CN209246968U - A kind of silicium wafer flatness detecting device - Google Patents
A kind of silicium wafer flatness detecting device Download PDFInfo
- Publication number
- CN209246968U CN209246968U CN201920120711.0U CN201920120711U CN209246968U CN 209246968 U CN209246968 U CN 209246968U CN 201920120711 U CN201920120711 U CN 201920120711U CN 209246968 U CN209246968 U CN 209246968U
- Authority
- CN
- China
- Prior art keywords
- laser range
- electric machine
- negative pressure
- rotating electric
- silicium wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of silicium wafer flatness detecting devices, vertical beam is fixed on wherein a side of substrate, rotating electric machine is installed on the top of substrate, suction tray is installed on the output end of rotating electric machine, controller is installed on the upper end of vertical beam, multiple laser range sensors are spaced apart the lower part for being set to vertical beam, and suction tray is connected to negative pressure pump by connecting tube, and negative pressure pump, rotating electric machine and multiple laser range sensors are electrically connected to the controller.The utility model is the utility model has the advantages that the utility model rotating electric machine is used for Rotary adsorption disk, negative pressure pump provides negative pressure for silicium wafer to be sucked for suction tray, laser range sensor is for detecting laser range sensor to the distance between silicium wafer, by the distance between different laser range sensors to silicium wafer, whether same analysis silicium wafer is smooth, controller controls rotating electric machine, negative pressure pump and the work of multiple laser range sensors, improves working efficiency and effect.
Description
Technical field
The utility model relates to electronic component technology field, especially a kind of silicium wafer flatness detecting device.
Background technique
Silicium wafer is the important materials for making integrated circuit, can be with by carrying out photoetching, the means such as ion implanting to silicon wafer
Various semiconductor devices are made, there is surprising operational capability using chip made of silicon wafer, scientific and technical development constantly pushes away
The development of the technologies such as semiconductor, automation and computer is moved, silicon wafer is very widely used, is related to aerospace, industry, agriculture
The multiple fields such as industry and national defence.
The complex manufacturing technology of silicium wafer, it is higher to its quality requirement, it needs to grind in manufacturing process, that is, after the completion of grinding
It needs to detect silicium wafer flatness, silicium wafer surface irregularity will affect the processing quality of silicium wafer.
Therefore, it is necessary to propose a kind of silicium wafer flatness detecting device in response to the above problems.
Utility model content
In view of the above-mentioned deficiencies in the prior art, the purpose of this utility model is to provide a kind of silicium wafer flatness
Detection device.
A kind of silicium wafer flatness detecting device, including substrate, rotating electric machine, vertical beam, controller, suction tray, negative pressure pump
With multiple laser range sensors, the vertical beam is fixed on wherein a side of the substrate, and the rotating electric machine is installed on institute
The top of substrate is stated, the suction tray is installed on the output end of the rotating electric machine, and the controller is installed on the vertical beam
Upper end, multiple laser range sensors are spaced apart the lower part for being set to the vertical beam, and the suction tray passes through connecting tube
It is connected to the negative pressure pump, the negative pressure pump, rotating electric machine and multiple laser range sensors are electrically connected to the controller.
Compared with prior art, the utility model is the utility model has the advantages that the utility model is provided with rotating electric machine, vertical beam, control
Device, suction tray, negative pressure pump and multiple laser range sensors, rotating electric machine are used for Rotary adsorption disk, and negative pressure pump mentions for suction tray
For negative pressure for being sucked silicium wafer, laser range sensor for detecting laser range sensor to the distance between silicium wafer,
By the distance between different laser range sensors to silicium wafer, whether same analysis silicium wafer is smooth, controller control
Rotating electric machine, negative pressure pump and the work of multiple laser range sensors, improve working efficiency and effect.
Preferably, the front end face of the controller setting is provided with liquid crystal touch display screen.
Using preferably technical solution the utility model has the advantages that liquid crystal touch display screen can show relevant parameter, touching in addition can be passed through
Touch screen input instruction.
Preferably, the negative pressure pump is installed on the substrate.
Preferably, the upper end of the suction tray is provided with suction disc, and the suction disc is made of rubber material.
Using preferably technical solution the utility model has the advantages that suction disc is for being sucked silicium wafer, rubber material elasticity is preferably.
Preferably, there are three the laser range sensor settings.
Using preferably technical solution the utility model has the advantages that multiple laser range sensors can detect the distance of different location, into
And analyze the flatness of silicium wafer.
Detailed description of the invention
Fig. 1 is silicium wafer flatness detecting device structure chart provided by the utility model；
Fig. 2 is the top view of the utility model.
Appended drawing reference in figure: 1, substrate；2, vertical beam；3, rotating electric machine；4, laser range sensor；5, controller；6, liquid
Brilliant touch display screen；7, suction tray；8, adsorption plate；9, negative pressure pump；10, silicium wafer.
Specific embodiment
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can
To be combined with each other.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.In addition, term " first ", " second " etc. are used for description purposes only, and should not be understood as indicating
Or it implies relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second " etc. are defined as a result,
Feature can explicitly or implicitly include one or more of the features.It is in the description of the present invention, unless another
It is described, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, on being understood by concrete condition
State the concrete meaning of term in the present invention.
The embodiments of the present invention are described in detail below in conjunction with attached drawing, but the utility model can be by right
It is required that the multitude of different ways for limiting and covering is implemented.
Such as Fig. 1 and as shown in connection with fig. 2, a kind of silicium wafer flatness detecting device, including substrate 1, rotating electric machine 3, vertical beam
2, controller 5, suction tray 7, negative pressure pump 9 and multiple laser range sensors 4, the vertical beam 2 are fixed on the substrate 1 wherein
A side, the rotating electric machine 3 are installed on the top of the substrate 1, and the suction tray 7 is installed on the defeated of the rotating electric machine 3
Outlet, the controller 5 are installed on the upper end of the vertical beam 2, and multiple laser range sensors 4, which are spaced apart, is set to institute
The lower part of vertical beam 2 is stated, the suction tray 7 is connected to the negative pressure pump 9, the negative pressure pump 9,3 and of rotating electric machine by connecting tube
Multiple laser range sensors 4 are electrically connected to the controller 5.
Compared with prior art, the utility model is the utility model has the advantages that the utility model is provided with rotating electric machine 3, vertical beam 2, control
Device 5, suction tray 7, negative pressure pump 9 and multiple laser range sensors 4 processed, rotating electric machine 3 are used for Rotary adsorption disk 7, and negative pressure pump 9 is
Suction tray 7 provides negative pressure for silicium wafer 10 to be sucked, and laser range sensor 4 is for detecting laser range sensor 4 to silicon
Distance between chip 10, by the distance between different laser range sensors 4 to silicium wafer 10 whether same analysis silicium wafer
Whether 10 is smooth, and controller 5 controls rotating electric machine 3, negative pressure pump 9 and multiple laser range sensors 4 and works, and improves working efficiency
And effect.
Further, the front end face that the controller 5 is arranged is provided with liquid crystal touch display screen 6.
Using further technical solution the utility model has the advantages that liquid crystal touch display screen 6 can show relevant parameter, in addition can pass through
Touch screen input instruction.
Further, the negative pressure pump 9 is installed on the substrate 1.
Further, the upper end of the suction tray 7 is provided with suction disc 8, and the suction disc 8 is made of rubber material.
Using further technical solution the utility model has the advantages that suction disc 8 is for being sucked silicium wafer, rubber material elasticity is preferably.
Further, there are three the settings of laser range sensor 4.
Using further technical solution the utility model has the advantages that multiple laser range sensors 4 can detect the distance of different location,
And then analyze the flatness of silicium wafer 10.
Wherein laser range sensor model RSDT-DLS-B-30, the model AT42QT4120 of controller.
Workflow: silicium wafer 10 is placed on suction tray 7, starts controller 5, laser range sensor 4 is to silicium wafer
10 carry out ranging, and related data A1 is fed back to controller 5；Rotating electric machine 3 is rotated by 90 °, and laser range sensor 4 is to silicon
Chip 10 carries out ranging, and related data A2 is fed back to controller, and rotating electric machine 3 is rotated by 90 °, and laser range sensor 4 is right
Silicium wafer 10 carries out ranging, and related data A3 is fed back to controller 5；Rotating electric machine 3 is rotated by 90 °, laser range sensor
4 pairs of silicium wafers 10 carry out ranging, and related data A4 is fed back to controller 5；Finally according to data A1, A2, A3 and A4 whether
The equal flatness to judge silicium wafer 10.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Equivalent structure or equivalent flow shift made by using the description of the utility model and the drawings, is directly or indirectly transported
Used in other related technical areas, it is also included in the patent protection scope of the utility model.
Claims (6)
1. a kind of silicium wafer flatness detecting device, it is characterised in that: including substrate (1), rotating electric machine (3), vertical beam (2), control
Device (5), suction tray (7), negative pressure pump (9) and multiple laser range sensors (4) processed, the vertical beam (2) are fixed on the substrate
(1) wherein a side, the rotating electric machine (3) are installed on the top of the substrate (1), and the suction tray (7) is installed on institute
The output end of rotating electric machine (3) is stated, the controller (5) is installed on the upper end of the vertical beam (2), and multiple laser rangings pass
Sensor (4) is spaced apart the lower part for being set to the vertical beam (2), and the suction tray (7) is connected to the negative pressure by connecting tube
It pumps (9), the negative pressure pump (9), rotating electric machine (3) and multiple laser range sensors (4) are electrically connected to the controller
(5)。
2. a kind of silicium wafer flatness detecting device as described in claim 1, it is characterised in that: controller (5) setting
Front end face be provided with liquid crystal touch display screen (6).
3. a kind of silicium wafer flatness detecting device as described in claim 1, it is characterised in that: negative pressure pump (9) installation
In on the substrate (1).
4. a kind of silicium wafer flatness detecting device as described in claim 1, it is characterised in that: the suction tray (7) it is upper
End is provided with suction disc (8).
5. a kind of silicium wafer flatness detecting device as claimed in claim 4, it is characterised in that: the suction disc (8) uses rubber
Glue material is made.
6. a kind of silicium wafer flatness detecting device as described in claim 1, it is characterised in that: the laser range sensor
(4) there are three setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920120711.0U CN209246968U (en) | 2019-01-23 | 2019-01-23 | A kind of silicium wafer flatness detecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920120711.0U CN209246968U (en) | 2019-01-23 | 2019-01-23 | A kind of silicium wafer flatness detecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209246968U true CN209246968U (en) | 2019-08-13 |
Family
ID=67536651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920120711.0U Expired - Fee Related CN209246968U (en) | 2019-01-23 | 2019-01-23 | A kind of silicium wafer flatness detecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209246968U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116359018A (en) * | 2023-05-31 | 2023-06-30 | 浙江祥晋汽车零部件股份有限公司 | Aluminum alloy threshold beam performance detection device and detection method |
-
2019
- 2019-01-23 CN CN201920120711.0U patent/CN209246968U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116359018A (en) * | 2023-05-31 | 2023-06-30 | 浙江祥晋汽车零部件股份有限公司 | Aluminum alloy threshold beam performance detection device and detection method |
| CN116359018B (en) * | 2023-05-31 | 2023-09-15 | 浙江祥晋汽车零部件股份有限公司 | Aluminum alloy threshold beam performance detection device and detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190813 Termination date: 20210123 |