CN209410779U - A kind of foam chip protective pad - Google Patents
A kind of foam chip protective pad Download PDFInfo
- Publication number
- CN209410779U CN209410779U CN201920052198.6U CN201920052198U CN209410779U CN 209410779 U CN209410779 U CN 209410779U CN 201920052198 U CN201920052198 U CN 201920052198U CN 209410779 U CN209410779 U CN 209410779U
- Authority
- CN
- China
- Prior art keywords
- card slot
- groove
- chip
- pad body
- protective pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of foam chip protective pads, are related to chip transportation field.Be characterized in that: the side of a kind of foam chip protective pad, including protection pad body, the protection pad body offers card slot corresponding with chip form, is removably connected with the Ka Gai that card slot can be completely covered above the card slot.The utility model has the advantages that can protect chip, damping antistatic.
Description
Technical field
The utility model relates to chip transportation fields, more specifically, it relates to a kind of foam chip protective pad.
Background technique
Chip, also known as microcircuit, microchip, refer to the silicon wafer for including integrated circuit, and volume very little, precision are high.
In the transportational process of chip, due to the volume very little of chip, and internal structure is accurate, in vanning, is difficult handle
Gap is filled up, and due to not corresponding protective pad, compares violence again in transportational process, and chip is violent in cabinet to rock possibility
It will lead to chip internal structure to be damaged, while friction occur between chip and chip, chip and cabinet and generates a large amount of
Electrostatic and lead to wafer damage.
Utility model content
The purpose of this utility model is to provide a kind of foam chip protective pad, have can protect chip, it is shockproof, prevent it is quiet
The advantage of electricity.
To achieve the above object, the utility model provides following technical solution:
The side of a kind of foam chip protective pad, including protection pad body, the protection pad body offers and chip shape
Shape corresponding card slot is removably connected with the Ka Gai that card slot can be completely covered above the card slot.
By using above-mentioned technical proposal, during chip transportation, chip is placed in card slot, then Ka Gai is covered
On, since the shape of card slot and chip is corresponding, during transportation, it will not relatively move, disappear between chip and card slot
In addition to chip since friction generates the influence of electrostatic interaction, and foam has certain elasticity, can have protective effect to chip,
There is good cushioning effect when acutely rocking, avoid the problem that the wafer damage as caused by violence in transportational process.
Further, the protection pad body is provided with the hollow plate of antistatic far from the side of card slot.
By using above-mentioned technical proposal, hollow plate can eliminate shadow caused by the electrostatic interaction during chip transportation
It rings, chip is prevented to be damaged, while the avoidable foam of hollow plate bending occurs during transportation, chip is caused to bend and damage
The problem of.
Further, the inner wall of the card slot is bonded with air bag.
By using above-mentioned technical proposal, air bag can play cushioning effect, improve the damping performance of protective pad.
Further, the protection pad body offers the first groove of two card slots of perforation between two card slots.
It is convenient in the process of disassembly to open Ka Gai by the first groove by using above-mentioned technical proposal.
Further, the protection pad body is located at card slot and offers the be connected to card slot far from the side of the first groove
Two grooves.
By using above-mentioned technical proposal, the second groove and the cooperation of the first groove, so that more holding in the process of disassembly
Easily Ka Gai is opened.
Further, chamfering is provided on the four edges edge line of the protection pad body side.
By using above-mentioned technical proposal, in binning process, due to the presence of chamfering, adjacent protective pad and protective pad
Between will form gap, be easy for protective pad capable of being taken out by the gap.
Further, the side that the protection pad body is located at card slot offers third groove, and the hollow plate is far from anti-
The side of protection pad ontology is provided with protrusion, the protrusion and third matching grooves.
By using above-mentioned technical proposal, the setting of third groove protrusion, so that above and below protective pad is in stacking process
The combination of two pieces of protective pads is more firm, reduces to shake in transportational process and damage caused by chip.
