Penetrate into the 3rd slit of above-mentioned 1st organic insulating film.
Display device as described in technical solution 1, which is characterized in that above-mentioned 2nd substrate has to above-mentioned 1st substrate pleurapophysis
Liner out, above-mentioned burrock portion are opposed with above-mentioned liner.
Display device as described in technical solution 11, which is characterized in that be also equipped be diffused into it is multiple in above-mentioned seal
Obturator, between the interval and above-mentioned 2nd cutting part and above-mentioned liner between above-mentioned 1st cutting part and above-mentioned liner between
Every roughly equal with the diameter of above-mentioned obturator.
Display device as described in technical solution 11, which is characterized in that the end in above-mentioned burrock portion and the end of above-mentioned liner
Portion is located at the end of above-mentioned display panel.
Display device as described in technical solution 11, which is characterized in that above-mentioned liner has penetrate through above-mentioned liner the 4th
Slit and the 4th cutting part and the 5th cutting part divided by above-mentioned 4th slit, above-mentioned seal are configured in above-mentioned 4th slit
It is interior.
Display device as described in technical solution 14, which is characterized in that above-mentioned display panel, which has, to be stretched out along the 1st direction
1st end and the 2nd end, the 3rd end along the 2nd direction stretching intersected with above-mentioned 1st direction and the 4th end and above-mentioned
Mounting portion between display unit and above-mentioned 1st end, above-mentioned 4th slit between above-mentioned 2nd end and above-mentioned display unit, on
It states between the 3rd end and above-mentioned display unit and between above-mentioned 4th end and above-mentioned display unit.
Display device as described in technical solution 14, which is characterized in that above-mentioned liner has penetrate through above-mentioned liner the 5th
Slit and the 6th cutting part divided by above-mentioned 5th slit, above-mentioned seal configuration is in above-mentioned 5th slit.
The technical program is capable of providing the display device for being able to achieve reliability raising.
Detailed description of the invention
Fig. 1 is the plan view for indicating the appearance of display device of present embodiment.
Fig. 2 is the plan view for indicating a structural example of contact sensor.
Fig. 3 is the plan view for indicating the relationship of pixel and sensor electrode shown in Fig. 2.
Fig. 4 is the basic structure for indicating pixel and the figure of equivalent circuit.
Fig. 5 is the plan view for indicating an example of pixel layout.
Fig. 6 is the plan view for indicating an example of pixel shown in fig. 5.
Fig. 7 is the cross-sectional view along the 1st substrate of A-B line shown in fig. 6.
Fig. 8 is the cross-sectional view along the display panel of C-D line shown in fig. 6.
Fig. 9 is the cross-sectional view along the 1st substrate of E-F line shown in fig. 6.
Figure 10 is the cross-sectional view along the display panel of G-H line shown in FIG. 1.
Figure 11 is the detailed cross-sectional view in region shown in Fig. 10.
Figure 12 is the plan view for indicating the position of the slit in burrock portion shown in Figure 11.
Figure 13 is the cross-sectional view for indicating the 1st variation of present embodiment shown in Figure 11.
Figure 14 is the plan view for indicating the position of slit of liner shown in Figure 13.
Figure 15 is the cross-sectional view for indicating the 2nd variation of present embodiment shown in Figure 11.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to present embodiment.In addition, the disclosure only an example, about this field
Technical staff is included in the utility model it can be readily appreciated that the person of suitably changing under remain the purport of utility model certainly
Range in.In addition, attached drawing has the width, thickness, shape compared with actual form to each portion to become more apparent explanation
The case where shape etc. shows schematically, but only an example do not limit the explanation of the utility model.In addition, in this specification
In each figure, have to the identical label of constituent element imparting played about existing figure with the same or similar function of above-mentioned person
And the case where suitably omitting duplicate detailed description.
Firstly, being described in detail to the display device DSP in relation to present embodiment.In the present embodiment, to aobvious
The case where showing device DSP is liquid crystal display device is illustrated.
Fig. 1 is the plan view for indicating the appearance of display device DSP of present embodiment.
In one example, the 1st direction X, the 2nd direction Y and the 3rd direction Z are mutually orthogonal, but can also be with the angle other than 90 degree
Intersect.1st direction X and the 2nd direction Y is equivalent to the direction with the main surface parallel for the substrate for constituting display device DSP, the 3rd direction Z
It is equivalent to the thickness direction of display device DSP.In the present specification, direction is indicated to the direction of the front end of the arrow of the 3rd direction Z
Referred to as top (or single be referred to as on) will be referred to as in the opposite direction lower section (or single be referred to as under) from the front end of arrow.In addition, false
If the observation position for observing display device DSP is in the front end side for indicating the arrow of the 3rd direction Z, will be positioned against from this
The observation of the X-Y plane as defined in the 1st direction X and the 2nd direction Y, which is referred to as, to be overlooked.
Here, the plan view of the display device DSP in X-Y plane is illustrated.Display device DSP has display panel
PNL, flexible printed circuit substrate 1, IC chip 2 and circuit substrate 3.
Display panel PNL is liquid crystal display panel, has the 1st substrate SUB1, the 2nd substrate SUB2, seal SE, light shield layer
BM, liner SP1 to SP4 and aftermentioned liquid crystal layer LC.In addition, display panel PNL has the display unit DA of display image and will show
Show the non-display portion NDA for the frame shape that portion DA is surrounded.2nd substrate SUB2 is opposed with the 1st substrate SUB1.1st substrate SUB1 has
The mounting portion MA more stretched out to the 2nd direction Y than the 2nd substrate SUB2.
Seal SE is located at non-display portion NDA, and the 1st substrate SUB1 is Nian Jie with the 2nd substrate SUB2.Light shield layer BM is located at non-
Display unit NDA.The position Chong Die with light shield layer BM is arranged in seal SE in vertical view.In Fig. 1, it is being configured with seal SE
Region and region configured with light shield layer BM in, indicated with mutually different oblique line, seal SE is Chong Die with light shield layer BM
Region cross spider shadow representation.Light shield layer BM is arranged on the 2nd substrate SUB2.
Liner SP1 to SP4 is all located at non-display portion NDA.Liner SP1 is located at the most peripheral of display panel PNL.Pad SP2
The side display unit DA is more leaned on positioned at than liner SP1.It is Chong Die with seal SE to pad SP1 and SP2.SP3 and SP4 is padded to be located at than sealing
Body SE leans on the side display unit DA.
Display unit DA is located at the inside surrounded by light shield layer BM.Display unit DA have on the 1st direction X and the 2nd direction Y with
Multiple pixel PX of rectangular configuration.
