CN209232765U - A kind of encapsulating structure and wireless communication module of wireless communication module - Google Patents

A kind of encapsulating structure and wireless communication module of wireless communication module Download PDF

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Publication number
CN209232765U
CN209232765U CN201920250363.9U CN201920250363U CN209232765U CN 209232765 U CN209232765 U CN 209232765U CN 201920250363 U CN201920250363 U CN 201920250363U CN 209232765 U CN209232765 U CN 209232765U
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China
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wireless communication
communication module
pin
jack
encapsulating structure
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CN201920250363.9U
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李可任
徐炜
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Shanghai Mxchip Information Technology Co Ltd
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Shanghai Mxchip Information Technology Co Ltd
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Abstract

The utility model discloses a kind of encapsulating structure of wireless communication module and wireless communication modules, comprising: the semicircle aperture set on the side of wireless communication module;Bottom surface, the pad that is in contact with semicircle aperture set on wireless communication module, for drawing the basic function pin and extension functional pin of wireless communication module;Jack on wireless communication module, in order to which contact pin is welded in the bottom surface of wireless communication module, draws basic function pin for cooperating when wireless communication module is in contact pin encapsulation mode with contact pin;Welding hole on wireless communication module, for welding antenna.It can be seen that, there is the wireless communication module of the application half bore encapsulation and contact pin to encapsulate two kinds of encapsulating structures simultaneously, user can select suitable welding manner according to the installation requirements of mainboard, it needs to develop wireless communication module again so as to avoid because mainboard installation requirements are different, and then saves development time and development cost.

Description

A kind of encapsulating structure and wireless communication module of wireless communication module
Technical field
The utility model relates to wireless communication fields, encapsulating structure more particularly to a kind of wireless communication module and wireless Communication module.
Background technique
Currently, there are mainly two types of packaged types for wireless communication module: half bore packaged type and contact pin packaged type.Wherein, Half bore packaged type: it is equipped with semicircle aperture in the side of wireless communication module, and is equipped with weldering in the bottom surface of wireless communication module Disk, and calorific value lesser mainboard larger suitable for access space.Contact pin packaged type: it is equipped with and inserts on wireless communication module Hole, and contact pin and jack cooperate, and are welded in the bottom surface of wireless communication module, suitable for accessing, space is smaller or calorific value is biggish Mainboard.As it can be seen that the encapsulating structure of wireless communication module (selects half bore packaged type or contact pin encapsulation side after once designing Formula), the mainboard range that wireless communication module is applicable in will necessarily be restricted, if not being applicable at this time in the wireless communication module Mainboard within the scope of mainboard when needing access to wireless communication module, then need to develop wireless communication module again and be set for it Suitable encapsulating structure is counted, to increase development time and development cost.
Therefore, how to provide a kind of scheme of solution above-mentioned technical problem is that those skilled in the art needs to solve at present The problem of.
Utility model content
The purpose of the utility model is to provide a kind of encapsulating structure of wireless communication module and wireless communication modules, have simultaneously There are half bore encapsulation and contact pin to encapsulate two kinds of encapsulating structures, user can select suitable welding side according to the installation requirements of mainboard Formula needs to develop wireless communication module again so as to avoid because mainboard installation requirements are different, and then saves the development time And development cost.
In order to solve the above technical problems, the utility model provides a kind of encapsulating structure of wireless communication module, comprising:
Semicircle aperture set on the side of wireless communication module;
Bottom surface, the pad that is in contact with the semicircle aperture set on the wireless communication module, it is described for drawing The basic function pin and extension functional pin of wireless communication module;
Jack on the wireless communication module, for when the wireless communication module is in contact pin encapsulation mode Cooperate with contact pin, in order to which the contact pin is welded in the bottom surface of the wireless communication module, draws the basic function pin;
Welding hole on the wireless communication module, for welding antenna.
Preferably, the jack of same basic function pin corresponding with any semicircle aperture through and the semicircle aperture phase The pad of contact.
Preferably, the central point of semicircle aperture corresponding with same basic function pin and jack is conllinear.
Preferably, when the number of the jack is even number, the jack is symmetrically distributed in the wireless communication module Left and right ends.
Preferably, the welding hole is distributed in the front end of the wireless communication module, corresponding with the extension functional pin Semicircle aperture be distributed in the rear end of the wireless communication module.
The jack for being preferably located at the same side on the wireless communication module is equally spaced, and is located at the wireless communication The semicircle aperture of the same side is equally spaced in module.
Preferably, the jack is specially round hole.
In order to solve the above technical problems, the utility model additionally provides a kind of wireless communication module, the radio communication mold The encapsulating structure of block uses the encapsulating structure of any of the above-described kind of wireless communication module.
The utility model provides a kind of encapsulating structure of wireless communication module, comprising: set on the side of wireless communication module The semicircle aperture in face;Bottom surface, the pad that is in contact with semicircle aperture set on wireless communication module, for drawing channel radio Believe the basic function pin and extension functional pin of module;Jack on wireless communication module, for working as radio communication mold Cooperate when block is in contact pin encapsulation mode with contact pin, in order to which contact pin is welded in the bottom surface of wireless communication module, draws basic training It can pin;Welding hole on wireless communication module, for welding antenna.
As it can be seen that there is the wireless communication module of the application half bore encapsulation and contact pin to encapsulate two kinds of encapsulating structures, user simultaneously Suitable welding manner can be selected according to the installation requirements of mainboard, be needed so as to avoid because mainboard installation requirements are different Again wireless communication module is developed, and then saves development time and development cost.
The utility model additionally provides a kind of wireless communication module, with above-mentioned encapsulating structure beneficial effect having the same.
Detailed description of the invention
It, below will be to the prior art and embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this A little attached drawings obtain other attached drawings.
Fig. 1 is a kind of front schematic view of the encapsulating structure of wireless communication module provided by the utility model;
Fig. 2 is a kind of schematic bottom view of the encapsulating structure of wireless communication module provided by the utility model;
Fig. 3 is a kind of contact pin package dimension figure of wireless communication module provided by the utility model;
Fig. 4 is a kind of half bore package dimension figure of wireless communication module provided by the utility model.
Specific embodiment
The core of the utility model is to provide the encapsulating structure and wireless communication module of a kind of wireless communication module, has simultaneously There are half bore encapsulation and contact pin to encapsulate two kinds of encapsulating structures, user can select suitable welding side according to the installation requirements of mainboard Formula needs to develop wireless communication module again so as to avoid because mainboard installation requirements are different, and then saves the development time And development cost.
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is a kind of front of the encapsulating structure of wireless communication module provided by the utility model Schematic diagram, Fig. 2 are a kind of schematic bottom view of the encapsulating structure of wireless communication module provided by the utility model.
The encapsulating structure of the wireless communication module includes:
Semicircle aperture A set on the side of wireless communication module;
Bottom surface, the pad B that is in contact with semicircle aperture A set on wireless communication module, for drawing radio communication mold The basic function pin and extension functional pin of block;
Jack C on wireless communication module, for when wireless communication module is in contact pin encapsulation mode and contact pin Cooperation draws basic function pin in order to which contact pin is welded in the bottom surface of wireless communication module;
Welding hole D on wireless communication module, for welding antenna.
Specifically, it is contemplated that the single encapsulating structure (encapsulating containing only half bore encapsulation or contact pin) of wireless communication module can make nothing The mainboard range that line communication module is applicable in is restricted, so the application had both used half bore packaged type to wireless communication module It is packaged, and wireless communication module is packaged using contact pin packaged type, seal same wireless communication module collection half bore Dress and contact pin encapsulate two kinds of encapsulating structures in one.It can be according to mainboard when wireless communication module accesses mainboard based on this Connection requirement selects suitable welding manner, for example, or such as ball bulb calorific value biggish mainboard smaller for space, is suitable for (i.e. wireless communication module is in contact pin encapsulation mode) is assembled using capillary mode, this is because wireless communication module is in slotting When accessing mainboard in the case where needle encapsulation mode, wireless communication module can be suspended on the top of mainboard element, to be conducive to lead Plate heat dissipation, and it is not take up motherboard space.And calorific value lesser mainboard larger for space is suitable for using SMD (Surface Mounted Devices, surface mount device) mode welds (i.e. wireless communication module is in half bore encapsulation mode).In addition, nothing It is additionally provided with the welding hole D for welding antenna in line communication module, utilizes antenna transmission wireless signal to realize.
Further, the integral type encapsulating structure of wireless communication module (half bore encapsulation+contact pin encapsulates) is carried out specifically It is bright: 1) half bore encapsulating structure: to be equipped with semicircle aperture A in the side of wireless communication module, and in the bottom surface of wireless communication module It is additionally provided with the pad B being in contact with semicircle aperture A, it is therefore an objective to draw the basic function pin and extension function of wireless communication module It can pin.Specifically, when designing the circuit board of wireless communication module, the basic function pin and extension function of wireless communication module Energy pin can be drawn by the cabling on circuit board;And when designing the pad locations of half bore encapsulation for wireless communication module, answer Guarantee each pad B with draw wireless communication module pin circuit board on cabling be in contact (a pad B it is corresponding wirelessly communicates One functional pin of module), to realize the basic function pin for drawing wireless communication module in the form of pad B and extension function Energy pin, and then so that wireless communication module is passed through pad B and access mainboard.Since half bore encapsulating structure is in wireless communication module Side be equipped with semicircle aperture A, so the operation of wireless communication module access mainboard is easier, and welding quality can obtain To guarantee.
2) contact pin encapsulating structure: being equipped with jack C on wireless communication module, when wireless communication module prepares to seal using contact pin When die-filling formula, contact pin is cooperated into jack C, is welded in the bottom surface of wireless communication module, it is therefore an objective to draw the base of wireless communication module This functional pin.Specifically, when designing the jack position of contact pin encapsulation for wireless communication module, it should ensure that each jack C and draw The cabling on the circuit board of wireless communication module basic function pin is in contact out, and (a jack C corresponds to wireless communication module One basic function pin), to make jack C after accessing contact pin, realize the base that wireless communication module is drawn in the form of contact pin This functional pin, and then wireless communication module is allow to access mainboard by contact pin, it is easy to disassemble.It should be noted that wireless In communication module contact pin can not be accessed in corresponding jack C without accessing the pin of mainboard.In addition, coming for contact pin encapsulation Say, due to jack C top and bottom all can not cabling, so encapsulating compared to half bore, the corresponding functional pin of contact pin encapsulation is few It is some.
The utility model provides a kind of encapsulating structure of wireless communication module, comprising: set on the side of wireless communication module The semicircle aperture in face;Bottom surface, the pad that is in contact with semicircle aperture set on wireless communication module, for drawing channel radio Believe the basic function pin and extension functional pin of module;Jack on wireless communication module, for working as radio communication mold Cooperate when block is in contact pin encapsulation mode with contact pin, in order to which contact pin is welded in the bottom surface of wireless communication module, draws basic training It can pin;Welding hole on wireless communication module, for welding antenna.
As it can be seen that there is the wireless communication module of the application half bore encapsulation and contact pin to encapsulate two kinds of encapsulating structures, user simultaneously Suitable welding manner can be selected according to the installation requirements of mainboard, be needed so as to avoid because mainboard installation requirements are different Again wireless communication module is developed, and then saves development time and development cost.
On the basis of the above embodiments:
As one kind, optionally embodiment, the jack C of same basic function pin corresponding with any semicircle aperture A run through The pad B being in contact with semicircle aperture A.
Specifically, in order to reduce two kinds of encapsulating structures space occupied on the circuit board of wireless communication module, this Shen Please will semicircle aperture A and jack C corresponding with same basic function pin as close to setting, at this time with any semicircle The jack C that aperture A corresponds to same basic function pin can be through the pad B being in contact with semicircle aperture A, so that semicircle The arrangement of aperture A and jack C are more compact.
As a kind of optionally embodiment, the center of semicircle aperture A and jack C corresponding with same basic function pin Point is conllinear.
Further, the application can be by the central point of semicircle aperture A and jack C corresponding with same basic function pin On the same line, so that the arrangement of semicircle aperture A and jack C is more neat, entirety is more beautiful for setting.
As a kind of optionally embodiment, when the number of jack C is even number, jack C is symmetrically distributed in radio communication mold The left and right ends of block.
Specifically, required on wireless communication module when the number of the basic function pin of wireless communication module is even number The jack C of setting is also even number.In this case, jack C can be symmetrically set in the left and right ends of wireless communication module by the application, The jack C for being distributed in wireless communication module left end is equal with the quantity of jack C of wireless communication module right end is distributed in, and base The central axes of circuit board are symmetrical where wireless communication module.
Similarly, when the jack C of setting required on wireless communication module is odd number, the application can will wherein (jack be total Quantity -1) a jack C is symmetrically set in the left and right ends of wireless communication module according to the set-up mode of jack in the present embodiment, then Remaining 1 jack C is set to the left or right of wireless communication module again.
In addition, the semicircle aperture A and jack C corresponding with same basic function pin proposed in based on the above embodiment Between positional relationship, it is known that semicircle aperture A is equally distributed in the left and right ends of wireless communication module.
It is distributed in the front end of wireless communication module as a kind of optionally embodiment, welding hole D, with extension functional pin pair The semicircle aperture A answered is distributed in the rear end of wireless communication module.
Further, welding hole D can be set to the front end of wireless communication module by the application, will be corresponding with extension functional pin Semicircle aperture A be set to wireless communication module rear end, consequently facilitating the circuit board wiring of wireless communication module.
As a kind of optionally embodiment, the jack C of the same side is equally spaced on wireless communication module, and is located at nothing The semicircle aperture A of the same side is equally spaced in line communication module.
Specifically, the jack C for being located at the same side on wireless communication module can be placed equidistant with by the application, similarly can also be by position Semicircle aperture A in the same side on wireless communication module is placed equidistant with, and overall distribution is more uniform.
Further, the contact pin package dimension of wireless communication module can be set according to contact pin package dimension figure as shown in Figure 3 Meter, the half bore package dimension of wireless communication module can be according to half bore package dimension G- Design as shown in Figure 4.In Fig. 3 and Fig. 4, The unit of institute's dimensioning is mm.
As one kind, optionally embodiment, jack C are specially round hole.
Specifically, the jack C of the application may be designed as round hole, be easier to weld.
It should be noted that the application should design channel radio before the circuit board trace of design wireless communication module Believe the encapsulating structure of module, is then walked according to the circuit board that the encapsulating structure of wireless communication module rationally designs wireless communication module Line.
In addition, the type of wireless communication module has very much, the pin number and pin of different types of wireless communication module Function is usually different.It should be noted that the application is when developing wireless communication module, configured good wireless communication module Each pin function.Below by taking one of wireless communication module as an example, to the pin number of the wireless communication module of this type And pin function is briefly described:
The pin number of the wireless communication module has 21, wherein Pin1-16 is basic function pin, and Pin17-19 is Extend functional pin.Specifically, the function of all pins of the wireless communication module need to be according to exclusively for the wireless communication module The pin function table of design is configured, for example, Pin1 is resetting pin in pin function table, is dragged down and is drawn high generation reset again; Pin8 is DC 3.3V operating voltage, and the range of operating voltage is 3.0~3.6V;Pin9 is grounding leg;Pin17 and Pin18 default Burning interface is debugged for engineering, can also being set to PWM in application layer, (Pulse Width Modulation, pulse are wide Degree modulation) interface or GPIO (General Purpose Input Output, universal input/output) interface uses;Pin21 is External antenna interface, Pin22 are antenna auxiliary earth foot ..., and the application corresponds to configuration pin function i.e. according to pin function table It can.
More specifically, the pin function table of wireless communication module can be set according to the application demand of wireless communication module Meter, for example, wireless communication module can be configured to support the module of 6 road PWM functions, make itself to have can be applied to it is cold, warm and red, On the bulb lamp of green, blue 5 road PWM demand.Moreover, the application can also debug burning interface again by Pin17 and Pin18 engineering The pin function for configuring wireless communication module, makes wireless communication module that can be flexibly applied to other intelligence such as small household appliances, Story machine In equipment.
The utility model additionally provides a kind of wireless communication module, and the encapsulating structure of wireless communication module is using any of the above-described The encapsulating structure of kind wireless communication module.
The introduction of wireless communication module provided by the present application please refers to the embodiment of above-mentioned encapsulating structure, and the application is herein not It repeats again.
It should also be noted that, in the present specification, relational terms such as first and second and the like be used merely to by One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged Except there is also other identical elements in the process, method, article or apparatus that includes the element.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The widest scope consistent with features of novelty.

Claims (8)

1. a kind of encapsulating structure of wireless communication module characterized by comprising
Semicircle aperture set on the side of wireless communication module;
Bottom surface, the pad that is in contact with the semicircle aperture set on the wireless communication module, it is described wireless for drawing The basic function pin and extension functional pin of communication module;
Jack on the wireless communication module, for when the wireless communication module is in contact pin encapsulation mode and slotting Needle cooperation, in order to which the contact pin is welded in the bottom surface of the wireless communication module, draws the basic function pin;
Welding hole on the wireless communication module, for welding antenna.
2. the encapsulating structure of wireless communication module as described in claim 1, which is characterized in that corresponding with any semicircle aperture The jack of same basic function pin runs through the pad being in contact with the semicircle aperture.
3. the encapsulating structure of wireless communication module as claimed in claim 2, which is characterized in that with same basic function pin pair The central point of the semicircle aperture and jack answered is conllinear.
4. the encapsulating structure of wireless communication module as claimed in claim 3, which is characterized in that when the number of the jack is even When number, the jack is symmetrically distributed in the left and right ends of the wireless communication module.
5. the encapsulating structure of wireless communication module as claimed in claim 4, which is characterized in that the welding hole is distributed in described The front end of wireless communication module, semicircle aperture corresponding with the extension functional pin are distributed in the wireless communication module Rear end.
6. the encapsulating structure of wireless communication module as claimed in claim 5, which is characterized in that be located at the wireless communication module The jack of upper the same side is equally spaced, and the semicircle aperture for being located at the same side on the wireless communication module is equally spaced.
7. the encapsulating structure of wireless communication module as claimed in claim 5, which is characterized in that the jack is specially circle Hole.
8. a kind of wireless communication module, which is characterized in that the encapsulating structure of the wireless communication module uses such as claim 1-7 The encapsulating structure of described in any item wireless communication modules.
CN201920250363.9U 2019-02-27 2019-02-27 A kind of encapsulating structure and wireless communication module of wireless communication module Active CN209232765U (en)

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Application Number Priority Date Filing Date Title
CN201920250363.9U CN209232765U (en) 2019-02-27 2019-02-27 A kind of encapsulating structure and wireless communication module of wireless communication module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920250363.9U CN209232765U (en) 2019-02-27 2019-02-27 A kind of encapsulating structure and wireless communication module of wireless communication module

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Publication Number Publication Date
CN209232765U true CN209232765U (en) 2019-08-09

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