Further, the Ka Gai and protection pad body clamping.
By using above-mentioned technical proposal, facilitates and open lid.
Further, the Ka Gai is provided with perpendicular first baffle, the Ka Gai close to the side wall of the first groove
Side wall close to the second groove is provided with perpendicular second baffle.
By using above-mentioned technical proposal, as Ka Gai and card slot clamping, first baffle is complete by the first groove and card slot
Isolation, second baffle can be completely isolated with card slot by the second groove, prevents chip from card slot and the first groove and the second groove
Connectivity part fall.
Compared with prior art, the utility model has the beneficial effects that
(1) by being provided with protection pad body, card slot, the air bag of foam material, the cushioning effect of protective pad is improved, is protected
Chip is not damaged in transportational process because of collision, meanwhile, the electrostatic work that can be eliminated during chip transportation of hollow plate
It is influenced with bring；
(2) by setting the first groove, the second groove, the mutual cooperation of the first groove and the second groove facilitates chip
It places and takes out；
(3) by setting third groove and protrusion, the cooperation of third groove and protrusion is improved firm in stacking process
Property.
Detailed description of the invention
Fig. 1 is attached view of the utility model with Ka Gai；
Fig. 2 is attached view of the utility model without Ka Gai；
Fig. 3 is the bottom view of the utility model；
Fig. 4 is the side view of the utility model；
Fig. 5 is the Ka Gai of utility model and the perspective view of the explosion of protection pad body.
Appended drawing reference: 1, pad body is protected；2, card slot；3, air bag；4, the first groove；5, the second groove；6, Ka Gai；7,
One baffle；8, second baffle；9, hollow plate；10, third groove；11, raised；12, chamfering.
Specific embodiment
With reference to the accompanying drawings and examples, the utility model is described in detail.
As shown in Figure 1 and Figure 2, a kind of foam chip protective pad, including protection pad body 1, protection pad body 1 are in cuboid
Shape is opened up in the upper surface of protection pad body 1 there are two card slot 2, and card slot 2 is in a rectangular parallelepiped shape and its length direction and protection advance capital for
The length direction of body 1 is consistent, and two clamp bar slots 2 are parallel to each other and are respectively distributed to left half of and right one side of something of protection pad body 1,
Plastic gas bag 3 is bonded on the inner wall of card slot 2, air bag 3 has cushioning effect, the damping performance of protective pad can be improved.It is protecting
The upper surface of pad body 1 and be located at offered between two card slots 2 perforation two card slots 2 the first groove of oblong-shaped 4, first
Groove 4 is located at protection 1 upper surface center of pad body, and it is recessed to offer second on inner sidewall of the card slot 2 far from the first groove 4
Slot 5, the cross section of the second groove 5 are semicircle.Being provided on protection pad body 1 and positioned at the opening of card slot 2 can be complete
The card lid 6 of card slot 2 is covered, card lid 6 can be clamped with card slot 2, and card lid 6 can also be bonded with card slot 2.
As shown in Figure 1, shown in Figure 5, card lid 6 is provided with perpendicular first baffle 7, card lid 6 close to the side wall of the first groove 4
Side wall close to the second groove 5 is provided with perpendicular second baffle 8, when card lid 6 is clamped with card slot 2 or is Nian Jie, the
One baffle 7 is completely isolated by the first groove 4 and card slot 2, and second baffle 8 can be completely isolated by the second groove 5 and card slot 2, prevents
Only chip is fallen from card slot 2 and the connectivity part of the first groove 4 and the second groove 5.
During chip transportation, chip can be placed in card slot 2, cover card lid 6, cased, due to foam
With elasticity, protection, damping can be played the role of during transportation.The cooperation of first groove 4 and the second groove 5 facilitate by
Card lid 6 is opened, while also facilitating the placement and taking-up of chip.
As shown in Figure 4, Figure 5, the hollow plate 9 of antistatic is bonded in the bottom of protection pad body 1, hollow plate 9 can be eliminated
Caused by electrostatic interaction the problem of wafer damage, while hollow plate 9 also acts as certain cushioning effect.In protection pad body 1
Upper surface is opened up in its width direction there are two third groove 10, and two third grooves 10 are respectively close in protection pad body 1
Two edge lines in the width direction.
As shown in Figure 3 and Figure 5, hollow plate 9 it is separate with protection pad body 1 side be bonded with protrusion 11, protrusion 11 with
Third groove 10 matches, and the matching of third groove 10 and protrusion 11, may make upper and lower two pieces of protective pads in stacking process
In conjunction with stronger, prevent during transportation protective pad occur opposite to shake the damage caused by chip.
As shown in Figure 1, setting is provided with chamfering 12 on the four edges edge line of protection 1 side of pad body, chamfering 12
It is arranged so that form the gap of a prismatic between protective pad adjacent all around during vanning, it is empty passes through the prismatic
Gap can be easy for that protective pad can be taken out, and improve the convenience of unpacking.
It the course of work of the utility model and has the beneficial effect that: in the transportational process of chip, chip being placed in card
In slot 2, card lid 6 is covered, is carrying out vanning transport, since foam has good cushioning effect, can be protected during transportation
Chip is extruded damage, since hollow plate 9 has the function of antistatic, can eliminate what electrostatic interaction damaged chip bring
Problem.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (9)
1. a kind of foam chip protective pad, including protection pad body (1), which is characterized in that the side of protection pad body (1)
Card slot (2) corresponding with chip form is offered, card slot can be completely covered by being removably connected with above the card slot (2)
(2) Ka Gai (6).
2. a kind of foam chip protective pad according to claim 1, which is characterized in that the protection pad body (1) is separate
The side of card slot (2) is provided with the hollow plate (9) of antistatic.
3. a kind of foam chip protective pad according to claim 1, which is characterized in that the inner wall of the card slot (2) is bonded
There are air bag (3).
4. a kind of foam chip protective pad according to claim 1, which is characterized in that the protection pad body (1) is located at
The first groove (4) of two card slots (2) of perforation is offered between two card slots (2).
5. a kind of foam chip protective pad according to claim 4, which is characterized in that the protection pad body (1) is located at
Card slot (2) offers the second groove (5) being connected to card slot (2) far from the side of the first groove (4).
6. a kind of foam chip protective pad according to claim 1, which is characterized in that the week of protection pad body (1)
Chamfering (12) are provided on the four edges edge line of side.
7. a kind of foam chip protective pad according to claim 2, which is characterized in that the protection pad body (1) is located at
The side of card slot (2) offers third groove (10), and the hollow plate (9) is provided with convex far from the side of protection pad body (1)
It rises (11), the protrusion (11) matches with third groove (10).
8. a kind of foam chip protective pad according to claim 1, which is characterized in that the Ka Gai (6) and card slot (2) are blocked
It connects.
9. a kind of foam chip protective pad according to claim 1, which is characterized in that the Ka Gai (6) is recessed close to first
The side wall of slot (4) is provided with perpendicular first baffle (7), and side wall of the Ka Gai (6) close to the second groove (5) is provided with
Perpendicular second baffle (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920052198.6U CN209410779U (en) | 2019-01-12 | 2019-01-12 | A kind of foam chip protective pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920052198.6U CN209410779U (en) | 2019-01-12 | 2019-01-12 | A kind of foam chip protective pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209410779U true CN209410779U (en) | 2019-09-20 |
Family
ID=67943498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920052198.6U Expired - Fee Related CN209410779U (en) | 2019-01-12 | 2019-01-12 | A kind of foam chip protective pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209410779U (en) |
-
2019
- 2019-01-12 CN CN201920052198.6U patent/CN209410779U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190920 Termination date: 20220112 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |