TW201824424A - Leveling equipment for chip-carrying sheet capable of moving a leveling equipment under the condition that the chip-carrying sheet is in a leveling state - Google Patents

Abstract

The present invention provides a leveling equipment of a chip-carrying sheet, comprising a back-side leveling device, a front-side sucking device, a moving device, and a controller. A holding seat of the front-side sucking device has a chip-carrying sheet sucking surface facing the front surface of a chip-carrying sheet. The vacuum suction members respectively correspond to the dicing channel on the front surface of a chip-carrying sheet under the condition that the chip-carrying sheet sucking surface faces the front surface of the chip-carrying sheet. The controller makes the vacuum suction members of the front-side sucking device suck the dicing channel on the front surface of the chip-carrying sheet under the condition that the chip-carrying sheet is maintained at a flat level by the back-side leveling device, so that the front-side sucking device holds the chip-carrying sheet in a leveling state. And, when the front-side sucking device holds the chip-carrying sheet in a leveling state, the moving device moves the front-side sucking device of the chip-carrying sheet to deliver the chip-carrying sheet in a leveling state.

Description

Grain carrier sheet leveling equipment

The present invention relates to a leveling device, and in particular, to a die-loading sheet leveling device capable of moving a die-loading sheet in a flattened state.

Semiconductor wafers are usually composed of single crystalline materials made of silicon or multiple element compounds, and are widely used in the manufacture of electronic component materials. In the manufacturing method of a semiconductor wafer, a molten material is first drawn into a single-crystal cylindrical ingot, then sliced into a substrate shape, and then polished to obtain a desired thickness.

However, with the technological development of the semiconductor industry, for better efficiency and smaller product volume, the thickness of semiconductor wafers is usually limited to the millimeter level. Such a thin thickness makes the wafer prone to warp, which seriously affects the accuracy of subsequent processing and inspection. Although some methods can temporarily level the wafer, such as using a vacuum suction device to suck the back of the wafer to temporarily flatten the wafer, once the wafer leaves the device, the wafer will return to a warped state. Therefore, this method can only temporarily level the wafer at a fixed position, and there is no way to keep the wafer level and move between various processing and measuring equipment. The processing equipment performs errors on the warped wafer, which reduces the yield, and it is difficult for the measurement equipment to directly detect the warped wafer.

Therefore, in order to solve the above-mentioned problems, an object of the present invention is to provide a die-bearing sheet leveling device capable of moving the die-bearing sheet in a flattened state.

The technical means adopted by the present invention to solve the problems of the conventional technology is to provide a die-bearing sheet leveling device, including: a back-side leveling device, which is attached to the back of a die-bearing sheet to be leveled The die carrier sheet is maintained in a flat state; a front surface adsorption device includes a holding seat and a plurality of vacuum suction members, and the holding seat has a die carrier sheet facing the front side of the die carrier sheet. Holding surface, the plurality of vacuum suction members are set on the holding surface of the die carrier sheet with a preset setting position, and the plurality of vacuum holding members on the holding surface of the die carrier sheet correspond to the die carrier The state of the front side of the sheet is a cutting channel corresponding to the front surface of the die carrier sheet; and a moving device connected to the front side suction device to move the front side suction device; and a control device, The signal is connected to the back surface leveling device, the mobile device, and the front surface adsorption device, wherein the control device is arranged to: in a case where the die carrier sheet is maintained in the leveled state by the back surface leveling device, Make The front surface adsorption device uses the plurality of vacuum suction members to adsorb the cutting channel on the front surface of the grain bearing sheet, and through controlling the back surface leveling device, the front surface adsorption device uses the plurality of vacuum suction members to adsorb the crystal particles. After the cutting channel on the front side of the carrier sheet, the back surface leveling device is detached from the attachment to the die carrier sheet, so that the front surface adsorption device is to hold the die carrier sheet in the leveled state, and In the case where the front surface adsorption device holds the crystal bearing sheet in the flattened state, the moving device moves the front surface adsorption device to transfer the crystal grain bearing sheet in the flattened state.

In one embodiment of the present invention, a die-bearing wafer leveling device is provided. The back-side leveling device includes a leveling stand and a plurality of vacuum contacts. The plurality of vacuum contacts are disposed through the leveling support. station.

According to an embodiment of the present invention, there is provided a chip-bearing sheet leveling device. The back-leveling device further includes a moving carrier connected to the leveling platform, and driving the leveling platform to a calibration plane. Adjust the position.

According to an embodiment of the present invention, there is provided a chip-bearing sheet leveling device. The back-leveling device further includes a calibration image capturing component. A signal is connected to the leveling platform. The calibration image capturing component is used for the calibration. A calibration image is taken for the leveling platform to adjust the position.

According to an embodiment of the present invention, a die-bearing wafer leveling device is provided. The holding seat is in the shape of a disc and corresponds to a wafer.

In one embodiment of the present invention, there is provided a die-bearing sheet leveling device. The preset setting positions of the plurality of vacuum suction members are on the die-bearing sheet holding surface corresponding to the die-bearing sheet. In the state of the front face, the intersection points corresponding to the cutting channels formed on the front face of the die carrier sheet respectively.

