CN208861296U - Optical finger print mould group and electronic equipment - Google Patents
Optical finger print mould group and electronic equipment Download PDFInfo
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- CN208861296U CN208861296U CN201821598520.7U CN201821598520U CN208861296U CN 208861296 U CN208861296 U CN 208861296U CN 201821598520 U CN201821598520 U CN 201821598520U CN 208861296 U CN208861296 U CN 208861296U
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- circuit board
- fingerprint identification
- mould group
- flexible circuit
- identification sensor
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Abstract
The utility model discloses a kind of optical finger print mould group, comprising: flexible circuit board；Flexible positioning region, the flexibility positioning region are set to the flexible circuit board, and installation cavity is formed between the flexibility positioning region and the flexible circuit board, and the installation cavity is equipped with avoid holes far from the side of the flexible circuit board；Fingerprint Identification sensor, the fingerprint Identification sensor are contained in the installation cavity and are set to the flexible circuit board, and the fingerprint Identification sensor is electrically connected with the flexible circuit board, and the fingerprint Identification sensor is corresponding with the evacuation hole site；Infrared fileter, the infrared fileter is set to the side away from the flexible circuit board of the fingerprint Identification sensor, and the infrared fileter is corresponding with the evacuation hole site.A kind of electronic equipment is also disclosed in the utility model.The thickness that above scheme can solve current optical finger print mould group is larger, is inconvenient to install and be easier to the problem of being damaged.
Description
Technical field
The utility model relates to optical finger print module design technical field more particularly to a kind of optical finger print mould group and electronics
Equipment.
Background technique
With the raising that people's information safety protection is realized, more and more electronic equipments use fingerprint identification technology, refer to
Line identification technology realized by fingerprint Identification sensor, and fingerprint Identification sensor is because of its outstanding protecting information safety and lesser
Volume becomes the standard configuration of electronic equipment.The type of fingerprint Identification sensor is more, such as capacitance type fingerprint identification sensor, optics
Formula fingerprint Identification sensor.
As electronic equipment minute design and degree of innovation are higher and higher, optical fingerprint identification sensor application is more next
It is more, but since the overall design of electronic equipment is inconsistent, using the optical finger print mould group of optical fingerprint identification sensor
It is different, it is more difficult to as unified structure.
Referring to FIG. 1, Fig. 1 is a kind of structural schematic diagram of typical optical finger print mould group.Optical finger print mould shown in FIG. 1
Group is assembled by various components, specifically, fingerprint Identification sensor 101 is bonded by glue-line 102 in the optical finger print mould group
On flexible circuit board 103, infrared fileter 104 is provided on fingerprint Identification sensor 101, bracket 105 is located at fingerprint knowledge
Individual sensor 101 and infrared fileter 104 are formed by the whole, and bracket 105 is adhesively fixed on flexible circuit by glue-line 109
On plate 103, fingerprint Identification sensor 101 is electrically connected by lead 106 with flexible circuit board 103, is passed through on flexible circuit board 103
Glue-line 107 is fixed with stiffening plate 108.
The various components of the optical finger print mould group of above structure are prefabricated component, there is assembly during assembling and miss
Difference, in particular, bracket 105 due to foozle and rigging error, has fit-up gap, this meeting between bracket 105 and optical filter
Cause the thickness of optical finger print mould group larger, this is unfavorable for the lightening design of electronic equipment.
At the same time, current optical finger print mould group is hard structure part, it is more difficult to adapt to installation environment, there is installation not side
Just the problem of, and current optical finger print mould group is easier to that rigid contact occurs with environment during the installation process, and then relatively holds
Easily it is damaged.
Utility model content
The utility model discloses a kind of optical finger print mould group, and the thickness to solve current optical finger print mould group is larger, no
Facilitate installation and is easier to the problem of being damaged.
To solve the above-mentioned problems, the utility model adopts the following technical solutions:
A kind of optical finger print mould group, comprising:
Flexible circuit board；
Flexible positioning region, the flexibility positioning region are set to the flexible circuit board, the flexibility positioning region with it is described soft
Property circuit board between form installation cavity, the installation cavity is equipped with avoid holes far from the side of the flexible circuit board；
Fingerprint Identification sensor, the fingerprint Identification sensor are contained in the installation cavity and are set to the flexible electrical
Road plate, the fingerprint Identification sensor are electrically connected with the flexible circuit board, and the fingerprint Identification sensor and the evacuation
Hole site is corresponding；
Infrared fileter, the infrared fileter be set to the fingerprint Identification sensor away from the flexible circuit board
Side, and the infrared fileter is corresponding with the evacuation hole site.
A kind of electronic equipment, the optical finger print mould group including display module He the bottom that the display module is arranged in, institute
Stating optical finger print mould group is optical finger print mould group described above.
