CN209478007U - A kind of skive conducive to chip removal - Google Patents
A kind of skive conducive to chip removal Download PDFInfo
- Publication number
- CN209478007U CN209478007U CN201920081163.5U CN201920081163U CN209478007U CN 209478007 U CN209478007 U CN 209478007U CN 201920081163 U CN201920081163 U CN 201920081163U CN 209478007 U CN209478007 U CN 209478007U
- Authority
- CN
- China
- Prior art keywords
- matrix
- diamond abrasive
- abrasive layer
- hole
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910003460 diamond Inorganic materials 0.000 claims abstract description 51
- 239000010432 diamond Substances 0.000 claims abstract description 51
- 239000011159 matrix material Substances 0.000 claims abstract description 48
- 239000004575 stone Substances 0.000 claims abstract description 5
- 239000003082 abrasive agent Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000011435 rock Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 38
- 238000000227 grinding Methods 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 5
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011229 interlayer Substances 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 description 7
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of skive conducive to chip removal, including matrix and diamond abrasive layer, described matrix is circular discoid, hole is offered at matrix center, hole week, edge was perpendicular to the direction of matrix equipped with boss, the diamond abrasive layer is uniformly arranged on the side that matrix is equipped with boss, the diamond abrasive layer and matrix coaxial arrangement, diamond abrasive layer upper surface is evenly arranged with chip space, the chip space and diamond abrasive layer are at 35 ° of -40 ° of angles, chip space one end and outside the boss flush to be flushed on the outside of the other end and diamond abrasive layer, by opening up chip space in diamond abrasive layer, and the diametrical direction of chip space and diamond abrasive layer is angled, so that the scrap generated in stone process is smoothly discharged, it improves work efficiency, it works in coordination in matrix and the setting of diamond abrasive interlayer convex Column and through-hole increase the stability of grinding wheel operation, and opening up radiating groove effectively at matrix back prevents grinding wheel operational process medium temperature from spending height.
Description
Technical field
The utility model belongs to grinding class operated implement technical field more particularly to a kind of boart boart conducive to chip removal
Wheel.
Background technique
Grinding wheel is also known as bonded abrasive tool, be by bonding agent by conventional abrasive material be consolidated into certain shapes (majority for circle, center has
Through-hole), and the bonded abrasive tool with some strength.It is generally made of abrasive material, bonding agent and stomata, this three parts is frequently referred to solid
Tie the three elements of grinding tool.According to the different classifications of bonding agent, ceramic (bonding agent) grinding wheel, resin (bonding agent) sand common are
Wheel, rubber (bonding agent) grinding wheel.Grinding wheel is one kind that dosage is maximum in grinding tool, using face is most wide, high speed rotation when use, can be right
The outer circle of metal or non-metal workpiece, inner circle, plane and various type faces etc. are roughly ground, half refines and refine and slot and cut
Break.The characteristic of grinding wheel is mainly determined by factors such as abrasive material, granularity, bonding agent, hardness, tissue, shape and size.
And the abrading block flour milling of existing skive is mostly smooth slotless or arranges chip space along grinding wheel radial alignment,
And the cross sectional shape of chip space be easy to cause chip space to block, and the waste residue exclusion being ground when it is ground in this way is undesirable,
Grinding speed is slow, poor quality and waste grinding tool, seriously affects working efficiency.
Utility model content
For the problems in background, the purpose of this utility model is to provide a kind of skives conducive to chip removal.
To achieve the above object, the utility model provides a kind of skive conducive to chip removal, including matrix and gold
Hard rock abrasive material, described matrix are circular discoid, and hole is offered at matrix center, and hole and matrix coaxial arrangement, hole week edge hang down
It directly is equipped with boss in the direction of matrix, is flushed on the inside of boss with hole inside, the diamond abrasive layer is uniformly arranged on matrix and sets
There is the side of boss, flushed on the inside of diamond abrasive layer with outside the boss, is flushed on the outside of diamond abrasive layer and on the outside of matrix, institute
Diamond abrasive layer and matrix coaxial arrangement are stated, diamond abrasive layer upper surface is evenly arranged with chip space, the chip removal
Slot and diamond abrasive layer flush outside the other end and diamond abrasive layer at 35 ° of -40 ° of angles, chip space one end and outside the boss
Side flushes.
In order to make the scrap in chip space be easier to be discharged, it is wider than chip removal trench bottom, the chip space bottom at the top of chip space
Portion is arc-shaped.
