CN209283628U - A kind of radiator structure of power discharging device - Google Patents
A kind of radiator structure of power discharging device Download PDFInfo
- Publication number
- CN209283628U CN209283628U CN201821361718.3U CN201821361718U CN209283628U CN 209283628 U CN209283628 U CN 209283628U CN 201821361718 U CN201821361718 U CN 201821361718U CN 209283628 U CN209283628 U CN 209283628U
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- CN
- China
- Prior art keywords
- heat sink
- discharging device
- power discharging
- mainboard
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of radiator structures of power discharging device,, diffusion heat sink and for place power discharging device mainboard heat sink including shell-like body, it is heat sink interior that the mainboard is mounted on the main body, if being placed on the mainboard and being equipped with xeothermic via hole at power discharging device position, the main body is heat sink, and internal correspond to is equipped with radiation rib at power discharging device position, the radiation rib is equipped with fluting, and the fluting is heat sink for accommodating the diffusion, and the diffusion is heat sink to be contacted with the mainboard bottom.The utility model has the characteristics that quickly to reduce the heat flow density of power discharging device and reduces hot localised points.
Description
Technical field
The utility model relates to a kind of radiator structures of power discharging device, belong to power amplifier technical field of heat dissipation.
Background technique
Radio-frequency power amplifier (RFPA) is the major part in emission system, in the front stage circuits of transmitter, modulation
RF signal power very little caused by oscillating circuit needs the ability after a series of amplification obtains enough radio-frequency powers
It is fed on antenna and radiate.In order to obtain sufficiently large radio frequency power output, it is necessary to use radio-frequency power amplifier.Power amplifier
Its size of the demand for development of device is smaller and smaller, so that power density be caused to continue to increase, leads to amplifier in real work
Temperature is significantly raised, and power characteristic receives the limitation of higher device temperature effect, so that actual power characteristic is well below under room temperature
Performance, cause the decline of handling capacity.Therefore, to the heat management of power discharging device be in radiofrequency signal system it is most important be also it is most tired
Difficult task.
Power amplifier is often the minimum device of most expensive, most power consumption, the efficiency of fixed equipment or terminal, effect PAE
It is defined as the difference of output signal power and input signal power and the ratio of DC power supply power consumption, is to measure power discharging device performance
Important indicator.For power amplifying device, temperature raising will lead to power gain decline, saturation output power reduce in addition it is right
Device reliability causes to seriously affect until burning.In order to strengthen the dissipation of power discharging device heat, the chip package side of mostly using
Shape flat no-lead packages (QFN, Quad Flat No-lead Package), are a kind of encapsulation of high heat flux density, hot weld
Disk welds on circuit boards, constitutes direct heat flow path and conducts chip heat into each layers of copper, heat diffusion limited efficacy,
Hot localised points are formed, the reduction of power amplifier high-temperature behavior is caused.However current heat sink conception could not sufficiently by device encapsulation feature and
System authority matches.
Summary of the invention
Technical problem to be solved by the utility model is to provide the heat flow densities that one kind can quickly reduce power discharging device
And reduce the radiator structure of hot localised points.
In order to solve the above technical problems, the technical solution adopted by the utility model is:
A kind of radiator structure of power discharging device, including shell-like body is heat sink, diffusion is heat sink and for placing power discharging device
Mainboard, the mainboard be mounted on the main body it is heat sink in, if on the mainboard place power discharging device position at be equipped with xeothermic mistake
Hole, the main body is heat sink, and internal correspond to is equipped with radiation rib at power discharging device position, and the radiation rib is equipped with fluting, described
Fluting is heat sink for accommodating the diffusion, and the diffusion is heat sink to be contacted with the mainboard bottom.
The diffusion is heat sink to be made of copper or copper alloy.
The main body is heat sink to be made of aluminium alloy.
The fluting and the diffusion it is heat sink between and the diffusion it is heat sink the mainboard between equipped with Heat Conduction Material.
It is described fluting and it is described diffusion it is heat sink between gap filling have heat-conducting silicone grease.
The diffusion is heat sink to be equipped with heat-conducting silicone grease or heat-conducting glue band between the mainboard.
The utility model it is achieved the utility model has the advantages that using the present apparatus radiator structure, will largely can only in existing design
The copper diffusion for being changed to be directly conducted to mainboard bottom surface by hot via hole by the heat that pad is conducted to mainboard is heat sink, then passes
It is heat sink and be dissipated in environment to be directed at main body.The heat flow density of power discharging device can be reduced rapidly using the radiator structure of the present apparatus
And hot localised points are reduced, guarantee its working performance and handling capacity.
Detailed description of the invention
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model section structural schematic diagram and heat dissipation schematic diagram.
Specific embodiment
The utility model is further described with reference to the accompanying drawing.Following embodiment is only used for clearly illustrating this
The technical solution of utility model, and cannot be used as a limitation the limitation protection scope of the utility model.
As shown in Figure 1, placing the power discharging device by 4 same columns on mainboard 3, power discharging device is encapsulated using QFN, and fever is brilliant
Body is placed in exposed pads, and main body is heat sink 1 to be designed as electronic equipment casing shape ADC12 material, and mainboard 3 is fixed by screws in
Main body is heat sink on 1, and power discharging device position is corresponded on mainboard 3 equipped with big calorimetric via hole 31, and main body is heat sink to correspond to power discharging device position on 1
Radiation rib 11 is installed, radiation rib 11 is equipped with fluting, and fluting is for accommodating copper diffusion heat sink 2, fluting 111 and diffusion
Gap filling has heat-conducting silicone grease between heat sink 2, and one layer of heat-conducting silicone grease or heat-conducting glue band are equipped between diffusion heat sink 2 and mainboard 3, can
To improve heat transfer efficiency.
As shown in Fig. 2, using this radiator structure, it is copper that amount of heat by hot via hole 31 is directly conducted to 3 bottom surface of mainboard
Heat sink 2 are spread, then conduct to main body heat sink 1 and is dissipated in environment.Heat sink conception based on the structure can be reduced rapidly
The heat flow density of power discharging device simultaneously reduces hot localised points, guarantees its working performance and handling capacity.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and deformations can also be made, these change
It also should be regarded as the protection scope of the utility model into deformation.
Claims (6)
1. a kind of radiator structure of power discharging device, characterized in that including shell-like body heat sink (1), spread heat sink (2) and be used for
The mainboard (3) of power discharging device is placed, the mainboard (3) is mounted in the main body heat sink (1), places function on the mainboard (3)
If putting and being equipped with xeothermic via hole (31) at device position, heat dissipation is equipped at corresponding power discharging device position inside the main body heat sink (1)
Rib (11), the radiation rib (11) are equipped with fluting, and the fluting is for accommodating the diffusion heat sink (2), the diffusion
Heat sink (2) are contacted with the mainboard (3) bottom.
2. a kind of radiator structure of power discharging device according to claim 1, characterized in that the diffusion heat sink (2) uses
Copper or copper alloy are made.
3. according to claim 1 or a kind of 2 described in any item radiator structures of power discharging device, characterized in that the main body heat
Heavy (1) is made of aluminium alloy.
4. a kind of radiator structure of power discharging device according to claim 1, characterized in that the fluting (111) with it is described
Spread between heat sink (2) and be equipped between diffusion heat sink (2) and the mainboard (3) Heat Conduction Material.
5. a kind of radiator structure of power discharging device according to claim 4, characterized in that the fluting (111) with it is described
Spreading gap filling between heat sink (2) has heat-conducting silicone grease.
6. a kind of radiator structure of power discharging device according to claim 4, characterized in that diffusion heat sink (2) and the institute
It states and is equipped with heat-conducting silicone grease or heat-conducting glue band between mainboard (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821361718.3U CN209283628U (en) | 2018-08-23 | 2018-08-23 | A kind of radiator structure of power discharging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821361718.3U CN209283628U (en) | 2018-08-23 | 2018-08-23 | A kind of radiator structure of power discharging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209283628U true CN209283628U (en) | 2019-08-20 |
Family
ID=67598709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821361718.3U Expired - Fee Related CN209283628U (en) | 2018-08-23 | 2018-08-23 | A kind of radiator structure of power discharging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209283628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116234245A (en) * | 2023-02-07 | 2023-06-06 | 中国科学院国家空间科学中心 | Cold-conducting and heat-dissipating device for ultra-large power consumption electronic components |
-
2018
- 2018-08-23 CN CN201821361718.3U patent/CN209283628U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116234245A (en) * | 2023-02-07 | 2023-06-06 | 中国科学院国家空间科学中心 | Cold-conducting and heat-dissipating device for ultra-large power consumption electronic components |
| CN116234245B (en) * | 2023-02-07 | 2023-09-15 | 中国科学院国家空间科学中心 | Cold-conducting and heat-dissipating device for ultra-large power consumption electronic components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200619 Address after: 215324, No. 2, No. 448 KUNKAI Road, Jinxi Town, Patentee after: KUNSHAN SHEMAO ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: Jinxi town Kunshan city Suzhou City Kunming 215300 Jiangsu province open No. 150 No. 3 Building Patentee before: HONGLICHENG PHOTOELECTRIC SCI&TECH CO.LTDD |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190820 Termination date: 20210823 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |