CN205160475U - Miniature power amplifier - Google Patents
Miniature power amplifier Download PDFInfo
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- CN205160475U CN205160475U CN201521028359.6U CN201521028359U CN205160475U CN 205160475 U CN205160475 U CN 205160475U CN 201521028359 U CN201521028359 U CN 201521028359U CN 205160475 U CN205160475 U CN 205160475U
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Abstract
The utility model provides a miniature power amplifier, include the PCB circuit board that is provided with power amplification circuit, PCB circuit board sets up internally at a metal -back, is equipped with a cavity on the metal casing, and PCB circuit board lies in the cavity, and PCB circuit board seals in the cavity through sealed glue of heat conduction, and it is sealed gluey also to be equipped with heat conduction between PCB circuit board and the metal casing. This power amplifier adopts and seals PCB circuit board at the metal -back internal through sealed glue of heat conduction, makes the PCB circuit board and the metal -back bodily form become a whole, and glue is sealed in heat conduction can play very good prevent salt fog, mould proof, waterproof, dirt -proof effect, even can guarantee also that this power amplifier normally works like this under unusual rugged environment. Adopt sealed glue of metal casing and heat conduction to encapsulate PCB circuit board and can also play very good electromagnetic shield effect simultaneously, can prevent effectively that ambient signal from disturbing, guarantee that power amplification circuit normally works.
Description
Technical field
The utility model relates to a kind of power amplifier, particularly a kind of miniature power amplifier of small volume.
Background technology
Power amplifier is the important component part of a lot of electric equipment, and power amplifier, due to the comparatively large easily heating of its power, therefore equipment often has higher requirement for the heat radiation of power amplifier.Current common power amplifier is all adopt the mode of wind-cooling heat dissipating to cool usually, mainly fan and copper, aluminium radiating fin are combined, heat transfer type is adopted to dispel the heat, in order to good radiating effect can be played, usual needs arrange larger space in the surrounding of radiator fan, the volume of power amplifier will be made like this to become large, but for a lot of electric equipment, often needing the power amplifier using small volume, with regard to needing, the mechanism of power amplifier being redesigned like this.
Chinese utility model patent (the patent No.: 028018400) disclose a kind of portable power amplifier, its structure is the power amplifier having portable external shell, be located at the printed base plate in this external shell and be contained on this printed base plate, arrange the heat-resistant part such as duplexer, antenna near power amplifier to dispel the heat, the volume of power amplifier can be effectively reduced like this.But the heat-resistant part such as duplexer, antenna may not be there is in a lot of electric equipment, therefore this power amplifier mechanism impracticable.
Utility model content
The shortcoming of prior art in view of the above, it is little, lightweight that the purpose of this utility model is to provide a kind of volume, miniature power amplifier easy to carry and use.
For achieving the above object and other relevant objects, the utility model provides a kind of miniature power amplifier, comprise the PCB being provided with power amplification circuit, described PCB is arranged in a metal shell, described metal shell is provided with a cavity caved inward, described PCB is positioned at described cavity, described PCB is enclosed in described cavity by conduction heat sealable glue, also be provided with conduction heat sealable glue between described PCB and described metal shell, described metal shell is provided with Wiring port.
Preferably, described PCB is provided with metal-oxide-semiconductor, is provided with metal-oxide-semiconductor cooling platform in described cavity, and described metal-oxide-semiconductor cooling platform is corresponding with the metal-oxide-semiconductor position in described PCB, and described metal-oxide-semiconductor contacts with described metal-oxide-semiconductor cooling platform.
Preferably, described PCB is provided with transformer, is provided with magnetic core cooling platform in described cavity, and described magnetic core cooling platform is corresponding with the magnetic core position of transformer in described PCB, and described magnetic core contacts with described magnetic core cooling platform.
Preferably, described PCB is provided with integrated circuit (IC) chip, heat dissipation of integrated circuit chip platform is also had in described cavity, described heat dissipation of integrated circuit chip platform is corresponding with integrated circuit (IC) chip position in described PCB, described integrated circuit (IC) chip and described heat dissipation of integrated circuit chip contact with platform.
Preferably, described PCB is provided with diode, is also provided with diode groove in described cavity, and described diode groove is corresponding with the diode location in described PCB, and described diode is positioned at described diode groove.
Preferably, described metal shell is Al-alloy casing, and described metal-oxide-semiconductor cooling platform, magnetic core cooling platform, heat dissipation of integrated circuit chip platform and described Al-alloy casing are formed in one structure.
Preferably, the two ends of described metal shell are provided with radiating fin.
As mentioned above, miniature power amplifier of the present utility model has following beneficial effect: this power amplifier adopts and is enclosed in metal shell by conduction heat sealable glue by PCB, PCB and metal shell is made to form an entirety, conduction heat sealable glue can play the effect of extraordinary Defend salt fog, mould proof, waterproof and dustproof, even if also can ensure that this power amplifier normally works like this under the environment of very severe.Adopt metal shell and conduction heat sealable glue to encapsulate PCB simultaneously and can also play extraordinary effectiveness, can effectively prevent outer signals from disturbing, guaranteed output amplifying circuit normally works.This power amplifier adopts modularized design, and compare this miniature power amplifier also to have volume little, lightweight with the power amplifier of routine, is easy to carry and the advantage such as replacing, can significantly improves the operating efficiency of power amplifier.
Accompanying drawing explanation
Fig. 1 is the front view of the metal shell of the utility model embodiment.
Fig. 2 is that the A-A of Fig. 1 is to cutaway view.
Fig. 3 is the end view of the utility model embodiment metal shell.
Element numbers explanation
1, metal shell 2, cavity 3, metal-oxide-semiconductor cooling platform 4, magnetic core cooling platform 5, support platform 6, diode groove 7, heat dissipation of integrated circuit chip platform 8, radiating fin 9, screw hole 10, Wiring port.
Embodiment
By particular specific embodiment, execution mode of the present utility model is described below, person skilled in the art scholar the content disclosed by this specification can understand other advantages of the present utility model and effect easily.
Refer to Fig. 1 to Fig. 3.Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, still all should drop on technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the utility model.
As shown in Figures 1 to 3, the utility model provides a kind of miniature power amplifier, and it comprises a metal shell 1, and metal shell 1 adopts Al-alloy casing, adopt this housing to have quality is light, easy to process, thermal diffusivity is good advantage.Metal shell 1 is provided with Wiring port 10, can connection PCB circuit board and external cable by Wiring port 10.In metal shell 1, be provided with a cavity caved inward 2, cavity 2 is provided with the PCB of power amplification circuit for placing, PCB is fixed in cavity 2 by screw.The opening part of cavity 2 and between PCB and metal shell 1 equal embedding have conduction heat sealable glue.At the opening part of cavity 2, conduction heat sealable glue is completely closed by the opening of cavity 2, and the lead-in wire in PCB outwards can be drawn through conduction heat sealable glue.Whole like this PCB will be completely enclosed within metal shell 1, any contact can not be had with the external world, can make to make PCB to have the effect of good Defend salt fog, mould proof, waterproof and dustproof, even if also can ensure that under the environment of very severe the power amplification circuit in PCB normally works like this.By conduction heat sealable glue PCB is encapsulated in metal shell and can also plays extraordinary effectiveness, can effectively prevent outer signals from disturbing.
The structure of this power amplification circuit can change to some extent according to application scenario, as long as the circuit that can realize power amplification function is all within the protection range of this patent.General power amplification circuit all comprises the components and parts such as metal-oxide-semiconductor, transformer, integrated circuit (IC) chip and diode, in the process of power amplifier work, metal-oxide-semiconductor in circuit, the magnetic core of transformer, integrated circuit (IC) chip are all the components and parts that caloric value is larger, in order to better heat-conducting effect can be played to these components and parts, in cavity 2, be provided with metal-oxide-semiconductor cooling platform 3, magnetic core cooling platform 4 and heat dissipation of integrated circuit chip platform 7.Metal-oxide-semiconductor cooling platform 3 is corresponding with the metal-oxide-semiconductor position in PCB, and metal-oxide-semiconductor contacts with metal-oxide-semiconductor cooling platform.Magnetic core cooling platform 4 is corresponding with the magnetic core position of transformer in PCB, and magnetic core contacts with magnetic core cooling platform.Heat dissipation of integrated circuit chip platform 7 is corresponding with integrated circuit (IC) chip position in PCB, integrated circuit (IC) chip 7 and heat dissipation of integrated circuit chip contact with platform.Effectively can improve metal-oxide-semiconductor, the magnetic core of transformer, the radiating effect of integrated circuit (IC) chip by this set, guaranteed output amplifying circuit can work long hours.In cavity 2, be also provided with diode groove 6, diode groove 6 is corresponding with the diode location in PCB, and diode is positioned at diode groove 6.The volume of whole power amplifier can be reduced so to a certain extent, simultaneously the also advantageously heat radiation of diode in circuit.
In order to play better radiating effect, a support platform 5 is also provided with at the middle part of cavity, support platform 5 is provided with screwed hole 9, the middle part of PCB is provided with the through hole corresponding with screwed hole 9 position, by screw, the middle part of PCB is connected with support platform 5 like this, can ensure that above-mentioned each components and parts are more tight with the contact of various corresponding cooling platform like this, and then improve radiating effect.Metal-oxide-semiconductor cooling platform 3, magnetic core cooling platform 4, heat dissipation of integrated circuit chip platform 7 can be set to integrated formed structure with Al-alloy casing 1, and it is more convenient to process like this, and radiating effect is better.In order to better radiating effect can be played, radiating fin 8 can also be set at the two ends of metal shell 1.
This power amplifier adopts and is enclosed in metal shell by conduction heat sealable glue by PCB, PCB and metal shell is made to form an entirety, conduction heat sealable glue can play the effect of extraordinary Defend salt fog, mould proof, waterproof and dustproof, even if also can ensure that this power amplifier normally works like this under the environment of very severe.Adopt metal shell and conduction heat sealable glue to encapsulate PCB simultaneously and can also play extraordinary effectiveness, can effectively prevent outer signals from disturbing, guaranteed output amplifying circuit normally works.This power amplifier adopts modularized design, and compare this miniature power amplifier also to have volume little, lightweight with the power amplifier of routine, is easy to carry and the advantage such as replacing, can significantly improves the operating efficiency of power amplifier.So the utility model effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative structure of the present utility model only, principle and effect thereof, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (7)
1. a miniature power amplifier, comprise the PCB being provided with power amplification circuit, it is characterized in that: described PCB is arranged in a metal shell, described metal shell is provided with a cavity caved inward, described PCB is positioned at described cavity, described PCB is enclosed in described cavity by conduction heat sealable glue, is also provided with conduction heat sealable glue between described PCB and described metal shell, and described metal shell is provided with Wiring port.
2. miniature power amplifier according to claim 1, it is characterized in that: described PCB is provided with metal-oxide-semiconductor, metal-oxide-semiconductor cooling platform is provided with in described cavity, described metal-oxide-semiconductor cooling platform is corresponding with the metal-oxide-semiconductor position in described PCB, and described metal-oxide-semiconductor contacts with described metal-oxide-semiconductor cooling platform.
3. miniature power amplifier according to claim 2, it is characterized in that: described PCB is provided with transformer, magnetic core cooling platform is provided with in described cavity, described magnetic core cooling platform is corresponding with the magnetic core position of transformer in described PCB, and described magnetic core contacts with described magnetic core cooling platform.
4. miniature power amplifier according to claim 3, it is characterized in that: described PCB is provided with integrated circuit (IC) chip, heat dissipation of integrated circuit chip platform is also had in described cavity, described heat dissipation of integrated circuit chip platform is corresponding with integrated circuit (IC) chip position in described PCB, described integrated circuit (IC) chip and described heat dissipation of integrated circuit chip contact with platform.
5. miniature power amplifier according to claim 4, it is characterized in that: described PCB is provided with diode, also be provided with diode groove in described cavity, described diode groove is corresponding with the diode location in described PCB, and described diode is positioned at described diode groove.
6. miniature power amplifier according to claim 4, is characterized in that: described metal shell is Al-alloy casing, and described metal-oxide-semiconductor cooling platform, magnetic core cooling platform, heat dissipation of integrated circuit chip platform and described Al-alloy casing are formed in one structure.
7. the miniature power amplifier according to claim 1 to 6 any one claim, is characterized in that: the two ends of described metal shell are provided with radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521028359.6U CN205160475U (en) | 2015-12-10 | 2015-12-10 | Miniature power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521028359.6U CN205160475U (en) | 2015-12-10 | 2015-12-10 | Miniature power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205160475U true CN205160475U (en) | 2016-04-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521028359.6U Active CN205160475U (en) | 2015-12-10 | 2015-12-10 | Miniature power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205160475U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952881A (en) * | 2017-03-15 | 2017-07-14 | 北京北广科技股份有限公司 | Water-cooled power combiner for high power solid state power amplifier |
| CN110996606A (en) * | 2020-01-06 | 2020-04-10 | 西安电掣风云智能科技有限公司 | Anti-interference integrated heat dissipation capacitor module and preparation method thereof |
| CN111182756A (en) * | 2020-02-21 | 2020-05-19 | 海盐新跃电器有限公司 | Energy-saving power amplifier |
| CN113835305A (en) * | 2021-09-22 | 2021-12-24 | 哈尔滨工业大学 | Cooling device for circuit board of photoetching machine |
-
2015
- 2015-12-10 CN CN201521028359.6U patent/CN205160475U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952881A (en) * | 2017-03-15 | 2017-07-14 | 北京北广科技股份有限公司 | Water-cooled power combiner for high power solid state power amplifier |
| CN110996606A (en) * | 2020-01-06 | 2020-04-10 | 西安电掣风云智能科技有限公司 | Anti-interference integrated heat dissipation capacitor module and preparation method thereof |
| CN111182756A (en) * | 2020-02-21 | 2020-05-19 | 海盐新跃电器有限公司 | Energy-saving power amplifier |
| CN111182756B (en) * | 2020-02-21 | 2021-01-01 | 海盐新跃电器有限公司 | Energy-saving power amplifier |
| CN113835305A (en) * | 2021-09-22 | 2021-12-24 | 哈尔滨工业大学 | Cooling device for circuit board of photoetching machine |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |