CN209297844U - A kind of patch hot pressing sensitive resistor - Google Patents
A kind of patch hot pressing sensitive resistor Download PDFInfo
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- CN209297844U CN209297844U CN201821709515.9U CN201821709515U CN209297844U CN 209297844 U CN209297844 U CN 209297844U CN 201821709515 U CN201821709515 U CN 201821709515U CN 209297844 U CN209297844 U CN 209297844U
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Abstract
The utility model provides a kind of patch hot pressing sensitive resistor, it is coupled between heat sensitive chip and chip varistor by right end or the left end welding as public end, and left end or right end are welded at the top of chip varistor, intermediate end is welded in the bottom of heat sensitive chip, the lead direction of all exits is all the same, and exit is connect after bending with pin；It is equipped with plastic-sealed body in the outside of heat sensitive chip and chip varistor, all pins are bonded with the lead surface of plastic-sealed body and surface exposure is on the lead surface of plastic-sealed body.The utility model optimizes product structure, realize product miniaturization, horizontal patch hot pressing sensitive resistor product can be directly obtained without bending process after plastic packaging cutting, or vertical sleeping double-purpose patch hot pressing sensitive resistor product is just obtained by once bending after plastic packaging cutting, the cost of labor of production is effectively reduced, production efficiency, and stabilized product quality are improved, product can be produced using SMD mount technology.
Description
Technical field
The utility model relates to technical field of electronic components, especially a kind of patch hot pressing sensitive resistor.
Background technique
There are three types of the techniques for producing compound hot pressing sensitive resistor at present: (1) circle lead welds pouch-type: 1. varistor core
Piece and the thermistor chip welding plug-in unit of direct-coupling → 2. → 3 welding → the 4. cutting detection packet of the mark of encapsulating solidification → 5. → 6.
Dress, first method must be the collocation coupling of size chip, the component after coupling because common end needs to be welded on chip varistor
An eccentric compound chip, as shown in fig. 7, this method can manual plug-in unit, welding, can also be with machine plug-in unit, welding；
(2) flat pin welds pouch-type: 1. 4. the plug-in unit → 3 welding → of voltage dependent resistor chip and thermistor chip welding direct-coupling → 2. wraps
The cutting detection packaging of sealing → 5 marks → 6., second method technique is with as the first, and only pin configuration is different, together
Sample must be the collocation coupling of size chip because common end needs to be welded on chip varistor, and the component after coupling is equally one
Eccentric compound chip, as shown in fig. 7, this method can manual plug-in unit, welding, can also be welded with machine plug-in unit；(3) flat to draw
Foot welds packet miniaturization type: the 1. cutting detection packaging of the mark of → 3 encapsulating solidification of the welding of plug-in unit → 2. coupling → 4. → 5., the third side
Method is to weld coupling by being placed on the intermediate common end of heat sensitive chip and chip varistor.
First, second kind of technique is all that common end need to be welded on chip varistor, therefore can not achieve miniaturization, the third technique
It is that can be minimized by common end welding coupling, but exit has encapsulating material when encapsulating, product is positioned using needs and beats " K " foot
Or positioning device, therefore rising for product is relatively high, the product of these three techniques production has the disadvantage that:
1, encapsulating material is easily scaling-off, influences welding quality；
2, common end pin, pressure-sensitive end pin rise height because to beat " K " foot, product, need space big；
3, the first product is long lead, is easily deformed in transportational process, client's production flow, needs to insert product
It is transported on foam with special packing case, packing cost, transportation cost are high.
4, three kinds of products are easily deformed because of pin, and product can not be made into volume from can not ensure by the pin pitch between pin
Band is delivered, and client can not use machine plug-in unit, and must use artificial plug-in unit, at high cost, low efficiency；
In conclusion currently used three productions technological work low efficiency, quality fluctuation are big, rise high, client can not
Machine plug-in unit, it is even more impossible to be produced using SMD mounting technology.
Utility model content
The purpose of this utility model is: providing a kind of patch hot pressing sensitive resistor, it is convenient for automated production, and product matter
Amount is stablized, and miniaturization is realized, and reduces production cost, client can mount production technology using SMD, to overcome the prior art
It is insufficient.
The utility model is realized in this way: patch hot pressing sensitive resistor, including heat sensitive chip, chip varistor, in temperature-sensitive
It is coupled between chip and chip varistor by right end or the left end welding as public end, and at the top of chip varistor
It is welded with left end or right end, is welded with intermediate end in the bottom of heat sensitive chip, the lead direction of all exits is homogeneous
Together, exit is connect after bending with pin；It is equipped with plastic-sealed body in the outside of heat sensitive chip and chip varistor, all pins are equal
It is bonded with the lead surface of plastic-sealed body and surface exposure is on the lead surface of plastic-sealed body.
The position of thermistor chip and voltage dependent resistor chip can be interchangeable.
Pin slot corresponding with three pins is equipped on the vertical patch face of plastic-sealed body, pin slot is closed slots or half-open
Slot.
Another dongle configuration is: before end and thermistor chip and voltage dependent resistor chip grafting are drawn in left, center, right three,
Thermistor chip is first carried out eccentric welding with voltage dependent resistor chip to couple, and reserves enough skies on voltage dependent resistor chip
Between, when being used for subsequent welding common end, then by the thermistor chip coupled and voltage dependent resistor chip and left, center, right leads ends
Grafting welding.
Due to using above technical scheme, the utility model optimizes product structure, realizes product miniaturization,
After plastic packaging cutting without bending process can directly obtain after horizontal patch hot pressing sensitive resistor product or plastic packaging cutting by
Primary bending just obtains vertical sleeping double-purpose patch hot pressing sensitive resistor product, and the cost of labor of production is effectively reduced, improves production
Efficiency, and stabilized product quality, product can be produced using SMD mount technology.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the horizontal patch hot pressing sensitive resistor of the utility model；
Fig. 2 is the structural schematic diagram of the vertical sleeping double-purpose patch hot pressing sensitive resistor of the utility model；
Fig. 3 is the structural plan schematic diagram of the stereo metal band of the utility model；
Fig. 4 is the texture edge schematic diagram of the stereo metal band of the utility model；
Fig. 5 is the texture edge schematic diagram after the plug-in unit welding of the utility model；
Fig. 6 is that the utility model carries out the schematic diagram after plastic packaging；
Fig. 7 is that heat sensitive chip and chip varistor pass through the schematic diagram after solder(ing) paste welding coupling.
Specific embodiment
The embodiments of the present invention: the production method of horizontal patch hot pressing sensitive resistor includes the following steps:
1) stereo metal band 10 is made by product requirement, the left exit drawn in the same direction is equipped on stereo metal band 10
13, intermediate exit 11 and right exit 12；Left exit 13 is made of left pin 131 and left end 132；Intermediate exit
11 are made of middle pin 111 and intermediate end 112；Right exit 12 is made of right pin 121 and right end 122, left, center, right
The pin connection corresponding after bending of three ends, all pins are directly connected on stereo metal band 10, and
The plane of all pins and the plane of metal tape 10 be in same plane and the plane be lower than bottommost Flat-end bottom
Face；
2) by thermistor chip 20 be placed on stereo metal band 10 corresponding left end 132 and right end 122 it
Between, voltage dependent resistor chip 30 is placed on stereo metal band between corresponding intermediate end 112 and right end 122, is made left
Right three ends clamp thermistor chip 20 and voltage dependent resistor chip 30, will then by way of immersed solder or hot air welding
Three end of left, center, right is welded with heat sensitive chip 20, chip varistor 30, and makes the temperature-sensitive after three end of left, center, right and welding
Chip 20 and chip varistor 30 form extraction in the same direction, i.e., the lead direction of all ends is identical；
3) heat sensitive chip 20 welded and chip varistor 30 are subjected to plastic packaging using insulating materials, form plastic-sealed body 40,
The surface exposure of three pin of left, center, right is bonded on the lead surface of plastic-sealed body 40 and with the lead surface of plastic-sealed body 40；
4) the good sub-assembly of plastic packaging is cut from metal tape 10, horizontal patch can be directly obtained by cutting three pin of left, center, right
Hot pressing sensitive resistor；Or three pin of left, center, right cut respectively carries out to bending in the same direction is primary, it is right so that it is fitted in plastic-sealed body 40
On the face answered, horizontal patch hot pressing sensitive resistor is obtained.
Thermistor chip 20 and the position of voltage dependent resistor chip 30 can be interchangeable.
Horizontal patch hot pressing sensitive resistor, including heat sensitive chip 20, chip varistor 30, heat sensitive chip 20 and chip varistor 30
Between coupled by the welding of right end 122 as public end, and be welded with left end 132 at the top of chip varistor 30,
It is welded with intermediate end 112 in the bottom of heat sensitive chip 20, the lead direction of all exits is all the same, and exit is by bending
It is connect afterwards with pin；Be equipped with plastic-sealed body 40 in the outside of heat sensitive chip 20 and chip varistor 30, all pins with plastic-sealed body 40
Lead surface fitting and surface exposure on the lead surface of plastic-sealed body 40；The good sub-assembly of plastic packaging is cut from metal tape 10
Under, horizontal patch hot pressing sensitive resistor can be directly obtained by cutting three pin of left, center, right
The embodiments of the present invention 2: the production method of vertical sleeping double-purpose patch hot pressing sensitive resistor includes the following steps:
1) stereo metal band 10 is made by product requirement, the left exit drawn in the same direction is equipped on stereo metal band 10
13, intermediate exit 11 and right exit 12；Left exit 13 is made of left pin 131 and left end 132；Intermediate exit
11 are made of middle pin 111 and intermediate end 112；Right exit 12 is made of right pin 121 and right end 122, left, center, right
The pin connection corresponding after bending of three ends, all pins are directly connected on stereo metal band 10, and
The plane of all pins and the plane of metal tape 10 be in same plane and the plane be lower than bottommost Flat-end bottom
Face；
2) by thermistor chip 20 be placed on stereo metal band 10 corresponding left end 132 and right end 122 it
Between, voltage dependent resistor chip 30 is placed on stereo metal band between corresponding intermediate end 112 and right end 122, is made left
Right three ends clamp thermistor chip 20 and voltage dependent resistor chip 30, will then by way of immersed solder or hot air welding
Three end of left, center, right is welded with heat sensitive chip 20, chip varistor 30, and makes the temperature-sensitive after three end of left, center, right and welding
Chip 20 and chip varistor 30 form extraction in the same direction, i.e., the lead direction of all ends is identical；
3) heat sensitive chip 20 welded and chip varistor 30 are subjected to plastic packaging using insulating materials, form plastic-sealed body 40,
The surface exposure of three pin of left, center, right is bonded on the lead surface of plastic-sealed body 40 and with the lead surface of plastic-sealed body 40；
4) the good sub-assembly of plastic packaging is cut from metal tape 10, three pin of left, center, right cut is respectively subjected to bending in the same direction
Once, it is fitted in it on corresponding face of plastic-sealed body 40, obtains vertical sleeping double-purpose patch hot pressing sensitive resistor.
Vertical sleeping double-purpose patch hot pressing sensitive resistor, including heat sensitive chip 20, chip varistor 30, heat sensitive chip 20 and pressure-sensitive core
Coupling is welded by the right end 122 as public end between piece 30, and is welded with left end at the top of chip varistor 30
132, it is welded with intermediate end 112 in the bottom of heat sensitive chip 20, the lead direction of all exits is all the same, and exit passes through
It is connect after bending with pin；Plastic-sealed body 40 is equipped in the outside of heat sensitive chip 20 and chip varistor 30, and all pins are and plastic packaging
The lead surface and adjacent surface of body 40 are bonded and surface exposure is on the lead surface and adjacent surface of plastic-sealed body 40；Plastic packaging is good
Sub-assembly is cut from metal tape 10, and three pin of left, center, right cut respectively carries out to bending in the same direction is primary, it is made to be fitted in plastic-sealed body
On 40 corresponding faces, vertical sleeping double-purpose patch hot pressing sensitive resistor is obtained.
On the vertical patch face of plastic-sealed body 40 be equipped with pin slot 31 corresponding with three pins, pin slot 31 be closed slots or
Half slots.
The embodiments of the present invention 3: the production method of vertical sleeping double-purpose patch hot pressing sensitive resistor includes the following steps:
1) stereo metal band 10 is made by product requirement, the left exit drawn in the same direction is equipped on stereo metal band 10
13, intermediate exit 11 and right exit 12；Left exit 13 is made of left pin 131 and left end 132；Intermediate exit
11 are made of middle pin 111 and intermediate end 112；Right exit 12 is made of right pin 121 and right end 122, left, center, right
The pin connection corresponding after bending of three ends, all pins are directly connected on stereo metal band 10, and
The plane of all pins and the plane of metal tape 10 be in same plane and the plane be lower than bottommost Flat-end bottom
Face；
2) thermistor chip 20 is carried out eccentric welding with voltage dependent resistor chip 30 to couple, and in voltage dependent resistor chip 30
On reserve enough spaces, to be used when subsequent welding common end, then the thermistor chip 20 and varistor that will couple
Chip 30 and left, center, right leads ends plug-in unit；Intermediate end 112 is welded on one side in thermistor chip 20, is coupled in chip varistor 30
Right end 122 is welded in face, welds left end 132 in 30 another side of chip varistor, the above welding can use manual welding, can also
Immersed solder or hot air welding are carried out simultaneously with three end of left, center, right and heat sensitive chip 20, chip varistor 30, and make three end of left, center, right
Head with weld after heat sensitive chip 20 and chip varistor 30 form extraction in the same direction, i.e., the lead direction of all ends is identical；
3) heat sensitive chip 20 welded and chip varistor 30 are subjected to plastic packaging using insulating materials, form plastic-sealed body 40,
The surface exposure of three pin of left, center, right is bonded on the lead surface of plastic-sealed body 40 and with the lead surface of plastic-sealed body 40；
4) the good sub-assembly of plastic packaging is cut from metal tape 10, horizontal patch can be directly obtained by cutting three pin of left, center, right
Hot pressing sensitive resistor；Or three pin of left, center, right cut respectively carries out to bending in the same direction is primary, it is right so that it is fitted in plastic-sealed body 40
On the face answered, vertical sleeping double-purpose patch hot pressing sensitive resistor is obtained.
On the vertical patch face of plastic-sealed body 40 be equipped with pin slot 31 corresponding with three pins, pin slot 31 be closed slots or
Half slots.
In the embodiment above, applicant is not defined the shape of plastic-sealed body 40, and usual plastic-sealed body 40 can be adopted
With the common shape of such as rectangle, rectangular, round etc, can also according to product customization needs or Chip scale, shape etc. because
Usually adjust matching shape.
Described in the utility model to be not limited to embodiment described in specific embodiment, those skilled in the art are according to this
The technical solution of utility model obtains other embodiments, also belongs to the technological innovation scope of the utility model.Obviously originally
The technical staff in field can carry out spirit and model of the various modification and variations without departing from the utility model to the utility model
It encloses.In this way, if these modifications and variations of the present invention belong to the claims of the present invention and its equivalent technology range
Interior, then the utility model is also intended to include these modifications and variations.
Claims (4)
1. a kind of patch hot pressing sensitive resistor, including heat sensitive chip (20), chip varistor (30), it is characterised in that: in temperature-sensitive core
It is coupled between piece (20) and chip varistor (30) by right end (122) or left end (132) welding as public end, and
It is welded with left end (132) or right end (122) at the top of chip varistor (30), is welded in the bottom of heat sensitive chip (20)
Intermediate end (112), the lead direction of all exits is all the same, and exit is connect after bending with pin；In temperature-sensitive core
The outside of piece (20) and chip varistor (30) is equipped with plastic-sealed body (40), all pins are bonded with the lead surface of plastic-sealed body (40),
And surface exposure is on the lead surface of plastic-sealed body (40).
2. patch hot pressing sensitive resistor according to claim 1, it is characterised in that: by heat sensitive chip (20) and chip varistor
(30) position is interchangeable.
3. patch hot pressing sensitive resistor according to claim 1, it is characterised in that: in the vertical patch face of plastic-sealed body (40)
It is equipped with pin slot (31) corresponding with three pins, pin slot (31) is that closed slots or half slot.
4. patch hot pressing sensitive resistor according to claim 1, it is characterised in that: another dongle configuration is: on a left side
Before middle right three draw end and thermistor chip (20) and chip varistor (30) grafting, first by heat sensitive chip (20) and chip varistor
(30) eccentric welding coupling is carried out, and reserves enough spaces on chip varistor (30), when being used for subsequent welding common end, then
The heat sensitive chip coupled (20) and chip varistor (30) and the grafting of left, center, right leads ends are welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821709515.9U CN209297844U (en) | 2018-10-22 | 2018-10-22 | A kind of patch hot pressing sensitive resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821709515.9U CN209297844U (en) | 2018-10-22 | 2018-10-22 | A kind of patch hot pressing sensitive resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209297844U true CN209297844U (en) | 2019-08-23 |
Family
ID=67646455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821709515.9U Active CN209297844U (en) | 2018-10-22 | 2018-10-22 | A kind of patch hot pressing sensitive resistor |
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| CN (1) | CN209297844U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110010316A (en) * | 2018-10-22 | 2019-07-12 | 朱同江 | A kind of production method and product of patch hot pressing sensitive resistor |
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2018
- 2018-10-22 CN CN201821709515.9U patent/CN209297844U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110010316A (en) * | 2018-10-22 | 2019-07-12 | 朱同江 | A kind of production method and product of patch hot pressing sensitive resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220104 Address after: 556000 third floor, building 4, phase I, big data Industrial Park, 130 Kaiyuan Avenue, Kaili Economic Development Zone, Kaili City, Qiandongnan Miao and Dong Autonomous Prefecture, Guizhou Province Patentee after: Guizhou Weilin Electronic Technology Co.,Ltd. Address before: 550005 No. 236-240, north section of Xintian Avenue, Wudang District, Guiyang City, Guizhou Province Patentee before: Zhu Tongjiang |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230103 Address after: 550,611 No.3 Workshop, IoT Industrial Park, No. 130, Kaiyuan Avenue, Kaili Economic Development Zone, Qiandongnan Miao and Dong Autonomous Prefecture, Guizhou Province Patentee after: GUIZHOU KAILI ECONOMIC DEVELOPMENT ZONE ZHONGHAO ELECTRONICS CO.,LTD. Address before: 556000 third floor, building 4, phase I, big data Industrial Park, 130 Kaiyuan Avenue, Kaili Economic Development Zone, Kaili City, Qiandongnan Miao and Dong Autonomous Prefecture, Guizhou Province Patentee before: Guizhou Weilin Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |