CN209327619U - Light emission component and optical module - Google Patents
Light emission component and optical module Download PDFInfo
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- CN209327619U CN209327619U CN201822259152.XU CN201822259152U CN209327619U CN 209327619 U CN209327619 U CN 209327619U CN 201822259152 U CN201822259152 U CN 201822259152U CN 209327619 U CN209327619 U CN 209327619U
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Abstract
The utility model relates to technical field of photo communication, provide a kind of light emission component, including LD chip component and the first encapsulating shell, LD chip component includes LD outgoing collimation lens set, it includes substrate that LD, which is emitted collimation lens set, the movable part that substrate has the mountable fixed part on the bottom plate of the first encapsulating shell and can be subjected to displacement along the bottom plate direction perpendicular to the first encapsulating shell, LD outgoing collimation lens set are mounted on movable part by adhesive-layer.A kind of optical module, including shell are also provided, light-receiving component and a kind of above-mentioned light emission component, light-receiving component and light emission component are set on shell.The position that the utility model passes through the movable part by adjusting the pedestal for being emitted collimation lens set installation for LD, the gap between collimation lens set and movable part is emitted so as to adjust LD, to achieve the purpose that control adhesive-layer thickness, and then it ensure that the power stability of light emission component, and overall structure is simply easily achieved, and greatly improves the quality of optical module.
Description
Technical field
The utility model relates to technical field of photo communication, specially a kind of light emission component and optical module.
Background technique
Higher rate, more highly integrated, more small package be always the developing direction of high-speed optical module, at present small package size
100G QSFP28 optical transceiver module obtains large batch of application in data center and Ethernet, and follow-on optical module exists
The coming years will be 200G, 400G, develop then to 800G, in order to reach optical switch optical interface high density demand, 200G,
The encapsulation of 400G even 800G optical module to keep with the comparable outer dimension of QSFP28, this proposes the encapsulation of optical module design
Very high challenge is gone out.And four main composition part light emission components, light-receiving component, PCB, package casing of optical module
In, light emission component encapsulates always the most part of difficulty.
In the encapsulation of light emission component, the optical coupling of lens is the part of most difficulty again, because micron-sized position becomes
Change will lead to significantling change for emitting module light power.When carrying out lens optical coupling, usually make Lens Coupling to institute's light requirement
Behind the position of power, use adhesive that lens are adhered on pedestal to fix lens.Glue generallys use ultra-violet curing at present
Glue, during adhesion process, ultraviolet irradiation solidification can make glue generate contraction, lead to lens displacement, optical power is caused to become
Change, so command displacement amount is wanted, the glue that on the one hand select solidification process shrinking percentage minimum, while must assure that the glue of bonding
The gap of thickness degree, that is, between lens lower surface and pedestal, because shrinkage is directly proportional to bondline thickness.On the other hand, lens glue
After cementation is fixed, in the work of device high/low temperature, glue-line, which can generate, to expand with heat and contract with cold, and the thermal expansion coefficient of general glue is compared to inorganic
Material is all much larger, thus to guarantee device high/low temperature work when lens therefore and generate displacement it is sufficiently small, it is also necessary to control
The thickness of glue-line is made, because this displacement is also directly proportional with bondline thickness.Since the height of LD chip is by LD chip
Under pedestal, LD chip thickness and LD chip and substrate sticking material thickness etc. codetermine, and this three has one
Fixed tolerance, and the pedestal under lens can also have certain tolerance simultaneously, therefore the gap between lens and Nian Jie pedestal is bonded
The thickness of glue-line is difficult to be controlled effectively.For this reason, it is necessary to find one kind effectively control bondline thickness method to guarantee light
The power stability of emitting module.
Utility model content
The purpose of this utility model is to provide a kind of light emission component and optical modules, collimate by adjusting being emitted for LD
The position of the movable part of the pedestal of lens group installation is emitted the gap between collimation lens set and movable part so as to adjust LD, with
Achieve the purpose that control adhesive-layer thickness, and then ensure that the power stability of light emission component, and overall structure is simply easy
In realization, the quality of optical module is greatly improved.
