CN209447778U - 在半导体处理中用于衬底的真空固持器 - Google Patents
在半导体处理中用于衬底的真空固持器 Download PDFInfo
- Publication number
- CN209447778U CN209447778U CN201920595587.3U CN201920595587U CN209447778U CN 209447778 U CN209447778 U CN 209447778U CN 201920595587 U CN201920595587 U CN 201920595587U CN 209447778 U CN209447778 U CN 209447778U
- Authority
- CN
- China
- Prior art keywords
- adsorption device
- holding board
- vacuum adsorption
- vacuum
- separation wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 74
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000000926 separation method Methods 0.000 claims abstract description 46
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 230000035515 penetration Effects 0.000 claims abstract description 3
- 239000012634 fragment Substances 0.000 claims description 5
- 239000011265 semifinished product Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011156 metal matrix composite Substances 0.000 claims description 2
- 229920013657 polymer matrix composite Polymers 0.000 claims description 2
- 239000011160 polymer matrix composite Substances 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000006978 adaptation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920595587.3U CN209447778U (zh) | 2019-04-28 | 2019-04-28 | 在半导体处理中用于衬底的真空固持器 |
DE202019102647.2U DE202019102647U1 (de) | 2019-04-28 | 2019-05-10 | Vakuumhalter für Substrate in der Halbleiterbearbeitung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920595587.3U CN209447778U (zh) | 2019-04-28 | 2019-04-28 | 在半导体处理中用于衬底的真空固持器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209447778U true CN209447778U (zh) | 2019-09-27 |
Family
ID=67550706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920595587.3U Active CN209447778U (zh) | 2019-04-28 | 2019-04-28 | 在半导体处理中用于衬底的真空固持器 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN209447778U (zh) |
DE (1) | DE202019102647U1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116325118A (zh) * | 2020-10-23 | 2023-06-23 | 科磊股份有限公司 | 高流量真空卡盘 |
-
2019
- 2019-04-28 CN CN201920595587.3U patent/CN209447778U/zh active Active
- 2019-05-10 DE DE202019102647.2U patent/DE202019102647U1/de active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116325118A (zh) * | 2020-10-23 | 2023-06-23 | 科磊股份有限公司 | 高流量真空卡盘 |
CN116325118B (zh) * | 2020-10-23 | 2024-02-13 | 科磊股份有限公司 | 高流量真空卡盘 |
Also Published As
Publication number | Publication date |
---|---|
DE202019102647U1 (de) | 2019-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Peng Shou Inventor after: Yin Xinjian Inventor after: Daniel Menos Inventor after: Bastian Hipkin Inventor after: Michael Hall Inventor after: Fu Ganhua Inventor before: Peng Shou Inventor before: Daniel Menos Inventor before: Bastian Hipkin Inventor before: Michael Hall Inventor before: Fu Jing Hua Inventor before: Yin Xinjian |