Flexible printed circuit substrate 1 is installed on mounting portion MA, is connected on circuit substrate 3.IC chip 2 is installed in
On flexible printed circuit substrate 1.In addition, IC chip 2 can also be installed on mounting portion MA.IC chip 2 is built-in in display figure
The display driver DD of signal required for image is shown is exported under the display pattern of picture.In addition, in the example in the figures, IC
Chip 2 be built-in with to detection object to display device DSP near to or in contact with the contact control that is controlled of contact sensing modes
Device TC processed.IC chip 2 is indicated by single dotted broken line in the figure, and display driver DD and contactor controller TC are indicated by dotted line.
The display panel PNL of present embodiment is that have by making the light of the back side from the 1st substrate SUB1 have selection
Ground penetrate and show image through display function infiltration type, have light by making the front side from the 2nd substrate SUB2
Selectively reflect show image reflection display function reflection-type or have through display function and reflect display function
Which kind of of semi-transmission type be ok.
In addition, the detailed structure about display panel PNL omits the description herein, but display panel PNL has and benefit
With the display pattern of the transverse electric field along substrate interarea, using the normal along substrate interarea vertical electric field display pattern, benefit
In the display pattern of oblique inclined tilting electric field, also by above-mentioned transverse electric field, vertical electric field and inclined with relative to substrate interarea
Which kind of corresponding structure of the display pattern that oblique electric field is appropriately combined and utilizes is ok.Here substrate interarea, be with by the 1st side
The face parallel to X-Y plane as defined in X and the 2nd direction Y.
Display panel PNL has to the 1st direction X the 1st end EG1 stretched out and the 2nd end EG2 and to the 2nd direction Y
The 3rd end EG3 and the 4th end EG4 stretched out.1st end EG1 is opposed with the 2nd end EG2 via display unit DA.3rd end
EG3 is opposed with the 4th end EG4 via display unit DA.In addition, mounting portion MA is between display unit DA and the 1st end EG1.2nd
Substrate SUB2 has the 5th end EG5 of the side mounting portion MA.
Fig. 2 is the plan view for indicating a structural example of contact sensor TS.Here, to the contact sensor of self-capacitance mode
TS is illustrated, but contact sensor TS is also possible to mutual capacitance mode.
Contact sensor TS has with multiple sensor electrode Rx (Rx1, Rx2 ...) of rectangular configuration and multiple sensors
Wiring L (L1, L2 ...).Multiple sensor electrode Rx are located on display unit DA, with rectangular on the 1st direction X and the 2nd direction Y
Configuration.1 sensor electrode Rx constitutes 1 sensor block B.Sensor block B is the minimum unit that can contact sensing.Multiple biographies
Sensor wiring L stretches out in display unit DA respectively along the 2nd direction Y, arranges along the 1st direction X.Sensor wire L is respectively set
In position for example Chong Die with aftermentioned signal wire S.In addition, sensor wire L is drawn to non-display portion NDA respectively, via
Flexible printed circuit substrate 1 is connected electrically in IC chip 2.
Here, it is conceived to the sensor wire L1 to L3 along the 1st direction X arrangement and the sensor along the 2nd direction Y arrangement
The relationship of electrode Rx1 to Rx3.Sensor wire L1 is Chong Die with sensor electrode Rx1 to Rx3, is electrically connected with sensor electrode Rx1
It connects.
Sensor wire L2 is Chong Die with sensor electrode Rx2 and Rx3, is electrically connected with sensor electrode Rx2.Pseudo- wiring D20
It is left from sensor wire L2.Pseudo- wiring D20 is Chong Die with sensor electrode Rx1, and is electrically connected with sensor electrode Rx1.Sensing
Device wiring L2 and puppet wiring D20 are located on the same signal wire.
Sensor wire L3 is Chong Die with sensor electrode Rx3, is electrically connected with sensor electrode Rx3.Pseudo- wiring D31 and sensing
Device electrode Rx1 overlapping, is electrically connected with sensor electrode Rx1.Pseudo- wiring D32 leaves from pseudo- wiring D31 and sensor wire L3.It is pseudo-
Wiring D32 is Chong Die with sensor electrode Rx2, is electrically connected with sensor electrode Rx2.Sensor wire L3, pseudo- wiring D31 and D32
On the same signal wire.
In the case where contacting sensing modes, contactor controller TC applies contact driving voltage to sensor wire L.As a result, to biography
Sensor electrode Rx applies contact driving voltage, carries out the sensing under sensor electrode Rx.With the sensing knot in sensor electrode Rx
The corresponding sensor signal of fruit is exported via sensor wire L to contactor controller TC.Contactor controller TC or outside
Host based on sensing signal detection object to display device DSP near to or in contact with the presence or absence of and object position coordinates.
In addition, in display mode, sensor electrode Rx is played as the common electrode for being applied common voltage (Vcom)
Function.The voltage supplier that common voltage is included from such as display driver DD applies via sensor wire L.
Fig. 3 is the plan view for indicating the relationship of pixel PX and sensor electrode Rx shown in Fig. 2.It, will be to the inverse time in Fig. 3
Needle, using the direction definition of scissors junction as direction D1, will be handed over clockwise with acute angle relative to the 2nd direction Y relative to the 2nd direction Y-direction
The direction definition of fork is direction D2.In addition, the 2nd direction Y and direction D1 angulation θ 1 and the 2nd direction Y and direction D2 institute at
Angle, θ 2 it is roughly the same.
1 sensor electrode Rx is configured across multiple pixel PX.In the example in the figures, it is located at the along the 2nd direction Y
The pixel PX of odd-numbered line is stretched out along direction D1.In addition, being located at the pixel PX of even number line along direction D2 along the 2nd direction Y
It stretches out.In addition, pixel PX here, indicates the minimum unit that can be individually controlled corresponding to picture element signal, have referred to as secondary
The case where pixel.In addition, there is the case where minimum unit for being used to realize colored display is referred to as main pixel MP.Main pixel MP has
It shows multiple pair pixel PX of mutually different color and constitutes.In one example, main pixel MP has aobvious as pair pixel PX
The blue pixel for showing red red pixel, display green green pixel and being displayed in blue.In addition, main pixel MP can also have
The white pixel being displayed in white.
In one example, on 1 sensor electrode Rx, 60~70 main pixel MP are configured with along the 1st direction X, along
2nd direction is configured with 60~70 main pixel MP.
Fig. 4 is the basic structure for indicating pixel PX and the figure of equivalent circuit.
Multiple scan line G are connected on scan line drive circuit GD.Multiple signal wire S are connected to signal-line driving circuit SD
On.In addition, scan line G and signal wire S might not can also linearly stretch out, their a part bending can also be with.For example,
Even if signal wire S part of it is bent, also think to stretch out along the 2nd direction Y.
Common electrode CE is arranged according to sensor block B respectively.Common electrode CE is connected to the voltage of common voltage (Vcom)
On supply unit CD, configured across multiple pixel PX.In addition, common electrode CE is also connected to contact control as described above respectively
On device TC, it is formed in the sensor electrode Rx that contact driving voltage is applied under contact sensing modes.
Each pixel PX has switch element SW, pixel electrode PE, common electrode CE, liquid crystal layer LC etc..Switch element SW
It is such as made of thin film transistor (TFT) (TFT), is electrically connected with scan line G and signal wire S.Scan line G and the picture along the 1st direction X arrangement
The respective switch element SW connection of plain PX.The respective switch element SW of signal wire S and the pixel PX along the 2nd direction Y arrangement
Connection.Pixel electrode PE is electrically connected with switch element SW.Pixel electrode PE is opposed with common electrode CE respectively, by pixel electricity
The electric field generated between pole PE and common electrode CE drives liquid crystal layer LC.Capacity C S is kept for example to be formed in and common electrode CE
Idiostatic electrode and between the idiostatic electrode of pixel electrode PE.
Fig. 5 is the plan view for indicating an example of pixel layout.
Scan line G1 to G3 is linearly stretched out respectively along the 1st direction X, and interval arranges on the 2nd direction Y.Signal
Line S1 to S3 respectively approximately along the 2nd direction Y stretch out, the interval on the 1st direction X and arrange.
Pixel electrode pe1 and pe2 configures between scan line G1 and G2.Pixel electrode pe1 and pe2 is arranged along the 1st direction X
Column.Pixel electrode PE3 and PE4 are configured between scan line G2 and G3.Pixel electrode PE3 and PE4 is arranged along the 1st direction X.Picture
Between signal wire S1 and S2, pixel electrode PE2 and PE4 are configured between signal wire S2 and S3 for plain electrode PE1 and PE3 configuration.
Pixel electrode pe1 and pe2 has the belt electrode Pa1 and Pa2 stretched out respectively along direction D1.Pixel electrode PE3 and
PE4 has the belt electrode Pa3 and Pa4 stretched out respectively along direction D2.In the example in the figures, belt electrode Pa1 to Pa4 is 2,
It may also be 1, it is also possible to 3 or more.
Common electrode CE1 is configured across pixel PX1 and PX2.Common electrode CE2 is configured across pixel PX3 and PX4.
Common electrode CE1 and CE2 is arranged along the 2nd direction Y.Common electrode CE1 and CE2 are included in 1 sensor electrode Rx shown in Fig. 2
In.Common electrode CE1 is overlapped on signal wire S1 to S3.Pixel electrode pe1 and pe2 overlaps on common electrode CE1.Altogether
Energization pole CE2 is overlapped on signal wire S1 to S3.Pixel electrode PE3 and PE4 are overlapped on common electrode CE2.It is illustrating
Example in, scan line G2 is located between common electrode CE1 and CE2.
Electric bridge portion BR is equivalent to the region indicated in figure with oblique line.Electric bridge portion BR is located at common electrode CE1 and is powered together
It is Chong Die with signal wire S2 between the CE2 of pole.Electric bridge portion BR is integrally formed with common electrode CE1 and common electrode CE2, will be common
Electrode CE1 and common electrode CE2 electrical connection.Electric bridge portion BR and common electrode CE1 and common electrode CE2 are also contained in sensor
In electrode Rx.
Fig. 6 is the plan view for indicating an example of pixel shown in fig. 5.Here, be conceived to scan line G1 as shown in Figure 5 and
The pixel PX1 that G2 and signal wire S1 and S2 are surrounded, is illustrated main portion.In addition, Fig. 6 indicates the knot on the 1st substrate SUB1
Structure.
Switch element SW is configured on the 1st substrate SUB1.Switch element SW is electrically connected with scan line G2 and signal wire S2.It opens
It closes element SW and has semiconductor layer SC and drain electrode DE.
Semiconductor layer SC is configured in such a way that part of it is Chong Die with signal wire S2, and other parts reach signal wire S1
And between S2, it is shaped generally as U-shaped.Semiconductor layer SC intersects in the position Chong Die with signal wire S2 and scan line G2, is believing
Number also intersect with scan line G2 between line S1 and S2.In scan line G2, the region Chong Die with semiconductor layer SC is respectively as grid
Electrode GE1 and GE2 are functioned for pole.That is, the switch element SW of example illustrated has double gated architecture.Semiconductor layer SC is at it
One end SCA passes through through hole CH1 and is electrically connected with signal wire S2, in addition, passing through through hole CH2 and electric leakage in the other end SCB
Pole DE electrical connection.
Drain electrode DE is formed as island, configures between signal wire S1 and signal wire S2.In addition, in switch element SW,
There is the case where drain electrode DE is referred to as source electrode.
Pixel electrode PE1 has the base portion BS with multiple belt electrode Pa1 one.Base portion BS is Chong Die with drain electrode DE, with leakage
Electrode DE electrical connection.
Fig. 7 is the cross-sectional view along the 1st substrate SUB1 of A-B line shown in fig. 6.
1st substrate SUB1 have insulating substrate 10, insulating film 11 to 16, semiconductor layer SC, scan line G2, signal wire S2,
Metal wiring ML2, common electrode CE1, electric bridge portion BR, alignment films AL1 etc..
Insulating substrate 10 is the substrate that glass substrate or the resin substrate of flexibility etc. have photopermeability.Insulating film 11 is located at exhausted
On edge substrate 10.Semiconductor layer SC is located on insulating film 11, is covered by insulating film 12.Semiconductor layer SC is for example by polysilicon
It is formed, but can also be formed by amorphous silicon or oxide semiconductor.
The gate electrode GE1 of a part as scan line G2 is located on insulating film 12, is covered by insulating film 13.Separately
Outside, other scan lines (not shown) also are located in layer identical with scan line G2.Scan line G2 is by aluminium (Al), titanium (Ti), silver
(Ag), the formation such as the metal materials such as molybdenum (Mo), tungsten (W), copper (Cu), chromium (Cr) or the alloy for combining these metal materials, both
It can be monolayer constructions, be also possible to multi-ply construction.In one example, scan line G2 is formed by molybdenum-tungsten alloy.
Signal wire S2 is located on insulating film 13, is covered by insulating film (the 1st organic insulating film) 14.In addition, (not shown)
Other signal wires also be located at in signal wire S2 same layer.Signal wire S2 is by above-mentioned metal material or by above-mentioned metal material
Expect that combined alloy etc. is formed, either monolayer constructions, are also possible to multi-ply construction.In one example, signal wire S2 is will to contain
There is the 1st layer, the 2nd layer containing aluminium (Al) of titanium (Ti) and contains the 3rd layer of laminated body stacked gradually of titanium (Ti).Signal wire S2
It is contacted across the through hole CH1 for penetrating through insulating film 12 and insulating film 13 with semiconductor layer SC.
Metal wiring ML2 is located on insulating film 14, is covered by insulating film (the 2nd organic insulating film) 15.Metal wiring ML2
It is formed by above-mentioned metal material or the alloy etc. for combining above-mentioned metal material, either monolayer constructions, are also possible to
Multi-ply construction.In one example, metal wiring ML2 is by the 1st layer that contains titanium (Ti), the 2nd layer containing aluminium (Al) and to contain titanium
(Ti) the 3rd layer of laminated body stacked gradually, or by the 1st layer that contains molybdenum (Mo), the 2nd layer containing aluminium (Al) and contain
The 3rd layer of laminated body stacked gradually of molybdenum (Mo).
Common electrode CE1 and electric bridge portion BR is located on insulating film 15, is covered by insulating film (inorganic insulating membrane) 16.It is common
Electrode CE1 and electric bridge portion BR is the transparent electricity formed by the transparent conductive material such as tin indium oxide (ITO) or indium zinc oxide (IZO)
Pole.Common electrode CE1 is passed through and is contacted the through hole CH3 that insulating film 15 penetrates through with metal wiring ML2.Alignment films AL1 is located at exhausted
On velum 16.
Insulating film 11 to 13 and insulating film 16 are by inorganic insulating materials such as Si oxide, silicon nitride, silicon nitrogen oxides
The inorganic insulating membrane of formation, either monolayer constructions, are also possible to multi-ply construction.Insulating film 14 and 15 is, for example, by propylene tree
The organic insulating film that the organic insulating materials such as rouge are formed.
As described above, common electrode CE1 is also used as sensor electrode Rx to function, metal wiring ML2 also as with
The sensor wire L of sensor electrode Rx electrical connection is functioned.
Fig. 8 is the cross-sectional view along the display panel PNL of C-D line shown in fig. 6.Example illustrated, which is equivalent to, to be used
Utilize the example of the display pattern of transverse electric field.
In the 1st substrate SUB1, signal wire S1 and S2 are located on insulating film 13, are covered by insulating film 14.Metal wiring
ML1 and ML2 is located at the surface of signal wire S1 and S2.Pixel electrode PE1 is located on insulating film 16, is oriented film AL1
Covering.Pixel electrode PE1 is the transparent electrode formed by the transparent conductive material of ITO or IZO etc..
2nd substrate SUB2 has insulating substrate 20, light shield layer BM, colour filter CF, outer covering layer OC, alignment films AL2 etc..
Insulating substrate 20 and insulating substrate 10 are again it is glass substrate or resin substrate etc. have the substrate of photopermeability.
Light shield layer BM and colour filter CF is located at the side opposed with the 1st substrate SUB1 of insulating substrate 20.Colour filter CF be configured in
Pixel electrode PE1 opposed position, part of it are Chong Die with light shield layer BM.Colour filter CF has red colour filter CFR, green
Colour filter CFG, blue colour filter CFB.Outer covering layer OC covers colour filter CF.Outer covering layer OC is formed by transparent resin.
Alignment films AL2 covers outer covering layer OC.Alignment films AL1 and alignment films AL2 is for example formed by the material in horizontal alignment property.
Above-mentioned the 1st substrate SUB1 and the 2nd substrate SUB2 is configured in the opposed mode of alignment films AL1 and alignment films AL2.The
It is bonded in the state of the cell gap as defined in being formed with 1 substrate SUB1 and the 2nd substrate SUB2 with seal.Liquid crystal layer LC
It is maintained between alignment films AL1 and alignment films AL2.Liquid crystal layer LC has liquid crystal molecule LM.(dielectric is normal by eurymeric by liquid crystal layer LC
Number anisotropy be positive) liquid crystal material or minus (dielectric constant anisotropy is negative) liquid crystal material constitute.
Optical element OD1 including polarizer PL1 is glued on the insulating substrate 10.Optics member including polarizer PL2
Part OD2 is bonded on insulating substrate 20.In addition, optical element OD1 and optical element OD2 can also have phase as needed
Poor plate, scattering layer, anti-reflection layer etc..
In such display panel PNL, the closing of electric field is not formed between pixel electrode PE and common electrode CE
Under state, liquid crystal molecule LM initial orientation between alignment films AL1 and alignment films AL2 is defined direction.In such closing
Under state, the light irradiated from lighting device IL towards display panel PNL is absorbed by optical element OD1 and optical element OD2, is become
It shows slinkingly and shows.On the other hand, it is formed between pixel electrode PE and common electrode CE under the open state of electric field, liquid crystal molecule LM
The direction different from initial orientation direction is oriented to by electric field, differently- oriented directivity is by electric field controls.In such opening state
Under state, a part of the light from lighting device IL becomes and obviously shows through optical element OD1 and optical element OD2.
Fig. 9 is the cross-sectional view along the 1st substrate SUB1 of E-F line shown in fig. 6.In addition, in the 1st substrate of diagram
In SUB1, the diagram than the layer on the lower of insulating film 13 and alignment films AL1 is omitted.
1st substrate SUB1 has above-mentioned drain electrode DE, signal wire S1 and S2, metal electrode ME, transparent electrode TE, metal
Wiring ML1 and ML2, insulating film 13 to 16, pixel electrode PE1, electric bridge portion BR.
Signal wire S1 and S2, drain electrode DE are located on insulating film 13, are covered by insulating film 14.Drain electrode DE is located at and letter
In number line S1 and S2 same layer, formed by material identical with signal wire S1 and S2.Insulating film 14, which has, penetrates into drain electrode DE
Through hole (the 1st through hole) CH11.
Metal wiring ML1 and ML2, metal electrode ME are located on insulating film 14, are covered by insulating film 15.Metal electrode ME
It is contacted in through hole CH11 with drain electrode DE.Metal electrode ME be located at in metal wiring ML1 and ML2 same layer, You Yujin
Belong to the identical metal material of wiring ML1 and ML2 to be formed.Insulating film 15 is located on insulating film 14, has and penetrates into metal electrode
Through hole (the 2nd through hole) CH21 of ME.In addition, in the present embodiment, the film thickness of insulating film 14 is about 2.5 μm, insulating film
15 film thickness is about 1.5 μm.
Transparent electrode TE, electric bridge portion BR are located on insulating film 15, are covered by insulating film 16.Transparent electrode TE is in through hole
It is contacted in CH21 with metal electrode ME.Transparent electrode TE and electric bridge portion BR is located at same with common electrode CE1 and CE2 shown in fig. 5
In one layer, formed by transparent conductive material identical with common electrode CE1 and CE2.Electric bridge portion BR is located at signal wire S2 and gold
Belong to the surface of wiring ML2.Insulating film 16 is located on insulating film 15, has and penetrates into the through hole of transparent electrode TE (the 3rd passes through
Through-hole) CH31.
