CN209294814U - A kind of LED component and lighting device - Google Patents
A kind of LED component and lighting device Download PDFInfo
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- CN209294814U CN209294814U CN201821839975.3U CN201821839975U CN209294814U CN 209294814 U CN209294814 U CN 209294814U CN 201821839975 U CN201821839975 U CN 201821839975U CN 209294814 U CN209294814 U CN 209294814U
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Abstract
The utility model discloses a kind of LED components, including LED light source component, heat-conducting layer and radiator；The heat-conducting layer and the LED light source component can realize heat transfer；The heat-conducting layer and the radiator can realize heat transfer；The connection type of the heat-conducting layer and adjacent structure is to be welded to connect.The utility model is by welding linked together the LED light emitting device of the LED component and radiator by heat-conducting layer, it ensure that coming into full contact between adjacent heterogeneous interface, reach being effectively conducted for heat, compare the prior art, increase significantly thermal coefficient, simultaneously, using welding instead can solve the problems, such as that adjacent heterogeneous interface caused by inevitable error cannot be in close contact during installing heat-conducting glue or heat-conducting pad in the prior art, improve the yields and service life of LED component from production process.The utility model provides a kind of lighting device with above-mentioned beneficial effect simultaneously.
Description
Technical field
The utility model relates to LED light emitting device fields, more particularly to a kind of LED component and lighting device.
Background technique
With the development of science and technology, LED light in more and more occasions instead of traditional incandescent lamp and neon lamp, with incandescent lamp
Bubble is compared with neon lamp, and the characteristics of light emitting diode is: operating voltage is very low (some more several volts)；Operating current very little (has
Several milliamperes of only zero point can shine)；Shock resistance and anti-seismic performance are good, high reliablity, and the service life is long；By modulating the electric current passed through
Power modulates luminous power in which can be convenient.Due to there is these features, light emitting diode be applied to it is more and more, it is more next
More extensive occasion is used as Signal Monitor in many electronic equipments as being used as light source in some photoelectric control equipments.Its
In, the heat dissipation of LED is always one of the critical bottleneck of LED technology.
Currently, LED light source component mainly passes through heat-conducting glue or heat-conducting pad sometimes for by plastics tabletting and lamps and lanterns
Radiator combine, the thermal coefficient of heat-conducting glue and heat-conducting pad mainly divides 1-8W etc., and the capacity of heat transmission is extremely limited, and when
The depth that the normal screw that will appear tabletting is not locked jail or opened is too deep, and there are gaps when initiation LED component and radiator, does not have
There is fitting, and then cause heat that can not effectively and timely reach following radiator, finally causes dead lamp, glue is split, this problem one
The normal use of terminal illumination client is directly annoying, client often complains dead lamp, and final analysis is all because of LED component and heat dissipation
Caused by not posted between device.Therefore, solve because caused by error inevitable in installation process LED light source component with it is scattered
Hot device connection is not closely that technical staff compels highly necessary to solve the problems, such as in field.
Summary of the invention
The purpose of the utility model is to provide a kind of LED component and lighting devices, to solve LED light source device in the prior art
Part connect untight problem with radiator.
In order to solve the above technical problems, the utility model provides a kind of LED component, comprising:
LED light source component, heat-conducting layer and radiator；
The heat-conducting layer and the LED light source component can realize heat transfer；
The heat-conducting layer and the radiator can realize heat transfer；
The connection type of the heat-conducting layer and adjacent structure is to be welded to connect.
Optionally, in above-mentioned LED component, the heat-conducting layer is metal tin layers；
The LED component further includes the first metal attachment layer, the connection of first metal attachment layer and the heat-conducting layer
Mode is to be welded to connect；
First metal attachment layer and the radiator connect.
Optionally, in above-mentioned LED component, the substrate of the LED light source component is ceramic substrate or aluminum substrate.
Optionally, in above-mentioned LED component, when the substrate of the LED light source component is aluminum substrate, the LED component
It further include the second metal attachment layer,
The connection type of second metal attachment layer and the heat-conducting layer is to be welded to connect；
Second metal attachment layer and the substrate of the LED light source component connect.
Optionally, in above-mentioned LED component, first metal attachment layer and second metal attachment layer are metallic nickel
Layer.
Optionally, in above-mentioned LED component, the thickness model of first metal attachment layer and second metal attachment layer
It encloses for 13 microns to 20 microns, including endpoint value.
Optionally, in above-mentioned LED component, the thickness range of the heat-conducting layer is 0.5 millimeter to 1.0 millimeters, including end
Point value.
Optionally, in above-mentioned LED component, the heat-conducting layer is connected to the opposite of the light-emitting surface of the LED light source component
Surface.
The utility model additionally provides a kind of lighting device, and the lighting device includes LED device described in any of the above-described kind
Part.
LED component provided by the utility model, including LED light source component, heat-conducting layer and radiator；The heat-conducting layer with
The LED light source component can realize heat transfer；The heat-conducting layer and the radiator can realize heat transfer；The heat-conducting layer and phase
The connection type of adjacent structure is to be welded to connect.The utility model is by welding by the LED light emitting device of the LED component
It is linked together with radiator by heat-conducting layer, ensure that coming into full contact between adjacent heterogeneous interface, reach being effectively conducted for heat,
The prior art is compared, increase significantly thermal coefficient, meanwhile, using welding instead can solve pacifying in the prior art from production process
The problem of adjacent heterogeneous interface caused by inevitable error cannot be in close contact during dress heat-conducting glue or heat-conducting pad,
Improve the yields and service life of LED component.
Detailed description of the invention
For the clearer technical solution for illustrating the utility model embodiment or the prior art, below will to embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of LED component in the prior art；
Fig. 2 is a kind of structural schematic diagram of specific embodiment of LED component provided by the utility model；
Fig. 3 is the structural schematic diagram of another specific embodiment of LED component provided by the utility model.
Specific embodiment
Heat concentrates in small-sized LED light emitting device, and LED light emitting device temperature increases, and causes the non-of thermal stress
It is uniformly distributed, the decline of chip light emitting efficiency and phosphor powder lasing efficiency；When temperature is more than certain value, component failure rate is exponentially
Rule increases.Statistics shows every 2 DEG C of the rising of component temperature, reliability decrease 10%.When multiple LED dense arrangements form
When white lumination system, the dissipation issues of heat are more serious.It solves thermal management issues and has become the prerequisite of high-brightness LED application
Condition.So if LED cannot radiate very well, its service life also can seriously be affected.
The structural schematic diagram of LED component in the prior art is as shown in Figure 1, include radiator 01, heat conductive pad 02, LED hair
Optical device 03 and immobilising device 04 (being illustrated as screw and respective gasket), the prior art in assembly often due to inevitably missing
Vibration in difference or use process causes immobilising device 04 to loosen, and then makes poor contact between structure, cause heat be difficult to from
It is propagated outward in LED light emitting device 03, influences the working efficiency and service life of LED component.
In order to make those skilled in the art better understand the scheme of the utility model, with reference to the accompanying drawing and specific implementation
The utility model is described in further detail for mode.Obviously, described embodiment is only the utility model a part
Embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, fall within the protection scope of the utility model.
The core of the utility model is to provide a kind of LED component, the structural schematic diagram of specific embodiment one such as Fig. 2 institute
Show, comprising:
LED light source component 103, heat-conducting layer 102 and radiator 101；
The heat-conducting layer 102 can realize heat transfer with the LED light source component 103；
The heat-conducting layer 102 can realize heat transfer with the radiator 101；
The connection type of the heat-conducting layer 102 and adjacent structure is to be welded to connect.
Further, the substrate of above-mentioned LED light source component 103 is ceramic substrate or aluminum substrate.Aforesaid substrate, that is, LED light
The junction of substrate and above-mentioned LED light source component 103 and adjacent structure where source device 103.
Above-mentioned radiator 101 can be active heat sink 101, can also be passive radiator 101, such as metal fins such as fan.
Further, above-mentioned welding manner can be that Reflow Soldering occurs due to the needs that electronic product is increasingly miniaturized
Chip component, traditional welding method cannot be met the needs of, therefore reflow soldering process just comes into being, specifically, by empty
Gas or nitrogen are heated to sufficiently high temperature after-blow to the wiring board for having posted element, after allowing the solder of elements on either side to melt with
Mainboard bonding.The advantage of this technique is that temperature is easily controllable, and oxidation is also avoided that in welding process, and manufacturing cost is also easier to
Control.
LED component provided by the utility model, including LED light source component 103, heat-conducting layer 102 and radiator 101；Institute
Heat transfer can be realized by stating heat-conducting layer 102 and the LED light source component 103；The heat-conducting layer 102 can be real with the radiator 101
Existing heat transfer；The connection type of the heat-conducting layer 102 and adjacent structure is to be welded to connect.The utility model is by welding
The LED light emitting device of the LED component is linked together with radiator 101 by heat-conducting layer 102, ensure that adjacent heterogeneous boundary
Coming into full contact between face reaches being effectively conducted for heat, compares the prior art, increase significantly thermal coefficient, meanwhile, use welding instead
It can be solved from production process in the prior art installing heat-conducting glue or inevitably error causes during heat-conducting pad
Adjacent heterogeneous interface the problem of cannot being in close contact, improve the yields and service life of LED component.
On the basis of above-mentioned specific embodiment, each structure material is further limited, and increase corresponding construction, had
Body embodiment two, structural schematic diagram is as shown in Figure 3, comprising:
LED light source component 103, heat-conducting layer 102 and radiator 101；
The heat-conducting layer 102 can realize heat transfer with the LED light source component 103；
The heat-conducting layer 102 can realize heat transfer with the radiator 101；
The heat-conducting layer 102 is metal tin layers；
The LED component further includes the first metal attachment layer 104, first metal attachment layer 104 and the heat-conducting layer
102 connection type is to be welded to connect；
First metal attachment layer 104 is connected with the radiator 101.
Present embodiment and above-mentioned specific embodiment the difference is that, present embodiment defines portion
The material of separation structure, and it is added to new construction, structure in addition to this is identical as above-mentioned embodiment, not reinflated superfluous herein
It states.
Further, above-mentioned first metal attachment layer 104 is metal nickel layer.
The substrate of above-mentioned LED light source component 103 is ceramic substrate or aluminum substrate, when the substrate of above-mentioned LED light source component 103
When for aluminum substrate, above-mentioned LED component further includes the second metal attachment layer, above-mentioned second metal attachment layer and above-mentioned heat-conducting layer 102
Connection type be welded to connect；Above-mentioned second metal attachment layer and the substrate of above-mentioned LED light source component 103 connect.
The thickness range of above-mentioned first metal attachment layer 104 and second metal attachment layer is 13 microns to 20 microns,
Including endpoint value, such as any of 13.0 microns, 15.8 microns or 20.0 microns.
The thickness range of above-mentioned heat-conducting layer 102 is 0.5 millimeter to 1.0 millimeters, including endpoint value, such as 0.50 millimeter, 0.65
Millimeter or any of 1.00 millimeters.
In the prior art, the part that radiator 101 is in contact with adjacent structure is aluminum, and the adhesion property of aluminium surface
Very poor, welding is inconvenient, for this purpose, present embodiment introduces the first metal attachment layer 104, improves adhesion strength, improves product most
Whole yields.Above-mentioned second metal attachment layer acted on above-mentioned first metal attachment layer 104 it is identical, please refer to above, herein not
It is reinflated to repeat.
The utility model has additionally provided a kind of lighting device, which is characterized in that the lighting device includes any of the above-described
Kind LED component.Refer to the prior art for other parts, not reinflated herein to repeat.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
For setting, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part
Explanation.
LED component provided by the utility model and lighting device are described in detail above.It is used herein
Specific case is expounded the principles of the present invention and embodiment, and the explanation of above example is only intended to help to manage
Solve the method and its core concept of the utility model.It should be pointed out that for those skilled in the art, not
Under the premise of being detached from the utility model principle, several improvements and modifications can be made to this utility model, these improve and repair
Decorations are also fallen into the protection scope of the utility model claims.
Claims (7)
1. a kind of LED component characterized by comprising
LED light source component, heat-conducting layer and radiator；
The heat-conducting layer and the LED light source component can realize heat transfer；
The heat-conducting layer and the radiator can realize heat transfer；
The connection type of the heat-conducting layer and adjacent structure is to be welded to connect；
The substrate of the LED light source component is ceramic substrate or aluminum substrate；
When the substrate of the LED light source component is aluminum substrate, the LED component further includes the second metal attachment layer,
The connection type of second metal attachment layer and the heat-conducting layer is to be welded to connect；
Second metal attachment layer and the substrate of the LED light source component connect.
2. LED component as described in claim 1, which is characterized in that the heat-conducting layer is metal tin layers；
The LED component further includes the first metal attachment layer, the connection type of first metal attachment layer and the heat-conducting layer
To be welded to connect；
First metal attachment layer and the radiator connect.
3. LED component as claimed in claim 2, which is characterized in that first metal attachment layer and second metal are attached
Layer be metal nickel layer.
4. LED component as claimed in claim 3, which is characterized in that first metal attachment layer and second metal are attached
The thickness range of layer be 13 microns to 20 microns, including endpoint value.
5. LED component as claimed in claim 4, which is characterized in that the thickness range of the heat-conducting layer is 0.5 millimeter to 1.0
Millimeter, including endpoint value.
6. LED component as described in claim 1, which is characterized in that the heat-conducting layer is connected to going out for the LED light source component
The opposite surface of smooth surface.
7. a kind of lighting device, which is characterized in that the lighting device includes LED device as claimed in any one of claims 1 to 6
Part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821839975.3U CN209294814U (en) | 2018-11-08 | 2018-11-08 | A kind of LED component and lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821839975.3U CN209294814U (en) | 2018-11-08 | 2018-11-08 | A kind of LED component and lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209294814U true CN209294814U (en) | 2019-08-23 |
Family
ID=67648262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821839975.3U Active CN209294814U (en) | 2018-11-08 | 2018-11-08 | A kind of LED component and lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209294814U (en) |
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2018
- 2018-11-08 CN CN201821839975.3U patent/CN209294814U/en active Active
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