CN209216926U - It is configured to the spray disk device on microwire road - Google Patents

Abstract

The utility model is suitable for microwire road preparation technical field, provide a kind of spray disk device for being configured to microwire road, the first etch structures including all substrate injection etching solutions of promising formation microwire road direction and the etching solution by vacuum suck removal product on the substrate, it include the second etch structures of etching solution and gas mixing being etched with two fluids to substrate injection, the third etch structures of part etching are only done in the edge of substrate injection etching solution, module is removed to the 4th etch structures of substrate intermittence injection etching solution and the exhaust gas of elimination exhaust gas according to the base plate transfer situation.Whereby, the utility model, which can effectively remove the etching solution on substrate, makes multiple faces of etching form relatively uniform etching.

Description

It is configured to the spray disk device on microwire road

Technical field

The utility model relates to microwire road preparation technical field more particularly to a kind of spray disk devices for being configured to microwire road.

Background technique

General etching is remained material to be treated, such as after necessary relevant treatment is done on printed circuit substrate surface Result required for remaining part point is formed by nozzle injection chemical medicinal liquid (etching solution, stchant)；Route phenomenon processing method is extensive It applies in semiconductors manufacture engineering.

It is related with etching solution and Etaching device according to the product quality that such etching and processing method manufactures.Specifically The type of etching solution, temperature, nozzle phenomenon in concentration etc. and Etaching device, number, size, spacing, configuration, material screen Speed change etc. a variety of conditions as etching quality.The quality key etched if simple arrangement is etching solution in the form of which type of It is injected on material.(the injection etching) and non-direct contact directly contacted by etching solution and material that nozzle sprays passes through The etching solution dipping (dipping) of remaining has very big difference in quality.

On the one hand pool effect can occur in etching engineering as described above, pool effect on material surface because spraying herein Etching solution the phenomenon that building up cause uneven etching etc. cause from desired different etching, keep product quality low, Such pool effect is the quantity in general Etaching device Rigen according to nozzle, and interval or arrangement etc. are not only variant, but also Can necessarily occur, need to study the scheme that can be effectively removed.

Associated companies have following several being disclosed of technology in the method for Persisting exploitation removal pool effect:

Firstly, as shown in Figure 1, being mounted on the injection nozzle 12 on 11 top of substrate and the injection that above-mentioned injection nozzle 12 is neighbouring Installation suction apparatus 13 is constituted between nozzle (drawing is not shown), the etching solution of injection is expelled to the outside of aforesaid substrate 11. The Etaching device 10 (the hereinafter referred to as prior art 1) that remaining etching solution is removed using above-mentioned suction apparatus 13 also comes forth；And And it is waved as shown in Figure 2 with standing vertically the transfer idler wheel 22 of the transfer of substrate 21 and being mounted on 21 front and back of aforesaid substrate The nozzle 23 and jet pipe 24 of movement are constituted, the Etaching device that the etching solution of injection is discharged downwards while uniformly spraying etching solution 20 (the hereinafter referred to as prior arts 2) also come forth.

But the case where prior art 1 because the spray particles of above-mentioned injection nozzle 12 are not dense enough, microwire road can be hindered The etching solution of etching part sprays approach between 50um route below and route, is difficult to play its effect for reality.And The case where prior art 2, because aforesaid substrate 21 sprays etching solution in the state of setting, etching solution can be flowed with aforesaid substrate 21 To lower end, the route between 21 top and bottom of aforesaid substrate can be caused to form non-uniform problem.

In summary, existing method is in actual use, it is clear that there is inconvenient and defect, it is therefore necessary to be changed Into.

Utility model content

For above-mentioned defect, the purpose of this utility model is to provide a kind of spray disk device for being configured to microwire road, The etching solution on substrate, which can effectively be removed, makes multiple faces of etching form relatively uniform etching.

To achieve the goals above, the utility model provides a kind of spray disk device for being configured to microwire road, includes:

First etch structures, equipped at least one for spraying the first spray of etching solution to the substrate for being transmitted to the first machining position The vacuum suck module of mouth frame and at least one etching solution for being discharged on the substrate；

Second etch structures, equipped at least one for being transmitted to erosion described in the substrate mixing jetting of the second machining position Carve the second nozzle frame of two fluids of liquid and gas；

Third etch structures, equipped at least one for being sprayed to the marginal portion for the substrate for being transmitted to third machining position The third injection nozzle carrier of the etching solution；

4th etch structures, equipped at least one for according to the detection information of the substrate to being transmitted to the 4th machining position 4th injection nozzle carrier of etching solution described in the substrate interrupted injection；

Exhaust gas removes module, for sucking the exhaust gas generated on the substrate and the cooling condensation exhaust gas to form recycling Medical fluid and pure gas.

It is the spray disk device on microwire road according to the composition, first etch structures include that there are two first sprays Mouth frame, two first jet framves are respectively arranged on the upper and lower side of the substrate of first machining position, and two described One injection nozzle carrier is equipped at least first jet for being right against the substrate upper and lower surface respectively；

The vacuum suck module is equipped with the vacuum suck nozzle close to the substrate upper end, the vacuum suck nozzle It is connected to Venturi tube, the Venturi tube connection circulating pump gushes.

It is the spray disk device on microwire road according to the composition, first etch structures further include having the first supply pump to gush With the first etching liquid cell, first supply pump, which is gushed, is connected to the first jet frame, and first etching liquid cell is connected to institute State that the first supply pump is gushed and first etching liquid cell is set under two first jet framves to recycle the etching solution.

It is the spray disk device on microwire road according to the composition, second etch structures include that there are two second sprays Mouth frame, the second supply pump are gushed, gas supply pump is gushed and the second etching liquid cell, and two second nozzle framves are respectively arranged on described The upper and lower side of the substrate of second machining position, and two second nozzle framves are equipped with and are right against the substrate or more respectively An at least second nozzle on two sides；

Second supply pump, which gushes to gush with the gas supply pump, to be connected on the second nozzle frame, and described second Etching liquid cell be connected to second supply pump gush and second etching liquid cell be set under two second nozzle framves with Recycle the etching solution.

It is the spray disk device on microwire road according to the composition, the gas supply pump, which is gushed, is connected with the heating of an at least gas Module；And/or

Second etching liquid cell and second supply pump are also connected with an at least etching solution heating module between gushing.

It is the spray disk device on microwire road according to the composition, the third etch structures include that there are two the thirds to spray Mouth frame, two third injection nozzle carriers are respectively arranged on the upper and lower side of the substrate of the third machining position, and two described Three injection nozzle carriers are equipped with several third nozzles in the marginal portion for corresponding to the substrate upper and lower surface respectively.

It is the spray disk device on microwire road according to the composition, the 4th etch structures include that there are two the 4th sprays Mouth frame, two the 4th injection nozzle carriers are respectively arranged on the upper and lower side of the substrate of the 4th machining position, and two described At least one the 4th nozzle corresponding to the substrate upper and lower surface is respectively equipped on four injection nozzle carriers.

It is the spray disk device on microwire road according to the composition, the 4th etch structures further include having third supply pump It gushes, third etching liquid cell, sensor and control unit；The third supply pump, which is gushed, is connected to the 4th injection nozzle carrier, described Third etching liquid cell be connected to the third supply pump gush and the third etching liquid cell be set to two the 4th injection nozzle carriers it Under to recycle the etching solution；

Before the sensor is set to the 4th machining position and described control unit is connect with the sensor, the control Unit processed is gushed with the third supply pump to be connect, and described control unit detects the inspection of the substrate according to the sensor Measurement information gushes etching solution described in intermittent entry to control the third supply pump to spray the substrate.

Be the spray disk device on microwire road according to the composition, the first jet frame and/or the second nozzle frame with One or so round-trip driving mechanism connection, the round-trip driving mechanism in left and right includes drive motor, rotating disk, eccentric shaft and company Lever, the drive motor are connect to drive the rotating disk to be rotated with the lower end of the rotating disk, and the eccentric shaft is inclined Feel at ease mounted in the rotating disk upper end and one end of the interlocking lever be fixedly connected with the eccentric shaft, the interlocking lever it is another One end is connected on the first jet frame and/or the second nozzle frame.

It is the spray disk device on microwire road according to the composition, the exhaust gas removal module includes for capturing high pressure spray Penetrate the air discharge duct of generated exhaust gas, damper and capacitor when the etching solution；The damper and the capacitor connect It is connected to external washer.

The spray disk device described in the utility model for being configured to microwire road, including all substrate sprays of promising formation microwire road direction Penetrate the first etch structures, the Xiang Suoshu substrate of etching solution and the etching solution by vacuum suck removal product on the substrate Injection includes the second etch structures of etching solution and gas mixing being etched with two fluids, only sprays and lose at the edge of substrate The third etch structures that liquid does part etching are carved, etching solution is sprayed to the substrate intermittence according to the base plate transfer situation 4th etch structures and the exhaust gas for eliminating exhaust gas remove module.Whereby, the utility model can be removed effectively on substrate Etching solution makes multiple faces of etching form relatively uniform etching.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the prior art 1；

Fig. 2 is the structural schematic diagram of the prior art 2；

Fig. 3 is the structural block diagram for being configured to the spray disk device on microwire road described in the preferred embodiment in the utility model；

Fig. 4 is first etch structures for being configured to the spray disk device on microwire road described in the preferred embodiment in the utility model With the structural schematic diagram of exhaust gas removal module；

Fig. 5 is second etch structures for being configured to the spray disk device on microwire road described in the preferred embodiment in the utility model Structural schematic diagram；

Fig. 6 is the third etch structures for being configured to the spray disk device on microwire road described in the preferred embodiment in the utility model Structural schematic diagram；

Fig. 7 is the 4th etch structures for being configured to the spray disk device on microwire road described in the preferred embodiment in the utility model Structural schematic diagram；

Fig. 8 is that the left and right for the spray disk device for being configured to microwire road described in the preferred embodiment in the utility model drives back and forth The attachment structure schematic diagram of mechanism.

Specific embodiment

In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain The utility model is not used to limit the utility model.

Fig. 3 shows the spray disk device 100 that composition described in the preferred embodiment in the utility model is microwire road, includes: the One etch structures 10, equipped at least one for spraying the first jet frame of etching solution to the substrate 60 for being transmitted to the first machining position 101 and at least one vacuum suck module of the etching solution for being discharged on substrate 60, such as Fig. 4；

Second etch structures 20 are used for equipped at least one to the 60 mixing jetting institute of the substrate for being transmitted to the second machining position The second nozzle frame 201 for stating two fluids of etching solution and gas, such as Fig. 5；

Third etch structures 30 are used for equipped at least one to the marginal portion for the substrate 60 for being transmitted to third machining position The third injection nozzle carrier 301 for spraying the etching solution, such as Fig. 6；

4th etch structures 40, equipped at least one for according to the detection information of substrate 60 to being transmitted to the 4th machining position 4th injection nozzle carrier 401 of etching solution described in 60 interrupted injection of substrate, such as Fig. 7；

Exhaust gas removes module 50, for sucking the exhaust gas generated on the substrate and the cooling condensation exhaust gas to be formed back Receive medical fluid and pure gas.

Such as Fig. 4, first etch structures 10 include that there are two first jet frame 101, two first jet framves 101 It is respectively arranged on the upper and lower side of the substrate 60 of first machining position, and two first jet framves 101 are equipped with and are right against institute respectively State an at least first jet 1011 for 60 upper and lower surface of substrate；The vacuum suck module is equipped with close to the true of 60 upper end of substrate Empty inlet nozzle 1022, the vacuum suck nozzle 1022 are connected to Venturi tube 102, the connection of Venturi tube 102 circulation Pump gushes 103；The vacuum suck nozzle 1022 is connected to Venturi tube 102 by a vacuum pipeline 1021.

Preferably, first etch structures 10 further include having the first supply pump to gush 104 and first etching liquid cell 105, First supply pump gushes 104 and is connected to first jet frame 101, and first etching liquid cell 105 is connected to the first supply pump and gushes 104 and first etching liquid cell 105 be set under two first jet framves 101 to recycle the etching solution.

Wherein, the other end of the Venturi tube 102 is connected to the opening of first etching liquid cell 105, will be true The etching solution that suction enters is recovered to first etching liquid cell 105, and first etching liquid cell 105 is inherently stored with The etching solution, to be transmitted to the first jet frame 101 for gushing 104 by first supply pump；Pass through first jet The first jet 1011 of frame 101 sprays etching solution on 60 top of substrate of transfer and lower part, and passes through the vacuum suck module The hydrops on substrate 60 is siphoned away with vacuum to remove pool effect.Specifically the first supply is used from the first etching liquid cell 105 The first jet frame 101 that pumping 104 is arranged to 60 top of substrate and lower part aspirates etching solutions, passes through the of first jet frame 101 One nozzle 1011 sprays etching solution to the top of substrate 60 and lower part.60 top of substrate (specifically center portion) can be sent out at this time Raw hydrops causes pool effect, and above-mentioned hydrops can be removed by the vacuum suck of vacuum suck nozzle 1022, the present embodiment Include that multiple vacuum suck nozzles 1022 are mounted adjacent to 60 top of substrate, text is connected to by vacuum suck pipe 1021 Venturi 102 receives suction, i.e., when transferring liquid to Venturi tube 102 by circulation 103 high speeds of pumping, in Venturi tube 102 Generation attraction is passed to vacuum suck nozzle 1022 can remove the hydrops on 60 top of substrate by vacuum suck.It is inhaled using vacuum Enter nozzle 1022 the advantages of 60 top of substrate only needs the smallest space；First etch structures 10 on substrate (101) top and Respectively comprehensively injection etching solution is etched work for lower part, the hydrops by vacuum suck removal on 60 top of substrate, to prevent Only pool effect can comprehensively do uniform etching on the top of substrate 60, be formed under the conditions of upper and lower part is same accurate Microwire road.

Such as Fig. 5, second etch structures 20 include that there are two second nozzle frame 201, the second supply pumps to gush 202, gas Supply pump gushes 203 and second etching liquid cell 204, and two second nozzle framves 201 are respectively arranged on second machining position The upper and lower side of substrate 60, and two second nozzle framves 201 are equipped with and are right against at least the one second of 60 upper and lower surface of substrate respectively Nozzle 2011；Second supply pump gush 202 and gas supply pump gush 203 and be connected on second nozzle frame 201, and described Two etching liquid cells 204 be connected to the second supply pump gush 202 and second etching liquid cell 204 be set under two second nozzle framves 201 To recycle the etching solution.Preferably, the gas supply pump gushes 203 and is connected with an at least gas heating module 206；With/ Or second etching liquid cell 204 and the second supply pump gush and are also connected with an at least etching solution heating module 205 between 202.

In the second etch structures 20, it is etched to two fluids of 60 mixing jetting etching solution of substrate and gas.Xiang Ji The top and lower part of plate 60 spray the two of gas and etching solution mixing by the second nozzle 2011 on second nozzle frame 201 Fluid body, is distributed jet particle subtle, improves jet velocity and pressure with the pressure of gas, the line on etching microwire road It can be supplied to form energy when between road.Here etching solution is the etching by the second etching liquid cell 204 and second nozzle frame 201 202 supply of supply pumping of liquid supply channel 2021.Especially for etching efficiency is improved, etching solution is supplied by being mounted on etching solution It is heated to the etching solution heating module 205 in approach 2021.Etching solution heating module 205 is added by installing in heating tank Hot device, which directly heats etching solution or heater is mounted on outside heating tank, does indirect heating.And extraneous gas adds in gas Thermal modules 206 are heated, by being mounted on gas supply channel, the suction force supply of the gas supply pumping 203 on 2031 It to second nozzle frame 201, is mixed with the etching solution, gas is supplied to after heating by the form of heating with determined temperature Two injection nozzle carriers 201 can prevent from reducing etching solution temperature because of gas, and low temperature etching liquid causes etching efficiency low.

Such as Fig. 6, the third etch structures 30 include there are two third injection nozzle carrier 301, and two third injection nozzle carriers 301 are distinguished Set on the upper and lower side of the substrate 60 of the third machining position, and two third injection nozzle carriers 301 are corresponding to substrate 60 respectively The marginal portion of upper and lower surface is equipped with several third nozzles 3011.In third etch structures 30, only at the edge of substrate 60 Part injection etching solution carries out required etching.Third by third nozzle 3011 in the marginal portion of required location of etch is sprayed Mouth 3011 sprays etching solution, can accomplish etching part needed for only etching.

Such as Fig. 7, the 4th etch structures 40 include that there are two the 4th injection nozzle carrier 401, two the 4th injection nozzle carrier 401 difference It is respectively equipped with set on the upper and lower side of the substrate 60 of the 4th machining position, and on two the 4th injection nozzle carriers 401 corresponding to substrate 60 At least one the 4th nozzle 4011 of upper and lower surface.4th etch structures 40 further include having third supply pump to gush the erosion of 402, third Carve liquid bath 403, sensor 404 and control unit 405；The third supply pump gushes 402 and is connected to the 4th injection nozzle carrier 401, institute State third etching liquid cell 403 be connected to third supply pump gush 402 and third etching liquid cell 403 be set to two the 4th injection nozzle carriers 401 Under to recycle the etching solution；The sensor 404 be set to the 4th machining position before and described control unit 405 and pass Sensor 404 connects, and described control unit 405 and third supply pump gush 402 connections, and described control unit 405 is according to sensor 404 It detects the detection information of substrate 50, gushes etching solution described in 402 intermittent entries to substrate 60 to control third supply pump It is sprayed.

4th etch structures 40 are to handle at least to be left afterwards to third etch structures (10~30) having carried out above-mentioned first Etch quantity, etching solution is sprayed with intermittence, does round-off work for the formation on microwire road, is perception substrate 60 when transferring substrate 60 Surface mount sensor 404 receives the operation third supply of 405 selectivity of control unit of detection information from sensor 404 The driving of pumping 402 or even the control of valve, can intermittent injection etching solution.It can be etched for intermittent to part injection Liquid, the 4th nozzle 4011 are set as part arrangement in the 4th spray stand 401, can accomplish that control section is sprayed.The sensor 404 It is the pulse (transfer constituted included in driving portion that perception substrate 60, which needs to handle the operation of part etch quantity, in a non-contact manner Substrate), remove information (including the transmitting place, screen information) of the information and substrate 60 perceived is communicated to control list Member 405.Control unit 405 is to spray etching solution to the privileged site of substrate (101) according to interval to be etched with above- mentioned information.

Such as Fig. 3, the exhaust gas removal module generated exhaust gas when including for capturing etching solution described in high-pressure injection Air discharge duct 501, damper 502 and capacitor 503；The damper 502 and capacitor 503 are connected to external washing Device.It is had in above-mentioned etch structures and pernicious gas occurs during etching substrate 60, the present embodiment is with the first etching For structure 10, generated gas and mist are discharged by air discharge duct 501 when capturing high-pressure injection etching solution, are arranged at this time 501 mounting shock absorber 502 of air drain and capacitor 503, which are connected to gas and mist, is arranged in external washer progress forced-ventilated, Liquid medicine to be condensed can be done to be recycled, to external only row's pure gas, the liquid medicine of condensation may be recovered utilization and can save money, to Outside is that pure gas is only discharged, and environmental issue can be done to big minimum.

The first jet frame 101 and/or second nozzle frame 201 are connect with one or so round-trip driving mechanism, the left and right Round-trip driving mechanism includes drive motor 111, rotating disk 112, eccentric shaft 113 and interlocking lever 114；The drive motor 111 connect to drive the rotating disk 112 to be rotated with the lower end of rotating disk 112, and the eccentric shaft 113 is eccentrically mounted at rotation The other end of the upper end of turntable 112 and one end of the interlocking lever 114 is fixedly connected with eccentric shaft 112, the interlocking lever 114 connects It is connected on the first jet frame 101 and/or second nozzle frame 201；Such as Fig. 8, the present embodiment by taking first jet frame 101 as an example into Row explanation.

The first jet frame 101 and/or the when carrying out above-mentioned first etch structures 10 or the second etch structures 20 work Two injection nozzle carriers 201 generally require carry out level and move back and forth to ensure the abundant of etching, by with the round-trip of institute's constant speed degree, spray Move back and forth first jet frame 101 and/or second nozzle frame 201 in institute's set a distance when penetrating etching solution, make 60 top of substrate and under The comprehensive etching solution in portion is uniformly distributed and pressure injection, forms uniform etching, improves the quality on production microwire road.Certainly round-trip Move driving structure also has many feasible examples in addition to the foregoing.

When etching work, above-mentioned 10 to the 4th etch structures 40 of the first etch structures be job order be can carry out it is more The variation of sample, such as 20 to the 4th etch structures 40 of the second etch structures are simultaneously operable, and can be occurred in the first etch structures 10 Before or after.

In conclusion the spray disk device described in the utility model for being configured to microwire road, including promising formation microwire road direction First etch structures of all substrates injection etching solutions and the etching solution by vacuum suck removal product on the substrate, It include the second etch structures of etching solution and gas mixing being etched with two fluids, only in substrate to substrate injection Injection etching solution in edge does the third etch structures of part etching, is sprayed according to the base plate transfer situation to the substrate intermittence It penetrates the 4th etch structures of etching solution and eliminates the exhaust gas removal module of exhaust gas.Whereby, the utility model can effectively be gone Except the etching solution on substrate makes multiple faces of etching form relatively uniform etching, the microwire of embodiment according to the present utility model It is below can effectively to be produced line width route 30/30um by road production for the fusion progress of the etching technique sequence of above-mentioned multiplicity Microwire base board improves the quality of product.

Certainly, the utility model can also have other various embodiments, without departing substantially from the spirit of the present invention and its essence In the case of, those skilled in the art work as can make various corresponding changes and modifications, but these according to the utility model Corresponding changes and modifications all should belong to the protection scope of the utility model the attached claims.

Claims (9)

1. a kind of spray disk device for being configured to microwire road, which is characterized in that include:

First etch structures, equipped at least one for spraying the first jet frame of etching solution to the substrate for being transmitted to the first machining position And the vacuum suck module of at least one etching solution for being discharged on the substrate；

Second etch structures, equipped at least one for being transmitted to etching solution described in the substrate mixing jetting of the second machining position With the second nozzle frame of two fluids of gas；

Third etch structures, equipped at least one for described in the injection of the marginal portion for the substrate for being transmitted to third machining position The third injection nozzle carrier of etching solution；

4th etch structures, equipped at least one for according to the detection information of the substrate to being transmitted to described in the 4th machining position 4th injection nozzle carrier of etching solution described in substrate interrupted injection；

Exhaust gas removes module, for sucking the exhaust gas generated on the substrate and the cooling condensation exhaust gas to form released liquor And pure gas；

The exhaust gas removes the air discharge duct of generated exhaust gas when module includes for capturing etching solution described in high-pressure injection, subtracts Shake device and capacitor；The damper and the capacitor are connected to external washer.

2. the spray disk device according to claim 1 for being configured to microwire road, which is characterized in that the first etch structures packet It includes there are two the first jet frame, two first jet framves are respectively arranged on the upper of the substrate of first machining position Lower end, and two first jet framves are equipped at least first jet for being right against the substrate upper and lower surface respectively；

The vacuum suck module is equipped with the vacuum suck nozzle close to the substrate upper end, the vacuum suck nozzle connection To Venturi tube, the Venturi tube connection circulating pump gushes.

3. the spray disk device according to claim 2 for being configured to microwire road, which is characterized in that first etch structures are also Include the first supply pump gush with the first etching liquid cell, first supply pump, which is gushed, is connected to the first jet frame, described One etching liquid cell is connected to that first supply pump is gushed and first etching liquid cell is set under two first jet framves To recycle the etching solution.

4. the spray disk device according to claim 1 for being configured to microwire road, which is characterized in that the second etch structures packet Include there are two the second nozzle frame, the second supply pump is gushed, gas supply pump is gushed and the second etching liquid cell, two described second Injection nozzle carrier is respectively arranged on the upper and lower side of the substrate of second machining position, and two second nozzle framves are equipped with difference It is right against an at least second nozzle for the substrate upper and lower surface；

Second supply pump, which gushes to gush with the gas supply pump, to be connected on the second nozzle frame, and second etching Liquid bath is connected to that second supply pump is gushed and second etching liquid cell is set under two second nozzle framves with recycling The etching solution.

5. the spray disk device according to claim 4 for being configured to microwire road, which is characterized in that the gas supply pump gushes company It is connected to an at least gas heating module；And/or

Second etching liquid cell and second supply pump are also connected with an at least etching solution heating module between gushing.

6. the spray disk device according to claim 1 for being configured to microwire road, which is characterized in that the third etch structures packet It includes there are two the third injection nozzle carrier, two third injection nozzle carriers are respectively arranged on the upper of the substrate of the third machining position Lower end, and two third injection nozzle carriers are equipped with several thirds in the marginal portion for corresponding to the substrate upper and lower surface respectively Nozzle.

7. the spray disk device according to claim 1 for being configured to microwire road, which is characterized in that the 4th etch structures packet It includes there are two the 4th injection nozzle carrier, two the 4th injection nozzle carriers are respectively arranged on the upper of the substrate of the 4th machining position Lower end, and at least one the 4th nozzle corresponding to the substrate upper and lower surface is respectively equipped on two the 4th injection nozzle carriers.

8. the spray disk device according to claim 7 for being configured to microwire road, which is characterized in that the 4th etch structures are also Include third supply pump gush, third etching liquid cell, sensor and control unit；The third supply pump gush be connected to it is described 4th injection nozzle carrier, the third etching liquid cell be connected to the third supply pump gush and the third etching liquid cell be set to two institutes It states under the 4th injection nozzle carrier to recycle the etching solution；

Before the sensor is set to the 4th machining position and described control unit is connect with the sensor, and the control is single First gush with the third supply pump connect, and described control unit detects that the detection of the substrate is believed according to the sensor Breath, gushes etching solution described in intermittent entry to control the third supply pump to spray the substrate.

9. the spray disk device according to claim 1 for being configured to microwire road, which is characterized in that the first jet frame and/ Or the second nozzle frame is connect with one or so round-trip driving mechanism, the round-trip driving mechanism in left and right include drive motor, Rotating disk, eccentric shaft and interlocking lever, the drive motor connect with the lower end of the rotating disk with drive the rotating disk into Row rotation, the eccentric shaft is mounted on the upper end of the rotating disk and one end of the interlocking lever is fixed with the eccentric shaft Connection, the other end of the interlocking lever are connected on the first jet frame and/or the second nozzle frame.