The base portion BS of pixel electrode PE1 is located on insulating film 16, is covered by alignment films AL1 (not shown).Pixel electrode
PE1 is contacted in through hole CH31 with transparent electrode TE.In addition, pixel electrode PE1 is electrically connected with metal electrode ME.
Figure 10 is the cross-sectional view along the display panel PNL of G-H line shown in FIG. 1.Figure 10 indicates display panel PNL's
Non-display portion NDA.
1st substrate SUB1 has periphery wiring WR1 to WR3 and peripheral electrode PRE in non-display portion NDA.Periphery wiring
WR1 is configured on insulating film 12, is covered by insulating film 13.Periphery wiring WR1 configuration in scan line same layer, by with scanning
The identical material of line is formed.Periphery wiring WR2 is configured on insulating film 13, is covered by insulating film 14.Periphery wiring WR2 configuration
With signal wire same layer, formed by material identical with signal wire.Periphery wiring WR3 and peripheral electrode PRE configuration are being insulated
On film 16, it is oriented film AL1 covering.Periphery wiring WR3 and peripheral electrode PRE be configured to pixel electrode same layer, and by with
The identical material of pixel electrode is formed.
1st substrate SUB1 has the groove portion GR that insulating film 14 and 15 is penetrated into insulating film 13 in non-display portion NDA.Slot
Portion GR is located in the region Chong Die with seal SE.In the present embodiment, the width W1 of groove portion GR is about 90 μm.It can be by slot
Portion GR cuts off the intrusion path of the moisture transmitted from the outside of display panel PNL along insulating film 14 and 15.
Insulating film 16 configures on insulating film 15, is also disposed in the inside of groove portion GR.Insulating film 16 and groove portion GR's
Side contact.Since the side of groove portion GR forms step by insulating film 14 and 15, so insulating film 16 is liable to stick to groove portion
On the side of GR.In addition, peripheral electrode PRE and alignment films AL1 are also disposed in the inside of groove portion GR.
1st substrate SUB1 has the burrock portion BA being made of insulating film 14 and 15 in non-display portion NDA.BA, burrock portion
It is prominent to the 2nd side substrate SUB2 between the 3rd end EG3 and groove portion GR of display panel PNL.SP1 pairs of burrock portion BA and liner
It sets.In addition, burrock portion BA has slit SL1 to SL3.In the present embodiment, the width W2 of burrock portion BA is about 60 μm.
Light shield layer BM has the slit SL11 for penetrating into insulating substrate 20.It being capable of invading the moisture transmitted along light shield layer BM
Enter path slit SL11 cutting.In addition, since the 1st substrate SUB1 in the position Chong Die with slit SL11 has periphery wiring
WR1, so being able to suppress the light leakage from slit SL11.
Light shield layer BM has slit SL12 in the region Chong Die with liquid crystal layer LC.Therefore, it can be cut at slit SL12
The movement routine of the disconnected charge to display unit DA via light shield layer BM.As a result, in the manufacturing process of display panel PNL, energy
Enough electrostatic is inhibited to concentrate on display unit DA, inhibits display panel PNL damage.In addition, due to the 1st substrate SUB1 with slit SL12
The position of overlapping has periphery wiring WR2, so being able to suppress the light leakage from slit SL12.In addition, colour filter CFR and CFB exist
It is overlapped and configures on the 3rd direction Z in slit SL12.Therefore, can press down for having penetrated the light around the wiring WR2 of periphery also
Make the light leakage from slit SL12.
SP1 to SP4 configuration is padded on the 2nd substrate SUB2, it is prominent to the 1st side substrate SUB1.SP1 to SP4 is padded by setting
Rouge material is formed.In addition, being configured with the colour filter CFB adjusted for height in the position Chong Die with liner SP1 and SP2.At this
In embodiment, the width W3 for padding SP1 is about 50 μm.In addition, alignment films AL2 will not liner SP1 to SP4 covering.
The end BAE of the burrock portion BA and end SPE for padding SP1 is located at the 3rd end EG3 of display panel PNL.That is, dike
Weir portion BA and liner SP1 when in manufacturing process by display panel PNL from when substantially blank material is cut into single, as being used to support
The component of display panel PNL is configured on cutting line.Therefore, it is able to suppress and acts on when the cutting by display panel PNL
Power and display panel PNL are deformed, and inhibit cutting bad.In addition, about display panel PNL shown in FIG. 1 the 2nd end EG2 and
The 5th end EG5 of 4th end EG4 and the 2nd substrate SUB2 is also the same, and burrock portion BA and liner SP1 are located on cutting line.
Figure 11 is the detailed cross-sectional view of region AR shown in Fig. 10.
Insulating film 14 and 15 is penetrated into insulating film 13 by slit SL1 to SL3.Seal SE enters slit SL1 to SL3
It is interior.In addition, burrock portion BA has the cutting part DD1 to DD4 divided by slit SL1 to SL3.Cutting part DD1 is located at the 3rd end
The side display unit DA of EG3.Cutting part DD2 is located at the side display unit DA of cutting part DD1.Cutting part DD3 is located at the aobvious of cutting part DD2
Show the portion side DA.Cutting part DD4 is located at the side display unit DA of cutting part DD3.Slit SL1 be located at cutting part DD1 and cutting part DD2 it
Between.Slit SL2 is between cutting part DD2 and cutting part DD3.Slit SL3 is between cutting part DD3 and cutting part DD4.
Insulating film 16 covers cutting part DD1 to DD4, reaches the 3rd end EG3.In addition, alignment films AL1 is in diagram
Cutting part DD3 and DD4 are covered in example and reach slit SL2, cutting part DD1 and DD2 are not covered.In addition, alignment films
AL1 is not limited to example illustrated, cutting part DD1 and DD2 can also be covered and reach the 3rd end EG3.
Insulating film 14 is divided into cutting part DD41 to DD44 by slit SL1 to SL3.Insulating film 15 is by slit SL1 to SL3 points
It is segmented into cutting part DD51 to DD54.That is, cutting part DD1 is made of cutting part D41 and D51, cutting part DD2 by cutting part D42 and
D52 is constituted, and cutting part DD3 is made of cutting part D43 and D53, and cutting part DD4 is made of cutting part D44 and D54.
There is cutting part D41 width W41, cutting part D42 there is width W42, cutting part D43 to have width W43, cutting part
D44 has width W44.In the present embodiment, width W41 to W44 is 10 μm or more respectively.In addition, slit SL1 is in cutting part
There is width W45, slit SL2 to have width W46 between cutting part D42 and cutting part D43 between D41 and cutting part D42, it is narrow
Stitch SL3 has width W47 between cutting part D43 and cutting part D44.In the present embodiment, width W45 to W47 is respectively
3.5 μm or more.In addition, as shown in Figure 10, width W41 to W47 width W2 after being added is about 60 μm.