According to an embodiment of the present invention, a die-bearing sheet leveling device is provided, and further includes a die-bearing sheet detection image capture device connected to the control device. The die-bearing sheet detection image capture device is The grain bearing sheet in the flattened state is detected on the front side of the grain bearing sheet.

Through the technical means adopted by the present invention, the die carrier sheet can be sent to various processing and measuring equipments while keeping the flat state, so that processing and measuring are easier and time-saving, thereby increasing production yield and reducing production costs.

The specific embodiments used in the present invention will be further explained by the following embodiments and accompanying drawings.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 7. This description is not intended to limit the embodiment of the present invention, but is an example of the embodiment of the present invention.

As shown in FIG. 1, a die carrier wafer leveling device 100 according to an embodiment of the present invention includes a back surface leveling device 1, a front surface adsorption device 2, a moving device 3, and a control device 4.

The back surface leveling device 1 maintains the die carrier sheet W in a flattened state by being attached to the back surface of a die carrier sheet W to be leveled. The die carrier sheet W may be a wafer that has not been cut, or a sheet-like die carrier (a plurality of die are adhered to a substrate) in a fan-out process, and the present invention is not limited thereto. In this embodiment, the back surface leveling device 1 is a device that uses vacuum suction to level the wafer carrier sheet W, and includes a leveling platform 11 and a plurality of vacuum contacts 12, and the plurality of vacuum contacts 12 are disposed through The leveling base 11 can be protruded from the surface of the leveling base 11. In detail, as shown in FIG. 3 and FIG. 4, the plurality of vacuum contacts 12 protrude from the surface of the leveling base 11, so that each vacuum contact 12 touches the die carrier sheet to be leveled. The back of W. Due to the possible warpage of the die carrier sheet W, the protruding lengths of the plurality of vacuum contacts 12 are also different. These vacuum contacts 12 have both touch detection and vacuum nozzle functions. When the vacuum contacts 12 all touch the back of the die carrier sheet W, the die carrier sheet W is pulled down by vacuum suction, so that the originally warped die carrier sheet W is leveled on a plane. . However, the present invention is not limited to this, and other die-leveling methods or different mechanisms may be used to level the die-bearing sheet W.

As shown in FIGS. 1 and 2, the front suction device 2 includes a suction holder 21 and a plurality of vacuum suction members 22. The holding base 21 has a die-bearing sheet holding surface F facing the front side of the die-bearing sheet W. A plurality of vacuum suction members 22 are arranged at a predetermined setting position on the die-holding sheet holding surface F, and a plurality of Each vacuum suction member 22 corresponds to a cutting channel C (drawn in the first section) formed on the front surface of the die carrier sheet W in a state where the die carrier sheet holding surface F corresponds to the front face of the die carrier sheet W. Figure 5). In this embodiment, the holding base 21 has a disc shape and a shape corresponding to a wafer, and the shape may correspond to, for example, an 8-inch wafer and a 12-inch wafer depending on the product. However, the present invention is not limited to this. 21 may have a square shape corresponding to a square substrate. In this embodiment, the preset positions of the plurality of vacuum suction members 22 are respectively corresponding to the state where the die carrier sheet holding surface F corresponds to the front side of the die carrier sheet W corresponding to the die carrier. The intersection of the cutting channels C formed on the front surface of the sheet W, but the present invention is not limited to this.

The moving device 3 is connected to the front suction device 2 to move the front suction device 2. In this embodiment, as shown in FIG. 1, the moving device 3 can move the front suction device 2 in a horizontal direction (shown by a double arrow on the upper end). In addition, the present invention is not limited to this, and the front adsorption device 2 may be moved in a horizontal plane or a vertical direction (Z axis).

The control device 4 is connected to the back leveling device 1, the mobile device 3, and the front adsorption device 2 by signals. As shown in FIG. 5, the control device 4 is arranged to cause the front surface adsorption device 2 to adsorb the crystal grains with the plurality of vacuum suction members 22 in a case where the die carrier sheet W is maintained in a flat state by the back surface leveling device 1. As shown in FIG. 6, the cutting channel C on the front surface of the carrier sheet W is controlled by the back surface leveling device 1, and the front surface adsorption device 2 uses a plurality of vacuum suction members 22 to adsorb the cut of the front surface of the wafer carrier sheet W. After the channel C, the back surface leveling device 1 is detached from the attachment with the die carrier sheet W, so that the front surface adsorption device 2 is holding the die carrier sheet W in the leveled state. In addition, as shown in FIG. 7, the control device 4 is provided to move the moving device 3 (drawn in FIG. 1) when the front surface suction device 2 holds the die carrier sheet W in a flat state. The adsorption device 2 transfers the die-carrying sheet W in the flattened state.

Since the front surface adsorption device 2 uses a plurality of vacuum suction members 22 to adsorb the cutting channel C on the front surface of the die carrier sheet W, the die carrier sheet can be transferred without damaging the die on the front side of the die carrier sheet W. W.

Further, as shown in FIG. 1, in this embodiment, the back surface leveling device 1 further includes a moving carrier 13 connected to the leveling platform 11, and the leveling platform 11 is driven to adjust on a calibration plane. position.

Further, in this embodiment, the back surface leveling device 1 further includes an image capturing member for calibration, and a signal is connected to the leveling platform 11. The calibration image capturing component is used to capture a calibration image for the leveling platform 11 to adjust the position.

Further, in this embodiment, the die carrier chip leveling device 100 further includes a die carrier chip detection image capture device, which is a signal connection control device 4, and the die carrier chip detection image capture device is provided on the wafer. The grain bearing sheet W is detected on the front side of the grain bearing sheet W in a flat state.

In summary, the die carrier sheet leveling apparatus 100 of the present invention can not only level the die carrier sheet W from the back of the die carrier sheet W, but also can send the die carrier sheet W to each of them while the die carrier sheet W remains leveled. Processing and measuring equipment makes processing and measuring easier and saves time, thus increasing production yield and reducing production costs.

The above descriptions and descriptions are merely illustrations of the preferred embodiments of the present invention. Those with ordinary knowledge of this technology may make other modifications based on the scope of the patent application defined below and the above description, but these modifications should still be made. It is the spirit of the present invention and is within the scope of the present invention.

100‧‧‧ Grain carrier sheet leveling equipment

1‧‧‧Flat-leveling device for die carrier sheet

11‧‧‧leveling platform

12‧‧‧vacuum contacts

13‧‧‧mobile carrier

2‧‧‧Front-side adsorption device for grain bearing sheet

21‧‧‧ Holding seat

22‧‧‧Vacuum suction

3‧‧‧ mobile device

4‧‧‧control device

C‧‧‧ cutting channel

F‧‧‧ Grain-bearing sheet suction surface

W‧‧‧ Die Carrier Sheet

FIG. 1 is a schematic diagram showing a die carrier wafer leveling apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing a front surface adsorption device of a die carrier sheet according to an embodiment of the present invention. Figures 3 to 4 are schematic diagrams showing a flattening device for flattening a die-bearing sheet by the back-leveling device. FIG. 5 to FIG. 6 are schematic diagrams showing a die carrier sheet held by the front adsorption device in a flat state. FIG. 7 is a schematic diagram showing a die carrier sheet transferred in a flattened state.

Claims (7)

A die-bearing sheet leveling device includes: a back-side leveling device for maintaining the die-bearing sheet in a flat state by being attached to the back surface of a die-bearing sheet to be leveled; The adsorption device includes a holding base and a plurality of vacuum suction parts. The holding base has a holding surface of a die-carrying sheet facing the front side of the die-carrying sheet. The plurality of vacuum suction parts are provided in a preset setting. The position is set on the holding surface of the die carrier sheet, and the plurality of vacuum suction members respectively correspond to the holding of the die carrier in a state where the holding surface of the die carrier sheet corresponds to the front side of the die carrier sheet. A cutting channel formed on the front surface of the sheet; and a moving device connected to the front suction device so that the front suction device can be moved; and a control device connected to the back leveling device, the moving device and the front suction A device, wherein the control device is arranged to: when the die carrier sheet is maintained in the flat state by the back surface leveling device, cause the front surface adsorption device to adsorb the crystal particles with the plurality of vacuum suction members Bear The cutting channel on the front surface of the sheet is controlled by the back surface leveling device, and the back surface is leveled after the front surface adsorption device adsorbs the cutting channel on the front surface of the grain bearing sheet with the plurality of vacuum suction members. The device is detached from the attachment of the crystal grain bearing sheet, so that the front surface adsorption device is holding the crystal grain bearing sheet in the flat state, and the front surface adsorption device is holding the crystal grain in the flat state. In the case of a granular carrier sheet, the moving device is moved to the front adsorption device, and the grain carrier sheet in the flattened state is transferred. The grain-bearing wafer leveling device according to claim 1, wherein the back-surface leveling device includes a leveling platform and a plurality of vacuum contacts, and the plurality of vacuum contacts are disposed through the leveling platform. The chip-bearing chip leveling device according to claim 2, wherein the back-leveling device further includes a moving carrier connected to the leveling platform, and driving the leveling platform to adjust the position on a calibration plane . The chip-bearing sheet leveling device according to claim 3, wherein the back-leveling device further includes a calibration image capturing component, and a signal is connected to the leveling platform, and the calibration image capturing component is used to shoot a A calibration image is provided for the leveling platform to adjust the position. The die carrier wafer leveling apparatus according to claim 1, wherein the holding seat is in a disc shape and corresponds to a wafer. The die carrier sheet leveling device according to claim 1, wherein the preset setting positions of the plurality of vacuum suction members are in a state where the die carrier sheet holding surface corresponds to the front side of the die carrier sheet Below are the intersections corresponding to the cutting channels formed on the front surface of the die carrier sheet, respectively. The die-bearing wafer leveling device according to claim 1, further comprising a die-bearing wafer detection image capture device, which is connected to the control device, and the die-bearing wafer detection image capture device is connected to the die. The front side of the carrier sheet detects the grain carrier sheet in the flattened state.