CN209328047U - A kind of IC chip induction header structure - Google Patents

A kind of IC chip induction header structure Download PDF

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Publication number
CN209328047U
CN209328047U CN201920168283.9U CN201920168283U CN209328047U CN 209328047 U CN209328047 U CN 209328047U CN 201920168283 U CN201920168283 U CN 201920168283U CN 209328047 U CN209328047 U CN 209328047U
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CN
China
Prior art keywords
fingerprint recognition
chip
recognition chip
metallic elastic
deckle board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920168283.9U
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Chinese (zh)
Inventor
周守佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Mingyi Electronic Technology Co Ltd
Original Assignee
Chengdu Mingyi Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201920168283.9U priority Critical patent/CN209328047U/en
Application granted granted Critical
Publication of CN209328047U publication Critical patent/CN209328047U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model embodiment discloses a kind of IC chip induction header structure, protection panels including fingerprint recognition chip and for protecting fingerprint recognition chip, it is integrated between the fingerprint recognition chip and protection panels by adhesive layer bonding, the lower surface of the fingerprint recognition chip is provided with metallic elastic bent plate, the both ends of the metallic elastic bent plate are connected with the fingerprint recognition chip insulation, and there are gaps between the middle part of the metallic elastic bent plate and the fingerprint recognition chip, the lower surface of the metallic elastic bent plate, which is provided with, is bonded support bottom plate with it, the limit deckle board around fingerprint recognition chip is provided on the support bottom plate;Surrounding setting limit deckle board of the utility model embodiment in fingerprint induction chip; fingerprint recognition chip is fixed in limit deckle board; protection panels are fastened on the top of limit deckle board, limit the distance that protection panels push by limit deckle board to avoid metallic elastic bending from being excessively squeezed and deformed.

Description

A kind of IC chip induction header structure
Technical field
The utility model embodiment is related to chip technology field, and in particular to a kind of IC chip induction header structure.
Background technique
Induction chip includes fingerprint recognition chip, video sensing chip, pressure sensitive chip etc., mobile communication equipment, In the electronic equipments such as tablet computer, for the security performance for enhancing electronic equipment, prevent the relevant information of user from leaking, part factory Quotient utilizes optics, acoustics, biosensor and biostatistics principle, and the physiological characteristic intrinsic according to human body, such as face The uniqueness of the features such as picture, iris, fingerprint designs and develops the electronic equipment bio-identification for providing human body bio-identification function Key, the electronic equipment of the type with key by carrying out identification verifying to the intrinsic physiological characteristic of human body, to decide whether The relative program for starting electronic equipment, has the advantages that securely and reliably etc. a variety of, and the most commonly used in the type key is to have The key of fingerprint identification function.
Currently, common fingerprint recognition key is generally provided with hemispherical shape in the bottom position of fingerprint recognition chip Metallic elastic piece, when panel is by extraneous pressure, the bottom of the metallic elastic piece be pressurized generate deformation and in being arranged in fingerprint The route of identification chip is connected, and then so that fingerprint recognition chip is received enabled instruction and start button conducting program, the tradition The fingerprint recognition key of structure in conducting, is connected by the bottom of metallic elastic piece and the route of fingerprint recognition chip, If applied to panel, pressure is excessive, and metallic elastic piece is also easy to produce mechanical deformation, and the effect of following the string or spring function are weak Change, and makes entire key lose conducting or reset function, and then entire key generates damage.
Utility model content
For this purpose, the utility model embodiment provides a kind of IC chip induction header structure, in fingerprint recognition chip Surrounding setting limit deckle board, fingerprint recognition chip are fixed in limit deckle board, and protection panels are fastened on the top of limit deckle board, lead to It crosses limit deckle board and limits the distance that protection panels push to avoid metallic elastic bending from being excessively squeezed and deformed, to solve background skill The problem of art is proposed.
To achieve the goals above, the embodiments of the present invention provides the following technical solutions:
A kind of IC chip induction header structure, the guarantor including fingerprint recognition chip and for protecting fingerprint recognition chip Protection slab is integrated between the fingerprint recognition chip and protection panels by adhesive layer bonding, the fingerprint recognition chip Lower surface is provided with metallic elastic bent plate, and the both ends of the metallic elastic bent plate are connected with the fingerprint recognition chip insulation, and There are gap, the lower surfaces of the metallic elastic bent plate between the middle part of the metallic elastic bent plate and the fingerprint recognition chip It is provided with and is bonded support bottom plate with it, the limit deckle board around fingerprint recognition chip is provided on the support bottom plate.
The area of the protection panels is greater than the circular area of the limit deckle board, the protection panels lower surface to limit The distance of deckle board upper surface is greater than the clearance distance between the metallic elastic bent plate and fingerprint recognition chip.
As a kind of preferred embodiment of the utility model, the middle part of the metallic elastic bent plate is between fingerprint recognition chip Gap is greater than 1 μm less than 200 μm.
As a kind of preferred embodiment of the utility model, distance of the protection panels lower surface to limit deckle board upper surface A kind of preferred embodiment clearance distance as the utility model between the metallic elastic bent plate and fingerprint recognition chip Difference is 1 μm~5 μm.
As a kind of preferred embodiment of the utility model, the metallic elastic bent plate is in " W " type.
As a kind of preferred embodiment of the utility model, the fingerprint recognition chip is flexible circuit board.
The embodiments of the present invention has the advantages that
On the one hand the utility model incudes fingerprint in the surrounding setting limit deckle board in fingerprint induction chip, limit deckle board Chip plays fixed function, avoids it that horizontal-shift occurs, and on the other hand, limit deckle board is fixed on inside spacing frame, and is protected The area that mask plate suqare is greater than limit deckle board is fastened on outside limit deckle board, limits what protection panels pushed by limit deckle board Distance to avoid metallic elastic bending is excessively squeezed and deformed follow the string effect so as to cause fingerprint recognition key damage ask Topic.
Detailed description of the invention
It, below will be to reality in order to illustrate more clearly of the embodiments of the present invention or technical solution in the prior art It applies mode or attached drawing needed to be used in the description of the prior art is briefly described.It should be evident that attached in being described below Figure is only exemplary, for those of ordinary skill in the art, without creative efforts, can be with It is extended according to the attached drawing of offer and obtains other implementation attached drawings.
Structure depicted in this specification, ratio, size etc., only to cooperate the revealed content of specification, for Those skilled in the art understands and reads, and is not intended to limit the utility model enforceable qualifications, therefore does not have technology On essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the utility model institute energy Under the effect of generation and the purpose that can reach, it should all still fall in the revealed technology contents of the utility model and obtain the model that can cover In enclosing.
Fig. 1 is the overall structure diagram of the utility model embodiment.
In figure:
1- fingerprint recognition chip;2- protection panels;3- adhesive layer;4- metallic elastic bent plate;5- support bottom plate;6- limitting casing Plate.
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this Content disclosed by specification understands other advantages and effect of the utility model easily, it is clear that described embodiment is The utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field is common Technical staff's every other embodiment obtained without making creative work belongs to the utility model protection Range.
As shown in Figure 1, the utility model provides a kind of IC chip induction header structure, including fingerprint recognition chip 1 and the protection panels 2 for protecting fingerprint recognition chip 1, protection panels 2 here are that the panel of fingerprinting operation simultaneously can also be with Fingerprint recognition chip 1 is protected, the fingerprint recognition chip 1 that the utility model uses is preferably flexible circuit board, certainly hard Plate or Rigid Flex can also be bonded alternatively between the fingerprint recognition chip 1 and protection panels 2 by adhesive layer 3 It is integrated, the lower surface of the fingerprint recognition chip 1 is provided with metallic elastic bent plate 4, and metallic elastic bent plate 4 here can be It is also possible to arc-shaped, the both ends of the metallic elastic bent plate 4 and the fingerprint recognition chip 1 insulation connection, and institute in " W " type It states there are gap between the middle part of metallic elastic bent plate 4 and the fingerprint recognition chip 1, which is greater than 1 μm less than 200 μm.
When protection panels 2 are by external pressure, deformation occurs under the effect of external force for metallic elastic bent plate 4, metal elastic Property bent plate 4 middle part be connected to related pressure inductive signal being sent to fingerprint recognition chip 1 with fingerprint recognition chip 1, by This completes the conducting of fingerprint recognition key, high sensitivity.
In order to avoid metallic elastic bent plate 4 receives excessively extruding and the deformation that can not restore is caused, in the metallic elastic The lower surface of bent plate 4 is provided with and is bonded support bottom plate 5 with it, is provided on the support bottom plate 5 around fingerprint recognition chip 1 Deckle board 6 is limited, the area of the protection panels 2 is greater than the circular area of the limit deckle board 6,2 lower surface of protection panels Distance to limit 6 upper surface of deckle board is greater than the clearance distance between the metallic elastic bent plate 4 and fingerprint recognition chip 1.
Specifically, distance and the metallic elastic bent plate 4 of 2 lower surface of protection panels to limit 6 upper surface of deckle board The difference of clearance distance between fingerprint recognition chip 1 is 1 μm~5 μm.
The utility model limits 6 one side of deckle board to fingerprint in the surrounding setting limit deckle board 6 in fingerprint induction chip 1 Induction chip 1 plays fixed function, avoids it that horizontal-shift occurs, and on the other hand, limit deckle board 6 is fixed in limit deckle board 6 Portion, and 2 area of protection panels is greater than the area of limit deckle board 6 to be fastened on outside limit deckle board 6, is limited by limit deckle board 6 Determine protection panels 2 pushing distance to avoid the excessive compressional deformation of metallic elastic bending 4 follow the string effect so as to cause Fingerprint recognition key damages problem.
Although above having made detailed description to the utility model with generality explanation and specific embodiment, On the basis of the utility model, it can be made some modifications or improvements, this is apparent to those skilled in the art 's.Therefore, these modifications or improvements on the basis of without departing from the spirit of the present invention, belong to the utility model and want Seek the range of protection.

Claims (5)

1. a kind of IC chip incudes header structure, including fingerprint recognition chip (1) and for protecting fingerprint recognition chip (1) Protection panels (2), between the fingerprint recognition chip (1) and protection panels (2) by adhesive layer (3) bonding be integrated, It is characterized in that, the lower surface of the fingerprint recognition chip (1) is provided with metallic elastic bent plate (4), the metallic elastic bent plate (4) Both ends and the fingerprint recognition chip (1) insulation connection, and the middle part of the metallic elastic bent plate (4) and the fingerprint recognition There are gap between chip (1), the lower surface of the metallic elastic bent plate (4) is provided with the support bottom plate (5) being bonded with it, institute State the limit deckle board (6) being provided on support bottom plate (5) around fingerprint recognition chip (1);
The area of the protection panels (2) is greater than the circular area of limit deckle board (6), protection panels (2) lower surface Distance to limit deckle board (6) upper surface is greater than the clearance gap between the metallic elastic bent plate (4) and fingerprint recognition chip (1) From.
2. a kind of IC chip according to claim 1 incudes header structure, which is characterized in that the metallic elastic is curved The middle part of plate (4) is greater than 1 μm less than 200 μm to the gap of fingerprint recognition chip (1).
3. a kind of IC chip according to claim 1 incudes header structure, which is characterized in that the protection panels (2) lower surface is between the distance and the metallic elastic bent plate (4) and fingerprint recognition chip (1) of limit deckle board (6) upper surface Clearance distance difference be 1 μm~5 μm.
4. a kind of IC chip according to claim 1 incudes header structure, which is characterized in that the metallic elastic is curved Plate (4) is in " W " type.
5. a kind of IC chip according to claim 1 incudes header structure, which is characterized in that the fingerprint recognition core Piece (1) is flexible circuit board.
CN201920168283.9U 2019-01-30 2019-01-30 A kind of IC chip induction header structure Expired - Fee Related CN209328047U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920168283.9U CN209328047U (en) 2019-01-30 2019-01-30 A kind of IC chip induction header structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920168283.9U CN209328047U (en) 2019-01-30 2019-01-30 A kind of IC chip induction header structure

Publications (1)

Publication Number Publication Date
CN209328047U true CN209328047U (en) 2019-08-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920168283.9U Expired - Fee Related CN209328047U (en) 2019-01-30 2019-01-30 A kind of IC chip induction header structure

Country Status (1)

Country Link
CN (1) CN209328047U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: An integrated circuit chip sensing head structure

Effective date of registration: 20211224

Granted publication date: 20190830

Pledgee: The Agricultural Bank of Chengdu branch of Limited by Share Ltd. Chinese Sichuan

Pledgor: Chengdu Mingyi Electronic Technology Co.,Ltd.

Registration number: Y2021990001201

PE01 Entry into force of the registration of the contract for pledge of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190830

CF01 Termination of patent right due to non-payment of annual fee
PC01 Cancellation of the registration of the contract for pledge of patent right

Granted publication date: 20190830

Pledgee: The Agricultural Bank of Chengdu branch of Limited by Share Ltd. Chinese Sichuan

Pledgor: Chengdu Mingyi Electronic Technology Co.,Ltd.

Registration number: Y2021990001201

PC01 Cancellation of the registration of the contract for pledge of patent right