CN209297322U - Fingerprint identification device and electronic equipment - Google Patents

Fingerprint identification device and electronic equipment Download PDF

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Publication number
CN209297322U
CN209297322U CN201822101017.2U CN201822101017U CN209297322U CN 209297322 U CN209297322 U CN 209297322U CN 201822101017 U CN201822101017 U CN 201822101017U CN 209297322 U CN209297322 U CN 209297322U
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CN
China
Prior art keywords
identification device
fingerprint identification
display screen
electronic equipment
sensing chip
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CN201822101017.2U
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Chinese (zh)
Inventor
熊峰
郭益平
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Huiding Technology Co Ltd
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Application filed by Shenzhen Huiding Technology Co Ltd filed Critical Shenzhen Huiding Technology Co Ltd
Priority to CN201822101017.2U priority Critical patent/CN209297322U/en
Priority to CN201921409247.3U priority patent/CN212135449U/en
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Abstract

The embodiment of the present application provides a kind of fingerprint identification device and electronic equipment, when the fingerprint identification device is applied to electronic equipment, the fingerprint identification device is set between the display screen of the electronic equipment and the center of the electronic equipment, and has gap between the display screen.The fingerprint identification device and electronic equipment of the embodiment of the present application, can make fingerprint identification device full decoupled with display screen, avoid due to be bonded it is bad caused by high cost, low efficiency and the problems such as complex process;Fingerprint identification device is arranged between display screen and center simultaneously, from the various components without avoiding electronic equipment internal, for example, the fingerprint identification device can be overlapped on the thickness direction of electronic equipment with battery, so that the placement position of fingerprint identification device is no longer limited.

Description

Fingerprint identification device and electronic equipment
Technical field
This application involves fingerprint identification technology field more particularly to a kind of fingerprint identification devices and electronic equipment.
Background technique
Under published screen there are mainly two types of optical finger print identifying schemes.The first is the light based on periodical microwell array Road modulator approach, the program are required fingerprint recognition mould group and screen (such as Organic Light Emitting Diode (Organic Light- Emitting Diode, OLED)) it fits closely.Be for second based on lenticule scheme, the program be by fingerprint recognition mould group with Screen separation, is fixed below the center of electronic equipment.
In the first scheme, may exist by being bonded bad bring higher cost, low efficiency, complex process etc. is asked Topic;In second scheme, need to avoid battery space, sound chamber, subplate, motor, subscriber identification card (Subscriber Identification Module, SIM) etc. be just able to satisfy electronic equipment requirement.
Utility model content
In view of this, the embodiment of the present application provides a kind of fingerprint identification device and electronic equipment, can preferably meet The demand of electronic equipment, and can reduce cost, improve efficiency, assembly is simple.
In a first aspect, a kind of fingerprint identification device is provided, and when the fingerprint identification device is applied to electronic equipment, institute Fingerprint identification device is stated to be set between the display screen of the electronic equipment and the center of the electronic equipment, and with the display There is gap between screen.
In one possible implementation, the fingerprint identification device is fixed on the upper surface of the center.
In one possible implementation, the upper surface of the center is extended downwardly equipped with groove, the fingerprint recognition Device is fixed in the groove.
In one possible implementation, the fingerprint identification device is fixed on institute by conductive or non-conductive double-sided adhesive It states in groove.
In one possible implementation, the fingerprint identification device is fixed on the groove by mechanical connecting structure It is interior.
Optionally, the depth of the groove can be less than or equal to 0.3mm.
In one possible implementation, the upper surface of the fingerprint identification device is between the lower section of the display screen At least one lamination is set, at least one described lamination has aperture, and the fingerprint identification device is at least partially housed in described In aperture, to receive the light penetrated from the display screen.
Effective optical path can be guaranteed by shielding lower lamination aperture, while it is also possible that shape between display screen and fingerprint identification device At good sealing, foreign substance pollution is avoided to influence image quality.
In one possible implementation, at least one described lamination includes foamed cotton layer, the fingerprint identification device Upper surface attaches the foamed cotton layer.
The foam of certain thickness and size retention is attached in the upper surface of fingerprint identification device, which can be with Greater than 50%, to form sealed environment between fingerprint identification device under display screen, reach shading, dust-proof requirement.
In one possible implementation, the fingerprint identification device includes: sensing chip;Through-hole array is described logical Hole array is set to the top of the sensing chip, and the light penetrated from the display screen is directed toward to the induction list of the sensing chip In member.
In one possible implementation, the sensing chip is fixed on flexible circuit board or the flexible print The reinforcement steel disc surface of circuit board.
Sensing chip bonding can be effectively reduced into fingerprint identification device on the reinforcement steel disc surface of flexible circuit board Thickness.
In one possible implementation, the fingerprint identification device further include: bracket, the bracket is by the through-hole Array is fixed on the top of the sensing chip.
In one possible implementation, the fingerprint identification device further include: optically filtering piece is set to the biography Between sense chip and the through-hole array;The optically filtering piece is fitted on the sensing chip or the optically filtering piece It fixes on the bracket, and there is gap with the sensing chip.
In one possible implementation, the fingerprint identification device includes multiple sensing chips, the multiple sensing Chip is distributed on flexible circuit board side by side.
Multiple sensing chips are distributed on flexible circuit board side by side, so as to form multiple fingerprint detection areas Domain is advantageously implemented full frame unlocked by fingerprint, so as to improve user experience.
Second aspect provides a kind of electronic equipment, times including display screen, center and the first aspect or first aspect Fingerprint identification device in one possible implementation.
In one possible implementation, the display screen is Organic Light Emitting Diode OLED screen.
In one possible implementation, the center is metal or plastic structure part.
There is gap between display screen and center, and between display screen by being arranged fingerprint identification device, it can So that fingerprint identification device is full decoupled with display screen, avoid due to be bonded it is bad caused by high cost, low efficiency and work The problems such as skill is complicated;Fingerprint identification device is arranged between display screen and center simultaneously, is not required to evacuation electronic equipment internal Various components, for example, the fingerprint identification device can be overlapped on the thickness direction of electronic equipment with battery, so that fingerprint is known The placement position of other device is no longer limited.
These aspects or other aspects of the application can more straightforward in the following description.
Detailed description of the invention
Fig. 1 shows the schematic block diagram of the application scenarios of the embodiment of the present application.
Fig. 2 is a kind of structural schematic diagram of typical fingerprint identification device.
Fig. 3 is the structural schematic diagram of another typical fingerprint identification device.
Fig. 4 is the structural schematic diagram of the fingerprint identification device of the embodiment of the present application.
Fig. 5 is another structural schematic diagram of the fingerprint identification device of the embodiment of the present application.
Fig. 6 is the assemble flow schematic diagram of the fingerprint identification device of the embodiment of the present application.
Fig. 7 is the schematic block diagram of the electronic equipment of the embodiment of the present application.
Specific embodiment
In order to make those skilled in the art more fully understand the technical solution in the embodiment of the present application, below in conjunction with the application Attached drawing in embodiment, the technical scheme in the embodiment of the application is clearly and completely described.Obviously, described reality Applying example only is a part of the embodiment of the embodiment of the present application, instead of all the embodiments.Based on the embodiment in the application, originally The range of the embodiment of the present application protection all should belong in field those of ordinary skill every other embodiment obtained.
A kind of common application scenarios, fingerprint identification device provided by the embodiments of the present application can apply smart phone, Tablet computer and other with the mobile terminal of display screen or other terminal devices;More specifically, in above-mentioned terminal device In, fingerprint identification device can be specially optical finger print device, and the regional area or complete below display screen can be set Portion region is to form (Under-display) optical fingerprint systems under screen.
The structural schematic diagram for the terminal device that can be applicable in for the embodiment of the present application as shown in Figure 1, the terminal device 100 Including display screen 120 and fingerprint identification device 130, wherein the fingerprint identification device 130 is arranged under the display screen 120 The regional area of side.The fingerprint identification device 130 may include the induction arrays with multiple optical sensor units, wherein The induction arrays are also possible to a fingerprint sensor.The induction arrays region or its optical sensor region are institute State the fingerprint detection region 103 of fingerprint identification device 130.As shown in Figure 1, the fingerprint detection region 103 is located at the display Among the display area 102 of screen 120, therefore, user is needing to be unlocked the terminal device 100 or other fingerprints When verifying, it is only necessary to by finger pressing in the fingerprint detection region 103 for being located at the display screen 120, can realize and refer to Line input.Since fingerprint detection can be realized in screen, terminal device 100 using the above structure is special without its front Reserved space is arranged fingerprint key (such as Home key).
Embodiment as one preferred, the display screen 120 can use the display screen with spontaneous light display unit, Such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or micro-led (Micro-LED) display screen.In addition, the display screen 120 can be specially touching display screen, it is aobvious can not only to carry out picture Show, touch or the pressing operation of user can also be detected, to provide a personal-machine interactive interface for user.For example, one In kind embodiment, the terminal device 100 may include touch controller, and the touch controller can be specially touch surface Plate can be set on 120 surface of display screen, partially can also integrate or be monolithically integrated into the display screen 120 Portion, to form the touching display screen.For using OLED display screen, the fingerprint identification device 130 can use institute It states OLED display screen 120 and is located at the display unit (i.e. OLED light source) in the fingerprint detection region 103 as optical finger print inspection The excitation light source of survey.
In other embodiments, the fingerprint identification device 130 can also be mentioned using built-in light source or external light source For the optical signal for carrying out fingerprint detection.In this case, the fingerprint identification device 130 can be adapted for non-spontaneous light Display screen, such as liquid crystal display or other passive light emitting displays.To apply with backlight module and liquid crystal display panel Liquid crystal display for, fingerprint detection under the screen to support liquid crystal display, the fingerprint identification device 130 can also include For the excitation light source of optical finger print detection, the excitation light source can be specially infrared light supply or specific wavelength non-visible light Light source, can be set below the backlight module of the liquid crystal display or be arranged in the guarantor of the terminal device 100 Fringe region below protecting cover plate, and the fingerprint identification device 130 is arranged below the backlight module, and the backlight mould Group is by carrying out aperture or other optical designs to film layers such as diffusion sheet, blast piece, reflector plates to allow fingerprint detection light to wear It crosses liquid crystal display panel and backlight module and reaches the induction arrays of the fingerprint identification device 130.
Also, the induction arrays of the fingerprint identification device 130 are specifically as follows optical detector (Photo detector) Array comprising multiple optical detectors in array distribution, the optical detector can be used as optical sensor as described above Unit.When the light that finger pressing is at the fingerprint detection region 103, and the display unit in the fingerprint detection region 103 issues Line occurs to reflect and formed reflected light in the fingerprint of finger surface, wherein the ridge of the finger print and the reflected light of paddy are different , reflected light penetrates from the display screen 120 and is received and converted to corresponding electric signal by the photodetector array, i.e., Fingerprint detection signal;Fingerprint image data can be obtained based on the fingerprint detection signal, and can be referred to further progress Line matching verifying, to realize optical finger print identification function in the terminal device 100.
In other alternate embodiments, the fingerprint identification device 130 also be can be set below the display screen 120 Whole region, so that the fingerprint detection region 103 is expanded to the entire display area 102 of the entire display screen 120, it is real Existing full frame fingerprint recognition.
It should be understood that the terminal device 100 can also include transparency protected cover board 110, institute in specific implementation Stating cover board 110 can be glass cover-plate or sapphire cover board, be set to the top of the display screen 120 and cover the end The front of end equipment 100.Therefore, in the embodiment of the present application, the pressing of so-called finger the display screen 120 actually refer to by It is pressed in the cover board 110 of 120 top of display screen or the protective layer of the covering cover board 110.
As a kind of optional implementation, as shown in Figure 1, the fingerprint identification device 130 may include optical detection part Divide 134 and optical module 132, the light detecting portion 134 includes the induction arrays and is electrically connected with the induction arrays Reading circuit and other auxiliary circuits, a chip (Die) can be produced on by semiconductor technology;The i.e. described light inspection Optical imagery chip or image sensor chip can be produced on by surveying part 134.
The optical module 132 can be set in the top of the induction arrays of the light detecting portion 134, the optics group Part 132 may include filter layer (Filter), optical waveguide layer and other optical elements;The filter layer, which can be used for filtering out, to be penetrated The environment light of finger, and the optical waveguide layer be mainly used for will from the guiding of finger surface reflected reflected light (for example optics is quasi- Straight or convergence) extremely induction arrays progress optical detection.
To be detected finger surface of the light that the display screen 120 issues above the display screen 120 reflects, from After the reflected reflected light of finger carries out optical alignment or convergence through the microwell array or the lens unit, into One step is received after the filtering of filter layer by the optical detecting parts 134, and the optical detecting parts 134 can be further The reflected light received is detected, to get the fingerprint image of the finger to realize fingerprint recognition.
It should be appreciated that above-mentioned fingerprint identification device 130 is only a kind of illustrative structure, and in specific implementation, the optics The position of the filter layer of component 132 is not limited in the lower section of the optical waveguide layer;For example, in a kind of alternate embodiment, the filter Photosphere also can be set between the optical waveguide layer and the display screen 120, that is, be located above the optical waveguide layer;Alternatively, described Optical module 132 may include two layers of filter layer, and the two is separately positioned on above and below the optical waveguide layer.In other substitutions In embodiment, which is also desirably integrated into inside the optical waveguide layer, possibly even dispenses, and the application does not limit this System.
In specific implementation, the optical module 132 can be encapsulated in the same optics with the light detecting portion 134 and refer to Line chip.It is also possible to be mounted on inside fingerprint identification device as the component relatively independent with optical detecting parts 134, is The optical module 132 is arranged in the chip exterior where the light detecting portion 134, than optical module 132 as will be described It is fitted in above the chip, or the subelement of the optical module 132 is integrated among said chip.Wherein, institute Stating the optical waveguide layer of optical module 132, there are many implementations.
In one embodiment, the optical waveguide layer of the optical module 132 is specially in semi-conductor silicon chip or other substrates The optical path modulation device or beam path alignment device that (such as Si oxide or nitride) is made, with multiple optical path modulation lists Member or collimation unit, specifically, the light path modulation unit or collimation unit can be specially logical with high-aspect-ratio Hole, therefore the multiple collimation unit or lens unit may be constructed through-hole array.From the reflected reflected light of finger In, the light for being incident on the light path modulation unit or collimation unit can be passed through and be connect by optical sensor unit below It receives, the through-hole that each optical sensor unit can substantially receive above it is guided over the reflected light of the fingerprint lines come, To which the induction arrays can detect the fingerprint image of finger.
In other alternate embodiments, the optical waveguide layer also may include optical lens (Lens) layer, have one or Multiple optical lens units, such as the lens group of one or more non-spherical lens compositions.From the reflected reflected light of finger After carrying out beam path alignment or convergence through the optical lens unit, and received by optical sensor unit below, accordingly, The induction arrays can detecte out the fingerprint image of finger.
On the other hand, the induction arrays of the light detecting portion 134 can specifically only include single induction arrays, can also Using double induction arrays (Dual Array) or more induction arrays with two or more induction arrays arranged side by side The framework of (Multiple Array).When the light detecting portion 134 is using double induction arrays or more induction arrays frameworks, The optical module 132 can cover described two or above induction arrays using an independent optical waveguide layer simultaneously;It is alternative Ground, the optical module 132 also may include two or more optical waveguide layers arranged side by side, such as two or more optical path tune Device or beam path alignment device processed or two or more optical lens mirror layer, described two or arranged side by side above optical waveguide layers point It is not correspondingly arranged at the top of described two or above induction arrays, for drawing associated reflections light guide or converging under it The induction arrays of side.
In other substitution implementations, the display screen 120 can also use the display screen of non-spontaneous light, for example use The liquid crystal display of backlight;In this case, the fingerprint identification device 130 just can not be using the aobvious of the display screen 120 Show unit as excitation light source, it is therefore desirable to be internally integrated excitation light source in the fingerprint identification device 130 or outside it Setting motivates light source to realize that optical finger print detects, and testing principle is consistent with content is described above.
Although should be appreciated that in the embodiment shown in fig. 1 to be to shield lower optical finger print identification with the fingerprint identification device For device, still, in other embodiments, the fingerprint identification device of the terminal device 100 can also be referred to using ultrasonic wave Line identification device or other kinds of fingerprint identification device replace.Type and specific structure of the application to fingerprint identification device It is not particularly limited, as long as above-mentioned fingerprint identification device can satisfy carries out fingerprint recognition inside the display screen of terminal device Performance requirement.
Referring to Fig. 2, in a kind of typical fingerprint identification device, the lower surface of cover sheet 210 and OLED display screen 220 upper surface fitting, fingerprint identification device 230 by glue material 240 in a manner of dispensing with the following table face paste of OLED display screen 220 It closes, and the lower surface of fingerprint identification device 230 is welded and fixed with flexible circuit board 250.Specifically, glue material 240 can be with It is formed in the lateral wall of fingerprint identification device 230, so that the lateral wall of fingerprint identification device 230 and OLED display screen 220 Fitting completely is carried out between lower surface to fix.In addition, the lower surface edge of OLED display screen 220 is by foam gum 260 in The upper surface of frame 270 is bonded, and center 270 has a groove structure in 230 region of fingerprint identification device, which can be with Avoiding space is provided for flexible circuit board 250 for fingerprint identification device 230 and below.In addition, center 270 and rear cover It may be provided with battery 280 between 290.
Although requiring fingerprint recognition it can be found that design structure shown in Fig. 2 realizes the fingerprint recognition under display screen The problem of device and display screen are fastenedly connected, cause in this way is exactly:
220 cost of 1.OLED display screen is very high, and very fragile, and fingerprint identification device 230 is bonded with OLED display screen 220 It is easy to damage OLED display screen 220 in the process.
2. replacement difficulty is larger after fingerprint identification device 230 is directly attached to OLED display screen 220, and in replacement fingerprint Damage OLED display screen 220 is easy to when identification device 230.That is, due to fingerprint identification device 230 and OLED display screen 220 are fully adhered to together, the damage of fingerprint identification device 230 such as occur, are dismantling fingerprint recognition from 220 lower surface of OLED display screen Damage OLED display screen 220 is easy to when device 230.
3. the attaching process that fingerprint identification device 230 is directly attached to 220 lower surface of OLED display screen is complicated.
Referring to Fig. 3, in another typical fingerprint identification device, the lower surface of cover sheet 310 and display screen 320 Upper surface fitting, which can be fixed at the lower section of the display screen 320, the fingerprint identification device 330 lower surface is welded and fixed with flexible circuit board 350.And between the fingerprint identification device 330 and the display screen 320 There are gaps 390.As one kind, optionally implementation, the fingerprint identification device 330 can be set by being fixedly connected on terminal The lower section for being mounted on the display screen 320 is realized on standby internal easily disassembled device, such as can be by fingerprint identification device 330 It is mounted on the lower surface of center 370, which can be used as consolidating between the fingerprint identification device 330 and the display screen 320 Determine frame.The center 370 is set to the frame among display screen 320 and rear cover and for carrying internal various assemblies, internal each Kind component includes but is not limited to battery, mainboard, camera, winding displacement, various inductors, microphone, earpiece etc. components.As a result, So that the fingerprint identification device 330 and the display screen 320 are full decoupled, avoid installation or dismantle the fingerprint identification device The display screen 320 is damaged when 330.
It can be found that although the fingerprint recognition under display screen, fingerprint recognition also may be implemented in design structure shown in Fig. 3 Device is fixed below the center of terminal device, it may be necessary to avoid battery, mainboard, camera, winding displacement, various inductors, words Cylinder, earpiece etc. components, so that position of the fingerprint detection region in screen is limited.
Therefore, above-mentioned various in order to solve the problems, such as, the embodiment of the present application provides a kind of fingerprint identification device, can either solve Certainly the attaching process of fingerprint identification device and display screen is complicated, is bonded higher cost and holds in fitting process and maintenance process The problems such as display screen easy to damage, and it is able to solve the limited problem in position of the fingerprint detection region in screen.
Fig. 4 is a kind of schematic diagram of fingerprint identification device provided by the embodiments of the present application.When the fingerprint recognition fills It sets when being applied to electronic equipment (such as smart phone), as shown in figure 4, the lower surface of cover sheet 410 and display screen 420 is upper Surface fitting, the fingerprint identification device 430 can be fixed between the lower section of the display screen 420 and center 440, and with There is gap 470 between display screen 420.In a kind of optional implementation, which may include one easy The structural member of disassembly, and part is fixed between the display screen 420 of electronic equipment and the center 440 of electronic equipment with this configuration, And there is certain interval between the fingerprint identification device 430 and display screen 420.In another optional implementation, the knot Component is the center 440 of electronic equipment.Specifically, which can be fixed on the upper surface of center 440.And And there is gap 470 between display screen 420.Wherein, which can be OLED screen 120 as shown in Figure 1, this refers to Line identification device 430 can be fingerprint identification device 130 as shown in Figure 1.The center 440 can be used as the fingerprint identification device Fixed frame between 430 and the display screen 420.The center 440 is set among display screen 420 and rear cover 460 and for carrying The frame of internal various assemblies, such as battery 450, or can also be mainboard, sound chamber, subplate, camera, motor, winding displacement, respectively Kind inductor, microphone, earpiece, SIM card position etc. components.In Fig. 4, which can exist with battery 450 The thickness direction of electronic equipment is overlapped, and fingerprint detection region can be placed on any position of display screen 420, for example, fingerprint is known It other region can be apart from 420 20~80mm of lower edge of display screen.The specific knot of the display screen 420 and the fingerprint identification device 430 Structure, function and fingerprint identification process are referred to be previously with regard to the description of OLED display screen 120 and fingerprint identification device 130, Details are not described herein again.
Therefore, fingerprint identification device provided by the embodiments of the present application can make fingerprint identification device complete with display screen Decoupling, avoid due to be bonded it is bad caused by high cost, low efficiency and the problems such as complex process;Fingerprint recognition is filled simultaneously It installs between display screen and center, from the various components without avoiding electronic equipment internal, for example, the fingerprint recognition Device can be overlapped on the thickness direction of electronic equipment with battery, so that the placement position of fingerprint identification device is no longer limited.
The center 440 can specifically be made of metal or alloy material, it might even be possible to be made of plastic material, this feelings Under condition, which can even be integrally formed with the frame of electronic equipment, and so-called integrated molding is exactly internal center and frame It is an entirety.For example, frame can be a metal welt, or the painting of one layer of metalloid can be plated on center Material.Further, which can also be compound center, take the mobile phone as an example, and center 440 includes inner central frame 1 and outer central frame 2, Inner central frame 1 is for carrying mobile phone components, and for outer central frame 2 outside inner central frame 1,2 outer of outer central frame is equipped with mobile phone key, inner central frame 1 It is integrated with outer central frame 2.Since mobile phone center is designed to that inner central frame and outer central frame, interior outer central frame are integrated into an entirety, It is outer central frame abrasion first, due to there was only key on outer central frame, replacement outer central frame is simple and convenient, at low cost when mobile phone is impacted; It is possible to further which resilient material is arranged between interior outer central frame, due to interior outer central frame under the compression of elastic layer elastic force phase To fixation, therefore, when outer central frame absorbs impact power, elastic layer can reduce the impact to inner central frame.
As a specific implementation manner, setting groove can be extended downwardly in the upper surface of the center 440, i.e., at this The installation region of fingerprint identification device 430 forms groove structure, so that the fingerprint identification device 430 is at least partially housed in groove It is interior.The fingerprint identification device 430 can be fixed in the groove.A kind of possible embodiment are as follows: the fingerprint identification device 430 can To be fixed in groove by conductive or non-conductive double-sided adhesive.For example, can be in the lower surface of fingerprint identification device 430 or recessed Rooved face attaches double-sided adhesive, and applies certain pressure in the upper surface of fingerprint identification device 430, by itself and groove fixed bonding. Alternatively possible embodiment are as follows: the fingerprint identification device 430 can pass through mechanical connection manner by dedicated location structure It is fixed on groove surfaces.For example, screw installation fixed form, mode and coupling fixed form etc. is welded and fixed.
Wherein, the depth of the groove can be less than or equal to 0.3mm, and the thickness of center 440 is generally 0.6mm, in order not to Other performances of electronic equipment are influenced, guarantee that the thickness for having the thinnest part of reeded center 440 is greater than or equal to as far as possible 0.2mm, it should be appreciated that the depth of groove can be related to the thickness of center, and parameters value is used only for example herein, does not make to have Body limits.
The display screen 420 used in the technical solution of the embodiment of the present application can be OLED screen, soft screen or hard screen, with Under be explained in detail by taking OLED screen as an example.If the fingerprint identification device 430 is optical fingerprint identification device, which knows The optical signal that other device 430 needs to detect the display screen 420 sending passes through the reflected light that finger reflects to form, fingerprint recognition dress At least 50 μm of the air gap should be kept by setting between 430 and display screen 420.There can also be one layer of screening below display screen 420 The laminations such as photosphere, screen protection foam, optical cement, screen assembly flexible circuit board are needed by each lamination aperture, so that this refers to Line identification device 430 is at least partially housed in aperture, effectively to receive the light penetrated from display screen 420.The bore size phase For electronic equipment, it can laterally be less than or equal to 30mm along screen, it is longitudinal then less than or equal to 60mm along screen, or Person, shielding lower lamination bore size can extend outwardly 0.7~1.5mm relative to the outer dimension of fingerprint identification device.This field Technical staff understands that parameters value is also given for example only herein, is not especially limited.
Optionally, the foam of certain thickness and size retention can also be attached in the upper surface of fingerprint identification device 430, Closed environment can be formed between fingerprint identification device 430 below display screen 420, and shading, dust-proof can achieve with this It is required that.Wherein, foam compression ratio can be greater than 50%, the bonding plane of foam and display screen 420 can without stickiness or low stickiness, In order to do over again.
Fig. 5 is the schematic diagram of another fingerprint identification device provided by the embodiments of the present application.When the fingerprint recognition When device is applied to electronic equipment (such as smart phone), as shown in figure 5, the lower surface of cover sheet 410 and display screen 420 Upper surface fitting, the fingerprint identification device 430 can be fixed in the groove of upper surface setting of center 440.The fingerprint recognition Device 430 can be the light path design principle based on collimating aperture, specifically, comprising: sensing chip 431 and optical path modulation device 432, For example, the optical path modulation device 432 is through-hole array.Optionally, following table of 432 upper surface of optical path modulation device to display screen 420 Face has certain the air gap.A kind of optical path modulation device in alternative implementation, in the fingerprint identification device 430 432 can directly fit with display screen 420, and the other assemblies in the fingerprint identification device 430 can be fixed on the recessed of center 440 In slot.To be detected finger surface of the light that display screen 420 issues above display screen 420 reflects, and passes through optical path modulation Device 432 is collimated and is modulated to from the reflected reflected light of finger surface, and reflected light is directed to sensing chip 431 simultaneously It is received, the sensing chip 431 can further detect the reflected light received, to realize fingerprint recognition.
Optionally, the optical path modulation device 432 can use collimator structure, if having from structure exactly a laminate A dry optical channel, i.e. through-hole array, structure can make optical fiber or other can convert diverging light to the lens of collimated light Structure, in addition to channel is light transmission, wall surface and other regions all use light screening material to coat, and in use, reflected light is saturating Enter collimator after crossing cover board, display screen, filters and reflect in collimator.Light is scattered, so that reaching subject to the light of sensing chip Direct light, to obtain blur-free imaging.
Alternatively, the optical path modulation device 432 can also use microlens structure, and when in use, reflected light is through lid Enter lens after plate, display screen, is then focused on sensing chip, to obtain blur-free imaging.
Optionally, in one embodiment of the application, as shown in figure 5, the fingerprint identification device 430 further include: optics Filter plate 433.The optically filtering piece 433 can be set between sensing chip 431 and optical path modulation device 432.It should be understood that In specific implementation, the position of the optically filtering piece is not limited in the lower section of the optical path modulation device 432, also can be set in light Between road modulator 432 and display screen 420, that is, it is located at 432 top of optical path modulation device;Alternatively, may include two layers of optics Filter plate 433, the two are separately positioned on above and below optical path modulation device 432.In other alternative embodiments, the light Learn filter plate 433 be also desirably integrated into inside optical path modulation device 432, possibly even dispense, the application to this with no restriction.
In one possible implementation, as shown in figure 5, the fingerprint identification device 430 further include: bracket 434, the branch Frame 434 can be used as the connector between the fingerprint identification device 430 and display screen 420 and/or center 440, for realizing this Being fixedly connected between three.Optionally, which can be directly anchored on the bracket 434, for example, the light The side surface of road modulator 432 can be bonded by fixed glue with the inner surface of bracket 432.Alternatively, which goes back It may include bulge-structure, which can be used for placing the optical path modulation device 432.For example, can be by optical path modulation Device 432 passes through fixed glue and is bonded with the upper surface of the bulge-structure of bracket 432.It should be noted that the bracket 432 can be and set Separated multiple components on the outside of fingerprint identification device 430 are set, are also possible to be integrally formed.
It should be understood that the optically filtering piece 433 can be used to reduce the undesirable bias light in fingerprint induction, to improve Optical sensor of the sensing chip 431 to the light received.The optically filtering piece 433 specifically can be used for filtering out ambient light wave It is long, for example, near infrared light and partial feux rouges etc..In another example blue light or some blue light.For example, human finger's absorbing wavelength Major part in the energy of light lower than 580nm, if one or more optical filters or optical filtering coating can design It is wavelength-filtered from 580nm to infrared light, then can greatly reduces influence of the environment light to the optical detection in fingerprint induction.
Optionally, which can be infrared cutoff optically filtering piece, can be fixed by optics glue laminating It on sensing chip 431 or can also be fixed on bracket 434 and the holding certain distance of sensing chip 431, wherein work as optics When filter plate 433 is fitted on sensing chip 431, it is desirable that Ying Wuqi between sensing chip 431 and optically filtering piece 433 after solidification Bubble.
Alternatively, which may include one or more optical filters, one or more of light It learns filter and is configurable to such as bandpass filters, to allow the transmission of the light of OLED pixel emission, while stopping sunlight In other light components such as infrared light.When the fingerprint identification device 430 described in outdoor application, this optical filtering can be effective Reduce the bias light as caused by sunlight in ground.One or more of optical filters can be implemented as such as optical filtering painting Layer, the optical filtering coating are formed on one or more continuous interfacials, or can be implemented as one or more discrete boundaries On face.It should be understood that the optical filter 433 can be produced on the surface of any optical component, or along to via hand In the reflected light to the optical path of sensing chip 431 that digital reflex is formed.
Optionally, in one embodiment of the application, which can also include being used for transmission signal Circuit board, as shown in figure 5, the circuit board can be flexible circuit board (Flexible Printed Circuit, FPC)435。
Optionally, the sensing chip 431 can be fixed on the upper table of the flexible circuit board 435 by crystal-bonding adhesive Face, and the flexible circuit board 435 is electrically connected by gold thread.The sensing chip 431 can also be arrived by pad solder The flexible circuit board 435 it is upper.Alternatively, the sensing chip 431 can be fixed on described through the above way It the reinforcement steel disc surface of flexible circuit board 435 can be preferably real to reduce the thickness of the fingerprint identification device 430 Existing technical scheme.Specifically, the sensing chip 431 can pass through the flexible circuit board 435 realization and its The electrical interconnection and signal transmission of the other elements of his peripheral circuit or terminal device 100 as shown in Figure 1.For example, described Sensing chip 431 can receive the control letter of the processing unit of the terminal device 100 by the flexible circuit board 435 Number, and can also be given the fingerprint detection signal (such as fingerprint image) output by the flexible circuit board 435 The processing unit of the terminal device 100 or control unit etc..
Optionally, as shown in figure 5, the bracket 434 can be by realizing in the fixed glue of 435 peripheral point of flexible circuit board Sealing bonding, wherein glue thickness design can control in 0.02mm~0.03mm.
Optionally, as shown in figure 5, the bracket 434 can seal gold thread by sealant in the digging empty avoiding of gold thread area.It should Sealant after requiring solidification needs that gold thread is completely covered.The optical path modulation device 432 can be by putting fixed glue in 434 glue groove of bracket It is Nian Jie with bracket 434, it is desirable that not block the optical path of through-hole array aperture area after adhesive curing.
Wherein, the fixed glue can have following at least one characteristic: epoxy systems or acrylic system, and viscosity >= 2000mPas, cure shrinkage < 3%, curing mode can be the low-temperature setting within 85 DEG C.
In one possible implementation, which may include multiple small area detection zones, or It can be a large area detection zone.For example, the fingerprint identification device 430 may include multiple sensing chips 431, Duo Geguang Road modulator 432 and multiple optically filtering pieces 433 etc..Wherein, multiple sensing chip 431, multiple optical path modulation devices 432 with And it can be corresponded between multiple this three of optically filtering piece 433, and the fingerprint detection region that each sensing chip is formed Area should be greater than 5mm*8mm, wherein the size of each sensing chip should be greater than 5.5mm*8.5mm.For another example this refers to Line identification device 430 can also only include 431, through-hole array of a sensing chip and an optically filtering piece 433, In, the area in the fingerprint detection region which forms should be greater than 5mm*30mm, wherein the size of sensing chip should Greater than 5.5mm*30.5mm.When the fingerprint identification device 430 includes multiple sensing chips, multiple sensing chip be can be used One processing unit, and multiple sensing chip can be distributed on flexible circuit board side by side.
It should be noted that in the embodiment of the present application, the sensing chip 431 corresponds to the inspection of photoelectricity described in Fig. 1 Part 134 is surveyed, the optically filtering piece 133 and through-hole array 132 correspond to optical module 132 described in Fig. 1, specific to tie Structure, function and fingerprint detection process are referred to be previously with regard to the description of fingerprint identification device 130 shown in Fig. 1, herein It repeats no more.
It should be understood that the fingerprint identification device 430 of encapsulation may include above-mentioned part or all of component in specific implementation, For example, optically filtering piece 433 and sensing chip 431 can be packaged together to form fingerprint identification device 430, and optical path modulation Device 432, each component such as bracket 434 and flexible circuit board 435 can be separately mounted on electronic equipment.
Illustrate again, the parameter value illustrated in above each embodiment is not intended to limit this application, can basis Specific implementation is modified accordingly.
Fig. 6 is the schematic diagram of the assemble flow 500 of the fingerprint identification device of the embodiment of the present application.Specifically, the assembly Process 500 includes:
S510, passive device patch.
The passive devices such as capacitor, MCU are fixed on flexible circuit board 435.
S520, sensing chip fitting.
Sensing chip 431 is fixed on flexible circuit board 435 or flexible circuit board 435 by crystal-bonding adhesive Reinforcement steel disc surface, wherein bonding can reduce the thickness of fingerprint identification device on the reinforcement steel disc surface of flexible circuit board Degree, while passive device being electrically connected with sensing chip 431.
S530, optical filter fitting.
Optical filter 433 is fixed on sensing chip 431 by optical cement, which can be complete Cover sensing chip 431, and require solidification after between sensing chip bubble-free, the optically filtering piece 433 can be infrared End optically filtering piece, the use of wavelength is effectively 475nm~550nm.
S540, sensing chip bonding.
Sensing chip 431 is electrically connected to flexible circuit board 435 by gold thread, constitutes with flexible circuit board 435 Circuit part.
S550, cradle fits.
Bracket 434 is by realizing sealing bonding in the fixed glue of 435 peripheral point of flexible circuit board.
S560, gold thread sealing.
Bracket 434 seals gold thread in the digging empty avoiding of gold thread region, by sealant, and sealant needs to cover completely after requiring solidification Lid gold thread, to improve connection reliability.
S570, optical path modulation device 432 are bonded.
Optical path modulation device 432 can be periodical array of orifices form, and optical path modulation device 432 passes through the point in bracket glue groove Fixed glue is Nian Jie with bracket, it is desirable that does not block 432 aperture area optical path of optical path modulator after adhesive curing.
Wherein, fixed glue can be the glue for belonging to epoxy systems or acrylic system, and the fixed glue has following spy At least one of property: it is opaque to visible light but, with a thickness of 0.02mm~0.10mm, viscosity > 20000mPas, cure shrinkage < 3%.The curing mode of the fixed glue can be the low-temperature setting within 85 DEG C, be also possible to ultra-violet curing (Ultraviolet Curing, UV) solidification, it can also be that UV solidifies the low-temperature setting combined within 85 DEG C.
S580, functional test.
The test of the fingerprint identification device 430 is mainly carried out at this time, for example, fingerprint detection is tested.
Double-sided adhesive is pasted on S590, mould group surface.
Above-mentioned mould group is the fingerprint identification device 430, in step 580 when test passes, in the following table of the mould group Face paste double-sided adhesive, can also the upper surface of mould group attach have certain thickness and size retention foam, foam compression ratio > 50%, sealed environment is being formed between the optical path modulation device under display screen 420, is reaching shading, dust-proof requirement.Wherein steep Cotton and the lower bonding plane of screen can be without stickiness or low stickiness, convenient for doing over again.
S591, mould group paste center.
By double-sided adhesive that the mould group and center 440 is fixed, the region of 440 fixed module of center can open deep gouge, and And conductive or non-conductive double-sided adhesive can be attached in the lower surface of mould group or deep gouge, pass through mould group appearance profile and center 440 Deep gouge formed positioning.
420 lower surface of display screen constitutes the object distance of fingerprint identification device 430 to the distance of optical path modulation device upper surface, at this In distance range, shielding lower laminated construction needs aperture to guarantee effective optical path.To shield firmly for class, shielding lower lamination may include foam, double Face glue, screen assembly flexible circuit board etc..And it can be in 440 lower surface placing battery of center, mainboard, camera, row Line, various inductors, microphone, earpiece etc. components.
S592, functional test.
What is carried out at this time is to test comprehensively, i.e. system test, and when testing suitable, assemble flow is completed.
The embodiment of the present application also provides a kind of electronic equipment, which includes the fingerprint in above-mentioned various embodiments Identification device, display screen and center, wherein the fingerprint identification device is between display screen and center, and and display screen Between have gap.
Fig. 7 is the schematic block diagram according to electronic equipment 600 provided by the embodiments of the present application.Electronic equipment shown in Fig. 7 600 include: radio frequency (Radio Frequency, RF) circuit 610, memory 620, other input equipments 630, display screen 640, The components such as sensor 650, voicefrequency circuit 660, I/O subsystem 670, processor 680 and power supply 690.Those skilled in the art It is appreciated that electronic devices structure shown in Fig. 7 does not constitute the restriction to electronic equipment, may include than illustrate it is more or Less component perhaps combines certain components and perhaps splits certain components or different component layouts.Ability field technology Personnel are understood that display screen 640 belongs to user interface (User Interface, UI), and electronic equipment 600 may include ratio Diagram or less user interface.
It is specifically introduced below with reference to each component parts of the Fig. 7 to electronic equipment 600:
RF circuit 610 can be used for receiving and sending messages or communication process in, signal sends and receivees, particularly, by base station After downlink information receives, handled to processor 680;In addition, the data for designing uplink are sent to base station.In general, RF circuit packet Include but be not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier (Low Noise Amplifier, LNA), duplexer etc..In addition, RF circuit 610 can also be communicated with network and other equipment by wireless communication. Memory 620 can be used for storing software program and module, and processor 680 is stored in the software journey of memory 620 by operation Sequence and module, thereby executing the various function application and data processing of electronic equipment 600.Memory 620 can mainly include Storing program area and storage data area, wherein storing program area can application journey needed for storage program area, at least one function Sequence (such as sound-playing function, image player function etc.) etc.;Storage data area, which can be stored, uses institute according to electronic equipment 600 Data (such as audio data, phone directory etc.) of creation etc..In addition, memory 620 may include high-speed random access memory, It can also include nonvolatile memory, a for example, at least disk memory, flush memory device or other volatile solid-states are deposited Memory device.
Other input equipments 630 can be used for receiving the number or character information of input, and generate and electronic equipment 600 User setting and the related signal input of function control.Specifically, other input equipments 630 may include but be not limited to secondary or physical bond (light mouse is that do not show can for disk, function key (such as volume control button, switch key etc.), trace ball, mouse, operating stick, light mouse Depending on the touch sensitive surface exported, or the extension of touch sensitive surface formed by screen) etc. one of or it is a variety of.Its He is connected input equipment 630 with other input device controls devices 671 of I/O subsystem 670, in other equipment input controller Signal interaction is carried out with processor 680 under 671 control.
Display screen 640 can be used for showing information input by user or the information and electronic equipment 600 that are supplied to user Various menus, can also receive user input.Specific display screen 640 can be touch screen, it may include display panel 641, And touch panel 642.Touch panel 642 can cover display panel 641, and user can be according in the display of display panel 641 Hold (the display content includes but is not limited to soft keyboard, virtual mouse, virtual key, icon etc.), on display panel 641 It on the touch panel 642 of covering or is nearby operated, after touch panel 642 detects operation on it or nearby, is led to It crosses I/O subsystem 670 and sends processor 680 to determine that user inputs, be followed by subsequent processing device 680 according to user's input and pass through I/O Subsystem 670 provides corresponding visual output on display panel 641.Although in Fig. 7, touch panel 642 and display panel 641 be the input and input function for realizing electronic equipment 600 as two independent components, but in certain embodiments, Can be integrated by touch panel 642 and display panel 641 and that realizes electronic equipment 600 output and input function.
Electronic equipment 600 may also include at least one sensor 650, for example, the sensor 650 can be positioned at display screen Fingerprint sensor under 640 or in display screen 640, that is, the fingerprint identification device in the embodiment of the present application.
Voicefrequency circuit 660, loudspeaker 661, microphone 662 can provide the audio interface between user and electronic equipment 600. Signal after the audio data received conversion can be transferred to loudspeaker 661, be converted to by loudspeaker 661 by voicefrequency circuit 660 Voice signal output;On the other hand, the voice signal of collection is converted to signal by microphone 662, after being received by voicefrequency circuit 660 Audio data is converted to, then audio data is exported to RF circuit 610 to be sent to such as another mobile phone, or by audio data Output is further processed to memory 620.
I/O subsystem 670 is used to control the external equipments of input and output, may include other equipment input controller 671, Sensor controller 672, display controller 673.Optionally, other one or more input control apparatus controllers 671 from its His input equipment 630 receives signal and/or sends signal to other input equipments 630, other input equipments 630 may include Physical button (push button, rocker buttons etc.), dial, slide switch, control stick, click idler wheel, (light mouse is not aobvious to light mouse Show the touch sensitive surface visually exported, or the extension of the touch sensitive surface formed by screen).It is worth noting that Other input control apparatus controllers 671 can be connect with any one or multiple above equipments.In the I/O subsystem 670 Display controller 673 from display screen 640 receive signal and/or to display screen 640 send signal.Display screen 640 detects After user's input, user's input that display controller 673 will test is converted to and is shown in the user interface on display screen 640 The interaction of object, i.e. realization human-computer interaction.Sensor controller 672 can receive signal from one or more sensor 660 And/or signal is sent to one or more sensor 660.
Processor 680 is the control centre of electronic equipment 600, utilizes various interfaces and the entire electronic equipment of connection Various pieces by running or execute the software program and/or module that are stored in memory 620, and are called and are stored in Data in reservoir 620 execute the various functions and processing data of electronic equipment 600, to carry out whole prison to electronic equipment Control.Optionally, processor 680 may include one or more processing units;Preferably, processor 680 can integrate application processor And modem processor, wherein the main processing operation system of application processor, user interface and application program etc., modulatedemodulate Processor is adjusted mainly to handle wireless communication.It is understood that above-mentioned modem processor can not also be integrated into processor In 680.The processor 680 can be used to execute each step in the application embodiment of the method.
Electronic equipment 600 further includes the power supply 690 (such as battery) powered to all parts, it is preferred that power supply can lead to Cross power-supply management system and processor 680 be logically contiguous, thus by power-supply management system realize management charging, electric discharge and The functions such as power consumption.
Although being not shown, electronic equipment 600 can also include camera, bluetooth module etc., and details are not described herein.
It should be understood that " one embodiment " or " embodiment " that specification is mentioned in the whole text mean it is related with embodiment A particular feature, structure, or characteristic includes at least one embodiment of the application.Therefore, occur everywhere in the whole instruction " in one embodiment " or " in one embodiment " not necessarily refer to identical embodiment.In addition, these specific features, knot Structure or characteristic can combine in any suitable manner in one or more embodiments.
Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure Member and circuit can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are actually with hard Part or software mode execute, the specific application and design constraint depending on technical solution.Professional technician can be with Each specific application is used different methods to achieve the described function, but this realization is it is not considered that exceed this Shen Range please.
In several embodiments provided herein, it should be understood that disclosed circuit, branch and unit, it can be with It realizes by another way.For example, branch described above is schematically, for example, the division of the unit, only one Kind of logical function partition, there may be another division manner in actual implementation, for example, multiple units or components can combine or It is desirably integrated into a branch, or some features can be ignored or not executed.
If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product When, it can store in a computer readable storage medium.Based on this understanding, the technical solution of the application is substantially The part of the part that contributes to existing technology or the technical solution can embody in the form of software products in other words Come, which is stored in a storage medium, including some instructions are used so that a computer equipment (can To be personal computer, server or the network equipment etc.) execute each embodiment the method for the application all or part Step.And storage medium above-mentioned include: USB flash disk, it is mobile hard disk, read-only memory (Read-Only Memory, ROM), random Access various Jie that can store program code such as memory (Random Access Memory, RAM), magnetic or disk Matter.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be subject to the scope of protection of the claims.

Claims (15)

1. a kind of fingerprint identification device, which is characterized in that when the fingerprint identification device is applied to electronic equipment, the fingerprint Identification device is set between the display screen of the electronic equipment and the center of the electronic equipment, and between the display screen With gap.
2. fingerprint identification device according to claim 1, which is characterized in that the fingerprint identification device is fixed in described The upper surface of frame.
3. fingerprint identification device according to claim 2, which is characterized in that the upper surface of the center, which extends downwardly, to be equipped with Groove, the fingerprint identification device are fixed in the groove.
4. fingerprint identification device according to claim 3, which is characterized in that the fingerprint identification device passes through conductive or non- Conductive double sided adhesive tape is fixed in the groove.
5. fingerprint identification device according to claim 3, which is characterized in that the fingerprint identification device passes through mechanical connection Structure is fixed in the groove.
6. fingerprint identification device according to any one of claim 1 to 5, which is characterized in that the fingerprint identification device Upper surface at least one lamination is arranged between the lower section of the display screen, at least one described lamination has aperture, described Fingerprint identification device is at least partially housed in the aperture, to receive the light penetrated from the display screen.
7. fingerprint identification device according to any one of claim 1 to 5, which is characterized in that at least one described lamination Including foamed cotton layer, the upper surface of the fingerprint identification device attaches the foamed cotton layer.
8. fingerprint identification device according to any one of claim 1 to 5, which is characterized in that the fingerprint identification device Include:
Sensing chip;
Through-hole array, the through-hole array are set to the top of the sensing chip, and the through-hole array will be from the display screen The light of transmission is directed toward on the sensing unit of the sensing chip.
9. fingerprint identification device according to claim 8, which is characterized in that the sensing chip is fixed on flexible print electricity The reinforcement steel disc surface of road plate or the flexible circuit board.
10. fingerprint identification device according to claim 8, which is characterized in that the fingerprint identification device further include:
The through-hole array is fixed on the top of the sensing chip by bracket, the bracket.
11. fingerprint identification device according to claim 10, which is characterized in that the fingerprint identification device further include:
Optically filtering piece is set between the sensing chip and the through-hole array;
The optically filtering piece is fitted on the sensing chip or the optically filtering piece is fixed on the bracket, and with The sensing chip has gap.
12. fingerprint identification device according to claim 8, which is characterized in that the fingerprint identification device includes multiple biographies Sense chip, the multiple sensing chip are distributed on flexible circuit board side by side.
13. a kind of electronic equipment, which is characterized in that the electronic equipment includes as described in any one of claims 1 to 12 Fingerprint identification device, display screen and center, the center support the display screen.
14. electronic equipment according to claim 13, which is characterized in that the display screen is Organic Light Emitting Diode OLED Screen.
15. electronic equipment according to claim 13, which is characterized in that the center is metal or plastic structure part.
CN201822101017.2U 2018-12-13 2018-12-13 Fingerprint identification device and electronic equipment Ceased CN209297322U (en)

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
US11144743B2 (en) 2019-11-12 2021-10-12 Egis Technology Inc. Ultrasonic fingerprint sensor and operation method thereof
US11232317B2 (en) 2018-12-29 2022-01-25 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification apparatus and electronic device
CN114115448A (en) * 2020-08-26 2022-03-01 北京小米移动软件有限公司 Electronic device
US11917763B2 (en) 2018-12-13 2024-02-27 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification apparatus and electronic device

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Publication number Priority date Publication date Assignee Title
CN112949593B (en) * 2018-12-13 2024-04-30 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment
WO2022165775A1 (en) * 2021-02-05 2022-08-11 深圳市汇顶科技股份有限公司 Chip packaging structure and electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11917763B2 (en) 2018-12-13 2024-02-27 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification apparatus and electronic device
US11232317B2 (en) 2018-12-29 2022-01-25 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification apparatus and electronic device
US11144743B2 (en) 2019-11-12 2021-10-12 Egis Technology Inc. Ultrasonic fingerprint sensor and operation method thereof
CN114115448A (en) * 2020-08-26 2022-03-01 北京小米移动软件有限公司 Electronic device

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