CN209374484U - A kind of LED package support, packaging body and display - Google Patents

A kind of LED package support, packaging body and display Download PDF

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Publication number
CN209374484U
CN209374484U CN201920380635.7U CN201920380635U CN209374484U CN 209374484 U CN209374484 U CN 209374484U CN 201920380635 U CN201920380635 U CN 201920380635U CN 209374484 U CN209374484 U CN 209374484U
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China
Prior art keywords
chip
led package
package support
led
bracket
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Active
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CN201920380635.7U
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Chinese (zh)
Inventor
徐军
张广谱
赵普
王博
王玉年
沈思宽
朋朝明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Skyworth RGB Electronics Co Ltd
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Shenzhen Skyworth RGB Electronics Co Ltd
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Priority to CN201920380635.7U priority Critical patent/CN209374484U/en
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Abstract

The utility model relates to display backlight technical field more particularly to a kind of LED package supports, packaging body and display.LED package support includes bracket pad and bracket shell, the bracket shell is provided with the groove for accommodating LED chip, the bracket pad is set to the slot bottom of the groove, the bracket pad is in inverted " V " shape, two inclined surface of the bracket pad are chip stationary plane, and LED chip is fixed on the chip stationary plane.Packaging body includes above-mentioned LED package support, and display includes above-mentioned LED package support or packaging body.Bracket pad is in inverted " V " shape, so that the light emitting angle of the LED chip in LED package support is increased two times of chip stationary plane and the angle of slot bottom on the basis of the original, the increase of the light-emitting angle of LED chip solves the problems, such as the lamp shadow of side-light type.The lamp bar light emitting angle of straight-down negative can be increased, reduce lamp bar or lamp bead quantity to reach.

Description

A kind of LED package support, packaging body and display
Technical field
The utility model relates to display backlight technical field more particularly to a kind of LED package supports, packaging body and display Device.
Background technique
LED in conventional backlight assembly is fixed on the package support by crystal-bonding adhesive by chip.As shown in Figure 1, traditional Package support (such as 3030 package supports, 7020 package supports, 4014 package supports etc.) includes bracket shell 10 and bracket weldering Disk 20, bracket pad 20 are set to the bottom of the groove 101 of bracket shell 10.Chip positive and negative anodes are welded to bracket weldering by gold thread On disk 20.Bracket pad 20 is plate-like structure, and chip stationary plane is a flat surface, and chip is welded on bracket pad 20, due to The influence of height and LED chip itself light emitting angle of the side wall of grooves on two sides 101, light emitting angle are all 120 ° or so.It is answering With the field (such as TV mould group field) of LED, the light emitting angle for being limited to LED can cause some problems, such as side-light type mould The problems such as group LED light emitting angle will lead to lamp shadow.
Therefore, a kind of LED package support, packaging body and display are needed, to solve the above technical problems.
Utility model content
The purpose of this utility model is to provide a kind of LED package support, packaging body and display, in LED lamp There is biggish light emitting angle.
For this purpose, the utility model uses following technical scheme:
On the one hand a kind of LED package support, including bracket pad and bracket shell are provided, the bracket shell is provided with appearance Receive the groove of LED chip, the bracket pad is set to the slot bottom of the groove, and the bracket pad is in inverted " V " shape, the branch Two inclined surface of frame pad are chip stationary plane, and LED chip is fixed on the chip stationary plane.
Preferably, the angle between the chip stationary plane and the slot bottom of the groove is θ, wherein 0 ° of 30 ° of < θ <.
Preferably, the LED chip is adhered on the chip stationary plane by crystal-bonding adhesive.
Preferably, height of the height of the highest point of the bracket pad not higher than the side wall of the groove.
Preferably, the angle between the side wall of the groove and the slot bottom of the groove is β, wherein 90 °≤β≤120 °.
Preferably, the material of the bracket pad is copper.
Preferably, the material of the bracket shell is PCT, EMC or SMC.
On the other hand a kind of packaging body, including LED package support as described above are provided.
Preferably, the packaging body further includes multi-chip or dual chip.
Another aspect provides a kind of display comprising packaging body as described above.
The utility model has the beneficial effects that bracket pad is in inverted " V " shape, make the slot bottom of chip stationary plane and groove in angle Setting, the chip stationary plane that makes the light emitting angle of the LED chip in LED package support increase two times on the basis of the original with The angle of slot bottom, the increase of the light-emitting angle of LED chip solve the problems, such as the lamp shadow of side-light type, reach the number for reducing LED chip The LED chip of amount or identical quantity can accomplish light mixing away from smaller, to accomplish ultra-narrow side side-light type.Under can increasing directly The lamp bar light emitting angle of formula reduces lamp bar or lamp bead quantity to reach, or using the LED chip of identical quantity, light mixing away from Can accomplish it is smaller, to reduce straight-down negative mould group thickness.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of LED package support in the prior art;
Fig. 2 is the structural schematic diagram of LED package support provided by the utility model.
In figure: 10, bracket shell;101, groove;20, bracket pad;30, chip;
1, bracket shell;11, groove;2, bracket pad;21, chip stationary plane;3, LED chip.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all Belong to the range of the utility model protection.
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model Limitation.
As shown in Fig. 2, present embodiment discloses a kind of LED package supports comprising bracket pad 2 and bracket shell 1, branch Frame shell 1 is provided with the groove 11 for accommodating LED chip 3, and bracket pad 2 is set to the slot bottom of groove 11, and bracket pad 2 is in Two inclined surface of " V " shape, bracket pad 2 are chip stationary plane 21, and LED chip 3 is fixed on chip stationary plane 21, as excellent It selects, LED chip 3 is adhered on chip stationary plane 21 by crystal-bonding adhesive in the present embodiment.Bracket pad 2 is in inverted " V " shape, makes chip The slot bottom of stationary plane 21 and groove 11 is arranged in angle, to make have certain angle between LED chip 3 and slot bottom, seals LED The light emitting angle of LED chip 3 in dress bracket increases two times of chip stationary plane 21 and the folder of slot bottom on the basis of the original Angle, the increase of 3 light-emitting angle of LED chip solve the problems, such as the lamp shadow of side-light type, reach the quantity for reducing LED chip 3, or The LED chip 3 of identical quantity can accomplish light mixing away from smaller, to accomplish ultra-narrow side side-light type.The lamp of straight-down negative can be increased Light emitting angle reduces lamp bar or lamp bead quantity to reach, or using the LED chip 3 of identical quantity, and light mixing is away from can be with Accomplish it is smaller, to reduce straight-down negative mould group thickness.
The material of bracket pad 2 is copper, plating nickel on surface processing.The material of bracket shell 1 is PCT, in other embodiments It can also be EMC or SMC.In order to which subsequent LED package support can go on smoothly encapsulation, the height of the highest point of bracket pad 2 Not higher than the height of the side wall of groove 11.
Angle between chip stationary plane 21 and the slot bottom of groove 11 is θ, wherein 0 ° of 30 ° of < θ <.The light-emitting angle of LED For 120 ° of+2 θ, the value range of θ is 5 ° -15 ° in the present embodiment, can make the light-emitting angle of LED by 120 ° increase to 130 ° - 150 °, light-emitting angle amplification is larger.
Angle between the side wall of groove 11 and the slot bottom of groove 11 is β, wherein 90 °≤β≤120 °.The side wall of groove 11 Angle between the slot bottom of groove 11 increases, and the top of side wall and the horizontal distance of slot bottom are bigger, and LED light-emitting angle also can It increases with it.
The LED package support is suitable for the encapsulation of dual chip or multi-chip, increases branch by the direction x or y in one direction The gradient of frame pad 2, to realize that the light-emitting angle in this direction increases.
The present embodiment also discloses a kind of packaging body comprising LED package support as above, which further includes dual chip Or multi-chip.The packaging body can increase the light-emitting angle for encapsulating intracorporal LED chip.
The present embodiment also discloses a kind of display comprising packaging body as above.
Obviously, the above embodiments of the present invention is used for the purpose of clearly illustrating examples for clearly illustrating the present invention, and It is not limitations of the embodiments of the present invention.For those of ordinary skill in the art, in above description On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments Exhaustion.Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc., should be included in Within the protection scope of the utility model claims.

Claims (10)

1. a kind of LED package support, including bracket pad (2) and bracket shell (1), which is characterized in that the bracket shell (1) It is provided with the groove (11) for accommodating LED chip (3), the bracket pad (2) is set to the slot bottom of the groove (11), the branch Frame pad (2) is in inverted " V " shape, and two inclined surface of the bracket pad (2) are chip stationary plane (21), the LED chip (3) It is fixed on the chip stationary plane (21).
2. LED package support according to claim 1, which is characterized in that the chip stationary plane (21) and the groove (11) the angle between slot bottom is θ, wherein 0 ° of 30 ° of < θ <.
3. LED package support according to claim 1, which is characterized in that the LED chip (3) passes through die bond glue sticking In on the chip stationary plane (21).
4. LED package support according to claim 1, which is characterized in that the height of the highest point of the bracket pad (2) Not higher than the height of the side wall of the groove (11).
5. LED package support according to claim 1, which is characterized in that the side wall and the groove of the groove (11) (11) the angle between slot bottom is β, wherein 90 °≤β≤120 °.
6. LED package support according to claim 1, which is characterized in that the material of the bracket pad (2) is copper.
7. LED package support according to claim 1, which is characterized in that the material of the bracket shell (1) be PCT, EMC or SMC.
8. a kind of packaging body, which is characterized in that including LED package support such as of any of claims 1-7.
9. packaging body according to claim 8, which is characterized in that the packaging body further includes multi-chip or dual chip.
10. a kind of display, which is characterized in that it includes packaging body as claimed in claim 8 or 9.
CN201920380635.7U 2019-03-25 2019-03-25 A kind of LED package support, packaging body and display Active CN209374484U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920380635.7U CN209374484U (en) 2019-03-25 2019-03-25 A kind of LED package support, packaging body and display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920380635.7U CN209374484U (en) 2019-03-25 2019-03-25 A kind of LED package support, packaging body and display

Publications (1)

Publication Number Publication Date
CN209374484U true CN209374484U (en) 2019-09-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920380635.7U Active CN209374484U (en) 2019-03-25 2019-03-25 A kind of LED package support, packaging body and display

Country Status (1)

Country Link
CN (1) CN209374484U (en)

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