CN209296007U - Sensor module, inertial measurement cluster and mobile device - Google Patents
Sensor module, inertial measurement cluster and mobile device Download PDFInfo
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- CN209296007U CN209296007U CN201920108784.8U CN201920108784U CN209296007U CN 209296007 U CN209296007 U CN 209296007U CN 201920108784 U CN201920108784 U CN 201920108784U CN 209296007 U CN209296007 U CN 209296007U
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Abstract
The utility model discloses a kind of sensor module, inertial measurement cluster and mobile devices.Sensor module includes the first fixing piece, the second fixing piece and the first circuit board equipped at least one sensor module.Second fixing piece is connect with the first fixing piece, second fixing piece is opposite with the first fixing piece and is spaced apart to limit installation space, first circuit board is set to installation space, first circuit board is fixedly connected at least one of the first fixing piece and the second fixing piece, at least partly not parallel with the horizontal plane and out of plumb of first circuit board.Sensor module according to the present utility model, by will at least partly first circuit board be obliquely installed, sensor module on first circuit board can be tilted with horizontal plane, so as to avoid, the vibration in vertical direction or horizontal direction is direct, acts on some sensor module completely, vibration component can be distributed to all directions, so as to be effectively reduced influence of the vibration to the detection accuracy of sensor module.
Description
Technical field
The utility model relates to sensor technical fields, specifically, more particularly to a kind of sensor module, inertia measurement
Component and mobile device.
Background technique
As the needs such as the development of mobile device, especially automobile, robot, spacecraft and unmanned vehicle carry out movement control
The equipment of system, the kinematic accuracy of mobile device become one of the main competitive field of mobile device.Inertial measurement cluster is a kind of
It is determined for the structure member of mobile device current control state and operation conditions.The measurement accuracy pair of inertial measurement cluster
It is most important in the control precision and running precision of mobile device.Inertial measurement cluster generally includes inertial sensor and for connecting
The circuit board of inertial sensor is connect, inertial sensor may include an integrated multi-axial sensor or multiple single-axis sensors, be used to
Property sensor can be used to test the component of acceleration and angle information of mobile device.
In the related technology, circuit board is usually the pedestal installation parallel or perpendicular to mobile device, so that individually integrated more
Axle sensor is fixed on pedestal or multiple single-axis sensors respectively parallel or perpendicular to pedestal in parallel.Due to mobile device
Take off or descent in, it will usually generate biggish vibration, and inertial sensor is more sensitive to shaking.In order to reduce shake
Influence of the rotating ring border to inertial sensor, some mobile devices anti-seismic performance stronger sensor bigger using range, also
Some better damping devices of mobile device using effect, but these can all increase the production cost and design hardly possible of mobile device
Degree.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art.For this purpose, the utility model exists
In proposing that a kind of sensor module, the sensor module have the advantages that structure is simple, detection accuracy is high.
The utility model also proposes a kind of inertial measurement cluster with the sensor component.
The utility model also proposes a kind of mobile device with the sensor component.
According to the sensor module of the utility model embodiment, comprising: the first fixing piece；Second fixing piece, described second
Fixing piece is connect with first fixing piece, and second fixing piece is opposite with first fixing piece and is spaced apart to limit
Installation space；First circuit board equipped at least one sensor module, the first circuit board are set to the installation space, institute
It states first circuit board to be fixedly connected at least one of first fixing piece and second fixing piece, first circuit
At least partly not parallel with the horizontal plane and out of plumb of plate.
According to the sensor module of the utility model embodiment, by will at least partly first circuit board be obliquely installed, the
Sensor module on one circuit board can be tilted with horizontal plane, so as to avoid the vibration in vertical direction or horizontal direction
Directly, some sensor module is acted on completely, and only vibration component in part can pass to sensor module, so as to have
Effect ground reduces influence of the vibration to the detection accuracy of sensor module, and then the service performance of sensor module can be improved.Separately
Outside, first circuit board is tilted and is installed, the measuring range of sensor module can also be improved.
Some embodiments according to the present utility model, on the first direction of the first circuit board, first circuit
Plate have opposite first end and second end, from the first end to the direction of the second end on, the first circuit board edge
Second direction inclination, the first direction is parallel with the horizontal plane, the second direction and the horizontal plane.
In some embodiments of the utility model, first fixing piece includes first surface, the first surface position
In in the installation space, the first surface is parallel with the first circuit board.
In some embodiments of the utility model, first fixing piece includes second surface, the second surface with
The first surface is opposite, and the second surface is located at outside the installation space, and the second surface and the horizontal plane are flat
Row.
In some embodiments of the utility model, second fixing piece includes third surface, the third surface position
In in the installation space, the third surface is parallel with the first circuit board.
In some embodiments of the utility model, second fixing piece include the 4th surface, the 4th surface with
The third surface is opposite, and the 4th surface is located at outside the installation space, and the 4th surface and the horizontal plane are flat
Row.
Some embodiments according to the present utility model, the sensor module further include fastener；First fixing piece
With the first mounting hole, second fixing piece have the second mounting hole, the fastener be arranged in first mounting hole and
Second mounting hole.
In some embodiments of the utility model, the side of first fixing piece towards second fixing piece is equipped with
First mounting post；Second fixing piece is equipped with the second mounting post, second installation towards the side of first fixing piece
Column is opposite with first mounting post；The first circuit board be located in first mounting post and second mounting post it
Between.
In some embodiments of the utility model, first mounting hole is set to first mounting post and through described
First mounting post and the first fixing piece, second mounting hole be set to second fixing piece and through second mounting post and
Second fixing piece；The first circuit board is equipped with third mounting hole, and the fastener is successively arranged in first mounting hole, institute
State third mounting hole and second mounting hole.
In some embodiments of the utility model, the free end of second mounting post is equipped with protrusion, second peace
It fills hole and runs through the protrusion, the protrusion is suitable for being arranged in the third mounting hole.
According to the inertial measurement cluster of the utility model embodiment, comprising: first support；Second support, described second
Frame is connect with the first support, and the second support is opposite with the first support and is intervally arranged；Sensor module, it is described
Sensor module is sensor module as described above, and the sensor module is located at the first support and the second support
Between, the sensor module includes flexible circuit board and the first connector, one end of the flexible circuit board and described first
The other end of circuit board electrical connection, the flexible circuit board is located at outside the installation space, first connector with it is described soft
Property circuit board the other end electrical connection；First bolster, first bolster are located at the sensor module and described first
Between bracket；Second bolster, second bolster is between the sensor module and the second support；Second electricity
Road plate, the second circuit board are connect with the second support, and the second circuit board and the sensor module are positioned at described
The two sides of second support, the second circuit board are electrically connected with the first circuit board, the second circuit board be equipped be suitable for
The second connector that first connector is cooperatively connected.
According to the inertial measurement cluster of the utility model embodiment, by will at least partly first circuit board be obliquely installed,
Sensor module on first circuit board can be tilted with horizontal plane, so as to avoid the shake in vertical direction or horizontal direction
It is dynamic directly, act on some sensor module completely, so as to be effectively reduced vibration to the detection essence of sensor module
The influence of degree, and then the service performance of sensor module can be improved, the measuring range of sensor module can also be improved.And
The fortune between first support and sensor module can be buffered by the first bolster of setting and the second bolster, the first bolster
Dynamic, the second bolster can buffer the movement between second support and sensor module, so as to improve inertial measurement cluster
Damping performance, reduce the probability that shakes under external force of sensor module, and then the detection of sensor module can be improved
Precision.In addition, the construction of first support and second support can be in order to the installation of sensor module.
According to the mobile device of the utility model embodiment, including inertial measurement cluster as described above.
According to the mobile device of the utility model embodiment, by will at least partly first circuit board be obliquely installed in movement
Equipment, mobile device take off, fly and descent in, the vibration amplitude formed in the vertical direction is big, by the first circuit
Sensor module and horizontal plane on plate tilt, and can directly act on sensor module to avoid the vibration on vertical direction, only
There is part vibration component that can pass to sensor module, so as to be effectively reduced vibration to the detection accuracy of sensor module
Influence, and then the service performance of sensor module can be improved, the measuring range of sensor module can also be improved.And it is logical
The fortune between first support and sensor module can be buffered by crossing the first bolster of setting and the second bolster, the first bolster
Dynamic, the second bolster can buffer the movement between second support and sensor module, so as to improve inertial measurement cluster
Damping performance, reduce the probability that shakes under external force of sensor module, and then the detection of sensor module can be improved
Precision.In addition, the construction of first support and second support can be in order to the installation of sensor module.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram according to the sensor module of the utility model embodiment；
Fig. 2 is the Structure explosion diagram according to the sensor module of the utility model embodiment；
Fig. 3 is the structural schematic diagram according to the inertial measurement cluster of the utility model embodiment；
Fig. 4 is the structural schematic diagram according to the mobile device of the utility model embodiment.
Appended drawing reference:
Mobile device 1,
Inertial measurement cluster 10,
Sensor module 100,
First fixing piece 110, the first mounting hole 111, the first mounting post 112, first surface 113, second surface 114,
Second fixing piece 120, the second mounting hole 121, the second mounting post 122, protrusion 123, third surface 125, the 4th table
Face 126,
First circuit board 130, sensor module 131, third mounting hole 133, flexible circuit board 134, the first connector
135,
Fastener 140,
First support 200, second support 300, support column 400, the first bolster 500, the second bolster 600, the second electricity
Road plate 700, the second connector 710.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
As shown in Figures 1 and 2, according to the sensor module of the utility model embodiment 100, including the first fixing piece 110,
Second fixing piece 120 and first circuit board 130.
Specifically, as shown in Figures 1 and 2, the second fixing piece 120 is connect with the first fixing piece 110, the second fixing piece
120 is opposite with the first fixing piece 110 and be spaced apart to limit installation space.For example, the second fixing piece 120 and the first fixing piece
110 can be laminated and be spaced setting.First circuit board 130 is set to installation space.It is understood that first circuit board 130
Between the first fixing piece 110 and the second fixing piece 120.For example, the first fixing piece 110, first circuit board 130 and second are fixed
Part 120 can be cascading, and first circuit board 130 is located between the first fixing piece 110 and the second fixing piece 120 with structure
Appearance is at the structure for being similar to " sandwich ".In first circuit board 130 and the first fixing piece 110 and the second fixing piece 120 extremely
Few one is fixedly connected.
It should be noted that " being fixedly connected " mentioned herein is that first circuit board 130 is fixed on the first fixing piece 110
And/or second fixing piece 120, " being fixedly connected " can be non-removable connection type, be also possible to dismountable connection side
Formula, for example, first circuit board 130 and the first fixing piece 110 are detachably connected, first circuit board 130 and the second fixing piece 120
It is detachably connected.In addition, " connection " can be the connection type being directly connected to, be also possible to the connection type being indirectly connected with.
At least partly not parallel with the horizontal plane and out of plumb of first circuit board 130.It is to be appreciated that " horizontal plane " can
Think that the relatively complete static water near first circuit board 130 is formed by plane and the face parallel with the plane.It can
With understanding, a part either whole region and horizontal plane on first circuit board 130, which are formed, is greater than zero degree and less than nine
Ten degree of angle.First circuit board 130 is equipped at least one sensor module 131.For example, there are three first circuit board 130 sets
Sensor module 131, three sensor modules 131 are respectively positioned between first circuit board 130 and the first fixing piece 110, three biographies
Sensor module 131 may be respectively used for the state of motion value in detection X-direction, Y-direction and Z-direction.For another example, first circuit board
130 can be equipped with a sensor module 131, which can detecte the fortune in X-direction, Y-direction and Z-direction
Dynamic state value.
In the related technology, since most of aircraft especially multi-rotor aerocraft horizontal area is big, so its vibration exists
Component on the vertical direction of fuselage can be bigger, and flight controller is generally affixed to the horizontal zone of fuselage, so flying
Influenced bigger by shaking for the sensor of kinematic parameter on sense aircraft vertical direction in line control unit, sensor is adopted
The physical quantity serious distortion of collection.
According to the sensor module 100 of the utility model embodiment, by the way that at least partly inclination of first circuit board 130 is set
It sets, the sensor module 131 on first circuit board 130 can be tilted with horizontal plane, and the vibration on vertical direction can share
On three directions of the three-dimensional coordinate on the basis of 130 top incline of first circuit board, so as to avoid on vertical direction
Vibration completely, individually influences the kinematic parameter on the vertical direction that sensor module 131 detects, and only part vibration component can be folded
The kinematic parameter being added on the vertical direction of the detection of sensor module 131, so as to be effectively reduced vibration to sensor die
The influence of detection accuracy on 131 vertical direction of block, and then the service performance of sensor module 100 can be improved.In addition, by first
The inclination installation of circuit board 130, can also improve the measuring range of sensor module 100.
As shown in Figures 1 and 2, some embodiments according to the present utility model, in the first direction of first circuit board 130
On, first circuit board 130 is with opposite first end and second end, on the direction from first end to second end, first circuit board
130 tilt in a second direction, and first direction is parallel to the horizontal plane, second direction and horizontal plane.It is understood that from
On one end to the direction of second end, second end is gradually distance from horizontal plane.For example, first circuit board 130 is rectangular plate part, the
On the length direction of one circuit board 130, first circuit board 130 includes opposite first end and second end, and first end is located at level
In face, on from first end to the direction of second end, first circuit board 130 is gradually distance from horizontal plane, and second end is located at first end
Top.Thus, it is possible to being obliquely installed convenient for first circuit board 130, the movement of the vertical direction detected of sensor module 131
Parameter only will receive the influence of the vibration of the part on vertical direction.
In some embodiments of the utility model, first circuit board 130 zero degree and can be less than horizontal by being greater than
60 degree of angle.For example, first circuit board 130 can be able to be 30 degree or 45 degree with the angle of horizontal plane.Thus, it is possible to be convenient for
By based on the three-dimensional system of coordinate on horizontal plane and based on switching over operation between three-dimensional system of coordinate on first circuit board 130, from
And can in order to by sensor module 131 the physical quantitys of collected all directions synthesize to obtain the water based on horizontal plane
Square to the physical quantity with vertical direction.
For example, first circuit board 130 can be 30 degree with the angle of horizontal plane, sensor module on first circuit board 30
The inertia collection capacity that 131 three-dimensional coordinates detected based on first circuit board 130 are fastened is Ax, Ay, Az, then is converted to and is based on
Three components that three-dimensional coordinate in horizontal plane is fastened are as follows: Ax*cosa+Az*sina, Ay, Az*cosa-Ax*sina.
As shown in Figures 1 and 2, in some embodiments of the utility model, the first fixing piece 110 includes first surface
113, first surface 113 is located in installation space, and first surface 113 is parallel with first circuit board 130.It is understood that the
The surface that construction forms the part wall of installation space on one fixing piece 100 is inclined surface, in other words, on the first fixing piece 100
Construction forms the surface of the part wall of installation space and horizontal plane forms the angle for being greater than zero degree, structure on the first fixing piece 100
Appearance is adapted at the surface of the part wall of installation space with first circuit board 130.Pass through the first fixing piece of construction as a result,
110 shape.The first fixing piece 110 can be made to adapt to first circuit board 130, so as to be convenient for first circuit board 130
Installation, reduce sensor module 100 thickness.
As shown in Figures 1 and 2, in some embodiments of the utility model, the first fixing piece 110 includes second surface
114, second surface 114 and first surface 113 are opposite, and second surface 114 is located at outside installation space, second surface 114 and water
Plane is parallel.It is understood that the surface on the first fixing piece 110 far from first circuit board 130 is parallel to horizontal plane.By
This, can be in order to the installation of the first fixing piece 110.
For example, on the length direction of first circuit board 130, the distance between first surface 113 and second surface 114 by
Cumulative big, in the width direction of first circuit board 130, the distance between first surface 113 and second surface 114 are constant.Again
Such as, in the width direction of first circuit board 130, the distance between first surface 113 and second surface 114 are gradually increased,
On the length direction of first circuit board 130, the distance between first surface 113 and second surface 114 are constant.
As shown in Figures 1 and 2, in some embodiments of the utility model, the second fixing piece 120 includes third surface
125, third surface 125 is located in installation space, and third surface 125 is parallel with first circuit board 130.It is understood that the
The surface that construction forms the part wall of installation space on two fixing pieces 120 is inclined surface, in other words, on the second fixing piece 120
Construction forms the surface of the part wall of installation space and horizontal plane forms the angle for being greater than zero degree, structure on the second fixing piece 120
Appearance can be adapted at the surface of the part wall of installation space with first circuit board 130.It is fixed by construction second as a result,
The shape of part 120.The second fixing piece 120 can be made to adapt to first circuit board 130, so as to be convenient for first circuit board
130 installation reduces the thickness of sensor module 100.
As shown in Figures 1 and 2, in some embodiments of the utility model, the second fixing piece 120 includes the 4th surface
126, the 4th surface 126 is opposite with third surface 125, and the 4th surface 126 is located at outside installation space, the 4th surface 126 and water
Plane is parallel.It is understood that the surface on the second fixing piece 120 far from first circuit board 130 is parallel to horizontal plane.By
This, can be in order to the installation of the second fixing piece 120.
For example, on the length direction of first circuit board 130, the distance between third surface 125 and the 4th surface 126 by
Cumulative big, in the width direction of first circuit board 130, the distance between third surface 125 and the 4th surface 126 are constant.Again
Such as, in the width direction of first circuit board 130, the distance between third surface 125 and the 4th surface 126 are gradually increased,
On the length direction of first circuit board 130, the distance between third surface 125 and the 4th surface 126 are constant.
Some embodiments according to the present utility model, sensor module 131 can be acceleration transducer or velocity pick-up
Device.For example, sensor module 131 can be integrated six axle sensors (three-axis gyroscope and triaxial accelerometer) chip, sensor
Component 100 can be used for measuring the speed of service and acceleration of mobile device 1, may thereby determine that mobile device 1 position and
Pose, and then further motion control can be carried out to mobile device 1.
As shown in Fig. 2, some embodiments according to the present utility model, sensor module 100 further includes fastener 140.The
One fixing piece 110 has the first mounting hole 111, and the second fixing piece 120 has the second mounting hole 121, and fastener 140 is arranged in the
One mounting hole 111 and the second mounting hole 121.For example, the first mounting hole 111 can be along the thickness direction of the first fixing piece 110
The first fixing piece 110 is penetrated through, the second mounting hole 121 can be formed as the groove body on the second fixing piece 120, the second mounting hole 121
The second fixing piece 120 is not penetrated through, one end that fastener 140 can pass through the first mounting hole 111 and fastener 140 can protrude into the
Two mounting holes 121.For another example, the first mounting hole 111 can penetrate through the first fixing piece along the thickness direction of the first fixing piece 110
110, the second mounting hole 121 can penetrate through the second mounting hole 121 along the thickness direction of the second fixing piece 120, and fastener 140 can
The second mounting hole 121 can be protruded into pass through one end of the first mounting hole 111 and fastener 140.Pass through fastener 140 as a result,
First fixing piece 110 and the second fixing piece 120 can be connected, structure is simple and facilitates operation, passes so as to simplify
The installation of sensor component 100.
As shown in Fig. 2, fastener 140 can be threaded fastener in some embodiments of the utility model.In this reality
With in novel some embodiments, fastener 140 can be threadedly coupled with the second mounting hole 121, clamping or interference are connect.At this
In some embodiments of utility model, fastener 140 can be threadedly coupled with the first mounting hole 111, clamping or interference are connect.?
In some embodiments of the utility model, fastener 140 can have interval between the peripheral wall surfaces of the first mounting hole 111, tightly
The one end of firmware 140 far from the second mounting hole 121 is only supported with the first fixing piece 110.
As shown in Fig. 2, the first mounting hole 111 can be multiple, the second installation in some embodiments of the utility model
Hole 121 can be multiple and correspond with multiple first mounting holes 111 that fastener 140 is multiple and installs with multiple first
Hole 111 corresponds.It should be noted that " multiple " mentioned herein are two and more than two meanings.For example, first
There are four mounting holes 111, and four the first mounting holes 111 are intervally arranged, and the second mounting hole 121 is four, four the second mounting holes
121 and four the first mounting holes 111 correspond, the first corresponding mounting hole 111 of each second mounting hole 121 is opposite,
Fastener 140 is four, and each fastener 140 can be arranged in second mounting hole 121 and right with second mounting hole 121
The first mounting hole 111 answered.Thus, it is possible to the connective stability of the first fixing piece 110 and the second fixing piece 120 is improved, thus
The mounting stability of first circuit board 130 and sensor module 131 can be improved, and then sensor module 100 can be improved
Structural stability.
As shown in Figures 1 and 2, in some embodiments of the utility model, the first fixing piece 110 is towards the second fixing piece
120 side is equipped with the first mounting post 112, and the second fixing piece 120 is equipped with the second mounting post towards the side of the first fixing piece 110
122, the second mounting post 122 and the first mounting post 112 are opposite, and first circuit board 130 is located in the first mounting post 112 and the second peace
It fills between column 122.It is understood that the first mounting post 112 and the second mounting post 122 are respectively positioned on the first fixing piece 110 and
Between two fixing pieces 120, the first mounting post 112 is connect with the first fixing piece 110, the second mounting post 122 and the second fixing piece 120
Connection, the end face of the free end of the first mounting post 112 is opposite with the end face of free end of the second mounting post 122 and interval is arranged,
First circuit board 130 be located in the end face of the free end of the first mounting post 112 and the free end of the second mounting post 122 end face it
Between.Thus, it is possible to which first circuit board 130 is positioned between the first fixing piece 110 and the second fixing piece 120, can also be convenient for
The installation and removal of first circuit board 130.
It, can be first by 130 1 surface of first circuit board and the second mounting post 122 in 100 installation process of sensor module
Free end end face contact, then the end face of the free end of the first mounting post 112 and another surface of first circuit board 130 are connect
Touching, so that first circuit board 130 is located between the first mounting post 112 and the second mounting post 122, then will by fastener 140
First fixing piece 110 is connected with the second fixing piece 120.
In some embodiments of the utility model, the end face of the free end of the first mounting post 112 can be plane or oblique
Face.Further, the first mounting post 112 can be cylinder, polygon prism or polygonal pyramid.In some embodiments of the utility model
In, the first mounting post 112 is vertical with the first fixing piece 110 to be connect.In some embodiments of the utility model, the second mounting post
122 construction is identical as the shape of the first mounting post 112.
As shown in Figures 1 and 2, in some embodiments of the utility model, the first mounting hole 111 is set to the first mounting post
112 and run through the first mounting post 112 and the first fixing piece 110, the second mounting hole 121 is set to the second fixing piece 120 and through the
Two mounting posts 122 and the second fixing piece 120, first circuit board 130 are equipped with third mounting hole 133, and fastener 140 is successively arranged in
First mounting hole 111, third mounting hole 133 and the second mounting hole 121.As a result, fastener 140 can by the first fixing piece 110,
Second fixing piece 120 and first circuit board 130 connect, so as to improve the mounting stability of first circuit board 130, also
It can simplify the structure setting and attended operation of the first fixing piece 110 and the second fixing piece 120.
As shown in Figures 1 and 2, in some embodiments of the utility model, the free end of the second mounting post 122 is equipped with convex
123 are played, through protrusion 123, protrusion 123 is suitable for being arranged in third mounting hole 133 the second mounting hole 121.For example, protrusion 123
One end is connect with the end face of the free end of the second mounting post 122, and the other end of protrusion 123 extends towards first circuit board 130, convex
Third mounting hole 133 can be arranged in by playing 123, and fastener 140 can pass through the first mounting hole 111 and the second mounting hole 121, from
And fastener 140 can be saved and connect with first circuit board 130.
Further, the periphery wall of protrusion 123 can be bonded with the wall surface of third mounting hole 133.Thus, it is possible to limit
First circuit board 130 is positioned at protrusion 123 by the displacement of one circuit board 130.
As shown in Figures 1 and 2, some embodiments according to the present utility model, first circuit board 130 can be equipped with first device
Part, at least one of the first fixing piece 110 and the second fixing piece 120 are equipped with the escape groove for accommodating component.For example, first
Device can be located at the same surface of first circuit board 130, and the surface the second fixing piece 120 of direction with sensor module 131,
Second fixing piece 120 is equipped with escape groove, and component can be located in escape groove.Thus, it is possible to reduce sensor module 100
Thickness.
As shown in Figures 1 and 2, in some embodiments of the utility model, escape groove can be multiple, multiple escape groove
In a part can be used for accommodating component, another part of multiple escape groove can be used for accommodating sensor module 131.?
In the other embodiment of the utility model, escape groove can be one, and component and sensor module 100 are respectively positioned on escape groove
It is interior.Thus, it is possible to simplify the construction of sensor module 100.
Some embodiments according to the present utility model, the first fixing piece 110 are metal block, and the second fixing piece 120 is metal
Block.Thus, it is possible to improve the weight of sensor module 100, the first fixing piece 110 and the second fixing piece 120 can be used as sensing
The clump weight of device assembly 100 avoids sensor module 100 outside so as to improve the mounting stability of sensor module 100
It is shaken under the action of power (such as wind-force), influences the detection accuracy of sensor module 131.
As shown in figure 3, according to the inertial measurement cluster 10 of the utility model embodiment, including first support 200, second
Frame 300, sensor module 100, the first bolster 500, the second bolster 600 and second circuit board 700, sensor module 100
For sensor module 100 as described above, second support 300 is connect with first support 200, second support 300 and first support
200 is opposite and be intervally arranged.For example, at least partly being laminated and be spaced with first support 200 for second support 300 is arranged.
For sensor module 100 between first support 200 and second support 300, the first bolster 500 is located at sensor module 100
Between first support 200, the second bolster 600 is between sensor module 100 and second support 300.Second circuit board
700 connect with second support 300, and second circuit board 700 is located at the two sides of second support 300 with sensor module 100.For example,
First support 200, the first bolster 500, sensor module 100, the second bolster 600, second support 300 and second circuit board
700 can stack gradually arrangement.Second circuit board 700 is electrically connected with first circuit board 130.
As shown in figure 3, sensor module 100 may include flexible circuit board 134 and the first connector 135, flexible circuit
One end of plate 134 is electrically connected with first circuit board 130, and the other end of flexible circuit board 134 is located at outside installation space.First connection
Device 135 is electrically connected with the other end of flexible circuit board 134, and second circuit board 700, which is equipped with to be suitable for cooperating with the first connector 135, to be connected
The second connector 710 connect.The information that sensor module 131 detects as a result, can be transferred to second by flexible circuit board 134
Circuit board 700.Second circuit board 700 can be equipped with controller, and controller can store the detection information of sensor module 131.
According to the inertial measurement cluster 10 of the utility model embodiment, by will at least partly first circuit board 130 tilt
It is arranged, the sensor module 131 on first circuit board 130 can be tilted with horizontal plane, and the vibration on vertical direction can share
Onto three directions of the three-dimensional coordinate on the basis of 130 top incline of first circuit board, so as to avoid on vertical direction
Vibration completely, individually influence sensor module 131 detect vertical direction on kinematic parameter, only part vibration component meeting
The kinematic parameter on vertical direction that the sensor module that is added to 131 detects, so as to be effectively reduced vibration to sensor
The influence of detection accuracy on 131 vertical direction of module, and then the service performance of sensor module 100 can be improved, it can also mention
The measuring range of high sensor module 100.
In addition, first can be buffered by the first bolster 500 of setting and the second bolster 600, the first bolster 500
Movement between frame 200 and sensor module 100, the second bolster 600 can buffer second support 300 and sensor module
Movement between 100, so as to improve the damping performance of inertial measurement cluster 10, reduce sensor module 100 in outer masterpiece
With the probability of lower shaking, and then the detection accuracy of sensor module 100 can be improved.In addition, first support 200 and second support
300 construction can be in order to the installation of sensor module 100.
Some embodiments according to the present utility model, the first bolster 500 can be damping cotton, and the second bolster 600 can
Think damping cotton.First bolster 500 can be Nian Jie with sensor module 100, and the second bolster 600 can be with sensor module
100 bondings.For example, the first bolster 500 can be Nian Jie with sensor module 100 by double-sided adhesive, the second bolster 600 can be with
It is Nian Jie with sensor module 100 by double-sided adhesive.First bolster 500 can be Nian Jie with first support 200, the second bolster
600 can be Nian Jie with second support 300.For example, the first bolster 500 can be Nian Jie with first support 200 by double-sided adhesive, the
Two bolsters 600 can be Nian Jie with second support 300 by double-sided adhesive.In some embodiments of the utility model, first is slow
Stamping 500 can in a ring, and the second bolster 600 can be in a ring.
As shown in figure 3, some embodiments according to the present utility model, inertial measurement cluster 10 can also include multiple intervals
One end of the support column 400 of arrangement, support column 400 is connect with first support 200, the other end and second support of support column 400
300 connections.It should be noted that " multiple " mentioned herein are two and more than two meanings, for example, support column 400
It can be four, four support columns 400 are intervally arranged.It can be by first support 200 and second by four support columns 400 of setting
Bracket 300 is spaced apart, to limit the installation cavity for installing sensor module 100.
As shown in figure 3, one end and the first support 200 of support column 400 pass through in some embodiments of the utility model
Threaded fastener connection, the other end of support column 400 are connect with second support 300 by threaded fastener, second circuit board 700
It is connect with second support 300 by threaded fastener.For example, first support 200 can be equipped with the first threaded hole, one of spiral shell
Line fastener can be cooperatively connected with the first threaded hole, and second support 300 can be equipped with the second threaded hole, another screw threads for fastening
Part can be cooperatively connected with the second threaded hole.Thus, it is possible to be convenient for the assembly and disassembly of inertial measurement cluster 10.It is practical new at this
In some embodiments of type, the first connector 135 and the second connector 710 can be with grafting.
As shown in figure 4, according to the mobile device 1 of the utility model embodiment, including inertial measurement cluster as described above
10。
According to the mobile device 1 of the utility model embodiment, by will at least partly first circuit board 130 be obliquely installed,
Sensor module 131 on first circuit board 130 can be tilted with horizontal plane, and the vibration on vertical direction can share with
On three directions of the three-dimensional coordinate on the basis of one circuit board, 130 top incline, so as to avoid the vibration on vertical direction
Completely, the kinematic parameter on the vertical direction that sensor module 131 detects individually is influenced, only part vibration component can be added to
The kinematic parameter on vertical direction that sensor module 131 detects, so as to be effectively reduced vibration to sensor module 131
The influence of detection accuracy on vertical direction, and then the service performance of sensor module 100 can be improved, sensor can also be improved
The measuring range of component 100, and by setting the first bolster 500 and the second bolster 600, the first bolster 500 can be with
The movement between first support 200 and sensor module 100 is buffered, the second bolster 600 can buffer second support 300 and pass
Movement between sensor component 100, so as to improve the damping performance of inertial measurement cluster 10, reduce sensor module 100
The probability shaken under external force, and then the detection accuracy of sensor module 100 can be improved.In addition, first support 200 with
The construction of second support 300 can be in order to the installation of sensor module 100.
Some embodiments according to the present utility model, mobile device 1 can be unmanned vehicle, aircraft, robot etc..
In the description of the present invention, it should be understood that term " first ", " second " are used for description purposes only, and
It cannot be understood as indicating or implying relative importance or implicitly indicate the quantity of indicated technical characteristic.It defines as a result,
The feature of " first ", " second " can explicitly or implicitly include one or more of the features.In the utility model
In description, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected, can also be communication；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, the connection inside two elements or the interaction relationship of two elements be can be.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combination and combination.
While there has been shown and described that the embodiments of the present invention, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principles of the present invention and objective
And modification, the scope of the utility model are defined by the claims and their equivalents.
Claims (12)
1. a kind of sensor module characterized by comprising
First fixing piece；
Second fixing piece, second fixing piece are connect with first fixing piece, and second fixing piece is solid with described first
It is opposite and spaced apart to limit installation space to determine part；
First circuit board equipped at least one sensor module, the first circuit board are set to the installation space, and described the
One circuit board is fixedly connected at least one of first fixing piece and second fixing piece, the first circuit board
At least partly not parallel with horizontal plane and out of plumb.
2. sensor module according to claim 1, which is characterized in that on the first direction of the first circuit board,
The first circuit board has opposite first end and second end,
On from the first end to the direction of the second end, the first circuit board tilts in a second direction,
The first direction is parallel with the horizontal plane, the second direction and the horizontal plane.
3. sensor module according to claim 2, which is characterized in that first fixing piece includes first surface, institute
First surface is stated to be located in the installation space,
The first surface is parallel with the first circuit board.
4. sensor module according to claim 3, which is characterized in that first fixing piece includes second surface, institute
It is opposite with the first surface to state second surface, and the second surface is located at outside the installation space, the second surface with
The horizontal plane is parallel.
5. sensor module according to claim 2, which is characterized in that second fixing piece includes third surface, institute
Third surface is stated to be located in the installation space,
The third surface is parallel with the first circuit board.
6. sensor module according to claim 5, which is characterized in that second fixing piece includes the 4th surface, institute
It is opposite with the third surface to state the 4th surface, and the 4th surface is located at outside the installation space, the 4th surface with
The horizontal plane is parallel.
7. sensor module according to claim 1, which is characterized in that further include fastener；
First fixing piece has the first mounting hole, and second fixing piece has the second mounting hole, and the fastener is worn
In first mounting hole and second mounting hole.
8. sensor module according to claim 7, which is characterized in that first fixing piece is fixed towards described second
The side of part is equipped with the first mounting post；
Second fixing piece towards the side of first fixing piece be equipped with the second mounting post, second mounting post with it is described
First mounting post is opposite；
The first circuit board is located between first mounting post and second mounting post.
9. sensor module according to claim 8, which is characterized in that first mounting hole is set to first installation
Column and run through first mounting post and the first fixing piece, second mounting hole is set to second fixing piece and through described
Second mounting post and the second fixing piece；
The first circuit board is equipped with third mounting hole, and the fastener is successively arranged in first mounting hole, the third
Mounting hole and second mounting hole.
10. sensor module according to claim 9, which is characterized in that the free end of second mounting post is equipped with convex
It rises, second mounting hole runs through the protrusion, and the protrusion is suitable for being arranged in the third mounting hole.
11. a kind of inertial measurement cluster characterized by comprising
First support；
Second support, the second support are connect with the first support, the second support it is opposite with the first support and
It is intervally arranged；
Sensor module, the sensor module are the sensor module according to any one of claim 1-10, institute
Sensor module is stated between the first support and the second support, the sensor module include flexible circuit board and
First connector, one end of the flexible circuit board are electrically connected with the first circuit board, the other end of the flexible circuit board
Outside the installation space, first connector is electrically connected with the other end of the flexible circuit board；
First bolster, first bolster is between the sensor module and the first support；
Second bolster, second bolster is between the sensor module and the second support；
Second circuit board, the second circuit board are connect with the second support, the second circuit board and the sensor group
Part is located at the two sides of the second support, and the second circuit board is electrically connected with the first circuit board, the second circuit board
Equipped with the second connector for being suitable for being cooperatively connected with first connector.
12. a kind of mobile device, which is characterized in that including inertial measurement cluster according to claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920108784.8U CN209296007U (en) | 2019-01-22 | 2019-01-22 | Sensor module, inertial measurement cluster and mobile device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920108784.8U CN209296007U (en) | 2019-01-22 | 2019-01-22 | Sensor module, inertial measurement cluster and mobile device |
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| CN209296007U true CN209296007U (en) | 2019-08-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109596141A (en) * | 2019-01-22 | 2019-04-09 | 广州极飞科技有限公司 | Sensor module, inertial measurement cluster and mobile device |
| CN114754808A (en) * | 2021-01-08 | 2022-07-15 | 精工爱普生株式会社 | Inertial measurement unit |
-
2019
- 2019-01-22 CN CN201920108784.8U patent/CN209296007U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109596141A (en) * | 2019-01-22 | 2019-04-09 | 广州极飞科技有限公司 | Sensor module, inertial measurement cluster and mobile device |
| CN114754808A (en) * | 2021-01-08 | 2022-07-15 | 精工爱普生株式会社 | Inertial measurement unit |
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Address after: 510000 Block C, 115 Gaopu Road, Tianhe District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Jifei Technology Co.,Ltd. Address before: 510000 Block C, 115 Gaopu Road, Tianhe District, Guangzhou City, Guangdong Province Patentee before: Guangzhou Xaircraft Technology Co.,Ltd. |