To achieve the above object, the utility model embodiment provides the following technical solutions: a kind of light emission component, including LD
Chip component and the first encapsulating shell for encapsulating the LD chip component, the LD chip component include for receiving light letter
Number and the LD of shaping be emitted collimation lens set, LD outgoing collimation lens set includes substrate, the substrate have it is mountable
It fixed part on the bottom plate of first encapsulating shell and can be subjected to displacement along the bottom plate direction perpendicular to first encapsulating shell
Movable part, LD outgoing collimation lens set is mounted on the movable part by adhesive-layer.
Further, the fixed part and the movable part have an inclined-plane, the inclined-plane of the fixed part and the movable part
Inclined-plane is obliquely installed towards the direction of bottom plate perpendicular to first encapsulating shell, and the inclined-plane sliding of the fixed part install in
On the inclined-plane of the movable part.
Further, the optical signal that further includes that treated for receiving the LD chip component and the light wavelength division multiplexing of multiplex
And the second encapsulating housing for encapsulating the light wavelength division multiplexing, first encapsulating shell are fixed with second encapsulating shell
Connection, to form the second chamber for encapsulating the first chamber of the LD chip component and for encapsulating the light wavelength division multiplexing
Room, the first chamber are located in first encapsulating shell, and the second chamber is located in second encapsulating shell.
Further, the second chamber has the opening blocked by first encapsulating shell, and the LD chip component is sent out
First encapsulating shell described in optical signals out corresponds to the opening and enters in the second chamber.
Further, first encapsulating shell is equipped with glass plate optical window, the LD far from the side wall of the LD chip component
Glass plate optical window described in the optical signals of chip component transmitting penetrates and is sent to the light wavelength division multiplexing.
Further, the glass plate optical window is obliquely installed, and has angle between the side wall of the LD chip component, should
The range of angle is between 2~10 degree.
Further, second encapsulating shell is equipped with coupled lens, second envelope far from the side of first encapsulating shell
Fiber adapter group is also equipped on dress shell, the fiber adapter group includes optical fiber, coupling lock pin and adapter, the light
Fine both ends couples lock pin and adapter connection, the coupling lock pin are connected to the coupled lens with described respectively,
The adapter is for optical signal to be transmitted in another optical module.
Further, first encapsulating shell far from second encapsulating shell side have groove, the groove with it is described
It is penetrated through in first encapsulating shell, pcb board is installed in the groove, passes through spun gold between the pcb board and the LD chip component
Bonding wire welding.
Further, the LD chip component further includes LD chipset for emitting optical signal and for matching the light
The wavelength and isolation reflected light of signal enter the isolator group of the LD chipset, the LD chipset, LD outgoing collimation
Lens group and the isolator group are set gradually along the optical path of the optical signal transmission.
The utility model embodiment provides another technical solution: a kind of optical module, including shell further include light-receiving group
Part and a kind of above-mentioned light emission component, the light-receiving component and the light emission component are set on the shell.
Compared with prior art, the utility model has the beneficial effects that
1, it by adjusting the position of the movable part of the pedestal for LD outgoing collimation lens set installation, is emitted so as to adjust LD quasi-
Gap between straight lens group and movable part to achieve the purpose that control adhesive-layer thickness, and then ensure that light emission component
Power stability, and overall structure is simply easily achieved, and greatly improves the quality of optical module.
2, by using two-part structure, LD chip component and light wavelength division multiplexing is independent, by the place of optical signal
Reason is divided into the progress of two steps, both improves yield, is additionally favorable for mounting process implementation.
3, it is welded between pcb board and light emission component by spun gold bonding wire, spun gold bonding wire can be shortened according to actual needs
Length, on the one hand, reduce the impedance discontinuity of signal transmission line, on the other hand, the gold thread pad on pcb board is much smaller than
The fabric swatch space of pcb board is greatly saved in the solder pad of FPC plate, to increase number of channels in same volume.
4, by using fiber adapter group, stress can be eliminated with effective compensation build-up tolerance using the flexibility of optical fiber,
Component stress is avoided to fall optical issue.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of light emission component provided by the embodiment of the utility model；
Fig. 2 is a kind of the first encapsulating shell, seal cover board and the PCB of light emission component provided by the embodiment of the utility model
The structural schematic diagram of plate installation；
Fig. 3 is a kind of structural schematic diagram of the fiber adapter group of light emission component provided by the embodiment of the utility model；
Fig. 4 is that a kind of LD of light emission component provided by the embodiment of the utility model is emitted the structural representation of collimation lens set
Figure；
In appended drawing reference: 1-LD chip component；10-LD chipset；100-LD chip；11-LD is emitted collimation lens set；
110-LD is emitted collimation lens；12- isolator group；120- isolator；2- light wavelength division multiplexing；The first encapsulating shell of 3-；30- first
Chamber；31- glass plate optical window；32- groove；The second encapsulating shell of 4-；40- second chamber；41- coupled lens；5- fiber adapter
Group；50- optical fiber；51- couples lock pin；52- adapter；6- seal cover board；7-PCB plate；80- fixed part；81- movable part；Between a-
Gap, the inclined-plane b-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
All other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model embodiment provides a kind of light emission component, including LD chip component 1 and use
In the first encapsulating shell 3 for encapsulating the LD chip component 1, the LD chip component 1 includes for receiving optical signal and shaping
LD is emitted collimation lens set 11, and LD outgoing collimation lens set 11 includes substrate, and the substrate has mountable described the
It fixed part 80 on the bottom plate of one encapsulating shell 3 and can be subjected to displacement along the bottom plate direction perpendicular to first encapsulating shell 3
Movable part 81, the LD outgoing collimation lens set 11 are mounted on the movable part 81 by adhesive-layer.In the present embodiment, it is
Guarantee the yield of coupling, the position that LD is emitted collimation lens set 11 is essentially hard and fast, therefore usually when packaged
Will be fixed, though can variation slightly will not influence very much to couple, but this change amplitude need it is minimum, however due to
The lower part of LD outgoing collimation lens set 11 can be mounted on fixed pedestal in the prior art by adhesive-layer, if not to adhesive-layer
Thickness controlled, in ultra-violet curing and when expanding with heat and contract with cold, due to the characteristic of adhesive-layer itself, the thickness of adhesive-layer will be sent out
Changing when this variation occurs, may will be such that LD is emitted if not controlling the thickness of the adhesive-layer before encapsulation early period
The position of collimation lens set 11 has exceeded the variation of the amplitude in controlled range, just influences whether the power stability of light emission component
Property, therefore, fixed pedestal in the prior art is improved to the adjustable pedestal of adjustment height position in the present embodiment, by adjustable
The direction (for ease of description, is defined as one in the direction of the bottom plate perpendicular to first encapsulating shell 3 by the movable part of pedestal
As property vertical direction put because the first encapsulating shell 3 is horizontal under normal conditions)) on adjust, to reduce LD outgoing collimation
The mesh of the thickness of the adhesive-layer in the gap is filled to reach control in gap between lens subassembly and the movable part
's.
The mode for optimizing above-mentioned adjusting please refers to Fig. 1-4, specifically, the fixed part 80 has the first inclined-plane, the work
Dynamic portion 81 has the second inclined-plane that can be slided on first inclined-plane, the first inclined-plane and the movable part of the fixed part 80
81 the second inclined-plane is obliquely installed towards the direction of the bottom plate perpendicular to first encapsulating shell 3.Two inclined-planes are the mark in Fig. 4
Number b, in the present embodiment, the mode of adjusting are in such a way that two inclined-planes cooperations are adjusted, since inclined power can decompose
Therefore as long as movable part 81 slides on fixed part 80, it can be realized and move down for the power of vertical direction and the power of horizontal direction
It is dynamic, referring to Fig. 4, the gap between movable part 81 and LD outgoing collimation lens set 11 is a, by adjusting the position of movable part 80
To adjust the value of gap a, so as to just control the thickness of adhesive-layer before encapsulation early period, after controlling adhesive-layer
After thickness, it can be packaged.Preferably, the movable part 81 and movable part 81 are triangular prismatic type, and the two of two triangular prismatic types
A inclined-plane cooperation, and one of triangular prismatic type has the plane of installation LD outgoing collimation lens set 11.Certainly, in addition to this,
The mode of above-mentioned adjusting can also be realized using lifting part, such as lifting part is installed in fixed part 80, then will be movable
Portion 81 is installed on this lifting part, the lifting of movable part 81 is realized by lifting part, to complete above-mentioned adjusting, specifically
, lifting part can have much in the form of, such as screw rod transmission.
As the prioritization scheme of the utility model embodiment, this component further includes light wavelength division multiplexing 2 and the second encapsulation
Shell 4.Wherein, the light wavelength division multiplexing 2, the optical signal and multiplex for receiving the transmitting of LD chip component 1 are at light beam；
Second encapsulating shell 4, for encapsulating the light wavelength division multiplexing 2；First encapsulating shell 3 and second encapsulating shell 4 are solid
Fixed connection, to be formed for encapsulating the first chamber 30 of the LD chip component 1 and for encapsulating the light wavelength division multiplexing 2
Second chamber 40, the first chamber 30 are located in first encapsulating shell 3, and the second chamber 40 is located at second encapsulation
In shell 4.For abreast of the times requirement, i.e. rate is higher and higher, it is necessary to increase the quantity of light wave multiplexing, and consider again
The encapsulation of miniaturization, just can only by the LD chip that can more generate light wave and other cooperate its part to be all integrated in one
In a shell, part is more certainly will to will cause yield decline, for example, yield perhaps can achieve when an only light wave
98%, but if light wave is more, calculation formula, that is, multiple 98% of yield is multiplied, it is clear that more how yield reduces very much,
Condition is integrated in processing inside a shell, undoubtedly greatly affected yield there are also the device that other cooperate.Therefore, in this reality
It applies in example, it, will if the second encapsulating shell 4 is individually encapsulated light wavelength division multiplexing 2 if the first encapsulating shell 3 is individually encapsulated LD chip component 1
LD chip component 1 and light wavelength division multiplexing 2 are independent, and the processing of optical signal is divided into two steps and is carried out, yield is both improved, also
Conducive to the implementation of mounting process.
Scheme is advanced optimized, is opened referring to Fig. 1, the second chamber 40 has by what first encapsulating shell 3 blocked
Mouthful, and the corresponding opening of the first encapsulating shell 3 described in the optical signals of the LD chip component 1 sending enters second chamber
In room 40.In the present embodiment, as shown in Figure 1, the second encapsulating shell 4 close to the side of the first encapsulating shell 3 is not no side wall, this
Place is an opening, in this way, the first encapsulating shell 3 and the second encapsulating shell 4 share a side wall.It is designed in this way, compared with using such as two
First encapsulating shell 3 will eliminate a side wall to form two chambers, on the one hand reduce the processing request of the second encapsulating shell, separately
On the one hand, space has been saved, has kept length component shorter.
As the prioritization scheme of the utility model embodiment, referring to Fig. 1, the LD chip component 1 includes LD chipset
10, LD is emitted collimation lens set 11 and isolator group 12.Wherein, the LD chipset 10, for emitting optical signal；It is described
LD is emitted collimation lens set 11, for the optical signal to be carried out Shape correction；The isolator group 12, matches the optical signal
Wavelength, and for reflected light to be isolated into the LD chipset 10；The LD chipset 10, the LD are emitted collimation lens set
11 and the isolator group 12 set gradually along the optical path of the optical signal transmission.In the present embodiment, LD chipset 10
Effect is the optical signal for launching different wave length, for example, by using four LD chips, respectively emits 4 four λ 1, λ 2, λ 3, λ wavelength
Then optical signal carries out Shape correction to above-mentioned optical signal using LD outgoing collimation lens set 11, then penetrates isolator group 12
The phenomenon that multiplex is reached in light wavelength division multiplexing 2 into light beam, but will appear reflected light in the process, it enters in order to prevent
LD chip, therefore fallen these reflected light isolation processings using isolator group 12, to avoid the deterioration for causing high-speed optical signal.
LD chipset 10, LD outgoing collimation lens set 11 and isolator group 12 are set in the first encapsulating shell 3, pass through their cooperation
Handle available more good optical signal.