There is cutting part D51 width W51, cutting part D52 there is width W52, cutting part D53 to have width W53, cutting part
D54 has width W54.In the present embodiment, width W51 to W54 is 8 μm or more respectively.In addition, slit SL1 is in cutting part
There is width W55, slit SL2 to have width W56 between cutting part D52 and cutting part D53 between D51 and cutting part D52, it is narrow
Stitch SL3 has width W57 between cutting part D53 and cutting part D54.In the present embodiment, width W55 to W57 is 4 respectively
μm or more.
In cutting part DD1, the width W41 of cutting part D41 is bigger than the width W51 of cutting part D51.In cutting part DD2,
The width W42 of cutting part D42 is bigger than the width W52 of cutting part D52.In cutting part DD3, the width W43 score of cutting part D43
The width W53 for cutting portion D53 is big.In cutting part DD4, the width W44 of cutting part D44 is bigger than the width W54 of cutting part D54.This
Outside, the width W45 of the part in slit SL1 by the width W55 for the part that insulating film 15 penetrates through than penetrating through insulating film 14 is big.
Equally, in slit SL2, width W56 is bigger than width W46.In slit SL3, width W57 is bigger than width W47.
Slit SL1 has side SS1 and SS2.Slit SL2 has side SS3 and SS4.Slit SL3 have side SS5 and
SS6.Side SS1 to SS6 is respectively provided with the step between insulating film 14 and insulating film 15.Due to by by insulating film 14 and 15 points
Other Butut and form slit SL1 to SL3, so side SS1 to SS6 have step.
Multiple obturators 100 are spread in seal SE.Obturator 100 is respectively provided with diameter DM.Cutting part DD1 and liner
Interval between interval GP2, cutting part DD3 between interval GP1, cutting part DD2 between SP1 and liner SP1 and liner SP1
The diameter DM of interval GP4 and obturator 100 between GP3, cutting part DD4 and liner SP1 are roughly equal.Therefore, obturator 100
It is not overlapped mutually and is clipped between cutting part DD1 to DD4 and liner SP1 on the 3rd direction Z.Diameter DM is, for example, about 0.5 μm.
It is bonded in addition, obturator 100 does not have bonding force, the 1st substrate SUB1 and the 2nd substrate SUB by the bonding force of seal SE.
For example, in the case where burrock portion BA does not have slit SL1 to SL3, when by the 1st substrate SUB1 and the 2nd substrate
When SUB2 is bonded, seal SE is squeezed out between burrock portion BA and liner SP1, and obturator 100 is intensively in burrock portion BA and lining
It pads between SP1.Therefore, the bonding force between the 1st substrate SUB1 and the 2nd substrate SUB2 is possible to decline.
According to the present embodiment, burrock portion BA has the slit SL1 to SL3 for penetrating through insulating film 14 and insulating film 15.It is close
Envelope body SE is entered in the inside of slit SL1 to SL3.Therefore, obturator 100 can be made equably to disperse together with seal SE
Into slit SL1 to SL3, it is able to suppress obturator 100 and is densely configured between burrock portion BA and liner SP1.In addition, energy
Enough expand the bond area between seal SE and burrock portion BA by slit SL1 to SL3.Thus, it is possible to inhibit the 1st substrate
Bonding force decline between SUB1 and the 2nd substrate SUB2.In addition, in the case where burrock portion BA has slit SL1 to SL3,
It is able to maintain the supporting functions by display panel PNL from burrock portion BA when substantially blank material is cut into single.Thereby, it is possible to improve
The reliability of display device DSP.
In addition, in the example in the figures, burrock portion BA has 3 slit SL1 to SL3, but burrock portion BA also can have 1
Item or 2 slits, it is possible to have 4 or more slits.
Figure 12 is the plan view for indicating the position of the slit SL1 to SL3 of burrock portion BA shown in Figure 11.It, will in Figure 12
Groove portion GR is indicated with ascending diagonal line to the right, and burrock portion BA is indicated with ascending diagonal line to the left.In addition, by seal SE dotted line table
Show.
Burrock portion BA has along the 1st direction X part 1 BA1 stretched out and part 2 BA2 and stretches out along the 2nd direction Y
Third portion BA3 and the 4th part BA4.Part 1 BA1 and part 2 BA2 respectively with third portion BA3 and the 4th part BA4 phase
Even.Part 1 BA1 is between display unit DA and the 1st end EG1.Part 2 BA2 is located at display unit DA and the 2nd end EG2
Between.Third portion BA3 is between display unit DA and the 3rd end EG3.4th part BA4 is located at display unit DA and the 4th end
Between EG4.Burrock portion BA has slit SL1 to SL3 in part 2 BA2, third portion BA3, the 4th part BA4.That is, slit
SL1 to SL3 between the 2nd end EG2 and display unit DA, between the 3rd end EG3 and display unit DA, the 4th end EG4 and aobvious
Show between portion DA.
Groove portion GR has along the 1st direction X part 1 GR1 stretched out and part 2 GR2 and along the 2nd direction Y stretching
Third portion GR3 and the 4th part GR4.Part 1 GR1 and part 2 GR2 respectively with third portion GR3 and the 4th part GR4 phase
Even.Part 1 GR1 is located at the side display unit DA of the part 1 BA1 of burrock portion BA.Part 2 GR2 is located at the 2nd of burrock portion BA
The side display unit DA of part BA2.Third portion GR3 is located at the side display unit DA of the third portion BA3 of burrock portion BA.4th part GR4
Positioned at the side display unit DA of the 4th part BA4 of burrock portion BA.
Seal SE has along the 1st direction X part 1 SE1 stretched out and part 2 SE2 and stretches out along the 2nd direction Y
Third portion SE3 and the 4th part SE4.Part 1 SE1 and part 2 SE2 respectively with third portion SE3 and the 4th part SE4 phase
Even.In the example in the figures, part 1 SE1 is Chong Die with the part 1 GR1 of groove portion GR, but the not part 1 with burrock portion BA
BA1 overlapping.Part 2 SE2 is Chong Die with the part 2 BA2 of the part 2 GR2 of groove portion GR and burrock portion BA.Third portion SE3 with
The third portion BA3 of the third portion GR3 and burrock portion BA of groove portion GR are overlapped.The 4th part GR4 of 4th part SE4 and groove portion GR and
The 4th part BA4 of burrock portion BA is overlapped.In addition, width W22 of the width W21 of part 1 SE1 than part 2 SE2, the 3rd
Divide width W23, the width W24 of the 4th part SE4 of SE3 big.