The technical solution adopted in the utility model can reach it is following the utility model has the advantages that
Optical finger print mould group disclosed by the utility model realizes that infrared fileter, fingerprint recognition pass by flexible positioning region
Fixed assembling between sensor and flexible circuit board, flexible positioning region have preferable deformability, and therefore, flexible positioning region is straight
It connects and is attached on fingerprint Identification sensor and flexible circuit board, therefore can be avoided and assemble caused fit-up gap using components
Generation, this can undoubtedly reduce the thickness of optical finger print mould group.
At the same time, flexible circuit board and flexible positioning region have good deformability, can directly pass through itself
Deformation adjusts the positional relationship with components other in electronic equipment, and then reaches entire optical finger print mould group and more neatly pacify
The purpose of dress, facilitates the installation of optical finger print mould group, simultaneously as having good deformability, therefore in assembling process
Rigid interference is less likely to occur, is also just less likely to occur to damage.
Detailed description of the invention
Attached drawing described herein is used to provide a further understanding of the present invention, and constitutes one of the utility model
Point, the exemplary embodiment of the utility model and the description thereof are used to explain the utility model, does not constitute to the utility model
Improper restriction.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of typical optical finger print mould group；
Fig. 2 is the structural schematic diagram of optical finger print mould group disclosed in the utility model embodiment；
Fig. 3 is the partial structure diagram of electronic equipment disclosed in the utility model embodiment；
Fig. 4 is the perspective view of the explosion of Fig. 2.
Description of symbols:
101- fingerprint Identification sensor, 102- glue-line, 103- flexible circuit board, 104- infrared fileter, 105- bracket,
106- lead, 107- glue-line, 108- stiffening plate, 109- glue-line；
100- flexible circuit board, 200- fingerprint Identification sensor, the first glue-line of 210-, 220- second step face, 300- are red
Outer optical filter, 400- flexibility positioning region, 410- avoid holes, the first fixed part of 420-, the second fixed part of 430-, 431- first step
Face, 500- conducting wire, 600- display module, 610- cover sheet, 620-OCA glue-line, 630- display screen, the second glue-line of 700-.
Specific embodiment
It is specific below in conjunction with the utility model to keep the purpose of this utility model, technical solution and advantage clearer
Technical solutions of the utility model are clearly and completely described in embodiment and corresponding attached drawing.Obviously, described embodiment
It is only the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field
Those of ordinary skill's every other embodiment obtained without making creative work, belongs to the utility model
The range of protection.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment of the utility model is described in detail.
Fig. 2-Fig. 4 is please referred to, the utility model embodiment discloses a kind of optical finger print mould group, disclosed optical finger print mould
Group includes flexible circuit board 100, fingerprint Identification sensor 200, infrared fileter 300 and flexible positioning region 400.
Flexible circuit board 100 is that fingerprint Identification sensor 200 provides installation foundation, while fingerprint Identification sensor 200 is logical
Flexible circuit board 100 is crossed to be electrically connected with the external world.
Flexible positioning region 400 is set to flexible circuit board 100, is formed between flexible positioning region 400 and flexible circuit board 100
Installation cavity.Installation cavity is equipped with avoid holes 410 far from the side of flexible circuit board 100.
Fingerprint Identification sensor 200 is contained in installation cavity and is set to flexible circuit board 100.Fingerprint Identification sensor
200 are electrically connected with flexible circuit board 100, and fingerprint Identification sensor 200 is corresponding with 410 position of avoid holes.Fingerprint recognition sensing
Device 200 is corresponding with 410 position of avoid holes, refers to that fingerprint Identification sensor 200 is oppositely arranged with avoid holes 410.Usual situation
Under, fingerprint Identification sensor 200 is fixed on flexible circuit board 100.
Infrared fileter 300 is set to the side away from flexible circuit board 100 of fingerprint Identification sensor 200, Jin Ershi
Now filter.Infrared fileter 300 is more advantageous to fingerprint Identification sensor 200 and carries out fingerprint recognition.In the present embodiment.Infrared filtering
Piece 300 is corresponding with 410 position of avoid holes.It should be noted that infrared fileter 300 is corresponding with 410 position of avoid holes, refer to
Infrared fileter 300 is oppositely arranged with avoid holes 410.
In the present embodiment, installation cavity can be realized fingerprint Identification sensor 200 and flexible circuit board 100 and infrared filtering
Assembly between piece 300 and fingerprint Identification sensor 200.Specifically, infrared fileter 300 can be fixed in avoid holes 410,
In the present embodiment, flexible positioning region 400 can be the Plastic Division of encapsulated moulding, and during encapsulation, flexible positioning region 400 exists
It is formed by avoid holes 410 during hardening to be fixedly linked with infrared fileter 300, and then realizes infrared fileter 300
It is fixed.Certainly, infrared fileter 300 can also be adhesively fixed with avoid holes 410.
Optical finger print mould group disclosed in the utility model embodiment realizes infrared fileter by flexible positioning region 400
300, the assembly between fingerprint Identification sensor 200 and flexible circuit board 100, flexible positioning region 400 have good deformation energy
Power, flexible positioning region 400 is directly attached on fingerprint Identification sensor 200 and flexible circuit board 100, therefore can be avoided use
The generation of fit-up gap caused by components assemble, this can undoubtedly reduce the thickness of optical finger print mould group.
Flexible circuit board 100 and flexible positioning region 400 have good deformation, can directly be adjusted by the deformation of itself
The positional relationship of section and other components in electronic equipment, and then reach the mesh that entire optical finger print mould group is more neatly installed
, facilitate the installation of optical finger print mould group, simultaneously as having preferable deformability, therefore is not easy in assembling process
It is damaged.
In the present embodiment, the fingerprint Identification sensor 200 and infrared fileter 300 of optical finger print mould group pass through flexible positioning
Portion 400 is fixed on flexible circuit board 100, and flexible circuit board 100 is used as matrix, so that being formed as an entirety after encapsulation
Optical finger print mould group there is certain deformability, and then can make it through and change itself shape preferably to adapt to
Installation environment in electronic equipment.
In preferred scheme, fingerprint Identification sensor 200 can be fixed on flexible circuit board 100 by the first glue-line 210
On.This undoubtedly can be further improved the stability of fingerprint Identification sensor 200.Certainly, this be conducive to flexible positioning region 400 at
Type.Fingerprint Identification sensor 200 first passes through the first glue-line 210 and realizes fixation, then re-forms flexible positioning region 400, the first glue
Layer 210 can ensure that fingerprint Identification sensor 200 is kept when forming flexible positioning region 400 on fingerprint Identification sensor 200
It is fixed, and then be conducive to improve assembling quality.In preferred scheme, the first glue-line 210 can be conductive adhesive layer, such situation
Under, the first glue-line 210 can not only play the effect being fixedly connected, and can also play electrical connection 200 He of fingerprint Identification sensor
The effect of flexible circuit board 100.
In the present embodiment, infrared fileter 300 is attached to one that fingerprint Identification sensor 200 deviates from flexible circuit board 100
It is fixedly linked on the surface of side and with flexible positioning region 400.It is more advantageous to by the way of attaching and improves optical finger print mould group
Compactedness is more advantageous to the reduction of optical finger print mould group thickness.
Referring again to Fig. 2-Fig. 4, in the utility model embodiment, flexible positioning region 400 may include the first fixed part
420 and the second fixed part 430 for being an integral structure with the first fixed part 420, the first fixed part 420 sensed around fingerprint recognition
200 peripheral wall of device (i.e. the side wall of peripheral direction) is arranged and is fixedly linked with fingerprint Identification sensor 200, the first fixed part 420
Bottom end is fixedly linked with flexible circuit board 100, and the second fixed part 430 is located at the top of the first fixed part 420, the second fixed part
430 form the avoid holes 410 for surrounding infrared fileter 300.Specifically, the second fixed part 430 can surround infrared fileter
It 300 and is fixedly linked with infrared fileter 300.
Under normal conditions, the area of infrared fileter 300 is smaller, and the second fixed part 430 is formed by avoid holes 410 and is located at
Within first fixed part, 420 area defined, the second fixed part 430 at least partly structure can be with fingerprint Identification sensor
200 are fixedly linked.
In order to improve the stability of encapsulation, in preferred scheme, the second fixed part 430 is towards fingerprint Identification sensor 200
Surface include First terrace 431, fingerprint Identification sensor 200 has a second step face 220, First terrace 431 and the
Two step surfaces 220 are adapted.First terrace 431 and second step face 220 can be improved the area of encapsulation connection, and then can mention
The stability of height encapsulation.
In the present embodiment, flexible circuit board 100 can be connected with fingerprint Identification sensor 200 by conducting wire 500.Specifically
, conducting wire 500 can be embedded in flexible positioning region 400, and then can play the role of protecting conducting wire 500.Specifically, conducting wire
500 one end can be electrically connected with fingerprint Identification sensor 200, and the other end passes through flexible positioning region 400 and and flexible circuit board
100 electrical connections.
Based on optical finger print mould group disclosed in the utility model embodiment, the utility model embodiment discloses a kind of electronics and sets
Standby, disclosed electronic equipment includes the optical finger print mould group of display module 600 with the bottom that display module 600 is arranged in, should
Optical finger print mould group is the above optical finger print mould group.
Specifically, display module 600 includes display screen 630 and usually passes through OCA glue-line 620 and 930 stationary phase of display screen
Cover sheet 610 even.Cover sheet 910 is covered on display screen 630, and then provides protection for display screen 930.Cover sheet
610 be euphotic cover plate, such as glass cover-plate.
Optical finger print mould group is typically secured to the lower section of display module 600, and optical finger print mould group and display module 600 are usual
It can be adhesively fixed by the second glue-line 700.Specifically, optical finger print mould group is adhesively fixed on display by the second glue-line 700
Screen 630 is on the surface of the side of cover sheet 610.
Electronic equipment disclosed in the utility model embodiment can for smart phone, E-book reader, tablet computer, can
Wearable device etc., the utility model embodiment do not limit the specific type of electronic equipment.
Emphasis describes the difference between each embodiment in the utility model foregoing embodiments, between each embodiment
As long as different optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, this then no longer
It repeats.
The above description is only the embodiments of the present invention, is not intended to limit the utility model.For this field
For technical staff, various modifications and changes may be made to the present invention.All institutes within the spirit and principle of the utility model
Any modification, equivalent substitution, improvement and etc. of work, should be included within the scope of the claims of the utility model.
Claims (10)
1. a kind of optical finger print mould group characterized by comprising
Flexible circuit board；
Flexible positioning region, the flexibility positioning region are set to the flexible circuit board, the flexibility positioning region and the flexible electrical
Installation cavity is formed between the plate of road, the installation cavity is equipped with avoid holes far from the side of the flexible circuit board；
Fingerprint Identification sensor, the fingerprint Identification sensor are contained in the installation cavity and are set to the flexible circuit
Plate, the fingerprint Identification sensor are electrically connected with the flexible circuit board, and the fingerprint Identification sensor and the avoid holes
Position is corresponding；
Infrared fileter, the infrared fileter be set to the fingerprint Identification sensor away from the one of the flexible circuit board
Side, and the infrared fileter is corresponding with the evacuation hole site.
2. optical finger print mould group according to claim 1, which is characterized in that the infrared fileter is fixed on the evacuation
In hole.
3. optical finger print mould group according to claim 1, which is characterized in that the fingerprint Identification sensor passes through the first glue
Layer is fixed on the flexible circuit board.
4. optical finger print mould group according to claim 1, which is characterized in that the infrared fileter is attached to the fingerprint
Identification sensor is fixedly linked on the surface of the side of the flexible circuit board, and with the flexible positioning region.
5. optical finger print mould group according to claim 4, which is characterized in that the flexibility positioning region includes the first fixed part
With the second fixed part being an integral structure with first fixed part, first fixed part is sensed around the fingerprint recognition
The peripheral wall of device is arranged and is fixedly linked with the fingerprint Identification sensor, the bottom end of first fixed part and the flexible electrical
Road plate is fixedly linked, and second fixed position is in the top of first fixed part, and second fixed part is around described
Infrared fileter is fixedly linked with the infrared fileter.
6. optical finger print mould group according to claim 5, which is characterized in that second fixed part is known towards the fingerprint
The surface of individual sensor includes First terrace, and the fingerprint Identification sensor has second step face, the First terrace
It is adapted with the second step face.
7. optical finger print mould group according to claim 1, which is characterized in that the flexible circuit board and the fingerprint recognition
Sensor is electrically connected by conducting wire, and one end of the conducting wire is electrically connected with the fingerprint Identification sensor, and the other end passes through described
It flexible positioning region and is electrically connected with the flexible circuit board.
8. a kind of electronic equipment, which is characterized in that the optics including display module and the bottom that the display module is arranged in refers to
Line mould group, the optical finger print mould group are optical finger print mould group of any of claims 1-7.
9. electronic equipment according to claim 8, which is characterized in that the optical finger print mould group and the display module are logical
The second glue-line is crossed to be adhesively fixed.
10. electronic equipment according to claim 8, which is characterized in that the electronic equipment is smart phone, e-book is read
Read device, tablet computer or wearable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821598520.7U CN208861296U (en) | 2018-09-28 | 2018-09-28 | Optical finger print mould group and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821598520.7U CN208861296U (en) | 2018-09-28 | 2018-09-28 | Optical finger print mould group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208861296U true CN208861296U (en) | 2019-05-14 |
Family
ID=66419874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821598520.7U Active CN208861296U (en) | 2018-09-28 | 2018-09-28 | Optical finger print mould group and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208861296U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110738939A (en) * | 2019-10-31 | 2020-01-31 | 维沃移动通信有限公司 | Electronic device |
-
2018
- 2018-09-28 CN CN201821598520.7U patent/CN208861296U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110738939A (en) * | 2019-10-31 | 2020-01-31 | 维沃移动通信有限公司 | Electronic device |
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