CN110596830A - Optical assembly - Google Patents
Optical assembly Download PDFInfo
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- CN110596830A CN110596830A CN201910906115.XA CN201910906115A CN110596830A CN 110596830 A CN110596830 A CN 110596830A CN 201910906115 A CN201910906115 A CN 201910906115A CN 110596830 A CN110596830 A CN 110596830A
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- lens
- cushion block
- glue
- hole
- optical
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the application discloses optical assembly includes: a lens, a cushion block and a substrate; the substrate is provided with a through hole for accommodating the cushion block, so that the cushion block is conveyed to the position below the lens from the bottom of the substrate through the through hole; the cushion block penetrates through the through hole and is fixedly connected with the lower surface of the lens; the lens is fixed on the substrate through the cushion block.
Description
Technical Field
The present application relates to the field of optical communication technologies, and in particular, to an optical module.
Background
In the field of optical communication, especially in an optical module, focusing coupling or collimation of an optical signal by using a lens element is rarely used, while in a conventional optical emission coupling structure, the lens element is generally fixed by glue, however, the glue is easily deformed along with changes of temperature and humidity, and drives the lens element to displace, so that the coupling efficiency of a laser to a waveguide chip is directly influenced, and thus, the degradation of optical characteristics becomes a pending problem.
Disclosure of Invention
In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides an optical assembly, including: a lens, a cushion block and a substrate; wherein the content of the first and second substances,
the substrate is provided with a through hole for accommodating the cushion block, so that the cushion block is conveyed to the lower part of the lens from the bottom of the substrate through the through hole;
the cushion block penetrates through the through hole and is fixedly connected with the lower surface of the lens;
the lens is fixed on the substrate through the cushion block.
In an optional embodiment, the lower surface of the lens is a plane, and the lens is fixedly connected with the cushion block through the plane.
In an alternative embodiment, the pad is fixedly attached to the lower surface of the lens by glue.
In an alternative embodiment, the through hole is a clearance fit with the spacer.
In an alternative embodiment, the spacer is embedded in the through hole and is fixedly connected with the through hole under the condition that the lens is fixedly connected with the spacer.
In an alternative embodiment, the spacer is fixedly connected to the through hole by glue.
In an alternative embodiment, the glue is a photosensitive glue and/or an epoxy glue.
In an alternative embodiment, the spacer is made of a glass material; alternatively, the first and second electrodes may be,
the cushion block is made of ceramic materials; alternatively, the first and second electrodes may be,
the cushion block is made of a metal material.
In an optional embodiment, the method further comprises: an optical chip; wherein the content of the first and second substances,
the lens is arranged on the light path of the optical chip to focus or collimate the optical signal emitted by the optical chip.
An optical assembly provided by an embodiment of the present application includes: a lens, a cushion block and a substrate; the substrate is provided with a through hole for accommodating the cushion block, so that the cushion block is conveyed to the position below the lens from the bottom of the substrate through the through hole; the cushion block penetrates through the through hole and is fixedly connected with the lower surface of the lens; the lens is fixed on the substrate through the cushion block. Therefore, the thickness of the glue at the connecting position of the lens and the cushion block is controlled in a small range, and the problem of lens displacement caused by moisture absorption expansion or high-temperature expansion of the glue is solved.
Drawings
FIG. 1a is a side cross-sectional view of an optical assembly provided by an embodiment of the present application;
FIG. 1b is an enlarged view of the dashed area in a side cross-sectional view of the optical assembly of FIG. 1a provided by an embodiment of the present application;
FIG. 2a is a side cross-sectional view of an optical assembly provided by an embodiment of the present application;
FIG. 2b is an enlarged view of the dashed area in a side cross-sectional view of the optical assembly of FIG. 2a provided by an embodiment of the present application;
FIG. 3a is a side cross-sectional view of an optical assembly provided by an embodiment of the present application;
FIG. 3b is an enlarged view of the dashed area in a side cross-sectional view of the optical assembly of FIG. 3a provided by an embodiment of the present application;
FIG. 4 is a top view of an optical assembly provided by an embodiment of the present application;
FIG. 5 is a top view of one embodiment of a glue attachment for an optical assembly as provided in an embodiment of the present application;
FIG. 6 is a top view of another embodiment of a glue attachment for an optical assembly provided in the examples of the present application;
FIG. 7 is a top view of one embodiment of glue reinforcement of an optical component according to embodiments of the present application.
Detailed Description
So that the manner in which the features and elements of the present embodiments can be understood in detail, a more particular description of the embodiments, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.
In the field of optical communication, especially in an optical module, focusing coupling or collimation of an optical signal by using a lens element is rarely used, while in a conventional optical emission coupling structure, the lens element is generally fixed by glue, however, the glue is easily deformed along with changes of temperature and humidity, and drives the lens element to displace, so that the coupling efficiency of a laser to a waveguide chip is directly influenced, and thus, the degradation of optical characteristics becomes a pending problem.
The conventional lens fixing method generally places cushion blocks with different height specifications between a lens and a substrate, and fixes the cushion blocks with glue, so that the lens is lifted to a light path of an optical signal emitted by an optical chip, however, because the lens must be accurately arranged on the light path of the optical signal emitted by the optical chip, the height between the lens and the substrate can be changed along with the height of the optical signal emitted by the optical chip, when the cushion block is used for lifting the lens, a gap exists between the cushion block and the lens, at the moment, the cushion block can only be filled with glue, so that the thickness of a glue layer is difficult to control in a small range, and the problem that the position of the lens is deviated due to the fact that the glue is too thick and the temperature is changed or moisture is absorbed is caused.
Therefore, the following technical scheme of the embodiment of the application is provided.
Fig. 1a is a side cross-sectional view of an optical assembly provided in an embodiment of the present application, and fig. 1b is an enlarged view of a dotted line area in the side cross-sectional view of the optical assembly provided in the embodiment of the present application, where it should be noted that, in the embodiment of the present application, a part of optical devices of the optical assembly is omitted mainly for explaining a connection manner between a lens and a pad block. As shown in fig. 1b, an optical assembly provided in an embodiment of the present application includes: lens 110, spacer 120 (not shown in FIG. 1 b), and substrate 130; wherein the content of the first and second substances,
the substrate 130 is provided with a through hole 131 for accommodating the pad block 120, so that the pad block 120 is sent from the bottom of the substrate 130 to the lower part of the lens 110 through the through hole 131;
the pad 120 penetrates through the through hole 131 to be fixedly connected with the lower surface of the lens 110;
the lens 110 is fixed on the substrate 130 through the spacer 120.
Fig. 2a is a side cross-sectional view of an optical assembly provided in an embodiment of the present application, and fig. 2b is an enlarged view of a dotted area in the side cross-sectional view of the optical assembly provided in fig. 2a, as shown in fig. 1b and fig. 2b, in practical application, the lens 110 is sucked by a lens suction nozzle, the lower surface of the lens 110 is coated with glue, the lens 110 is suspended and placed on the optical path of the photo chip 140 by the lens suction nozzle, at this time, the pad 120 is sucked by a pad suction nozzle, at least one side of the pad 120 is coated with glue, the pad 120 is moved from the bottom of the substrate 130 (directly under the through hole 131) to the lower side of the lens 110 by the pad suction nozzle, and thus, the pad 120 passes through the through hole 131 and is fixedly connected with the lower surface of the lens 110. Thus, the cushion block 120 can be in close and seamless contact with the lens 110, that is, a gap between the cushion block 120 and the lens 110 can be reduced as much as possible, so that an adhesive layer between the cushion block 120 and the lens 110 is as small as possible, and the problem that the position of the lens is deviated due to temperature change or moisture absorption when the glue is too thick is avoided. It should be noted that the lens suction nozzle and the pad suction nozzle may suck the lens 110 and the pad 120 by vacuum suction. The lens suction nozzle and the cushion block suction nozzle can be suction nozzles on a fine adjustment frame.
In practical applications, the shape of the spacer 120 may be a cube, a cuboid, or any other solid shape that can be fixedly connected to the lower surface of the lens 110.
Fig. 4 is a top view of an optical assembly provided in an embodiment of the present application, and as shown in fig. 4, the optical assembly provided in the embodiment of the present application further includes: an optical chip 140; wherein the content of the first and second substances,
the lens 110 is disposed on the optical path of the optical chip 140 to focus or collimate the optical signal emitted from the optical chip 140.
In practical applications, the optical chip 140 may be a semiconductor laser, a light emitting diode, or the like. A semiconductor laser is a laser using a semiconductor material as a working substance, and is a device that generates laser light. A light emitting diode is a semiconductor electronic component that converts electrical energy into light energy. In a high-speed, large-capacity optical fiber communication system, a semiconductor laser is mainly used as a light source.
It should be noted that, in order to enable the optical signal emitted by the optical chip 140 to enter the lens 110 without loss, the optical chip 140 and the lens 110 (the pad block 120) may be integrated on the same substrate, so as to reduce attenuation that may be caused by transmission of the optical signal in the air, and reduce coupling cost. In this embodiment, the optical chip 140 and the spacer 120 are both disposed on the substrate 130, the spacer 120 is fixed in the through hole 131 of the substrate 130 in an embedded manner, and the lens 110 is fixedly disposed on the optical path of the optical chip 140 through the spacer 120. In the embodiment of the present invention, the optical chip 140 and the lens 110 are integrated on the same substrate 130 through the spacer 120, so that the optical path structure is simplified and shortened, the coupling cost is reduced, and the overall integration level is improved.
Fig. 3a is a side sectional view of the optical assembly provided in the embodiment of the present application, and fig. 3b is an enlarged view of a dotted area in the side sectional view of the optical assembly provided in the embodiment of the present application in fig. 3a, as shown in fig. 3a and fig. 3b, in the embodiment of the present application, the lower surface of the lens 110 is a plane, and the lens 110 is fixedly connected to the pad block 120 through the plane. It can be understood that the contact between the flat surface and the curved surface is smaller than the contact between the curved surface and the flat surface, so that the thickness of the glue at the connecting position of the lens 110 and the cushion block 120 is controlled to be as small as possible, and the problem that the position of the lens is deviated due to temperature change or moisture absorption when the glue is too thick is avoided.
In practical applications, the shape of the lens 110 may be a cube, a cuboid, or any other solid shape that can be fixedly connected to the pad 120.
It should be noted that at least one of the two light-passing surfaces of the lens 110 along the direction of the optical signal emitted by the optical chip 140 is a curved surface, and in practical applications, the lens 110 may be a converging lens, a collimating lens, or any other lens capable of focusing and collimating the optical signal emitted by the optical chip 140. The material of the converging lens and the collimating lens may be glass, crystal, or the like, and the embodiment of the present application is not limited thereto.
In the embodiment of the present application, the pad block 120 is fixedly connected to the lower surface of the lens 110 by glue. Wherein, the glue can be photosensitive glue and/or epoxy resin glue. As shown in fig. 1b, the lower surface of the lens 110 is a fixing surface of the lens 110 and the pad block 120, that is, a coating surface of glue between the lens 110 and the pad block 120.
In the embodiment of the present application, the through hole 131 is in clearance fit with the pad block 120. So that the pad block 120 can directly contact the inner wall of the through-hole 131 while sliding in the through-hole 131. In a case where the lens 110 is fixedly coupled to the pad block 120, the pad block 120 is inserted into the through hole 131 and is fixedly coupled to the through hole 131.
In the embodiment of the present application, the pad block 120 is fixedly connected to the through hole 131 by glue. Wherein, the glue can be photosensitive glue and/or epoxy resin glue. As shown in fig. 2b, two sides of the pad block 120 may be coated with glue, and the two sides are fixing surfaces of the pad block 120 and the through hole 131 (the substrate 130), that is, coating surfaces of the glue between the pad block 120 and the through hole 131 (the substrate 130). It should be noted that fig. 2b only illustrates one way of applying glue to the pad 120, and is not the only way.
Fig. 1 b-3 b may be provided as a series of side cross-sectional views illustrating successive steps of coupling the lens 110 to the spacer 120 according to embodiments of the present application. As shown in fig. 1 b-3 b, in practical application, the lens 110 is sucked by a lens suction nozzle, the glue is coated on the lower surface of the lens 110, the lens 110 is suspended and placed on the optical path of the optical chip 140 by the lens suction nozzle, at this time, the pad 120 is sucked by a pad suction nozzle, the glue is coated on at least one side surface of the pad 120, the pad 120 is moved from the bottom of the substrate 130 (right below the through hole 131) to the lower side of the lens 110 by the pad suction nozzle, the pad 120 passes through the through hole 131 to contact with the lower surface of the lens 110, in the case that the glue is photosensitive glue, ultraviolet light is irradiated on the contact surface between the pad 120 and the lens 110 to cure the photosensitive glue, so that the pad 120 passes through the through hole 131 to be fixedly connected with the lower surface of the lens 110, at this time, ultraviolet light is irradiated on the contact surface of the spacer 120 and the through hole 131 to cure the photosensitive glue, and then the spacer 120 is fixedly connected with the through hole 131. Thus, the cushion block 120 can be in close and seamless contact with the lens 110, that is, a gap between the cushion block 120 and the lens 110 can be reduced as much as possible, so that an adhesive layer between the cushion block 120 and the lens 110 is as small as possible, and the problem that the position of the lens is deviated due to temperature change or moisture absorption when the glue is too thick is avoided.
Fig. 5 is a top view of an embodiment of glue fixing performed on an optical assembly according to an embodiment of the present disclosure, and fig. 6 is a top view of another embodiment of glue fixing performed on an optical assembly according to an embodiment of the present disclosure, as shown in fig. 5 and fig. 6, in practical application, the pad block 120 and the through hole 131 are fixed by the glue, and specifically, two glue coating schemes may be adopted, namely, scheme a: trilateral C type point is glued (see dotted line frame in fig. 5, can leave the clearance between two cushion), scheme B: and (4) symmetrically dispensing on two sides (see a dotted line frame in figure 6, a gap can be left between the other two sides of the cushion block which are not coated with the glue and the through hole). Due to the clearance fit between the through hole 131 and the cushion block 120, the cushion block 120 is in direct contact with the inner wall of the through hole 131, so that the thickness of glue at the connecting position of the cushion block 120 and the through hole 131 can be reduced as much as possible, and the problem of lens displacement caused by moisture absorption expansion or high-temperature expansion of the glue is solved.
In practical applications, the shape of the pad 120 may be a cube, a cuboid, or any other three-dimensional shape that can be fixedly connected to the through hole 131.
In practical applications, as shown in fig. 4 to 7, the through hole 131 may be configured to accommodate widths of two of the pads 120 at the same time, so as to reduce the number of processing steps for the substrate 130 and save processing time. It should be noted that most of the optical chips in the optical module are arranged in pairs, and the optical chips are all disposed on the same substrate, and there is no large deviation in the optical paths of the optical signals emitted by the optical chips, so that after the through holes 131 are set to have widths capable of simultaneously accommodating two of the spacers 120, the fine adjustment frame can be used to place and fix the lens 110 and the spacers 120 in pairs. For example, a first lens and a second lens are respectively sucked by two lens suction nozzles on a fine adjustment frame, glue is coated on the lower surfaces of the first lens and the second lens, the first lens and the second lens are respectively suspended and placed on the light path of the optical chip by the two lens suction nozzles, at this time, a first cushion block and a second cushion block are sucked by the two cushion block suction nozzles, glue is respectively coated on at least one side surface of the first cushion block and the second cushion block, the first cushion block and the second cushion block are respectively moved to the lower sides of the first lens and the second lens from the bottom of the substrate (right below a through hole) by the two cushion block suction nozzles, the first cushion block and the second cushion block pass through the through hole to respectively contact with the lower surfaces of the first lens and the second lens, and in the case that the glue is photosensitive glue, ultraviolet light is irradiated on the contact surface of the first cushion block and the first lens to cure the photosensitive glue, and irradiating ultraviolet light on the contact surface of the second cushion block and the second lens to cure the photosensitive glue, so that the first cushion block and the second cushion block penetrate through the through hole to be respectively fixedly connected with the lower surfaces of the first lens and the second lens, at the moment, irradiating ultraviolet light on the contact surfaces of the first cushion block and the second cushion block and the through hole to cure the photosensitive glue, and then fixedly connecting the first cushion block and the second cushion block with the through hole.
In the embodiment of the present application, the spacer 120 needs to have a small expansion coefficient to ensure that the coupling structure does not generate a large displacement at high and low temperatures. Thus, the pad 120 may be made of a glass material; alternatively, the pad 120 may be made of a ceramic material; alternatively, the pad 120 may be made of a metal material.
It should be noted that after the cushion block 120 is fixedly connected to the lens 110 and the through hole 131, the joint between the cushion block 120 and the lens 110 and the joint between the cushion block 120 and the through hole 131 may be further reinforced by using epoxy resin glue.
It should be further noted that, after the cushion block 120 is fixedly connected to the lens 110 and the through hole 131, the joint between the cushion block 120 and the lens 110 and the joint between the cushion block 120 and the through hole 131 may be further reinforced by using epoxy resin glue. The reinforcement method includes front reinforcement and back reinforcement, the front reinforcement can apply glue to the joint of the spacer block 120 and the lens 110 (not shown in fig. 7) and the joint of the spacer block 120 and the through hole 131 in an L-shaped asymmetric dispensing manner (fig. 7 is a top view of an embodiment of glue reinforcement for an optical component provided in an embodiment of the present application, as shown by an L-shaped dashed frame in fig. 7); the backside reinforcement may apply glue from the bottom of the substrate to the connection of the pad 120 and the through hole 131 in a symmetrical dispensing manner. It should be noted that fig. 7 only illustrates an L-shaped asymmetric dispensing manner, and specifically which two side surfaces of the cushion block 120 form an L-shape is selected, which may be set according to actual requirements. It can be understood that, no matter the contact surface between the pad block 120 and the lens 110 or the contact surface between the pad block 120 and the through hole 131, the contact surfaces are rectangular contact surfaces, that is, four sides surround the contact surfaces, the L-shaped asymmetric dispensing manner is to apply glue to two connected sides, and the side-symmetric dispensing manner is to apply glue to two unconnected sides.
It should be noted that, the reinforcing means does not fill the glue between the contact surfaces of the pad block 120 and the lens 110, but coats the glue around the contact surfaces of the pad block 120 and the lens 110 to play a role of reinforcing, and such reinforcing means does not increase the thickness of the glue layer between the pad block 120 and the lens 110, so as to play a role of reinforcing the connection between the pad block 120 and the lens 110 without increasing the thickness of the glue layer. Similarly, the reinforcement method is not to fill the glue between the contact surfaces of the pad block 120 and the through hole 131, but to coat the glue around the contact surfaces of the pad block 120 and the through hole 131 to play a role in reinforcement, and such reinforcement method does not increase the thickness of the glue layer between the pad block 120 and the through hole 131, so that the connection between the pad block 120 and the through hole 131 can be reinforced without increasing the thickness of the glue layer.
It should be noted that, only the case that only one lens is set up in the light path of each optical chip is illustrated in fig. 1-7 in this application, and in practical application, a plurality of lenses can be set up on the light path of each optical chip, and when setting up two the lens is right the light signal that the optical chip launches converges and collimates, is close to the first lens of optical chip can be fixed through V type groove on the light path of optical chip, also can directly paste the dress in the light path of optical chip through high accuracy chip mounter, and keep away from the second lens of optical chip can be fixed through the embedding the cushion block of base plate on the light path of optical chip for further focusing and collimating the light signal of first lens output.
In some embodiments, when two lenses are disposed on the optical path of each optical chip, the first lens close to the optical chip may be further fixed on the optical path of the optical chip by an inverted T-shaped supporting component or a UT-bonding supporting component, and the second lens far from the optical chip may be fixed on the optical path of the optical chip by the spacer embedded in the substrate, for further focusing and collimating the optical signal output by the first lens. The inverted T-shaped support assembly comprises a base and a support column, the support column of the inverted T-shaped support assembly is used for fixing the lens, and the side face of the lens is fixedly connected with the side face of the support column; the base of the inverted T-shaped support component is used for integrally fixing the inverted T-shaped support component and the lens on the substrate. The UT combined type supporting component comprises a base and a U-shaped groove; the U-shaped groove of the UT combined type supporting assembly is used for fixing the lens, and two side surfaces of the lens are fixedly connected with the inner walls of two sides of the U-shaped groove; the base of the UT combined type supporting component is used for integrally fixing the UT combined type supporting component and the lens on the substrate. When a plurality of lenses are disposed on the optical path of each optical chip, the lenses may be fixed using various lens fixing methods or combinations of components to fix the lenses on the optical path of the optical chip.
It should be further noted that, in the embodiments of fig. 4 to 7, four corners of the through hole 131 are circular, and this is set so that when the pad block 120 moves in the through hole 131, the pad block 120 cannot move or is prevented from moving in the through hole 131 due to the glue blocking all gaps between the pad block 120 and the through hole 131.
As shown in fig. 1 b-3 b, in the embodiment of the present application, the pad 120 indirectly connects the substrate 130 and the lens 110 by being embedded in the through hole 131 of the substrate 130, and the connection manner is as follows: the lens 110 is suspended and fixed on the optical path of the optical chip 140, and then the pad block 120 is sent to the lower side of the lens 110 from the bottom of the substrate 130 in a manner of passing through the through hole 131 until contacting with the lower surface of the lens 110, so that the pad block 120 can be in close and seamless contact with the lens 110, that is, the gap between the pad block 120 and the lens 110 can be reduced as much as possible, so that the glue layer between the pad block 120 and the lens 110 is as small as possible, and the problem that the position of the lens is deviated due to the fact that the glue is too thick and the glue is easy to change due to temperature or absorb moisture is avoided.
An optical assembly provided by an embodiment of the present application includes: a lens, a cushion block and a substrate; the substrate is provided with a through hole for accommodating the cushion block, so that the cushion block is conveyed to the position below the lens from the bottom of the substrate through the through hole; the cushion block penetrates through the through hole and is fixedly connected with the lower surface of the lens; the lens is fixed on the substrate through the cushion block. Therefore, the thickness of the glue at the connecting position of the lens and the cushion block is controlled in a small range, and the problem of lens displacement caused by moisture absorption expansion or high-temperature expansion of the glue is solved.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The features disclosed in several of the apparatus embodiments provided in the present application may be combined arbitrarily, without conflict, to arrive at new apparatus embodiments.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. An optical assembly, comprising: a lens, a cushion block and a substrate; wherein the content of the first and second substances,
the substrate is provided with a through hole for accommodating the cushion block, so that the cushion block is conveyed to the lower part of the lens from the bottom of the substrate through the through hole;
the cushion block penetrates through the through hole and is fixedly connected with the lower surface of the lens;
the lens is fixed on the substrate through the cushion block.
2. The optical assembly of claim 1,
the lower surface of the lens is a plane, and the lens is fixedly connected with the cushion block through the plane.
3. The optical assembly of claim 2,
the cushion block is fixedly connected with the lower surface of the lens through glue.
4. The optical assembly of claim 1,
the through holes are in clearance fit with the cushion blocks.
5. The optical assembly of claim 1,
and under the condition that the lens is fixedly connected to the cushion block, the cushion block is embedded into the through hole and is fixedly connected with the through hole.
6. The optical assembly of claim 5,
the cushion block is fixedly connected with the through hole through glue.
7. Optical assembly according to claim 3 or 6,
the glue is photosensitive glue and/or epoxy resin glue.
8. Optical assembly according to one of claims 1 to 6,
the cushion block is made of a glass material; alternatively, the first and second electrodes may be,
the cushion block is made of ceramic materials; alternatively, the first and second electrodes may be,
the cushion block is made of a metal material.
9. The optical assembly of any one of claims 1 to 6, further comprising: an optical chip; wherein the content of the first and second substances,
the lens is arranged on the light path of the optical chip to focus or collimate the optical signal emitted by the optical chip.
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| CN201910906115.XA CN110596830A (en) | 2019-09-24 | 2019-09-24 | Optical assembly |
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| CN110596830A true CN110596830A (en) | 2019-12-20 |
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| CN103576255A (en) * | 2012-07-26 | 2014-02-12 | 日本电信电话株式会社 | Integrated optical module |
| DE102014219792A1 (en) * | 2014-09-30 | 2016-03-31 | Technische Universität Berlin | Optoelectronic component |
| CN106483608A (en) * | 2015-08-24 | 2017-03-08 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN109696730A (en) * | 2018-02-28 | 2019-04-30 | 苏州旭创科技有限公司 | Optical module itself and packaging method |
| CN209327619U (en) * | 2018-12-29 | 2019-08-30 | 武汉联特科技有限公司 | Light emission component and optical module |
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Application publication date: 20191220 |