In addition, burrock portion BA does not have slit SL1 to SL3 in part 1 BA1.Due to the 1st end of non-display portion NDA
The width of the portion side EG1 is wider than the width of the 2nd end EG2 to the 4th end side EG4 of non-display portion NDA, so the of seal SE
1 part SE1 does not reach the position Chong Die with the part 1 BA1 of burrock portion BA.Accordingly it is also possible on part 1 BA1 not
Form slit SL1 to SL3.Further, since the part 1 SE1 of seal SE is with bigger to the 4th part SE4 than part 2 SE2
Width, so the adhesive strength of part 1 SE1 is stronger than the respective adhesive strength of part 2 SE2 to the 4th part SE4.By
This can not also form slit SL1 extremely in part 1 BA1 even if part 1 SE1 is Chong Die with the part 1 BA1 of burrock portion BA
SL3。
Then, modified embodiment of the present embodiment is described in detail.
Figure 13 is the cross-sectional view for indicating the 1st variation of present embodiment shown in Figure 11.It is tied shown in Figure 13 and Figure 11
Structure is compared, and has on this point of slit SL21 and SL22 different in liner SP1.
Slit SL21 and SL22 penetrates into outer covering layer OC for SP1 is padded.Seal SE is entered in slit SL21 and SL22.
In addition, liner SP1 has cutting part SP11, SP12, the SP13 divided by slit SL21 and SL22.Cutting part SP11 is located at the 3rd
The side display unit DA of end EG3.Cutting part SP12 is located at the side display unit DA of cutting part SP11.Cutting part SP13 is located at cutting part
The side display unit DA of SP12.Slit SL21 is between cutting part SP11 and cutting part SP12.Slit SL22 is located at cutting part
Between SP12 and cutting part SP13.
There is cutting part SP11 width W11, cutting part SP12 there is width W12, cutting part SP13 to have width W13.?
In present embodiment, width W11 to W13 is 7 μm or more respectively.In addition, slit SL21 is in cutting part SP11 and cutting part SP12
Between have width W14, slit SL22 between cutting part SP12 and cutting part SP13 have width W15.In present embodiment
In, width W14 and W15 are 10 μm or more respectively.In addition, as shown in Figure 10, width W11 be added together to W15 after width W3
It is about 50 μm.
Cutting part SP11 is opposed with the cutting part DD1 of burrock portion BA.DD2 pairs of cutting part of cutting part SP12 and burrock portion BA
It sets.Cutting part SP13 is opposed with the cutting part DD4 of burrock portion BA.That is, the cutting part SP11 to SP13 of liner SP1 is configured respectively
With some opposed position of the cutting part DD1 to DD4 of burrock portion BA.
In the case where padding SP1 has slit SL21 and SL22, it can also make obturator 100 equal together with seal SE
Etc. ground be distributed in slit SL21 and SL22.In addition, seal SE and liner SP1 can be expanded by slit SL21 and SL22
Between bond area.In addition, being also able to maintain in the case where padding SP1 has slit SL21 and SL22 by display panel
Supporting functions of the PNL from liner SP1 when substantially blank material is cut into single.In addition, in the example in the figures, liner SP1 has 2
Slit SL21 and SL22, but pad SP1 and also can have 1 slit, it is possible to have 3 or more slits.
Effect similar to the above can be also obtained in such variation.
Figure 14 is the plan view for indicating to pad the position of the slit SL21 and SL22 of SP shown in Figure 13.It, will in Figure 14
Liner SP1 is indicated with the oblique line risen to the left.
Liner SP1 has along the 1st direction X part 1 SPP1 stretched out and part 2 SPP2 and stretches along the 2nd direction Y
Third portion SPP3 and the 4th part SPP4 out.Part 1 SPP1 and part 2 SPP2 respectively with third portion SPP3 and the 4th
SPP4 is divided to be connected.Part 1 SPP1 is between display unit DA and the 1st end EG1.Part 2 SPP2 be located at display unit DA with
Between 2nd end EG2.Third portion SPP3 is between display unit DA and the 3rd end EG3.4th part SPP4 is located at display unit
Between DA and the 4th end EG4.Pad SP1 has slit SL21 in part 2 SPP2, third portion SPP3, the 4th part SPP4
And SL22.That is, slit SL21 and SL22 are between the 2nd end EG2 and display unit DA, the 3rd end EG3 and display unit DA it
Between, between the 4th end EG4 and display unit DA.
In the example in the figures, the part 1 SE1 of seal SE is not Chong Die with the liner part 1 SPP1 of SP1.2nd
Divide SE2 Chong Die with the liner part 2 SPP2 of SP1.Third portion SE3 is Chong Die with the liner third portion SPP3 of SP1.4th part
SE4 is Chong Die with liner the 4th part SPP4 of SP1.
In addition, liner SP1 does not have slit SL21 and SL22 in part 1 SPP1.Due to the 1st of non-display portion NDA the
The width of the end side EG1 is wider than the width of the 2nd end EG2 to the 4th end side EG4 of non-display portion NDA, so seal SE
Part 1 SE1 does not reach the position Chong Die with the liner part 1 SPP1 of SP1.It therefore, can also be on part 1 SPP1
Slit SL21 and SL22 are not formed.Further, since the part 1 SE1 of seal SE has than part 2 SE2 to the 4th part
SE4 big width, so the adhesive strength of part 1 SE1 adhesive strength more respective than part 2 SE2 to the 4th part SE4 is strong.
Even if part 1 SPP1 overlapping of the part 1 SE1 relative to liner SP1 as a result, can not also form on part 1 SPP1
Slit SL21 and SL22.
Figure 15 is the cross-sectional view for indicating the 2nd variation of present embodiment shown in Figure 11.It is tied shown in Figure 15 and Figure 11
Structure is compared, different on this point slit SL1 does not penetrate through insulating film 14.
That is, insulating film 15 is penetrated into insulating film 14 by slit SL1.In addition, slit SL2 and SL3 also will not can also insulate
Film 14 penetrates through.Alternatively, 1 or 2 slits of certain of slit SL1 into SL3 are that the slit that does not penetrate through insulating film 14 can also be with.
Effect similar to the above can be also obtained in such variation.
As described above, according to the present embodiment, it can obtain can be realized the display device of reliability raising.
Disclosed main structure can be to liquid crystal display device application in the present embodiment.In addition, in this specification
Roughly equal performance allow for the error in manufacturing process.In addition, in present embodiment, if the configuration such as burrock portion BA exists
The width of component on 1st substrate SUB1 is measured near 10 side of insulating substrate, and the configuration of liner SP1 etc. is in the 2nd substrate
The width of component on SUB2 is measured near 20 side of insulating substrate.
In addition, illustrating several embodiments of the utility model, but these embodiments prompt as an example, no
It is the range of utility model to be limited.These new embodiments can be implemented in the form of other are various, not depart from
Various omissions, replacements and changes can be made in the range of the purport of utility model.These embodiments and modifications thereof are included in real
It in novel range or purport, and include in utility model documented by technical solution and its range of equal value.