Matrix and diamond abrasive layer produce relative sliding in order to prevent, and described matrix and diamond abrasive layer combine one side
Outside is nearby equipped with pillar, and the diamond abrasive layer offers and the matched through-hole of pillar, the pillar bottom and matrix one
Body formed, pillar runs through through-hole, and the pillar upper end and diamond abrasive layer upper surface flush.
It is more firm when in order to install and use grinding wheel, groove is equipped on the inside of the hole, groove one end and base bottom are neat
It flushes at the top of advection fog one end and boss, is wider than at groove notch at the groove slot bottom.
In order to reach service life expected from grinding wheel, the diamond abrasive layer with a thickness of 25-30 millimeters.
Temperature is excessively high when grinding wheel operates in order to prevent, and described matrix bottom diametrically offers radiating groove, radiating groove
Near bottom to matrix and diamond abrasive layer junction.
The beneficial effects of the utility model have: the skive of the utility model is by opening up row in diamond abrasive layer
Consider slot to be worth doing, and the diametrical direction of chip space and diamond abrasive layer is angled, so that generated in stone process
Scrap is smoothly discharged, and improves work efficiency, and the pillar and through-hole worked in coordination is arranged in matrix and diamond abrasive interlayer, into
One step increases the stability of grinding wheel operation, and opening up radiating groove effectively at matrix back prevents grinding wheel operational process medium temperature from spending
It is high.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of skive conducive to chip removal of the utility model.
Fig. 2 is a kind of skive side view conducive to chip removal shown in FIG. 1.
Detailed description of the invention: 1- matrix；2- diamond abrasive layer；The hole 3-；4- boss；5- chip space；6- pillar；7- through-hole；8-
Groove；9- radiating groove.
Specific embodiment
In order to be more clearly understood that the technical solution of the utility model, the utility model is carried out in conjunction with following instance further
Detailed description.It should be appreciated that specific embodiment described herein is only used to explain utility model, it is not used to limit this
Utility model.
A kind of skive conducive to chip removal, including matrix 1 and diamond abrasive layer 2, described matrix 1 are circular discs
Shape offers hole 3 at 1 center of matrix, and hole 3 and matrix 1 are coaxially disposed, the 3 weeks edges in hole perpendicular to matrix 1 direction equipped with boss
4, it flushes on the inside of the inside of boss 4 and hole 3, the diamond abrasive layer 2 is uniformly arranged on the side that matrix 1 is equipped with boss 4, Buddha's warrior attendant
It flushes, is flushed on the outside of 2 outside of diamond abrasive layer and matrix 1, the diamond abrasive on the outside of 2 inside of the stone mill bed of material and boss 4
Layer 2 and matrix 1 are coaxially disposed, and 2 upper surface of diamond abrasive layer is evenly arranged with chip space 5, the chip space 5 and Buddha's warrior attendant
The stone mill bed of material 2 flushes the other end and 2 outside of diamond abrasive layer is neat at 35 ° of -40 ° of angles on the outside of 5 one end of chip space and boss 4
It is flat.
Preferably, in order to make the scrap in chip space 5 be easier to be discharged, it is wider than 5 bottom of chip space, institute at the top of chip space 5
5 bottom of chip space is stated to be arc-shaped.
Preferably, matrix 1 and diamond abrasive layer 2 produce relative sliding in order to prevent, described matrix 1 and diamond abrasive
Layer combine one side outside nearby be equipped with pillar 6, the diamond abrasive layer 2 offer with the matched through-hole 7 of pillar 6, it is described convex
6 bottom of column and matrix 1 are integrally formed, and pillar 6 runs through through-hole 7, and 6 upper end of pillar and 2 upper surface of diamond abrasive layer flush.
Preferably, in order to more firm when installing and using grinding wheel, be equipped with groove 8 on the inside of the hole 3,8 one end of groove and
1 bottom of matrix flushes to be flushed at the top of the other end and boss 4, is wider than at groove notch at 8 slot bottom of groove.
Preferably, in order to reach service life expected from grinding wheel, the diamond abrasive layer 2 with a thickness of 25-30 millimeters.
Preferably, temperature is excessively high when grinding wheel operates in order to prevent, and 1 bottom of described matrix diametrically offers radiating groove
9, near 9 bottom of radiating groove to matrix 1 and diamond abrasive layer junction.
The course of work: when installation grinding wheel, the position of 3 inner groovy 8 of control wells installs grinding wheel to required equipment, grinding wheel fortune
When turning, phase mutual friction occurs for the workpiece and diamond abrasive layer 2 of required processing, and the scrap for the generation that rubs enters chip space 5 and works as
In, because the chip space 5 and 2 diametrical direction of diamond abrasive layer are angled, and 5 trench bottom of chip space is narrower than top
Portion, bottom are arc-shaped, and when grinding wheel runs at high speed, the scrap in chip space 5 is discharged under the action of the centrifugal force, grinding wheel high speed
Operating temperature constantly rises, and under the action of radiating groove 9, so that heat distributes faster, cools down faster for grinding wheel.
The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are also included in the patent protection scope of the utility model.
Claims (6)
1. a kind of skive conducive to chip removal, including matrix (1) and diamond abrasive layer (2), described matrix (1) is circle
Plate-like offers hole (3) at matrix (1) center, the coaxial arrangement of hole (3) and matrix (1), and hole (3) week, edge was perpendicular to matrix (1)
Direction be equipped with boss (4), flushed on the inside of boss (4) and on the inside of hole (3), the diamond abrasive layer (2) is uniformly arranged on base
Body (1) is equipped with the side of boss (4), flushes on the inside of diamond abrasive layer (2) with boss (4) outside, diamond abrasive layer (2) is outside
It is flushed on the outside of side and matrix (1), the diamond abrasive layer (2) and matrix (1) coaxial arrangement, which is characterized in that the Buddha's warrior attendant
The stone mill bed of material (2) upper surface is evenly arranged with chip space (5), and the chip space (5) and diamond abrasive layer (2) are at 35 ° -40 °
It flushes on the outside of angle, chip space (5) one end and boss (4) and is flushed on the outside of the other end and diamond abrasive layer (2).
2. a kind of skive conducive to chip removal according to claim 1, which is characterized in that wide at the top of chip space (5)
In chip space (5) bottom, chip space (5) bottom is arc-shaped.
3. a kind of skive conducive to chip removal according to claim 1, which is characterized in that described matrix (1) and gold
Hard rock abrasive material combines one side outside to be nearby equipped with pillar (6), and the diamond abrasive layer (2) offers to be matched with pillar (6)
Through-hole (7), pillar (6) bottom and matrix (1) be integrally formed, and pillar (6) runs through through-hole (7), pillar (6) upper end
It is flushed with diamond abrasive layer (2) upper surface.
4. a kind of skive conducive to chip removal according to claim 1, which is characterized in that set on the inside of the hole (3)
Fluted (8), groove (8) one end and matrix (1) bottom flush to be flushed at the top of the other end and boss (4), groove (8) slot bottom
Place is wider than at groove notch.
5. a kind of skive conducive to chip removal according to claim 1, which is characterized in that the diamond abrasive layer
(2) with a thickness of 25-30 millimeters.
6. a kind of skive conducive to chip removal according to claim 1, which is characterized in that described matrix (1) bottom
It diametrically offers radiating groove (9), near radiating groove (9) bottom to matrix (1) and diamond abrasive layer junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920081163.5U CN209478007U (en) | 2019-01-18 | 2019-01-18 | A kind of skive conducive to chip removal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920081163.5U CN209478007U (en) | 2019-01-18 | 2019-01-18 | A kind of skive conducive to chip removal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209478007U true CN209478007U (en) | 2019-10-11 |
Family
ID=68131504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920081163.5U Active CN209478007U (en) | 2019-01-18 | 2019-01-18 | A kind of skive conducive to chip removal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209478007U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110919556A (en) * | 2019-12-31 | 2020-03-27 | 桂林创源金刚石有限公司 | Cup-shaped grinding wheel rapid running-in structure |
-
2019
- 2019-01-18 CN CN201920081163.5U patent/CN209478007U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110919556A (en) * | 2019-12-31 | 2020-03-27 | 桂林创源金刚石有限公司 | Cup-shaped grinding wheel rapid running-in structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 061000 Wang Weitun Industrial Park, Machang Town, Qing County, Cangzhou City, Hebei Province Patentee after: Hebei Shunda Grinding Wheel Manufacturing Co.,Ltd. Country or region after: China Address before: 061000 Wang Weitun Industrial Park, Machang Town, Qing County, Cangzhou City, Hebei Province Patentee before: QINGXIAN SHUNDA GRINDING WHEEL MANUFACTURING Co.,Ltd. Country or region before: China |