Above scheme is advanced optimized, referring to Fig. 1, the LD chipset 10 includes multiple LD chips, LD outgoing collimation
Lens group 11 includes and the one-to-one multiple LD of multiple LD chips 100 are emitted collimation lenses 110, the isolator group 12
Including multiple isolators 120, each LD chip 100 emit light letter correspondingly with multiple LD outgoing collimation lenses
Number after the corresponding LD is emitted 110 shaping of collimation lens, enter after being then passed through corresponding isolator 120
Into the light wavelength division multiplexing 2.In the present embodiment, LD chip 100, LD outgoing collimation lens 110 and isolator 120
Quantity is all the same, so just can guarantee that optical signal one-to-one correspondence is handled.For example, by using two LD chips 100, then corresponding, LD
Be emitted collimation lens 110 quantity also there are two, while the quantity of isolator 120 also there are two.Preferably, in the present embodiment
LD coupled lens 41 can be used in LD outgoing collimation lens.
As the prioritization scheme of the utility model embodiment, Fig. 1 and Fig. 2 are please referred to, first encapsulating shell 3 is far from described
The side wall of LD chip component 1 is equipped with glass plate optical window 31, glass described in the optical signals that the LD chip component 1 emits
Plate optical window 31 penetrates and is sent to the light wavelength division multiplexing 2.It in the present embodiment, can be so as to by the glass plate optical window 31
It is pierced by and is concurrently incident upon in light wavelength division multiplexing 2 out of first encapsulating shell 3 in optical signal.A preferred side as the present embodiment
Case, the glass plate optical window 31 are obliquely installed, it and side wall have angle, and the range of the angle is skewed by this at 2~10 degree
State can reduce the reflection of light caused by glass optical window, when using 8 ° of angle, can greatly reduce light reflection.
As the prioritization scheme of the utility model embodiment, referring to Fig. 1, second encapsulating shell 4 is far from described first
The side of encapsulating shell 3 is equipped with coupled lens 41, the coupled lens 41, the light synthesized for receiving the light wavelength division multiplexing 2
Signal is simultaneously coupled.In the present embodiment, which can be again to treated the optical signal of light wavelength division multiplexing 2
Beam shaping is carried out, in order to be transmitted in the light-receiving component of another optical module.
Above scheme is advanced optimized, Fig. 1 and Fig. 3 is please referred to, is also equipped with fiber adapters on second encapsulating shell 4
Device group 5, the fiber adapter group 5 include optical fiber 50, coupling lock pin 51 and adapter 52, the both ends difference of the optical fiber 50
Lock pin 51 and the connection of the adapter 52 are coupled with described, the coupling lock pin 51 is connected to the coupled lens 41, described
Adapter 52 is for optical signal to be transmitted in another optical module.In the present embodiment, the purpose of fiber adapter group 5 be by
Optical signal is transferred in another optical module.Using this transmission mode, on the one hand can solve space in existing module it is small and
The defect for causing encapsulation difficult, because can use the flexible feature of optical fiber 50, according to special curved in narrow space
The optical signal coupled after multiplex is transferred in other optical module by Qu Fangfa, on the other hand can also solve existing optical assembly with
Hard link is used between pcb board 7, assembly certainly exists build-up tolerance, and haves the defects that stress, by utilizing the soft of optical fiber 50
Toughness, effective compensation build-up tolerance eliminate stress, component stress are avoided to fall optical issue.
As the prioritization scheme of the utility model embodiment, referring to Fig. 2, first encapsulating shell 3 and described second
Seal cover board 6 is mounted on encapsulating shell 4, one of them described seal cover board 6 is used to the LD chip component 1 being encapsulated in institute
It states in the first encapsulating shell 3, another described sealing cover is for light wavelength division multiplexing 2 to be encapsulated in second encapsulating shell 4.?
In the present embodiment, dust-proof and isolation steam can be played the role of by installing this seal cover board 6, improve reliability.
As the prioritization scheme of the utility model embodiment, Fig. 1 and Fig. 2 are please referred to, first encapsulating shell 3 is far from described
The side of second encapsulating shell 4 has groove 32, is equipped with pcb board 7 in the groove 32, the pcb board 7 and the groove 32 it
Between welded by spun gold bonding wire.In the present embodiment, for groove 32 for being inserted into optic module PCB plate 7, the slot thickness of the groove 32 is bigger
In the thickness of pcb board 7, connects so as to carry out spun gold bonding wire in PCB with LD chip chamber, so that bonding wire is short enough, reduce
The impedance discontinuity of signal transmission line, it is thus also avoided that needing to connect by FPC (flexible circuit board) in the prior art causes
Pad it is excessive and the problem of lead to 7 insufficient space of pcb board, make it possible the quantity for increasing channel in same volume.
As the prioritization scheme of the utility model embodiment, the place for needing to connect is all made of glue and is filled sealing,
It is filled sealing as being all made of glue at the first encapsulating shell 3, glass optical window, pcb board 7 and seal cover board 6, can be played anti-
Dirt and isolation steam effect, improve reliability.
The utility model embodiment provides a kind of optical module, including shell, light-receiving component and a kind of above-mentioned light hair
Component is penetrated, the light-receiving component and the light emission component are set on the shell.In the present embodiment, above-mentioned light
Emitting module can be used in conventional optical module, so that the yield of the optical module gets a promotion, and be easily installed the reality of technique
When, while being welded by spun gold bonding wire, the length of spun gold bonding wire can be shortened according to actual needs, on the one hand, reduce signal biography
The impedance discontinuity of defeated route, on the other hand, the gold thread pad on pcb board 7 are much smaller than the solder pad of FPC plate, save significantly
The about fabric swatch space of pcb board 7 to increase number of channels in same volume, and by using fiber adapters
Device group 5 can be eliminated stress, component stress is avoided to fall optical issue using the flexibility of optical fiber 50 with effective compensation build-up tolerance.
As the prioritization scheme of the utility model embodiment, above-mentioned light emission component and light-receiving component can have
It two groups, realizes that double hairs are double and receives, i.e., two light emission components are arranged side by side, and two light-receiving components are also arranged side by side, two light hairs
Penetrating has a certain distance between component and two light-receiving components, to guarantee that the optical fiber 50 of light-receiving component can be spread apart.
By using the double modes received of double hairs, required number of wavelengths can not only reduced, also helps the design and manufacture of chip, and
The dislocation placement of two light emission components and two light-receiving components one in front and one in back can effectively solve the problems, such as that space is small.
As the prioritization scheme of the utility model embodiment, the optical fiber in above-mentioned two groups of light emission components is defined as first
Optical fiber and the second optical fiber optimize the bend mode of the first optical fiber and the second optical fiber.First optical fiber and second optical fiber
It is bent into annular, and is respectively positioned on the top of two second encapsulating shells 4, and is located in the installation region of the shell.?
In the present embodiment, the first optical fiber is sent out from the end of its second encapsulating shell 4, the direction of the second encapsulating shell 4 closed on towards it
Then bending is further continued for ultimately forming an annular, and be linked into another optical module to back bending song；Likewise, the second light
Fibre is sent out from the end of its second encapsulating shell 4, the bending of the direction of the second encapsulating shell 4 closed on towards it, be then further continued for
Back bending is bent, ultimately forms an annular, and be connected into another optical module.It is bent as far as possible around great circle in bending, as long as
No more than the range of shell.By this curved mode, the head and the tail both ends of optical fiber can be guaranteed curved to the maximum extent
It is unlikely to be damaged when bent, while has also achieved the purpose that transmit optical signal.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (10)
1. a kind of light emission component, the first encapsulating shell including LD chip component and for encapsulating the LD chip component, institute
Stating LD chip component includes being emitted collimation lens set for receiving the LD of optical signal and shaping, it is characterised in that: the LD outgoing
Collimation lens set includes substrate, and the substrate has the fixed part being mounted on the bottom plate of first encapsulating shell and can be along vertical
The movable part being directly subjected to displacement in the bottom plate direction of first encapsulating shell, the LD outgoing collimation lens set are pacified by adhesive-layer
On the movable part.
2. a kind of light emission component as described in claim 1, it is characterised in that: the fixed part has the first inclined-plane, described
Movable part has the second inclined-plane that can be slided on first inclined-plane, and first inclined-plane and second inclined-plane are towards vertical
It is obliquely installed in the direction of the bottom plate of first encapsulating shell.
3. a kind of light emission component as described in claim 1, it is characterised in that: further include for receiving the LD chip component
Treated optical signal and the light wavelength division multiplexing of multiplex and the second encapsulating housing for encapsulating the light wavelength division multiplexing,
First encapsulating shell is fixedly connected with second encapsulating shell, to form the first chamber for encapsulating the LD chip component
With the second chamber for encapsulating the light wavelength division multiplexing, the first chamber is located in first encapsulating shell, and described
Two chambers are located in second encapsulating shell.
4. a kind of light emission component as claimed in claim 3, it is characterised in that: the second chamber has by first envelope
The opening that shell blocks is filled, and the first encapsulating shell described in the optical signals of LD chip component sending corresponds to the opening and enters
In the second chamber.
5. a kind of light emission component as claimed in claim 3, it is characterised in that: first encapsulating shell is far from the LD chip
The side wall of component is equipped with glass plate optical window, and glass plate optical window described in the optical signals of the LD chip component transmitting penetrates
And it is sent to the light wavelength division multiplexing.
6. a kind of light emission component as claimed in claim 5, it is characterised in that: the glass plate optical window is obliquely installed, and with
There is angle, the range of the angle is between 2~10 degree between the side wall of the LD chip component.
7. a kind of light emission component as claimed in claim 3, it is characterised in that: second encapsulating shell is far from first envelope
The side for filling shell is equipped with coupled lens, is also equipped with fiber adapter group, the fiber adapter group on second encapsulating shell
Including optical fiber, coupling lock pin and adapter, the both ends of the optical fiber couple lock pin and adapter company with described respectively
Logical, the coupling lock pin is connected to the coupled lens, and the adapter is for optical signal to be transmitted in another optical module.
8. a kind of light emission component as claimed in claim 3, it is characterised in that: first encapsulating shell is far from second envelope
The side for filling shell has groove, penetrates through in the groove and first encapsulating shell, is equipped with pcb board in the groove, described
It is welded between pcb board and the LD chip component by spun gold bonding wire.
9. a kind of light emission component as described in claim 1, it is characterised in that: the LD chip component further includes for emitting
The LD chipset of optical signal and the wavelength for matching the optical signal and be isolated reflected light enter the LD chipset every
From device group, the light of the LD chipset, LD outgoing collimation lens set and the isolator group along the optical signal transmission
Road is set gradually.
10. a kind of optical module, including shell, it is characterised in that: further include light-receiving component and such as any institute of claim 1-9
A kind of light emission component stated, the light-receiving component and the light emission component are set on the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822259152.XU CN209327619U (en) | 2018-12-29 | 2018-12-29 | Light emission component and optical module |
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|---|---|---|---|
| CN201822259152.XU CN209327619U (en) | 2018-12-29 | 2018-12-29 | Light emission component and optical module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596830A (en) * | 2019-09-24 | 2019-12-20 | 武汉光迅科技股份有限公司 | Optical assembly |
| CN113281841A (en) * | 2021-04-16 | 2021-08-20 | 武汉联特科技股份有限公司 | Silicon optical multichannel parallel optical component and coupling method thereof |
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2018
- 2018-12-29 CN CN201822259152.XU patent/CN209327619U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596830A (en) * | 2019-09-24 | 2019-12-20 | 武汉光迅科技股份有限公司 | Optical assembly |
| CN113281841A (en) * | 2021-04-16 | 2021-08-20 | 武汉联特科技股份有限公司 | Silicon optical multichannel parallel optical component and coupling method thereof |
| CN113281841B (en) * | 2021-04-16 | 2022-05-27 | 武汉联特科技股份有限公司 | Silicon optical multichannel parallel optical component and coupling method thereof |
| WO2022217736A1 (en) * | 2021-04-16 | 2022-10-20 | 武汉联特科技股份有限公司 | Silicon optical multi-channel parallel optical component and coupling method therefor |
| US11740417B2 (en) | 2021-04-16 | 2023-08-29 | Linktel Technologies Co., Ltd. | Silicon photonics multi-channel parallel optical component and coupling method thereof |
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