Claims (16)
1. a kind of display device, which is characterized in that
Have the display unit with display image and surround the display panel of the non-display portion of above-mentioned display unit,
Above-mentioned display panel has:
1st substrate, have the 1st organic insulating film, 2nd organic insulating film of the configuration on above-mentioned 1st organic insulating film and
Burrock portion in above-mentioned non-display portion with above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film；
2nd substrate, it is opposed with above-mentioned 1st substrate；And
Seal, by above-mentioned 1st substrate and above-mentioned 2nd substrate bonding,
Above-mentioned burrock portion has the 1st slit for penetrating through above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film and upper
The 1st cutting part and the 2nd cutting part of the segmentation of the 1st slit are stated,
Above-mentioned seal is configured in above-mentioned 1st slit.
2. display device as described in claim 1, which is characterized in that
Above-mentioned 1st substrate has in above-mentioned non-display portion penetrates through above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film
Groove portion,
Above-mentioned burrock portion is located between the end and above-mentioned groove portion of above-mentioned display panel.
3. display device as claimed in claim 2, which is characterized in that
Above-mentioned 1st substrate is also equipped with:
Switch element has drain electrode；
Metal electrode connects in the 1st through hole that above-mentioned 1st organic insulating film is penetrated into above-mentioned drain electrode with above-mentioned drain electrode
Touching；And
Pixel electrode is electrically connected with above-mentioned metal electrode.
4. display device as claimed in claim 3, which is characterized in that
Above-mentioned 1st substrate is also equipped with:
Transparent electrode, it is electric with above-mentioned metal in the 2nd through hole that above-mentioned 2nd organic insulating film is penetrated into above-mentioned metal electrode
Pole contact；And
Inorganic insulating membrane is located on above-mentioned 2nd organic insulating film, has the 3rd through hole for penetrating into above-mentioned transparent electrode,
Pixel electrodes are located on above-mentioned inorganic insulating membrane, contact in above-mentioned 3rd through hole with above-mentioned transparent electrode.
5. display device as described in claim 1, which is characterized in that
Above-mentioned 2nd organic insulating film of the width of above-mentioned 1st organic insulating film of above-mentioned 1st cutting part than above-mentioned 1st cutting part
Width it is big,
Above-mentioned 2nd organic insulating film of the width of above-mentioned 1st organic insulating film of above-mentioned 2nd cutting part than above-mentioned 2nd cutting part
Width it is big.
6. display device as described in claim 1, which is characterized in that
In above-mentioned 1st slit by above-mentioned 2nd organic insulating film perforation part width than in above-mentioned 1st slit will be above-mentioned
The width of the part of 1st organic insulating film perforation is big.
7. display device as described in claim 1, which is characterized in that
The side of above-mentioned 1st slit has step between above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film.
8. display device as described in claim 1, which is characterized in that
Above-mentioned display panel has the 1st end stretched out along the 1st direction and the 2nd end, along the 2nd intersected with above-mentioned 1st direction
The mounting portion between the 3rd end and the 4th end and above-mentioned display unit and above-mentioned 1st end that direction is stretched out,
Above-mentioned 1st slit between above-mentioned 2nd end and above-mentioned display unit, between above-mentioned 3rd end and above-mentioned display unit, with
And between above-mentioned 4th end and above-mentioned display unit.
9. display device as described in claim 1, which is characterized in that
Above-mentioned burrock portion have the 2nd slit for penetrating through above-mentioned 1st organic insulating film and above-mentioned 2nd organic insulating film and by
3rd cutting part of above-mentioned 2nd slit segmentation,
Above-mentioned seal is configured in above-mentioned 2nd slit.
10. display device as described in claim 1, which is characterized in that
Above-mentioned burrock portion has the 3rd slit that above-mentioned 2nd organic insulating film is penetrated into above-mentioned 1st organic insulating film.
11. display device as described in claim 1, which is characterized in that
Above-mentioned 2nd substrate has to above-mentioned 1st substrate-side liner outstanding,
Above-mentioned burrock portion is opposed with above-mentioned liner.
12. display device as claimed in claim 11, which is characterized in that
The multiple obturators being diffused into above-mentioned seal are also equipped with,
Interval between interval and above-mentioned 2nd cutting part and above-mentioned liner between above-mentioned 1st cutting part and above-mentioned liner and
The diameter of above-mentioned obturator is roughly equal.
13. display device as claimed in claim 11, which is characterized in that
The end in above-mentioned burrock portion and the end of above-mentioned liner are located at the end of above-mentioned display panel.
14. display device as claimed in claim 11, which is characterized in that
Above-mentioned liner has the 4th slit for penetrating through above-mentioned liner and the 4th cutting part divided by above-mentioned 4th slit and the 5th point
Portion is cut,
Above-mentioned seal is configured in above-mentioned 4th slit.
15. display device as claimed in claim 14, which is characterized in that
Above-mentioned display panel has the 1st end stretched out along the 1st direction and the 2nd end, along the 2nd intersected with above-mentioned 1st direction
The mounting portion between the 3rd end and the 4th end and above-mentioned display unit and above-mentioned 1st end that direction is stretched out,
Above-mentioned 4th slit between above-mentioned 2nd end and above-mentioned display unit, between above-mentioned 3rd end and above-mentioned display unit, with
And between above-mentioned 4th end and above-mentioned display unit.
16. display device as claimed in claim 14, which is characterized in that
The 6th cutting part that above-mentioned liner has the 5th slit for penetrating through above-mentioned liner and divided by above-mentioned 5th slit,
Above-mentioned seal configuration is in above-mentioned 5th slit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-050138 | 2018-03-16 | ||
| JP2018050138A JP7030578B2 (en) | 2018-03-16 | 2018-03-16 | Display device |
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| CN209514246U true CN209514246U (en) | 2019-10-18 |
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| KR100652047B1 (en) * | 2001-12-29 | 2006-11-30 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Display Device |
| JP2009042292A (en) * | 2007-08-06 | 2009-02-26 | Hitachi Displays Ltd | Liquid crystal display apparatus |
| US9448441B2 (en) * | 2012-05-25 | 2016-09-20 | Sharp Kabushiki Kaisha | Liquid crystal display device |
| JP6192914B2 (en) * | 2012-10-01 | 2017-09-06 | 株式会社ジャパンディスプレイ | Display device and manufacturing method thereof |
| JP2017122790A (en) * | 2016-01-06 | 2017-07-13 | 株式会社ジャパンディスプレイ | Liquid crystal display device |
| CN107024813B (en) * | 2017-06-06 | 2020-10-02 | 厦门天马微电子有限公司 | Array substrate, liquid crystal display panel and display device |
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