CN115104139A

CN115104139A - Fingerprint detection device and electronic equipment

Info

Publication number: CN115104139A
Application number: CN202080096189.2A
Authority: CN
Inventors: 段晓锋; 刘相英
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2022-09-23
Also published as: WO2021248496A1

Abstract

The fingerprint detection device and the electronic equipment are suitable for the electronic equipment with a display screen, wherein the bottom layer of the display screen is an opaque layer, and a window penetrating through the opaque layer is formed on the opaque layer; this fingerprint detection device includes: the optical path layer is arranged above the first sensor chip; the device comprises a substrate, a fixing structure and pressure-sensitive adhesive; the first sensor chip and the fixing structure are arranged on the upper surface of the substrate, and the upper surface of the fixing structure is fixed to the lower surface of the display screen through the pressure-sensitive adhesive; a grip portion; the first side of the substrate is provided with a golden finger, the side of the fixing structure comprises the first side and at least one second side except the first side, the holding part is fixedly arranged at any one of the at least one second side, and the holding part is used for peeling the fingerprint detection device from the display screen. The utility model provides an installation or the dismantlement complexity of fingerprint module can be reduced to the scheme of this application to promote the practicality.

Description

Fingerprint detection device and electronic equipment

Technical Field

The embodiments of the present application relate to the field of fingerprint identification, and more particularly, to a fingerprint detection apparatus and an electronic device.

Background

At present, in the scheme of fingerprint identification under a screen, an optical or ultrasonic fingerprint identification module is attached to the bottom of an Organic Light-Emitting Diode (OLED) screen, that is, the optical fingerprint identification module and the ultrasonic fingerprint identification module are required to be tightly bonded with a Light-Emitting layer at the bottom of the screen.

However, to current screen scheme of pasting, need install the fingerprint module earlier at the lower surface of screen, then will install the screen mounting of fingerprint module on the center for the fingerprint module can press from both sides the screen with between the center. It is thus clear that current screen pasting scheme, at the in-process of installation or dismantlement fingerprint module, the installation or dismantle the complexity too high, the practicality is too poor.

Therefore, there is a need in the art for a solution that can reduce the complexity of installation or removal of a fingerprint module, so as to improve the practicability thereof.

Disclosure of Invention

The utility model provides a fingerprint detection device and electronic equipment can reduce the installation of fingerprint module or dismantle the complexity to promote the practicality.

In a first aspect, a fingerprint detection apparatus is provided, which is suitable for an electronic device having a display screen, wherein a bottom layer of the display screen is an opaque layer, and a window penetrating through the opaque layer is formed on the opaque layer;

the fingerprint detection device includes:

the optical path layer is arranged above the first sensor chip;

the device comprises a substrate, a fixing structure and pressure-sensitive adhesive;

the first sensor chip is fixedly and electrically connected to the substrate, the fixing structure is arranged on the upper surface of the substrate and surrounds the first sensor chip, the upper surface of the fixing structure is fixed to the lower surface of the display screen through the pressure-sensitive adhesive, so that the first sensor chip is aligned with the windowing structure, the first sensor chip is used for receiving fingerprint detection signals which are returned by a human finger above the display screen and guided through the light path layer through the windowing structure, and the fingerprint detection signals are used for detecting fingerprint information of the finger;

a grip portion;

the side part of the fixing structure comprises a first side part and at least one second side part except the first side part, the substrate is provided with a golden finger at a position close to the first side part, the golden finger of the substrate can be electrically connected to the golden finger of the flexible circuit board through an anisotropic conductive adhesive film, the holding part is fixedly arranged at any one side part of the at least one second side part, and the holding part is used for peeling the fingerprint detection device from the display screen.

The fingerprint detection device comprises a substrate, a first sensor chip, a light path layer, a first fixing glue, a second fixing glue and a shell, wherein the light path layer is directly arranged on the upper surface of the first sensor chip, the lower surface of the first sensor chip is fixed on the substrate through the first fixing glue, the light path layer and the first sensor chip can be prevented from being independently arranged on the shell, and the size (such as thickness) of the fingerprint detection device is reduced.

In addition, the light path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate through the first fixing glue, so that all the components are tightly matched in the thickness direction (namely, all the components are tightly matched in the thickness direction without reserving gaps), and the size (such as thickness) of the fingerprint detection device is reduced.

Correspondingly, when fingerprint detection device's thickness obtains the control back, can the display screen with between the battery, for will fingerprint identification device sets up other positions outside the battery, not only need not adjust electronic equipment's original inner structure, can also promote electronic equipment's inner space's utilization ratio. For example, the volume of the battery can be increased, and the saved space is used for accommodating the battery with the increased volume, and accordingly, the service life and the user experience of the electronic device can be increased under the condition that the volume of the electronic device is not increased.

In addition, by arranging the holding part, the installation complexity and the disassembly complexity of the fingerprint detection device can be reduced, and correspondingly, the practicability of the fingerprint detection device can be improved.

To sum up, the technical scheme of this application not only can reduce fingerprint detection device's thickness can also reduce fingerprint detection device's installation complexity and dismantlement complexity to promote its practicality.

In some possible implementations, a curing adhesive is disposed between the at least one second side portion and the pressure sensitive adhesive, and between the holding portion and the side portion of the fixing structure, so as to fix the fixing structure and the holding portion.

Through at least one second lateral part with set up between the pressure-sensitive adhesive curing glue, in order relatively the display screen is fixed the pressure-sensitive adhesive can make fingerprint detection device's thrust value satisfies terminal customer's thrust test requirement, can make promptly fingerprint detection device can not produce the displacement in thrust test process, based on this, can guarantee fingerprint detection device is in the connection steadiness in the use, and is corresponding, can guarantee fingerprint detection device's stability of performance.

Further, by providing the curing adhesive between the grip portion and the side portion of the fixing structure, the grip portion can be fixed, and accordingly, the connection reliability of the grip portion can be ensured.

In some possible implementations, the curing glue is an ultraviolet curing glue or a hot melt glue.

In some possible implementations, the opaque layer is a buffer layer, and the upper surface of the fixing structure is fixed to a peripheral region of the lower surface of the buffer layer located at the window by the pressure sensitive adhesive.

In some possible implementation manners, the opaque layer sequentially comprises a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixing structure is fixed to the peripheral area of the lower surface of the copper foil layer located at the window by the pressure sensitive adhesive, or the upper surface of the fixing structure is fixed to the lower surface of the support film by the pressure sensitive adhesive.

Through first pressure sensitive adhesive utilizes the fixed knot of base plate constructs, will fingerprint detection device paste extremely the lower surface of the buffer layer of display screen, copper foil layer or support membrane, compare in with fingerprint detection device directly laminate extremely the display panel of display screen (OLED layer promptly), not only can avoid with fingerprint detection device laminates extremely influence behind the display screen the performance of display screen can also reduce the installation fingerprint detection device's difficult degree, and is corresponding, can reduce fingerprint detection device's installation complexity promotes electronic equipment's yield. Moreover, will fingerprint detection device paste extremely the lower surface of the buffer layer of display screen, copper foil layer or support membrane can also avoid dismantling fingerprint detection device's in-process damages the display screen, and is corresponding, can reduce fingerprint detection device's the dismantlement complexity and promote electronic equipment's yield.

In addition, through first pressure sensitive adhesive utilizes the fixed knot of base plate constructs, will fingerprint detection device paste to the lower surface of the buffer layer of display screen or copper foil layer, when the display screen receives to press or electronic equipment appears falling or when colliding, because display panel with there is the lower surface of buffer layer and/or copper foil layer between the fingerprint detection device, can avoid display panel with fingerprint detection device takes place the extrusion and influences display panel with fingerprint detection device's performance. In addition, by pasting the fingerprint detection device to the lower surface of the buffer layer or the copper foil layer of the display screen, compared with the case that the fingerprint detection device is directly pasted to the display panel or the support film of the display screen, the size of the window can be prevented from being too large, accordingly, the visual degree of a user when watching the fingerprint detection device from the front side of the display screen can be weakened, and the appearance of the electronic equipment can be beautified.

In some possible implementations, the lower surface of the support membrane is provided, in the region of the window, with a connection portion corresponding to the upper surface of the fixing structure, the connection portion being connected to the support membrane by a double-sided adhesive tape.

Through connecting portion, can avoid pressure sensitive adhesive or solidification glue is in form anomalous mark of pasting on the support membrane, correspondingly, can guarantee to install fingerprint detection device's electronic equipment's aesthetic property.

In some possible implementations, the connection portion is a rigid stiffener or a polyethylene terephthalate glue layer.

In some possible implementations, the connection portion is an opaque dielectric layer.

In some possible implementation manners, the substrate sequentially includes a first covering layer, a first conductive layer, a substrate layer, a second conductive layer, and a second covering layer from top to bottom, the upper surface of the substrate extends downward in a first region and penetrates through the first covering layer and the first conductive layer to form a first groove, and the upper surface of the substrate extends downward in a second region connected with the first region and penetrates through the first covering layer to form a pad of the substrate;

the fingerprint detection device further includes:

a first fixing glue and a first gold thread;

the lower surface of the first sensor chip is fixed in the first groove through the first fixing glue, and the first sensor chip is connected to the bonding pad of the substrate through the first gold thread.

By removing the first cover layer and the first conductive layer of the substrate at the first area to form the first groove for accommodating the first fixing adhesive and the first sensor chip, the thickness of the fingerprint detection device can be reduced.

Secondly, through getting rid of the base plate first overburden of second region department forms and is used for the electricity to connect the base plate pad of first sensor chip can provide accommodation space for being used for the electricity to connect first sensor chip with the base plate first gold thread, it is corresponding, reduced first gold thread is in the occupation space of base plate top, and then can reduce fingerprint detection device's thickness.

And thirdly, the thickness of the fingerprint detection device is reduced to the maximum extent through close fit among all the layers in the thickness direction.

Finally, because the light path layer is directly arranged on the upper surface of the first sensor chip, the image acquisition view field of the fingerprint detection device is only influenced by the area of the light path layer and the area of the corresponding first sensor chip, and on the basis, the area of the light path layer and the area of the corresponding first sensor chip can be reasonably designed according to actual requirements so as to meet the requirements of different users and different customers (for example, the requirement of the large-area image acquisition view field).

To sum up, the technical scheme of this application not only can reduce fingerprint detection device's thickness can also guarantee to have enough big image acquisition visual field.

In some possible implementations, the fingerprint detection apparatus further includes:

the second sensor chip, the second fixing glue and the second gold thread;

the upper surface of the substrate extends downwards in a third area connected with the second area and penetrates through the first covering layer and the first conducting layer to form a second groove, the second sensor chip is fixed in the second groove through second fixing glue, the second sensor chip is connected to a bonding pad of the substrate through the second gold wire, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used for matching with the first sensor chip to perform fingerprint identification under a screen.

Through the second sensor chip, the processing task of the first sensor chip can be shared, namely, one sensor chip with complete function and thicker is replaced by the first sensor chip and the second sensor chip which are arranged in parallel and have thinner thickness, and accordingly, the thickness of the fingerprint detection device can be reduced on the basis of not influencing the fingerprint identification performance.

In some possible implementations, the securing structure includes:

the bracket and the gold thread protection adhesive;

the gold thread protection adhesive is used for packaging the first gold thread, and the support is arranged on the upper surface of the first covering film and located on the outer side of the first sensor chip.

In some possible implementations, the support is a polyethylene terephthalate adhesive layer; or the bracket is fixed on the upper surface of the first cover film through bracket fixing glue and positioned on the outer side of the first sensor chip.

In some possible implementations, the fixation structure further includes:

a light-shielding layer;

the optical path layer comprises a lens layer and an optical path guiding layer, the micro lens is used for converging optical signals returned by human fingers above the display screen to the optical path guiding layer, the optical path guiding layer guides the optical signals converged by the micro lens to the first sensor chip, the light shielding layer extends from the upper part of the support to the upper part of the optical path guiding layer, a gap is formed between the light shielding layer and the micro lens layer, and the light shielding layer is used for shielding optical signals incident from other positions except the incident surface of the first sensor chip.

The light shielding layer is constructed to extend from the upper part of the bracket to the upper part of the light path guiding layer, so that not only can the light signals incident from the non-incident surface of the first sensor chip be effectively shielded, but also the light shielding layer can be tightly fixed to the light path layer as much as possible, and correspondingly, the thickness of the fingerprint detection device can be reduced as much as possible.

Further, configuring the light shielding layer to extend from above the holder to above the optical path guiding layer can avoid narrowing the image pickup area of the fingerprint detection device due to the light shielding layer covering the lens layer.

In some possible implementations, the light shielding layer and the grip portion are integrally molded.

In some possible implementations, an accommodating space is formed on a side of the light shielding layer away from the display screen, and the holding portion is disposed in the accommodating space.

The holding part is arranged in the accommodating space of the light shielding layer, so that the thickness of the fingerprint detection device can be reduced, and the holding part and the light shielding layer are ensured to have enough contact area so as to increase the connection reliability of the light shielding layer and the holding part.

In some possible implementations, a side of the light shielding layer where the grip portion is provided extends outward by a preset distance so that a user grips the grip portion.

In some possible implementation manners, the light shielding layer is a shielding adhesive layer, and the arc height position of the first gold thread is covered by the light shielding adhesive layer.

In some possible implementations, the fingerprint detection device further includes the flexible circuit board, and the gold finger of the flexible circuit board is electrically connected to the gold finger of the substrate through the anisotropic conductive adhesive film.

In a second aspect, an electronic device is provided, including:

a display screen;

the fingerprint detection device is the fingerprint detection device in any one of the first aspect or any one of the first aspect possible implementation manners, and the fingerprint acquisition area of the fingerprint detection device is at least partially located in the display area of the display screen.

In some possible implementations, the electronic device further includes a middle frame, and the middle frame is formed with an opening penetrating through the middle frame, and the opening is used for providing a receiving space for the fingerprint detection device.

Drawings

Fig. 1 is a schematic plan view of an electronic device to which the present application may be applied.

Fig. 2 is a schematic side cross-sectional view of the electronic device shown in fig. 1.

Fig. 3 to 6 are schematic structural diagrams of a fingerprint detection device according to an embodiment of the present application.

Fig. 7 and 8 are schematic structural diagrams of a display screen of an electronic device according to an embodiment of the present application.

Fig. 9 to 14 are schematic structural diagrams of an electronic device mounted with a fingerprint detection device according to an embodiment of the present application.

Fig. 15 is a schematic configuration diagram of a fingerprint detection device having a grip portion according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The technical scheme of the embodiment of the application can be applied to various electronic devices. Such as portable or mobile computing devices, e.g., smart phones, laptops, tablets, gaming devices, etc., and other electronic devices, e.g., electronic databases, automobiles, Automated Teller Machines (ATMs), etc. However, the present embodiment is not limited thereto.

The technical scheme of the embodiment of the application can be used for the biological feature recognition technology. The biometric technology includes, but is not limited to, fingerprint recognition, palm print recognition, iris recognition, face recognition, and living body recognition. For convenience of explanation, the fingerprint identification technology is described as an example below.

The technical scheme of the embodiment of the application can be used for the technology of fingerprint identification under the screen.

The screen fingerprint identification technology is characterized in that a fingerprint detection device is installed below a display screen, so that fingerprint identification operation is performed in a display area of the display screen, and a fingerprint collection area does not need to be arranged in an area, except the display area, of the front face of an electronic device. In particular, the fingerprint detection device uses light returning from a top surface of a display assembly of the electronic device for fingerprint sensing and other sensing operations. This returned light carries information about an object (e.g., a finger) in contact with or in proximity to the top surface of the display assembly, and the fingerprint detection device located below the display assembly collects and detects this returned light to effect the identification of the fingerprint under the screen. Among other things, the fingerprint detection device may be designed to achieve a desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light, thereby detecting fingerprint information of the finger.

Fig. 1 and fig. 2 are schematic diagrams illustrating an electronic device 100 to which an off-screen fingerprint identification technology may be applied, where fig. 1 is a schematic diagram of a front side of the electronic device 100, and fig. 2 is a schematic diagram of a partial cross-sectional structure of the electronic device 100 shown in fig. 1.

As shown in fig. 2, the electronic device 100 may include a display 120 and a fingerprint detection apparatus 130.

The display 120 may be a self-luminous display employing display units having self-luminous properties as display pixels. For example, the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.

In addition, the display screen 120 may also be specifically a touch display screen, which not only can perform image display, but also can detect a touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device 100 may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen 120, or may be partially or wholly integrated within the display screen 120, so as to form the Touch display screen.

The fingerprint detection device 130 may be an optical fingerprint detection device.

Specifically, the fingerprint detection device 130 (also referred to as a fingerprint identification module or a fingerprint detection module) may include a sensor chip (also referred to as a fingerprint sensor) having an optical sensing array. The optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photosensor. Alternatively, the fingerprint detection device 130 may include a Photo detector array (or referred to as a Photo detector array, a Photo sensor array) including a plurality of Photo detectors distributed in an array.

As shown in fig. 1, the fingerprint detection device 130 may be disposed in a partial area below the display screen 120 such that the fingerprint acquisition area (or detection area) 103 of the fingerprint detection device 130 is at least partially located within the display area 102 of the display screen 120.

As shown in fig. 2, the area or the light sensing range of the optical sensing array of the fingerprint detection device 130 corresponds to the fingerprint capturing area 103 of the fingerprint detection device 130. The fingerprint collection area 103 of the fingerprint detection device 130 may be equal to or not equal to the area or the light sensing range of the area where the optical sensing array of the fingerprint detection device 130 is located, which is not specifically limited in the embodiment of the present application.

For example, with the light path design of light collimation, the fingerprint acquisition area 103 of the fingerprint detection device 130 can be designed to substantially coincide with the area of the sensing array of the fingerprint detection device 130.

For another example, the macro lens may be used to design the light path of the converged light or the light path of the reflected light, so that the area of the fingerprint collection area 103 of the fingerprint detection device 130 is larger than the area of the sensing array of the fingerprint detection device 130.

The design of the optical path of the fingerprint detection device 130 is exemplified below.

Taking the optical path design of the fingerprint detection device 130 as an example, the optical Collimator with a through hole array having a high aspect ratio may be specifically a Collimator (collimater) layer made on a semiconductor silicon wafer, and the optical Collimator has a plurality of collimating units or micropores, the collimating units may be specifically small holes, in reflected light reflected from a finger, light perpendicularly incident to the collimating units may pass through and be received by a sensor chip below the collimating units, and light with an excessively large incident angle is attenuated by multiple reflections inside the collimating units, so that the sensor chip can basically only receive reflected light reflected from fingerprint grains directly above the sensor chip, and image resolution can be effectively improved, and fingerprint identification effect is improved.

Taking the optical path design of the fingerprint detection device 130 as an example, the optical path design of the Lens (Micro-Lens) layer may be implemented by a microlens array formed by a plurality of microlenses, which may be formed above the sensing array of the sensor chip through a semiconductor growth process or other processes, and each microlens may correspond to one or more sensing units of the sensing array. Other optical film layers such as dielectric layers or passivation layers may be further formed between the lens layer and the sensing units, and more specifically, a light blocking layer having micro holes may be further included between the lens layer and the sensing units, where the micro holes are formed between corresponding microlenses and the sensing units, and the light blocking layer may block optical interference between adjacent sensing units, and enable light to be converged into the micro holes through the microlenses and transmitted to the sensing units corresponding to the microlenses through the micro holes, so as to perform optical fingerprint imaging.

It should be noted that several implementations of the above optical path guiding structure may be used alone or in combination, for example, a lens layer may be further disposed below the collimator layer or the lens layer. Of course, when the collimator layer or the lens layer is used in combination with the lens layer, the specific lamination structure or optical path thereof may need to be adjusted according to actual needs.

The fingerprint detection device 130 may be used to collect fingerprint information (e.g., fingerprint image information) of a user.

Taking the example that the display screen 120 is an OLED display screen, the display screen 120 may be a display screen having a self-Light Emitting display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. The fingerprint detection device 130 may utilize the display unit (i.e., the OLED light source) of the OLED display screen located in the fingerprint acquisition area 103 as an excitation light source for optical fingerprint detection.

When a finger touches, presses, or approaches (collectively referred to as pressing in this application for convenience of description) the fingerprint collection area 103, the display 120 emits a beam of light to the finger above the fingerprint collection area 103, and the beam of light is reflected on the surface of the finger to form reflected light or scattered light after being scattered by the inside of the finger, and the reflected light and the scattered light are collectively referred to as reflected light in the related patent application for convenience of description. Because ridges (ridges) and valleys (vally) of the fingerprint have different light reflection capacities, reflected light from the ridges and the valleys of the fingerprint have different light intensities, and the reflected light is received by the sensor chip in the fingerprint detection device 130 and converted into corresponding electric signals, i.e., fingerprint detection signals, after passing through the display screen 120; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint identification function is realized in the electronic device 100.

Therefore, when the user needs to unlock the fingerprint of the electronic device 100 or perform other fingerprint verification, the user can realize the input operation of the fingerprint feature by pressing the finger on the fingerprint collection area 103 of the display screen 120.

Of course, the fingerprint detection device 130 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection and identification.

As shown in fig. 1, the electronic device 100 may further include a protective cover sheet 110.

The cover plate 110 may be embodied as a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front surface of the electronic device 100, and a protective layer may be further disposed on the surface of the cover plate 110. Therefore, in the embodiment of the present application, the pressing of the display screen 120 by the finger may actually mean that the finger presses the cover plate 110 above the display screen 120 or a protective layer covering the cover plate 110.

As shown in fig. 1, a Circuit board 140, such as a Flexible Printed Circuit (FPC), may be disposed below the fingerprint detection device 130.

The fingerprint detection device 130 may be electrically connected to the circuit board 140, and may be electrically interconnected and signal-transmitted with other peripheral circuits or other components of the electronic apparatus 100 via the circuit board 140. For example, the fingerprint detection device 130 may receive a control signal of a processing unit of the electronic apparatus 100 through the circuit board 140, and may also output a fingerprint detection signal from the fingerprint detection device 130 to the processing unit or the control unit of the electronic apparatus 100, or the like, through the circuit board 140.

Fig. 3 is a schematic structural view of a fingerprint detection device 200 including one sensor chip according to an embodiment of the present application. The fingerprint detection apparatus 200 is suitable for an electronic device having a display screen. For example, the fingerprint detection apparatus 200 may be applied to the electronic device 100 shown in fig. 1 or fig. 2.

It should be noted that, for convenience of description, the same reference numerals are used to designate the same components in the embodiments of the present application, and detailed description of the same components is omitted in different embodiments for the sake of brevity.

As shown in fig. 3, the fingerprint detection device 200 includes a substrate 210, a light path layer 220, a first sensor chip 230, a first fixing glue 240, and a first gold wire 250.

The substrate 210 sequentially comprises a first covering layer 212, a first conductive layer 211, a base material layer 213, a second conductive layer 214 and a second covering layer 215 from top to bottom, the upper surface of the substrate 210 extends downwards in a first area and penetrates through the first covering layer 212 and the first conductive layer 211 to form a first groove, and the upper surface of the substrate 210 extends downwards in a second area connected with the first area and penetrates through the first covering layer 212 to form a pad 2111 of the substrate 210. Optionally, in other alternative embodiments, the substrate 210 may include conductive layers other than the first conductive layer 211 and the second conductive layer 214. Alternatively, the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer. Alternatively, the first cover layer 212 or the second cover layer 213 may be an insulating layer (e.g., a resin layer).

The light path layer 220 sets up the top of first sensor chip 230, the lower surface of first sensor chip 230 passes through first fixed glue 240 is fixed extremely in the first recess, first sensor chip 230 passes through first gold wire 250 is connected to the pad 2111 of base plate 210, first sensor chip 230 is used for receiving via the human finger return of display screen top and pass through the fingerprint detection signal of light path layer 220 guide, the fingerprint detection signal is used for detecting the fingerprint information of finger.

In other words, the lower surface of the first sensor chip 230 is adhered in the first groove by the first fixing glue 240, so that at least a portion of the first sensor chip 230 is disposed in the first groove and electrically connected to the substrate 210 by the first gold wire 250; the first sensor chip 230 may be disposed below a display screen of an electronic device through the substrate 210, and the first sensor chip 230 is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, and detect fingerprint information of the finger based on the fingerprint detection signal, so as to perform fingerprint registration or identification.

It should be understood that the first sensor chip 230 may include a plurality of chips or may include one chip, for example, the first sensor chip 230 may include a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are disposed side by side in the first groove to be spliced into one optical fingerprint sensor chip assembly. Optical fingerprint sensor chip subassembly can be used for acquireing many fingerprint images simultaneously, can carry out fingerprint registration or discernment as a fingerprint image after many fingerprint image concatenations.

For the fingerprint detection device 200, the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, so that it is possible to avoid separately providing a housing for the optical path layer 220 and the first sensor chip 230, and reduce the size (e.g., thickness) of the fingerprint detection device 200.

In addition, by removing the first cover layer 212 and the first conductive layer 211 of the substrate 210 at the first area to form a first groove for accommodating the first fixing glue 240 and the first sensor chip 230, the thickness of the fingerprint detection device 200 can be reduced.

Secondly, by removing the first covering layer 212 at the second area of the substrate 210, a substrate 210 pad for electrically connecting the first sensor chip 230 is formed, so that an accommodating space can be provided for electrically connecting the first sensor chip 230 and the first gold wire 250 of the substrate 210, and accordingly, the occupied space of the first gold wire 250 above the substrate 210 is reduced, and the thickness of the fingerprint detection device 200 can be reduced.

Thirdly, the thickness of the fingerprint detection device 200 is guaranteed to be reduced to the maximum extent through the close fit between the layers in the thickness direction.

Finally, since the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, the image capture field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the area of the corresponding first sensor chip 230, and based on this, the area of the optical path layer 220 and the area of the corresponding first sensor chip 230 can be reasonably designed according to actual requirements, so as to meet the requirements (for example, the requirement of a large-area image capture field of view) of different users and different customers.

To sum up, the technical scheme of this application not only can reduce fingerprint detection device 200's thickness can also guarantee to have enough big image acquisition visual field.

As shown in fig. 3, in some embodiments of the present application, a gap d1 exists between the sidewall of the first sensor chip 230 and the sidewall of the first groove.

By designing a certain gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove, even if there is a difference between the size of the prepared product of the first sensor chip 230 and the design size of the first sensor chip 230, or even if there is a difference between the actual size of the first groove and the design size of the first groove, the mounting of the first sensor chip 230 in the first groove is not affected.

In other words, the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can be used not only as the dimensional tolerance of the first sensor chip 230 and/or the dimensional tolerance of the first groove, but also as the mounting tolerance of the first sensor chip 230, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved. The dimensional tolerance may be the magnitude of the absolute value of the difference between the maximum allowed limit dimension and the minimum limit dimension, or the dimensional tolerance may be the magnitude of the difference between the upper allowed deviation and the lower allowed deviation. The ultimate deviation is the ultimate dimension-the basic dimension, the upper deviation is the maximum ultimate dimension-the basic dimension, and the lower deviation is the minimum ultimate dimension-the basic dimension. The dimensional tolerance of the first sensor chip 230 may be a variation amount allowed in the process of cutting the first sensor chip 230. In the case where the basic size is the same, the smaller the dimensional tolerance, the higher the dimensional accuracy. Similarly, the mounting tolerance of the first sensor chip 230 may refer to an offset distance between a first allowable limit mounting position and a second allowable limit mounting position, the first limit mounting position may be a mounting position of a first sidewall closest to the first recess, the second limit mounting position may be a mounting position of a second sidewall closest to the first recess, the first sidewall being a sidewall opposite to the second sidewall.

For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove is 100-. For example 200 um. Of course, alternatively, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be other values or fall within a range of other preset values, which is not specifically limited in this application. For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be 100um or 250um, and for example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be within 100um to 400 un.

It should be noted that, the thickness of each component or layer in the fingerprint detection device 200 is not specifically limited, as long as the structural relationship between the components or layers adopts the design scheme of the present application, and the thickness of the fingerprint detection device is controlled in a close fit manner, which all fall within the protection scope of the present application.

As an example, the thickness of the first cover layer 212 and the thickness of the second cover layer are both 10-30um, for example 20 um; the thickness of the first conductive layer 211 and the thickness of the second conductive layer are both 10-20um, for example 13 um; the substrate has a thickness of 40-80um, for example 64 um; the thickness of the first sensor chip 230 is 50-150um, for example 60 um; the thickness of the light path layer 220 is 10-30um, for example 21 um; the maximum arc height d6 of the first gold wire 250 is 30-60um, e.g. 40 um; the thickness of the first fixing glue 240 is 10-30um, for example, 15 um.

Of course, the thickness of the first covering layer 212, the thickness of the first conductive layer 211, the thickness of the substrate layer 213, the thickness of the second conductive layer 214, the thickness of the second covering layer 215, the thickness of the first sensor chip 230, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values or within another preset value range, which is not specifically limited in this application.

As shown in fig. 3, in some embodiments of the present application, the fingerprint detection device 200 may further include a holder 251 and a gold wire protection paste 252; the gold wire protection glue 252 is used to encapsulate the first gold wire 250, and the bracket 251 is disposed on the upper surface of the first cover layer 212 and located outside the first sensor chip 230. Optionally, the bracket 251 is fixed on the upper surface of the first cover layer 212 and located outside the first sensor chip 230 by a bracket fixing adhesive 253. For example, the material of the bracket 251 includes, but is not limited to, metal, resin, glass fiber composite board, and glue layer. For example, the holder 251 is a polyethylene terephthalate (PET) adhesive layer. As another example, the holder 251 may be a holder formed of a foam material. Alternatively, the bracket fixing adhesive may be a double-sided adhesive tape.

In other words, the bracket 251 may be disposed above the substrate 210 and located at an outer side or a surrounding area of the first groove and the pad 2111 (for electrically connecting the first sensor chip 230) of the substrate 210.

As shown in fig. 3, in some embodiments of the present application, a width of a gap d2 formed between the first sensor chip 230 and the bracket 251 is greater than or equal to a width of a gap d1 formed between a side wall of the first sensor chip 230 and a side wall of the first groove, and an outer side of the bracket 251 extends a preset distance d3 in a direction approaching the first sensor chip 230 with respect to an outer side of the first cover layer 212. As an example, the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is 100-. Optionally, the thickness of the holder 251 is 40-100um, for example 50um or 80 um.

Of course, in other alternative embodiments, the gap d2 formed between the first sensor chip 230 and the support 251, the preset distance d3, or the thickness of the support 251 may have other specific values, or may be within a range of other preset values. The thickness of the holder 251 may also be 80um, for example.

By the gold wire protection glue 252, the stability of the electrical connection between the substrate 210 and the first sensor chip 230 can be ensured, and accordingly, the performance of the fingerprint detection device 200 can be ensured.

In addition, the gap d2 formed between the first sensor chip 230 and the support 251 can be used as not only the dimensional tolerance of the support 251 but also the installation tolerance of the support 251, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved. Similarly, the preset distance d3 can be used as a dimensional tolerance of the bracket 251 and also as an installation tolerance of the bracket 251, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved.

In some embodiments of the present application, the thickness of the gold wire protection paste 252 is less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing paste 240.

The thickness of the gold wire protection adhesive 252 is smaller than or equal to the sum of the thickness of the light path layer 220, the thickness of the first sensor chip 230 and the thickness of the first fixing adhesive 240, so that the thickness of the fingerprint detection device 200 can be reduced as much as possible while the first gold wire 250 is effectively packaged.

In other alternative embodiments, as shown in fig. 3, the thickness of the gold wire protection glue 252 may also be greater than the sum of the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240.

Of course, other parameters may be designed for the holder 251, as far as the preparation and installation of the holder 251. For example, as shown in fig. 3, in some embodiments of the present application, a width of a gap d4 between a side of the first sensor chip 230 close to the pad 2111 (for electrically connecting the first sensor chip 230) of the substrate 210 and the bracket 251 is greater than a gap d2 between a side of the first sensor chip 230 away from the pad 2111 (for electrically connecting the first sensor chip 230) of the substrate 210 and the bracket 251, so as to reserve a sufficient accommodating space for the bracket fixing adhesive 252. Alternatively, the width of the gap d4 between the side of the first sensor chip 230 close to the pad 2111 of the substrate 210 and the bracket 251 may be 1300um or other values.

As shown in fig. 3, in some embodiments of the present application, the fingerprint detection device 200 further includes a light shielding layer 260.

The optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222, the lens layer 221 is configured to converge an optical signal returned by a human finger above the display screen to the optical path guiding layer 222, the optical path guiding layer 222 guides the optical signal converged by the lens layer 221 to the first sensor chip 230, the light shielding layer 260 extends from above the bracket 251 to above the optical path guiding layer 222, a gap d5 is formed between the light shielding layer 260 and the lens layer 221, and the light shielding layer 260 is configured to shield an optical signal incident from a position other than an incident surface of the first sensor chip 230. Optionally, the light shielding layer 260 has a thickness of 10-30um, for example, 20 um. Of course, the thickness of the light-shielding layer 260 may also be other specific values or within another predetermined value range, which is not specifically limited in the present application.

The light shielding layer 260 is configured to extend from above the holder 251 to above the optical path guiding layer 222, so that not only the light signal incident from the non-incident surface of the first sensor chip 230 can be effectively shielded, but also the light shielding layer 260 can be fixed as closely as possible to the optical path layer 220, and accordingly, the thickness of the fingerprint detection device 200 can be reduced as much as possible.

Further, configuring the light shielding layer 260 to extend from above the holder 251 to above the optical path guiding layer 222 can avoid narrowing the image pickup area of the fingerprint detection device due to the light shielding layer 260 covering the lens layer 221.

As shown in fig. 3, in some embodiments of the present application, the light-shielding layer 260 is a shielding adhesive layer, and the arc height position of the first gold wire 250 is covered by the shielding adhesive layer.

Will the arc high position of first gold thread 250 designs for by shelter from the glue film and cover, not only can effectively shelter from the follow the light signal of the incident of the non-incident surface of first sensor chip 230 can also utilize the gold thread protection of first gold thread 250 is glued and is supported shelter from the glue film, and is corresponding, can promote fingerprint detection device 200's stability.

Of course, in other alternative embodiments, a filter may be used instead of the light-shielding layer 260. Wherein the optical filter is used to reduce undesired ambient light in the fingerprint sensing to improve the optical sensing of the received light by the first sensor chip 230. The filter may specifically be used to filter out light of a particular wavelength, e.g., near infrared light and portions of red light, etc. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm, based on which the filter can be designed to filter light with a wavelength from 580nm to infrared to reduce the influence of ambient light on the optical detection in fingerprint sensing. In particular implementations, the optical filter may include one or more optical filters, which may be configured, for example, as band pass filters, to allow transmission of light emitted by the OLED screen while blocking other light components, such as infrared light, in sunlight. The one or more optical filters may be implemented, for example, as optical filter coatings formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. For example, the filter may be a coating directly designed on the lens layer to prevent newton's rings from appearing in the fingerprint image acquired by the first sensor chip 230. Optionally, in addition, the light entrance surface of the optical filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectivity of the light entrance surface of the optical filter is lower than a first threshold, for example, 1%, thereby ensuring that the first sensor chip 230 can receive a sufficient optical signal, and further improving the fingerprint identification effect.

As shown in fig. 3, in some embodiments of the present application, the gold wire protection paste 252 of the first gold wires 250 is used to support the light shielding layer 260.

In other words, the thickness of the gold wire protection paste 252 is equal to the sum of the thickness of the optical path guiding layer 222, the thickness of the first sensor chip 230 and the thickness of the first fixing paste 240 in the optical path layer 220, so that the gold wire protection paste 250 supports the light shielding layer 260.

As shown in fig. 3, in some embodiments of the present application, the fingerprint detection device 200 further includes a first double-sided adhesive layer 271, a film material layer 272, and a second double-sided adhesive layer 273; the first double-sided adhesive layer 271 is disposed above the light-shielding layer 260, the film layer 272 is disposed above the first double-sided adhesive layer 271, and the second double-sided adhesive layer 273 is disposed above the film layer 272.

Before the fingerprint detection device 200 is installed, the first double-sided adhesive layer 271, the film material layer 272 and the second double-sided adhesive layer 273 are arranged, so that the light path layer 220 in the fingerprint detection device 200 can be effectively prevented from being damaged in the transportation process.

Fig. 4 is a schematic configuration diagram of a modified structure of the fingerprint detection device 200 shown in fig. 3.

As shown in fig. 4, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.

The upper surface of the substrate 210 extends downward in a third region connected to the second region and penetrates through the first covering layer 212 and the first conductive layer 211 to form a second groove, the second sensor chip 280 is fixed in the second groove by a second fixing adhesive 281, the second sensor chip 280 is connected to the pad 2111 of the substrate 210 by the second gold wire 282, so that the second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used for performing underscreen fingerprint identification by matching with the first sensor chip 230. Optionally, the third region and the first region are respectively located at two sides of the second region.

The second sensor chip 280 can share the processing task of the first sensor chip 230, that is, a functionally complete and thick sensor chip is replaced by the first sensor chip 230 and the second sensor chip 280 which are arranged in parallel and have a thin thickness, and accordingly, the thickness of the fingerprint detection apparatus 200 can be reduced without affecting the fingerprint identification performance.

In some embodiments of the present application, a gap d7 exists between a sidewall of the second sensor chip 280 and a sidewall of the second groove. Optionally, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove is 100-. Optionally, the thickness of the second sensor chip 280 is 50-150um, such as 60um, the maximum arc height of the second gold wire 282 is 30-60um, such as 40um, and the thickness of the second fixing glue 281 is 10-30um, such as 15 um. Of course, alternatively, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove, the thickness of the second sensor chip 280, the maximum arc height of the second gold wire 282, or the thickness of the second fixing glue 281 may also be other specific values or within one other preset value range, which is not specifically limited in the embodiment of the present application.

By designing a certain gap d7 between the side wall of the second sensor chip 280 and the side wall of the second groove, even if there is a difference between the size of the manufactured product of the second sensor chip 280 and the design size of the second sensor chip 280, or even if there is a difference between the actual size of the second groove and the design size of the second groove, the mounting of the second sensor chip 280 in the second groove is not affected.

In other words, the gap between the sidewall of the second sensor chip 280 and the sidewall of the second groove can be used not only as the dimensional tolerance of the second sensor chip 280 and/or the dimensional tolerance of the second groove, but also as the mounting tolerance of the second sensor chip 280, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved.

It should be noted that, when the fingerprint detection device 200 is mounted to an electronic apparatus, it can be connected to a main board of the electronic apparatus through an additional flexible circuit board. For example, as shown in fig. 5, the substrate 210 may further include a gold finger 2122 of the substrate 210, the gold finger 2122 of the substrate 210 is used for connecting to a flexible circuit board, and accordingly, the substrate 210 is connected to a motherboard of an electronic device through the flexible circuit board.

Fig. 6 is a schematic structural view of a fingerprint detection device 200 provided with a flexible circuit board according to an embodiment of the present application.

As shown in fig. 6, in some embodiments of the present application, the fingerprint sensing device 200 may further include a flexible circuit board 290 and An (ACF) 292, wherein the flexible circuit board 290 is formed with a gold finger 291 of the flexible circuit board 290; the gold finger 291 of the flexible circuit board 290 is electrically connected to the gold finger 2122 of the substrate 210 through the anisotropic conductive film 292.

Through the anisotropic conductive film 292, the gold finger 291 of the flexible circuit board 290 can be pressed to the gold finger 2122 of the substrate 210, which is equivalent to that, flexible circuit boards with different specifications can be configured for the fingerprint detection device 200, so that the fingerprint detection device 200 has more versatility, and accordingly, the requirements of different users or customers can be met.

As shown in fig. 6, in some embodiments of the present application, the fingerprint sensing device 200 may further include a protection adhesive 293 including an acf 292, and the protection adhesive 293 may be disposed at two ends of the acf 292 to protect the acf 292, and further protect the gold finger 291 of the flexible circuit board 290 and the gold finger 2122 of the substrate 210. As shown in fig. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include an image processor 296, and the image processor 296 is disposed at one end of the flexible circuit board 290. For example, the image processor 296 may be a Micro Processing Unit (MCU) for receiving a fingerprint detection signal (e.g., a fingerprint image) from the first sensor chip 230 via the flexible circuit board 290 and performing simple Processing on the fingerprint detection signal. As shown in fig. 6, in some embodiments of the present application, the fingerprint detection apparatus 200 may further include at least one capacitor 295 disposed at one end of the flexible circuit board 290, wherein the at least one capacitor 295 is used for optimizing (e.g., filtering) the fingerprint detection signal collected by the first sensor chip 230. Optionally, each of the first sensor chips 230 corresponds to one or more capacitors. As shown in fig. 6, in some embodiments of the present application, the fingerprint detection apparatus 200 may further include a connector 294 disposed at one end of the flexible circuit board 290, and the connector 294 may be used to connect with an external device or other components of the electronic device (e.g., a motherboard), so as to achieve communication with the external device or other components of the electronic device. For example, the connector 294 may be used to connect a processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296 and performs fingerprint identification based on the processed fingerprint detection signal.

It should be understood that fig. 3-6 are merely examples of embodiments of the present application and should not be construed as limiting the present application.

For example, in fig. 3 and 4, the lens layer 221 is used as a device for converging light signals in the optical path layer 220, and alternatively, the lens layer 221 may also use an optical collimator. The related description of the optical collimator can refer to the related description of the optical path design of the fingerprint detection device 130 in the foregoing.

For another example, the lens layer 221 may have a microlens array formed by a plurality of microlenses, the optical path guiding layer 222 may be a light blocking layer having a plurality of micro holes and disposed below the microlens layer 221, the micro holes correspond to the microlenses in a one-to-one manner, and the one or more optical sensing units in the first sensor chip 230 correspond to one microlens in the lens layer 221. Optionally, the optical path layer 220 may further include other optical film layers, such as a dielectric layer or a passivation layer.

The fingerprint detection device 200 of the present application is introduced above with reference to fig. 3 to 6, and the installation scheme of the fingerprint detection device 200 is described in detail below.

It should be noted that, since the holder 251, the holder fixing adhesive 253, and the light shielding layer 260 are optional layers, an intermediate concept (i.e., a fixing structure) is introduced below to facilitate the description of the fingerprint detection apparatus from the installation point of view. That is, the fixing structure includes at least one of the holder 251, the holder fixing paste 253, and the light shielding layer 260. In other words, the fixing structure is disposed on the upper surface of the substrate 210 and surrounds the first sensor chip 230. The fixing structure is a connecting part of the fingerprint detection device 200, and is used for connecting and fixing the fingerprint detection device 200 on the lower surface of the display screen.

In other words, the fingerprint detection device 200 includes a substrate 210, a light path layer 220, a first sensor chip 230, a first fixing glue 240, and a first gold wire 250. The substrate 210 includes, in order from top to bottom, a first covering layer 212, a first conductive layer 211, a base material layer 213, a second conductive layer 214, and a second covering layer 215. Optionally, the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222 thereunder. Optionally, the fixing structure may include a bracket 251 and a gold wire protection paste 252. The fixing structure may further include a light shielding layer 260. Optionally, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.

In some embodiments of the present application, the fingerprint detection device 200 may be applied to an electronic device having a display screen, wherein the bottom layer of the display screen is an opaque layer, and a window is formed through the opaque layer. Optionally, the fingerprint detection device has an overall thickness of 0.15-0.6 mm. Of course, other values are possible.

Wherein the fingerprint detection device 200 comprises:

a light path layer 220 and a first sensor chip 230, the light path layer 220 being disposed above the first sensor chip 230;

a substrate 210, a fixing structure and a pressure sensitive adhesive;

wherein the first sensor chip 230 is fixedly electrically connected to the substrate 210, the fixing structure is disposed on the upper surface of the substrate 210 and surrounds the first sensor chip 230, the upper surface of the fixing structure is fixed to the lower surface of the display screen by the pressure sensitive adhesive, so that the first sensor chip 230 is aligned with the windowing arrangement, the first sensor chip 230 is configured to receive, through the windowing arrangement, a fingerprint detection signal returned by a human finger above the display screen and guided through the optical path layer 220, the fingerprint detection signal being configured to detect fingerprint information of the finger.

Taking the display screen as an OLED screen as an example, when a finger is placed above the bright OLED screen, the finger will reflect light emitted from the OLED screen, and the reflected light will penetrate through the OLED screen to the lower side of the OLED screen. Since a fingerprint is a diffuse reflector, a light signal formed by reflection or diffusion of a finger exists in all directions. The fingerprint detection device 200 collects light signals leaked from the upper side of the OLED screen, and performs imaging of a fingerprint image based on the received light signals.

For the fingerprint detection device 200, the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing adhesive 240, so that it is avoided to separately provide a housing for the optical path layer 220 and the first sensor chip 230, and the size (e.g., thickness) of the fingerprint detection device 200 is reduced.

In addition, the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, so that the components are tightly fitted in the thickness direction (i.e., the components are tightly fitted in the thickness direction without a gap), thereby reducing the size (e.g., thickness) of the fingerprint detection apparatus 200.

Correspondingly, after the thickness of the fingerprint detection device 200 is controlled, the display screen and the battery can be arranged between the display screen and the battery, and the fingerprint identification device is arranged at other positions outside the battery, so that the original internal structure of the electronic equipment does not need to be adjusted, and the utilization rate of the internal space of the electronic equipment can be improved. For example, the volume of the battery can be increased, and the saved space is used for accommodating the battery with the increased volume, and accordingly, the service life and the user experience of the electronic device can be increased under the condition that the volume of the electronic device is not increased.

To facilitate understanding of the installation scheme of the fingerprint detection device 200, the structure of the display screen suitable for the present application will be briefly described below.

Fig. 7 is a schematic structural diagram of a display screen 310 according to an embodiment of the present application.

As shown in fig. 7, the display screen 310 may include, in order from top to bottom:

a cover plate (CG) 311, a first Optical Clear Adhesive (OCA) 312, a touch screen 313, a second OCA 314, a Polarizer (POL) 315, a display panel 316, a support film 317, a buffer layer (cushion)318, and a copper foil layer 319. Optionally, the touch screen 313 may also be integrated into the display panel 316, i.e. the display panel 316 may also be used as a touch screen.

The display panel 316 is used for displaying images, and the display panel 316 may also be referred to as a liquid crystal panel or a display screen panel. Alternatively, the display panel 316 may be formed of different materials to form various types of display panels. The display panel 316 may include a Liquid Crystal Display (LCD) panel or an Organic Light Emitting Diode (OLED) display panel. LCD panels include, but are not limited to, Thin Film Transistor (TFT) display panels, In-Plane Switching (IPS) display panels, and Super LCD (SLCD) display panels. Alternatively, the display panel 316 may be formed using different material technologies to form different panels. For example, the display panel 316 may be an OLED organic light emitting panel manufactured by Low Temperature Poly-silicon (LTPS) technology, which has an ultra-thin thickness, a light weight, and Low power consumption, and can be used to provide a relatively clear image. Of course, other material technologies may be used to fabricate the panel, including but not limited to amorphous silicon (a-Si), Indium Gallium Zinc Oxide (IGZO), and continuous granular crystalline silicon (CGS).

The CG 311 is used for protecting the display screen, the first OCA is used for attaching the CG 311 to the touch screen 313, the second OCA 314 is used for attaching the touch screen 313 to the POL 315, the POL 315 may be an optical film formed by compounding multiple layers of polymer materials and having a function of generating polarized light, unpolarized light is filtered into linearly polarized light parallel to a target direction when passing through the POL 315, and the target direction is the polarization direction of the POL 315. The support film 317 serves to support the display panel 316.

The cushion layer 318 may also be referred to as a screen print layer or an embossing layer, and the screen print layer may carry graphics that can be used as a logo, such as a trademark pattern. The buffer layer 318 may be a black sheet layer or a printed layer for shielding light. For example, the cushioning layer 318 may be a layered structure formed from a foam material. The copper foil layer 319 can also be referred to as a heat sink layer (which serves to reduce the temperature of the display screen) or a radiation protective layer. The buffer layer 318 and the copper foil layer 319 may be combined into a rear panel or a bottom layer of the display screen 310, or the rear panel of the display screen may further include a transparent layer or an opaque layer in addition to the buffer layer 318 and the copper foil layer 319, which is not limited in this application.

Fig. 8 is another schematic structural diagram of the display screen 310 according to the embodiment of the present application.

As shown in fig. 8, the display screen 310 may include, in order from top to bottom:

a cover plate (CG) 321, an Optical Clear Adhesive (OCA) 322, a Polarizer (POL) 323, an Encapsulation (Encap) layer 324, a display panel 325, and a buffer layer (cushion) 326. Alternatively, the display panel 325 may also function as a touch screen.

It should be noted that the display screen 310 shown in fig. 7 may also be referred to as a soft screen. The display screen 310 shown in fig. 8 may also be referred to as a hard screen. In other words, the fingerprint detection device 200 of the embodiment of the present application can be applied to both a soft screen (i.e., the display screen 310) and a hard screen (i.e., the display screen 310).

The following description will exemplarily explain a specific embodiment of the fingerprint detection device 200 applied to a display screen having a copper foil layer or a supporting film with reference to the accompanying drawings.

Fig. 9 is a schematic cross-sectional side view of an electronic device 300 having a fingerprint detection device 200 attached to a lower surface of a cushion layer 319 according to an embodiment of the present application. Fig. 10 is an illustrative bottom view of the electronic device 300 shown in fig. 9. Fig. 9 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in fig. 10.

As shown in fig. 9, in some embodiments of the present application, the fingerprint detection apparatus 200 may further include:

a grip portion 420;

wherein the side portion of the fixing structure includes the first side portion 297 and at least one second side portion other than the first side portion, the substrate 210 is provided with a gold finger at a position close to the first side portion, the gold finger of the substrate 210 (for example, the gold finger 2122 of the substrate 210 shown in fig. 6) is electrically connectable to a gold finger of a flexible circuit board (for example, the gold finger 291 of the flexible circuit board 290 shown in fig. 6) through an anisotropic conductive adhesive film, the grip portion 420 is fixedly provided at any one side portion of the at least one second side portion, and the grip portion 420 is used for peeling the fingerprint detection device from the display screen 310.

By providing the holding portion 420, the mounting complexity and the dismounting complexity of the fingerprint detection apparatus 200 can be reduced, and accordingly, the practicability thereof can be improved.

To sum up, the technical scheme of this application not only can reduce fingerprint detection device 200's thickness can also reduce fingerprint detection device 200's installation complexity and dismantlement complexity to promote its practicality.

As shown in fig. 10, in some embodiments of the present application, the substrate 210 is provided with gold fingers near the first side portion, the gold fingers of the substrate 210 are electrically connectable to the gold fingers of the flexible circuit board through the anisotropic conductive adhesive film, the side portion of the fixing structure includes the first side portion and at least one second side portion except the first side portion, a curing adhesive 392 is provided between the at least one second side portion and the pressure-sensitive adhesive 391, and a curing adhesive 392 is provided between the handle portion 420 and the side portion of the fixing structure to fix the fixing structure and the handle portion 420.

Without loss of generality, the curing glue 392 is an ultraviolet curing glue or a hot melt glue.

The Ultraviolet (UV) curing adhesive can also be called UV glue, shadowless adhesive, UV light curing adhesive, and the like, and is a single-component, low-viscosity and high-strength acrylate adhesive which can be cured by irradiation of ultraviolet light. The ultraviolet curing adhesive has the characteristics of long storage period, no solvent, high curing speed, good transparency, good heat resistance, good chemical resistance and the like.

Hot melt adhesive (Hot Glue) is the adhesive of a plasticity, and its physical state can change along with the temperature change within a certain temperature range, on this basis, through the Hot melt adhesive is relative the display screen is fixed pressure sensitive adhesive not only can guarantee the solidification effect of solidification is gluing is dismantling fingerprint detection device 200's in-process, can also be through heating the Hot melt adhesive to reduce its solidification effect, and then can reduce and dismantle or change fingerprint detection device 200's operation complexity.

By arranging the curing adhesive 392 between the at least one second side portion and the pressure-sensitive adhesive 391 to fix the pressure-sensitive adhesive 391 relative to the display screen, the thrust value of the fingerprint detection apparatus 200 can meet the thrust test requirement of a terminal customer, that is, the fingerprint detection apparatus 200 can not generate displacement in the thrust test process, so that the connection stability of the fingerprint detection apparatus 200 in the use process can be ensured, and correspondingly, the performance stability of the fingerprint detection apparatus 200 can be ensured.

Further, by providing the curing glue 392 between the grip portion 420 and the side portion of the fixing structure, the grip portion 420 can be fixed, and accordingly, the connection reliability of the grip portion 420 can be ensured.

As shown in fig. 9, in some embodiments of the present application, the upper surface of the fixing structure may be fixed to the lower surface of the copper foil layer 319 at a peripheral region of the fenestration by the pressure sensitive adhesive 391. At this time, from the viewpoint of bottom view, as shown in fig. 10, the curing adhesive 392 may not cover the pressure-sensitive adhesive 391. The side portions of the fixed structure include the first side portion 297 and at least one second side portion other than the first side portion 297, wherein the curing glue 392 may be disposed outside the at least one second side portion of the fixed structure.

As shown in fig. 9, in some embodiments of the present application, the electronic device 300 may further include a middle frame 360. The middle frame 360 may be used to carry or support various devices or components in the electronic device 300. The devices or components include, but are not limited to, a battery, a camera, an antenna, a motherboard, and the display screen.

Without loss of generality, the middle frame 360 is formed with an opening 361 penetrating through the middle frame, and the opening 361 is used for providing a containing space for the fingerprint detection device 200. In other words, the fingerprint detection device 200 is attached to the lower surface of the display screen in a hanging manner. For example, there is a gap between the fingerprint detection device 200 and the device below the middle frame 360. For example, the electronic device may further include a battery located below the fingerprint detection device 200, and a gap may be formed between the fingerprint detection device 200 and the battery. Optionally, a battery easy-open adhesive is disposed between the rear cover of the electronic device and the battery.

Fig. 11 is a schematic cross-sectional side view of an electronic device 300 having a fingerprint detection device 200 attached to a lower surface of a support film 317 according to an embodiment of the present application. Fig. 12 is a schematic bottom view of the electronic device 300 shown in fig. 11. Fig. 11 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in fig. 12.

As shown in fig. 11, in some embodiments of the present application, the upper surface of the securing structure may be secured to the lower surface of the support film 317 by the pressure sensitive adhesive 391. The windowing of the opaque layer may include windowing of the buffer layer 318 and windowing of the copper foil layer 319. The window of the opaque layer is used to provide a space for accommodating the fingerprint detection device 200 and the curing glue 392. At this time, from the perspective of bottom view, as shown in fig. 12, the curing adhesive 392 may not cover the pressure-sensitive adhesive 391, and a part of the lower surface of the support film 317 can be seen. The side portions of the fixed structure include the first side portion 297 and at least one second side portion other than the first side portion 297, wherein the curing glue 392 may be disposed outside the at least one second side portion of the fixed structure.

In other words, the fingerprint detection device 200 may be applied to an electronic device having a soft screen, and since the bottom layer of the display screen 310 includes the buffer layer 318 and the copper foil layer 319, the windowing of the opaque layer may include windowing of the buffer layer 318 and windowing of the copper foil layer 319. At this time, the upper surface of the fixing structure is fixed to the lower surface of the copper foil layer 319 at the peripheral region of the window by the pressure sensitive adhesive. Alternatively, the upper surface of the fixing structure is fixed to the lower surface of the support film 317 by the pressure sensitive adhesive.

In short, if the opaque layer (i.e., the bottom layer) of the display screen sequentially comprises a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixing structure may be fixed to a peripheral region of the lower surface of the copper foil layer at the fenestration by the pressure sensitive adhesive, or the upper surface of the fixing structure may be fixed to the lower surface of the support film by the pressure sensitive adhesive.

It should be understood that fig. 9-12 are only examples of the present application and should not be construed as limiting the present application.

In other alternative embodiments, the fingerprint detection device 200 may also be applied to an electronic device having a hard screen, i.e., the fingerprint detection device may also be applied to an electronic device having a buffer layer as a bottom layer.

Referring to fig. 8, if the fingerprint detection apparatus 200 is applicable to an electronic device having a hard screen, since the bottom layer of the display screen 310 is a buffer layer 326, the upper surface of the fixing structure is fixed to the peripheral region of the lower surface of the buffer layer 326 at the opening by the pressure sensitive adhesive. At this time, the window of the buffer layer 326 is the window of the opaque layer.

In short, the opaque layer (i.e. the bottom layer) of the display screen is a buffer layer, and the upper surface of the fixing structure is fixed to the peripheral area of the lower surface of the buffer layer located at the window through the pressure-sensitive adhesive.

By using the fixing structure of the substrate through the pressure sensitive adhesive, the fingerprint detection device is adhered to the lower surface of the buffer layer (e.g., the buffer layer 326 shown in fig. 8), the copper foil layer (e.g., the copper foil layer 319 shown in fig. 7) or the support film (e.g., the support film 317 shown in fig. 7) of the display screen, so that compared with the case where the fingerprint detection device is directly adhered to the display panel (e.g., the display panel 316 shown in fig. 7 or the display panel 325 shown in fig. 8), not only can the performance of the display screen be prevented from being affected after the fingerprint detection device is adhered to the display screen, but also the difficulty level of installing the fingerprint detection device can be reduced, and accordingly, the installation complexity of the fingerprint detection device can be reduced and the yield of the electronic device can be improved.

Moreover, will fingerprint detection device paste extremely the lower surface of the buffer layer of display screen, copper foil layer or support membrane can also avoid dismantling fingerprint detection device's in-process damages the display screen, and is corresponding, can reduce fingerprint detection device's the dismantlement complexity and promote electronic equipment's yield.

In addition, the fingerprint detection device is adhered to the lower surface of the buffer layer (for example, the buffer layer 326 shown in fig. 8) or the copper foil layer (for example, the copper foil layer 319 shown in fig. 7) of the display screen by the first pressure sensitive adhesive by using the fixing structure of the substrate, and when the display screen is pressed or the electronic device is dropped or collided, the lower surface of the buffer layer and/or the copper foil layer between the display panel and the fingerprint detection device can prevent the display panel and the fingerprint detection device from being squeezed to influence the performance of the display panel and the fingerprint detection device.

Moreover, by pasting the fingerprint detection device to the lower surface of the buffer layer or the copper foil layer of the display screen, compared with the case that the fingerprint detection device is directly pasted to the display panel or the support film of the display screen, the size of the window can be prevented from being too large, accordingly, the visual degree of a user watching the fingerprint detection device from the front side of the display screen can be weakened, and the appearance of the electronic equipment can be beautified.

Fig. 13 is a schematic side cross-sectional view of an electronic device 300 having a connection part 432 according to an embodiment of the present application. Fig. 14 is a schematic bottom view of the electronic device 300 shown in fig. 13. Fig. 13 is a schematic cross-sectional view of the electronic device 300 taken along the direction of the dotted line shown in fig. 14.

As shown in fig. 13, in some embodiments of the present application, the lower surface of the support membrane 317 is provided with a connection part 432 corresponding to the upper surface of the fixing structure in the area of the window, and the connection part 432 is connected to the support membrane 317 through a double-sided tape 431. Optionally, the connecting portion 432 is a rigid reinforcing plate or a polyethylene terephthalate adhesive layer. Optionally, the connection portion 432 is an opaque dielectric layer.

By the connecting part 432, the pressure-sensitive adhesive 391 or the curing adhesive 392 can be prevented from forming irregular pasting traces on the supporting film 317, and accordingly, the aesthetic property of the electronic equipment provided with the fingerprint detection device can be ensured.

It should be noted that in other alternative embodiments, the connection portion 432 may be formed by any adhesive layer that can be formed on the support film 317. The embodiment of the present application does not limit the specific material and shape of the connecting portion 432.

For example, the shape of the connection portion may be the same as the shape of the upper surface of the fixing structure. For another example, the size of the connecting portion may be larger than that of the upper surface of the fixing structure, so as to reserve a receiving space for the curing glue 392.

It should also be understood that fig. 9-14 are only examples of the present application and should not be construed as limiting the present application.

For example, the fingerprint detection device 200 may be fixedly disposed on the lower surface of the support film 317 as shown in fig. 7 by a stopper structure or the lower surface of the buffer layer 326 as shown in fig. 8 may be fixedly disposed on the peripheral region of the window by a stopper structure.

As another example, the grip portion 420 shown in fig. 9 to 14 is provided on the surface of the light shielding layer 260 close to the holder 251. The embodiments of the present application are not limited thereto.

Fig. 15 is a schematic structural view of the fingerprint detection device 200 provided with the grip portion 420 according to the embodiment of the present application.

As shown in fig. 15, an accommodating space is formed on a side of the light shielding layer 260 facing away from the display screen 310, and the holding portion 420 is disposed in the accommodating space. In other words, the light shielding layer 260 has an accommodating space on a side thereof adjacent to the holder 251, and the grip portion 420 is disposed in the accommodating space. As shown in fig. 15, optionally, a side of the light shielding layer 260 where the grip portion 420 is provided extends outward by a preset distance so that a user grips the grip portion 420. Optionally, the light shielding layer 260 and the grip part 420 are integrally molded to increase the reliability of the connection of the grip part 420.

The holding portion 420 is disposed in the accommodating space of the light shielding layer 260, which not only reduces the thickness of the fingerprint detection device 200, but also ensures that the holding portion 420 and the light shielding layer 260 have a sufficient contact area to increase the connection reliability of the light shielding layer 260 and the holding portion 420.

It should be noted that the above detailed description of the preferred embodiments of the present application with reference to the attached drawings, however, the present application is not limited to the specific details of the above embodiments, and the technical solution of the present application can be modified in many ways within the technical idea of the present application, and these simple modifications all belong to the protection scope of the present application. For example, the various features described in the foregoing detailed description may be combined in any suitable manner without contradiction, and various combinations that may be possible are not described in this application in order to avoid unnecessary repetition. For example, various embodiments of the present application may be arbitrarily combined with each other, and the same should be considered as the disclosure of the present application as long as the concept of the present application is not violated.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It can be clearly understood by those skilled in the art that, for convenience and simplicity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk, and various media capable of storing program codes.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A fingerprint detection device is characterized by being suitable for electronic equipment with a display screen, wherein the bottom layer of the display screen is an opaque layer, and a window penetrating through the opaque layer is formed on the opaque layer;

the fingerprint detection device includes:

the optical path layer is arranged above the first sensor chip;

the device comprises a substrate, a fixing structure and pressure-sensitive adhesive;

the first sensor chip is fixedly and electrically connected to the substrate, the fixing structure is arranged on the upper surface of the substrate and surrounds the first sensor chip, the upper surface of the fixing structure is fixed to the lower surface of the display screen through the pressure-sensitive adhesive, so that the first sensor chip is aligned with the windowing arrangement, the first sensor chip is used for receiving fingerprint detection signals which are returned by a human finger above the display screen and guided through the light path layer through the windowing arrangement, and the fingerprint detection signals are used for detecting fingerprint information of the finger;

a grip portion;

the side part of the fixing structure comprises a first side part and at least one second side part except the first side part, the substrate is provided with a golden finger at a position close to the first side part, the golden finger of the substrate can be electrically connected to the golden finger of the flexible circuit board through an anisotropic conductive adhesive film, the holding part is fixedly arranged at any one side part of the at least one second side part, and the holding part is used for peeling the fingerprint detection device from the display screen.
Fingerprint sensing device according to claim 1, wherein a cured glue is arranged between the at least one second side and the pressure sensitive glue, between the grip portion and the side portion of the fixing structure for fixing the fixing structure and the grip portion.
The fingerprint sensing device of claim 2, wherein the curing adhesive is an ultraviolet curing adhesive or a hot melt adhesive.
The fingerprint sensing apparatus of any one of claims 1 to 3, wherein the opaque layer is a cushioning layer, and the upper surface of the fixing structure is fixed to a peripheral region of the lower surface of the cushioning layer at the window by the pressure sensitive adhesive.
The fingerprint detection device according to any one of claims 1 to 3, wherein the opaque layer comprises a buffer layer and a copper foil layer in sequence from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixing structure is fixed to the peripheral area of the lower surface of the copper foil layer located at the window by the pressure sensitive adhesive, or the upper surface of the fixing structure is fixed to the lower surface of the support film by the pressure sensitive adhesive.
The fingerprint detection device of claim 5, wherein the lower surface of the support membrane is provided with a connection portion in the area of the window corresponding to the upper surface of the fixed structure, the connection portion being connected to the support membrane by a double-sided adhesive tape.
The fingerprint sensing device of claim 6, wherein the connecting portion is a rigid stiffener or a polyethylene terephthalate adhesive layer.
The fingerprint sensing device of claim 6, wherein the connecting portion is an opaque dielectric layer.
The fingerprint detection device according to any one of claims 1 to 3, wherein the substrate comprises a first covering layer, a first conductive layer, a base material layer, a second conductive layer and a second covering layer in sequence from top to bottom, the upper surface of the substrate extends downwards in a first area and penetrates through the first covering layer and the first conductive layer to form a first groove, the upper surface of the substrate extends downwards in a second area connected with the first area and penetrates through the first covering layer to form a pad of the substrate;

the fingerprint detection device further includes:

a first fixing glue and a first gold thread;

the lower surface of the first sensor chip is fixed in the first groove through the first fixing glue, and the first sensor chip is connected to the bonding pad of the substrate through the first gold thread.
The fingerprint detection apparatus according to claim 9, further comprising:

the second sensor chip, the second fixing glue and the second gold thread;

the upper surface of the substrate extends downwards in a third area connected with the second area and penetrates through the first covering layer and the first conducting layer to form a second groove, the second sensor chip is fixed in the second groove through second fixing glue, the second sensor chip is connected to a bonding pad of the substrate through a second gold thread, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used for matching with the first sensor chip to perform fingerprint identification under a screen.
The fingerprint sensing device of claim 9, wherein the fixed structure comprises:

the bracket and the gold thread protection adhesive;

the gold thread protection adhesive is used for packaging the first gold thread, and the support is arranged on the upper surface of the first covering film and located on the outer side of the first sensor chip.
The fingerprint sensing device of claim 11, wherein the support is a polyethylene terephthalate adhesive layer; or the bracket is fixed on the upper surface of the first cover film through bracket fixing glue and positioned on the outer side of the first sensor chip.
The fingerprint sensing device of claim 11, wherein the fixed structure further comprises:

a light-shielding layer;

the light path layer comprises a lens layer and a light path guiding layer, the micro lens is used for converging an optical signal returned by a human body finger above the display screen to the light path guiding layer, the light path guiding layer guides the optical signal converged by the micro lens to the first sensor chip, the shading layer extends from the upper part of the bracket to the upper part of the light path guiding layer, a gap is formed between the shading layer and the micro lens layer, and the shading layer is used for shading the optical signal incident from other positions except the incident surface of the first sensor chip.
The fingerprint detection device according to claim 13, wherein the light shielding layer and the grip portion are integrally molded.
The fingerprint detection device according to claim 13, wherein an accommodation space is formed on a side of the light shielding layer facing away from the display screen, and the grip portion is disposed in the accommodation space.
The fingerprint detection apparatus of claim 13, wherein a side of the light shielding layer where the grip portion is provided extends outward by a preset distance so that a user grips the grip portion.
The fingerprint detection device according to claim 13, wherein the light shielding layer is a light shielding adhesive layer, and the arc height position of the first gold wire is covered by the light shielding adhesive layer.
The fingerprint detection device according to any one of claims 1 to 3, further comprising the flexible circuit board, wherein the gold finger of the flexible circuit board is electrically connected to the gold finger of the substrate through the anisotropic conductive adhesive film.
An electronic device, comprising:

a display screen;

a fingerprint detection device disposed below the display screen, the fingerprint detection device being as claimed in any one of claims 1 to 18, and having a fingerprint acquisition area at least partially within the display area of the display screen.
The electronic device of claim 19, further comprising a middle frame, wherein the middle frame is formed with an opening through the middle frame, and the opening is used for providing a receiving space for the fingerprint detection device.