CN209435097U - 可供直流电源供应器功率模组用的转接板结构 - Google Patents

可供直流电源供应器功率模组用的转接板结构 Download PDF

Info

Publication number
CN209435097U
CN209435097U CN201920371250.4U CN201920371250U CN209435097U CN 209435097 U CN209435097 U CN 209435097U CN 201920371250 U CN201920371250 U CN 201920371250U CN 209435097 U CN209435097 U CN 209435097U
Authority
CN
China
Prior art keywords
power modules
pinboard
slot
power supply
control line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920371250.4U
Other languages
English (en)
Inventor
林睦钧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QINGHONG ELECTRONIC ENTERPRISE CO Ltd
Chyng Hong Electronic Co Ltd
Original Assignee
QINGHONG ELECTRONIC ENTERPRISE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to TW108200947U priority Critical patent/TWM577968U/zh
Application filed by QINGHONG ELECTRONIC ENTERPRISE CO Ltd filed Critical QINGHONG ELECTRONIC ENTERPRISE CO Ltd
Priority to CN201920371250.4U priority patent/CN209435097U/zh
Priority to US16/363,972 priority patent/US10609846B1/en
Priority to DE202019001474.8U priority patent/DE202019001474U1/de
Priority to JP2019001294U priority patent/JP3221909U/ja
Application granted granted Critical
Publication of CN209435097U publication Critical patent/CN209435097U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/026Multiple connections subassemblies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14325Housings specially adapted for power drive units or power converters for cabinets or racks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/047Box-like arrangements of PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Abstract

本实用新型提供一种可供直流电源供应器功率模组用的转接板结构,该直流电源供应器包含有一机箱,该机箱内设有一主电路控制板以及至少一功率模组,该功率模组的一侧设有一副电路控制板,该副电路控制板上设有一第三输入插槽以及一第三输出插槽,而可供插接一控制线,而该功率模组的另一侧则设有一转接板,该转接板上亦设有一第一输入插槽以及一第一输出插槽,以供该控制线插接,借此,该功率模组可通过该转接板电性相接,且该转接板还兼具有屏蔽及导风作用,而可隔离杂讯及电磁干扰,并提高散热效果。

Description

可供直流电源供应器功率模组用的转接板结构
技术领域
本实用新型与一种直流电源供应器有关,特别是指一种可供直流电源供应器功率模组用的转接板结构。
背景技术
如今,直流电源供应器为适应客户的需求,需有不同的额定输出功率,但若不同额定输出功率的电源供应器都开发一种机型,不仅成本过高,且不具效益,故请参阅图1,业者往往使用同一机箱1,并开发单一输出功率的功率模组2,如图2所示,该功率模组2底部设有一底座3,前端设有一风扇4,另于一侧纵向设有一立板5,一电路板6则固设于立板5上,再依电源供应器所需的额定输出功率,装设相对应所需数量的功率模组2于机箱1内,如图3所示,于该机箱1内装设有三组功率模组2,而每一功率模组2的电路板3均分别通过一等长的控制线7比邻串接,再连接至一主电路板8,借由该多个功率模组2的串联,提供所需额定的输出功率,例如当该功率模组2输出功率为5kw时,若该直流电源供应器装设有三组功率模组2时,则其额定输出功率即为15kw,而当直流电源供应器的额定输出功率只需要5kw或10kw时,则该机箱1内便仅需装设一组功率模组2或二组功率模组2加以串联,此时由于机箱1的空间内未能完全置满该功率模组2,为维持机箱1的重心,往往会调整功率模组2于机箱1内所装设的位置,请参阅图4所示,即为当机箱1内仅装设有二组功率模组2时,该多个功率模组2采靠机箱1左右两侧来装设,以维持机箱1的重心,此时该多个功率模组2中间便形成空缺,原本的控制线7便无法经由该多个功率模组2的电路板6相互串接,而使功率模组2必须以不同长度的控制线9相连接,不仅造成配线上的困扰,会使电源供应器的输出品质下降,以及维修不便,此外,因其中一功率模组2的一侧因机箱1中间空缺而无遮蔽,造成该功率模组2冷却风扇的冷却风往外散逸,影响该功率模组2的散热效果。
实用新型内容
本实用新型的目的在提供一种可供直流电源供应器功率模组用的转接板结构,除了使电源供应器的配线简化外,还兼具隔离杂讯及电磁干扰的屏蔽效果,以及提高功率模组散热效果的导风效果。
为达上述目的,本实用新型所提供的可供直流电源供应器功率模组用的转接板结构,该直流电源供应器包含有一机箱,该机箱内设有一主电路控制板以及至少一功率模组,该主电路控制板上设有一第二输出插槽,该功率模组邻近该主电路控制板的一侧纵向设有一立板,立板上设有一副电路控制板,该副电路控制板上设有一第三输入插槽以及一第三输出插槽,而可供插设一控制线,其主要特征在于:一转接板,其对应该功率模组而纵向设于该功率模组的另一侧,该转接板的尺寸大小涵盖该功率模组的一侧,且该转接板上于该副电路控制板相对应处亦设有一第一输入插槽以及一第一输出插槽,使该第一输入插槽以及该第一输出插槽亦可供插设该控制线,又该转接板上设有一铜箔,使该转接板的其中一面被该铜箔所覆盖。
可选的,该转接板为印刷电路板所构成。
可选的,该转接板顶面对应该第一输入插槽以及该第一输出插槽位置处设有一缺口,使该控制线可跨越该缺口。
可选的,该控制线为一扁平的排线,且该控制线包覆有一热收缩套管。
可选的,该功率模组下方具有一底座,该底座的一侧纵向朝上延伸有一锁固板,该转接板则锁固于该锁固板上。
本实用新型所提供的可供直流电源供应器功率模组用的转接板结构,通过该转接板设于该功率模组的一侧,且该转接板上设有该第一输入插槽以及该第一输出插槽,以供该控制线插设,借此,该主电路控制板与该功率模组可通过该转接板相连接,且还可作为该功率模组的屏蔽,而可隔离杂讯及电磁干扰,并作为冷却风扇的导风作用,提高功率模组的散热效果。
附图说明
图1为现有直流电源供应器的立体图;
图2为现有直流电源供应器功率模组的立体图;
图3为现有直流电源供应器于机箱内装设有三组功率模组形成满载的示意图;
图4为现有直流电源供应器于机箱内装设有二组功率模组而形成中间空缺的示意图;
图5为本实用新型的较佳实施例的立体图;
图6为本实用新型的较佳实施例的前视图;
图7为本实用新型的转接板装设于一功率模组的立体图;
图8为本实用新型于机箱内装设有二组功率模组时的使用示意图;
图9为本实用新型于机箱内装设有一组功率模组时的使用示意图。
图中:
1机箱;2功率模组;3底座;4风扇;5立体;6电路板;7控制线;8主电路板;
9控制线;
10转接板;11第一输入插槽;12第一输出插槽;13缺口;14锁固孔;15铜箔;20机箱;
30主电路控制板;31第二输出插槽;32连接线;40功率模组;41底座;411立板;
412锁固板;50副电路控制板;51第三输入插槽;52第三输出插槽;60控制线;61热收缩套管。
具体实施方式
请参阅图5及图6所示,本实用新型的较佳实施例的立体图及前视图,其提供一种可供直流电源供应器功率模组用的转接板结构,包含有:
一转接板10,为印刷电路板所构成,其一面后端的上方设有一第一输入插槽11以及一第一输出插槽12,且该转接板10顶面对应该第一输入插槽11以及该第一输出插槽12位置处设有一缺口13,另该转接板10下方设有数个锁固孔14,又该转接板10上则设有一铜箔15,该铜箔15贴附于该转接板10的另一面,使该转接板10被该铜箔15所覆盖形成屏蔽的作用。
请参阅图7所示,显示本实用新型的转接板装设于一功率模组的立体图,该功率模组40下方具有一金属材质的底座41,该底座41的一侧纵向朝上延伸有一同为金属材质的立板411,该立板411上设有一副电路控制板50,其中,该底座41另一侧纵向朝上延伸有一锁固板412,该转接板10则借由该锁固孔14锁固于该锁固板412上,且该转接板10的尺寸大小能够涵盖该功率模组40的一侧,借此使该功率模组40的两侧分别可借由该立板411及转接板10形成屏蔽作用,而可隔离杂讯及电磁干扰,另该功率模组40前方具有一冷却风扇42,使得该冷却风扇42可借由该立板411及转接板10的导风作用,可让该冷却风扇42所送出的冷却风不致于往外扩散,而能集中于该功率模组40上,达到更优秀的散热效果。
请参阅图8所示,本实用新型的第一实施例的使用示意图,显示于一机箱20内仅装设有二组功率模组40时的使用示意图,该机箱20内设有一主电路控制板30以及二功率模组40,该主电路控制板30上设有一第二输出插槽31,该多个功率模组40分别设于该机箱10的左右两侧,使该机箱10整体配重平衡,但于机箱20中间则形成空缺,另该主电路控制板30的第二输出插槽31插设有一连接线32,该连接线32的另一端插设于其中一副电路控制板50的第三输入插槽51,接着再通过一控制线60的一端插设于该副电路控制板50的第三输出插槽52,该控制线60的另一端则跨过该缺口13插设于该转接板10的第一输入插槽11,接着再通过另一控制线60的一端插设于该转接板10的第一输出插槽12,另一端则连接至另一副电路控制板50的第三输入插槽51,借此,使该主电路控制板30均能与该多个功率模组40电性相连接,而使该主电路控制板30能驱动该多个功率模组40,该电源供应器能通过该多个功率模组40整流串联后,将该多个功率模组40合并的功率予以输出。
由于该多个功率模组40之间的间隔距离相同,使每一控制线60的长度均为一致,且该多个副电路控制板50与该转接板10之间分别通过该控制线60相连接,使该机箱10内的线路排列整齐,以方便维修或更换,又该控制线60为一扁平的排线,且该控制线60的外周包覆有一热收缩套管61,以提高该控制线60的耐压绝缘效果。
此外,由于该功率模组40两侧分别设有该立板411及该转接板10,而形成导风板作用,使得该冷却风扇42所送出的冷却风受到该立板411及该转接板10的局限,不致于往外扩散,而能集中于该功率模组40上,达到更优秀的散热效果。
另外,由于该立板411为金属材质,而该转接板10内则设有金属材质的铜箔,使该功率模组40两侧形成一安全的屏蔽,而可隔离杂讯及电磁干扰。
请再参阅图9所示,本实用新型的第二实施例的使用示意图,显示于机箱20内仅装设有一组功率模组40时的使用示意图,该功率模组40设于该机箱10的中间位置处,使该机箱10整体配重平衡,于电性连接时,该功率模组40同样可借由该控制线60连接至主电路控制板30,形成电性连接,同时该功率模组40借由该转接板10的设置,同样形成导风及屏蔽效果。
以上所述实施例仅是为充分说明本实用新型而所举的较佳的实施例,本实用新型的保护范围不限于此。本技术领域的技术人员在本实用新型基础上所作的等同替代或变换,均在本实用新型的保护范围之内。本实用新型的保护范围以权利要求书为准。

Claims (5)

1.一种可供直流电源供应器功率模组用的转接板结构,该直流电源供应器包含有一机箱,该机箱内设有一主电路控制板以及至少一个功率模组,该主电路控制板上设有一第二输出插槽,该功率模组邻近该主电路控制板的一侧纵向设有一立板,该立板上设有一副电路控制板,该副电路控制板上设有一第三输入插槽以及一第三输出插槽,供插设一控制线,其特征在于:
一转接板,其对应该功率模组而纵向设于该功率模组的另一侧,该转接板的尺寸大小涵盖该功率模组的一侧,且该转接板上于该副电路控制板相对应处亦设有一第一输入插槽以及一第一输出插槽,使该第一输入插槽以及该第一输出插槽亦能够插设该控制线,又该转接板上设有一铜箔,使该转接板的其中一面被该铜箔所覆盖。
2.如权利要求1所述的可供直流电源供应器功率模组用的转接板结构,其特征在于,该转接板为印刷电路板所构成。
3.如权利要求1所述的可供直流电源供应器功率模组用的转接板结构,其特征在于,该转接板顶面对应该第一输入插槽以及该第一输出插槽位置处设有一缺口,使该控制线能够跨越该缺口。
4.如权利要求1所述的可供直流电源供应器功率模组用的转接板结构,其特征在于,该控制线为一扁平的排线,且该控制线包覆有一热收缩套管。
5.如权利要求1所述的可供直流电源供应器功率模组用的转接板结构,其特征在于,该功率模组下方具有一底座,该底座的一侧纵向朝上延伸有一锁固板,该转接板则锁固于该锁固板上。
CN201920371250.4U 2019-01-19 2019-03-22 可供直流电源供应器功率模组用的转接板结构 Active CN209435097U (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW108200947U TWM577968U (zh) 2019-01-19 2019-01-19 Adapter plate structure for DC power supply power module
CN201920371250.4U CN209435097U (zh) 2019-01-19 2019-03-22 可供直流电源供应器功率模组用的转接板结构
US16/363,972 US10609846B1 (en) 2019-01-19 2019-03-25 Adapter board structure for power module of DC power supply
DE202019001474.8U DE202019001474U1 (de) 2019-01-19 2019-03-29 Aufbau einer Adapterplatte für ein Leistungsmodul eines DC-Netzgeräts
JP2019001294U JP3221909U (ja) 2019-01-19 2019-04-10 直流パワーサプライ

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
TW108200947U TWM577968U (zh) 2019-01-19 2019-01-19 Adapter plate structure for DC power supply power module
CN201920371250.4U CN209435097U (zh) 2019-01-19 2019-03-22 可供直流电源供应器功率模组用的转接板结构
US16/363,972 US10609846B1 (en) 2019-01-19 2019-03-25 Adapter board structure for power module of DC power supply
DE202019001474.8U DE202019001474U1 (de) 2019-01-19 2019-03-29 Aufbau einer Adapterplatte für ein Leistungsmodul eines DC-Netzgeräts
JP2019001294U JP3221909U (ja) 2019-01-19 2019-04-10 直流パワーサプライ

Publications (1)

Publication Number Publication Date
CN209435097U true CN209435097U (zh) 2019-09-24

Family

ID=82358882

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920371250.4U Active CN209435097U (zh) 2019-01-19 2019-03-22 可供直流电源供应器功率模组用的转接板结构

Country Status (5)

Country Link
US (1) US10609846B1 (zh)
JP (1) JP3221909U (zh)
CN (1) CN209435097U (zh)
DE (1) DE202019001474U1 (zh)
TW (1) TWM577968U (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7294312B2 (ja) 2018-02-16 2023-06-20 Jnc株式会社 重合性化合物、重合性組成物、重合体及びフォトレジスト用組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141631A (ja) * 2000-10-31 2002-05-17 Yazaki Corp フレキシブル回路体の接続構造
US20060261783A1 (en) * 2005-05-23 2006-11-23 Paul Gamboa Electronic battery module (EBM) with bidirectional DC-DC converter
RU2603237C2 (ru) * 2011-07-22 2016-11-27 Адс Телекоммьюникейшнз, Инк. Узел соединения волоконно-оптического кабеля с коннектором, имеющий средство фиксации волокна
TWI456379B (zh) * 2012-07-23 2014-10-11 Chicony Power Tech Co Ltd 電源系統及其組合式電源裝置
US10021803B2 (en) * 2016-02-26 2018-07-10 Delta Electronics, Inc. Power supply
US10008454B1 (en) * 2017-04-20 2018-06-26 Nxp B.V. Wafer level package with EMI shielding
CN109412390B (zh) * 2017-08-15 2020-09-25 泰达电子股份有限公司 电源转换装置

Also Published As

Publication number Publication date
DE202019001474U1 (de) 2019-04-08
TWM577968U (zh) 2019-05-11
JP3221909U (ja) 2019-06-27
US10609846B1 (en) 2020-03-31

Similar Documents

Publication Publication Date Title
CN205029193U (zh) 一种不间断电源机柜
CA2909962A1 (en) Bus bar arrangement and a shroud for the same
US20130039006A1 (en) Server rack assembly
CN102882083A (zh) 供电装置及具有供电装置的机柜供电系统
US20130114185A1 (en) Switchgear bus assembly having reduced power loss, material and temperature
US20130039004A1 (en) Server rack assembly
JP2012513671A (ja) 通信用サブラックモジュール及び通信用サブラック
CA2571524C (en) Load resistor
CN209435097U (zh) 可供直流电源供应器功率模组用的转接板结构
CN109982540A (zh) 一种兼容19英寸和21英寸两种规格服务器的机柜
RU2474986C1 (ru) Модульная электрическая плата для силовых компонентов
CN207720524U (zh) 一种电路板结构及采用其的电磁炉
CN206293682U (zh) 一种面板拼装式机柜电源分配器
CN108055772A (zh) 一种电路板结构及采用其的电磁炉
CN211126461U (zh) 一种全自动电脑横机的双系统配电盘
CN210840219U (zh) 一种方便散热的插接式多层线路板
CN203690047U (zh) 具有散热结构的变压器及运用该变压器的电源供应器
CN210074196U (zh) 多层排列的接线铜排
CN208299676U (zh) 一种紧凑型变频器
EP3375059B1 (en) Modular distribution back support for circuit breakers
CN207705000U (zh) 用于干式变压器的板式夹件
CN104901518A (zh) 一种高压电力变换设备及其功率单元
CN205336092U (zh) 一种风能变流器及其功率模块
CN210443880U (zh) 一种具有线路整理功能的电能质量优化装置
CN215582343U (zh) 电子信息自动化控制柜

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant