CN209477528U - A kind of short pulse duration laser cutting device - Google Patents
A kind of short pulse duration laser cutting device Download PDFInfo
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- CN209477528U CN209477528U CN201821601452.5U CN201821601452U CN209477528U CN 209477528 U CN209477528 U CN 209477528U CN 201821601452 U CN201821601452 U CN 201821601452U CN 209477528 U CN209477528 U CN 209477528U
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Abstract
The utility model provides a kind of short pulse duration laser cutting device.The short pulse duration laser cutting device includes laser, expand device, collimator apparatus, reflecting mirror, cutting head and mobile platform.The laser is MOPA ultraviolet laser, and the laser beam pulsewidth of output is not more than 10ns.Short pulse duration laser cutting device provided in this embodiment, control by industry control unit to laser, galvanometer and processing platform, it is cut, there is the characteristic of output short pulse duration, high frequency lasers using MOPA ultraviolet laser, adjust cutting parameter, accurately workpiece to PI/FPC material the cutting of high quality can be carried out, avoid the defects of being carbonized, changing colour at joint-cutting.The apparatus structure is simple, easily operated, solves the cutting problem of the high quality and low cost to PI/FPC material.The machining accuracy for improving workpiece promotes the quality of product, improves the competitiveness of enterprise.
Description
Technical field
The utility model relates to technical field of laser processing more particularly to a kind of short pulse duration laser cutting devices.
Background technique
Laser processing is that laser processing can be substantially divided into laser heat and added according to the mechanism of laser beam and material interaction
Work and photochemical reaction process two classes.Laser heat processing refers to the fuel factor generated using laser beam projects to material surface come complete
At process, including the cutting of laser welding, laser engraving, surface modification, laser mark, laser drill and micro Process
Deng；Photochemical reaction processing refers to that laser beam is irradiated to object, causes or control photochemistry by high-density laser high-energy photon
The process of reaction.
In the prior art, when carrying out the workpiece of processing PI/FPC material using laser, (it is greater than usually using long pulsewidth
Ultraviolet laser 10ns), however cut quality is bad, the problems such as will appear carbonization at joint-cutting, change colour；Also there is use picosecond
(less than 20 picoseconds) ultraviolet laser, cut quality is good, but at high cost, is unfavorable for industrialized production.
Utility model content
Technical problem to be solved in the utility model is to guarantee to cut how using the workpiece for laser machining PI/FPC material
Production cost is reduced while cutting quality.
To solve the above-mentioned problems, the utility model proposes following technical schemes:
In a first aspect, the present embodiment proposes a kind of short pulse duration laser cutting device, which includes
Including sequentially connected laser, expand device, diaphragm, galvanometer, focusing device and processing platform, which is characterized in that further include
For controlling the industry control unit of the laser, galvanometer and processing platform, the laser is MOPA ultraviolet laser.
Further technical solution is for it, and the pulsewidth of the laser output is not more than 10ns.
Further technical solution is for it, and it is 2-10 times that the expand device, which expands multiple,.
Further technical solution is for it, and the diaphragm is used to control the output of laser, adjusts the power of light beam,
Further technical solution is for it, and the focusing device is focus lamp, is used for focused laser beam.
Further technical solution is for it, and industry control unit drives galvanometer, to control laser beam in the inclined of X-Y plane
Turn.
Further technical solution is for it, the power of the adjustable output laser beam of the diaphragm.
Further technical solution is for it, and the laser power is 7W.
Further technical solution is for it, and the processing platform is to be movably arranged, and it is flat that workpiece to be processed is set to processing
On platform, workpiece to be processed movement is driven by processing platform.
Second aspect, the utility model embodiment propose that a kind of be cut by laser using short pulse duration as described in relation to the first aspect is filled
Set the method being cut by laser, comprising the following steps:
Workpiece to be processed is fixed on processing platform, machining path is arranged by S1；
S2 opens laser, laser spot is focused on inside workpiece to be processed；
S3, control processing platform is mobile by the machining path, makes the laser beam of output according to machining path to be added
Work workpiece is cut；The optical maser wavelength wherein exported is 355nm, frequency 100kHz-10MHz.
Further technical solution is for it, and the pulse width of the laser beam is 100ps-10ns.
Further technical solution is for it, after the laser beam line focus device of the laser output focuses, positive burnt
Locate spot diameter less than 30 μm.
Further technical solution is for it, and the pulse energy of the laser beam is less than or equal to 20 μ J.
Compared with prior art, the attainable technical effect of the utility model institute includes:
The utility model proposes short pulse duration laser cutting device, by industry control unit to laser, galvanometer and add
The control of work platform has the characteristic of output short pulse duration, high frequency lasers, using MOPA ultraviolet laser by adjusting laser cutting
Parameter accurately workpiece to PI/FPC material can carry out the cutting of high quality, avoid the defects of being carbonized, changing colour at joint-cutting.The dress
It sets that structure is simple, easily operated, solves the cutting problem of the high quality and low cost to PI/FPC material.Improve adding for workpiece
Work precision promotes the quality of product, reduces production cost, improves the competitiveness of enterprise.
Detailed description of the invention
In order to illustrate more clearly of the utility model embodiment technical solution, will make below to required in embodiment description
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the utility model, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram for the short pulse duration laser cutting device that the utility model embodiment proposes.
Appended drawing reference
Laser 1, expand device 2, diaphragm 3, galvanometer 4, focusing device 5, workpiece to be processed 6, processing platform 7, industry control list
Member 8.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, the technical solution in embodiment is carried out it is clear, complete
Ground describes, and similar reference numerals represent similar component in attached drawing.Obviously, will be described below embodiment is only that this is practical
Novel a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
Member's every other embodiment obtained without creative efforts, belongs to the model of the utility model protection
It encloses.
It should be appreciated that ought use in this specification and in the appended claims, term " includes " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, the presence or addition of element, component and/or its set.
It is also understood that specific merely for the sake of describing in this utility model embodiment term used in the description
The purpose of embodiment and be not intended to limit the utility model embodiment.Such as in the utility model embodiment specification and appended power
As used in sharp claim, other situations unless the context is clearly specified, otherwise " one " of singular, "one"
And "the" is intended to include plural form.
Referring to Fig. 1, the utility model proposes a kind of short pulse duration laser cutting devices.As seen from the figure, which cuts
Cutting device includes the laser 1 being sequentially arranged along laser optical path, and expand device 2, diaphragm 3, galvanometer 4, focusing device 5 and processing are flat
Platform 7.Wherein, laser 1 is MOPA ultraviolet laser, can produce high frequency (100kHz-10MHz), pulsewidth no more than 10ns's
Laser beam.Expand device 2 is beam expanding lens, and the laser beam for generating to laser 1 carries out expanding processing.Diaphragm 3 is used for
The output for controlling laser, adjusts the power of light beam.In the present embodiment, focusing device 5 is focus lamp, is used for focused laser beam,
Workpiece is laser machined.For processing platform 7 for carrying and moving workpiece to be processed 6, processing platform 7 is needed according to processing can
It is moved along the direction X-Y.
In addition, the short pulse duration laser cutting device further includes industry control unit 8, galvanometer 4 is driven by industry control unit 8, can
Laser beam is controlled in the deflection of X-Y plane, so that laser cutting is more accurate efficiently.Industry control unit 8 by control laser 1,
Galvanometer 4 and processing platform 7 are, it can be achieved that accurate processing to workpiece.When processing large-scale workpiece, can by mobile galvanometer 4 with
And processing platform 7 adjusts the Working position of workpieces processing, improves cut quality.
In the present embodiment, industry control unit 8 is computer.
In the present embodiment, the multiple that expands of the beam expanding lens of selection is 2-10 times.When processing, by adjusting expanding for beam expanding lens
The size of laser facula is adjusted in multiple and focus lamp.
Continuing with referring to Fig. 1, the utility model embodiment proposes that a kind of short pulse duration using as described in above-described embodiment swashs
The method that light cutter device is cut by laser, includes the following steps:
Workpiece to be processed is fixed on processing platform, machining path is arranged by S1；
S2 opens laser, laser spot is focused on inside workpiece to be processed；
S3, control processing platform is mobile by the machining path, makes the laser beam of output according to machining path to be added
Work workpiece is cut；The optical maser wavelength wherein exported is 355nm, frequency 100kHz-10MHz.
For example, in one embodiment, the laser frequency of output is 100kHz, 300kHz, 500kHz, 800kHz, 1MHz,
2MHz, 4MHz, 7MHz or 10MHz etc..
In certain embodiments, the pulse width of the laser beam is 100ps-10ns.For example, in one embodiment,
The pulse width of the laser beam is 100ps, 300ps, 500ps, 700ps, 2ns, 3ns, 5ns, 7ns or 10ns etc..It is logical
The short pulse duration for crossing output is combined with high frequency can effectively avoid excessive laser energy calcination material, occur being carbonized or becoming at joint-cutting
Color defect, to effectively control the influence of fuel factor.
In certain embodiments, after the laser beam line focus device of the laser output focuses, the hot spot at positive coke
Diameter is less than 30 μm.For example, in one embodiment, expanding multiple and focus lamp by adjusting beam expanding lens, laser being adjusted
The diameter of hot spot is 29 μm, 24 μm, 20 μm, 15 μm, 13 μm, 10 μm, 7 μm, 4 μm or 2 μm etc..
In certain embodiments, the pulse energy of the laser beam is less than or equal to 20 μ J.For example, in an embodiment
In, pulsed laser energy is 20 μ J, 18 μ J, 14 μ J, 12 μ J, 8 μ J, 5 μ J, 3 μ J or 1 μ J etc.
In some embodiments, such as the present embodiment, the workpiece of the PI material with a thickness of 33 μm is processed, industry control unit is passed through
8 adjustment laser output parameters: the scanning machining speed of output pulse width 1ns, frequency 1MHz, power 7W, laser is
1200mm/s.In this way, the workpiece joint-cutting processed is perfect, the defects of not deforming, change colour.
Short pulse duration laser cutting device provided in this embodiment is flat to laser, galvanometer and processing by industry control unit
The control of platform has the characteristic of output short pulse duration, high frequency lasers using MOPA ultraviolet laser, by adjusting laser cutting ginseng
Number accurately workpiece to PI/FPC material can carry out the cutting of high quality, avoid the defects of being carbonized, changing colour at joint-cutting.The device
Structure is simple, easily operated, solves the cutting problem of the high quality and low cost to PI/FPC material.Improve the processing of workpiece
Precision promotes the quality of product, improves the competitiveness of enterprise.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, reference can be made to the related descriptions of other embodiments.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art
Novel spirit and scope.In this way, even these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.
The above is specific embodiment of the present utility model, but the protection scope of the utility model is not limited to
This, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in various etc.
The modifications or substitutions of effect, these modifications or substitutions should be covered within the scope of the utility model.Therefore, this is practical new
The protection scope of type should be subject to the protection scope in claims.
Claims (1)
1. a kind of short pulse duration laser cutting device, including sequentially connected laser, expand device, diaphragm, galvanometer, focusing device
And processing platform, which is characterized in that it further include the industry control unit for controlling the laser, galvanometer and processing platform, it is described
Laser is MOPA ultraviolet laser；The pulsewidth of the laser output is not more than 10ns；The expand device expands multiple
2-10 times；The focusing device is focus lamp, is used for focused laser beam；The industry control unit drives galvanometer, so that control swashs
Deflection of the light light beam in X-Y plane；The laser power is 7W；The processing platform is to be movably arranged, workpiece to be processed
It is set on processing platform, workpiece to be processed movement is driven by processing platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821601452.5U CN209477528U (en) | 2018-09-29 | 2018-09-29 | A kind of short pulse duration laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821601452.5U CN209477528U (en) | 2018-09-29 | 2018-09-29 | A kind of short pulse duration laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209477528U true CN209477528U (en) | 2019-10-11 |
Family
ID=68114094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821601452.5U Active CN209477528U (en) | 2018-09-29 | 2018-09-29 | A kind of short pulse duration laser cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209477528U (en) |
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2018
- 2018-09-29 CN CN201821601452.5U patent/CN209477528U/en active Active
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