CN209202671U - A kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate - Google Patents

Abstract

The utility model provides a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate, including cup lid and cup body, cup lid is adapted with cup body, it further include leading Wen Zhu, lead Wen Zhuwei metal copper post or metallic aluminium column or graphene column, and it leads and is equipped with heat pipe in Wen Zhu, it leads to be connected at the top of Wen Zhu and dissipates temperature portion, it leads to be arranged with outside Wen Zhu and leads warm shell, it leads warm column lower section side and is equipped at least one semiconductor chilling plate being vertically arranged, working face is close to lead Wen Zhu respectively and leads warm shell inside and outside semiconductor chilling plate, the space in warm shell in addition to leading Wen Zhu and semiconductor chilling plate is led filled with thermal insulation liner, through-hole compatible with warm shell is led is equipped in the middle part of cup lid.Advantage is: semiconductor chilling plate is placed directly in cup body, and the semiconductor chilling plate of different number can be selected according to actual needs, so that the energy of semiconductor chilling plate can be directly delivered in the intracorporal water of cup, to greatly reduce the loss in energy transmission, heating and refrigerating efficiency are improved.

Description

A kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate

Technical field

The utility model relates to cup technical field more particularly to a kind of high-efficiency cold-hot based on semiconductor chilling plate are dual-purpose Cup.

Background technique

Semiconductor chilling plate is also thermoelectric module, and its advantages are reliability requirement height, the field of no refrigerant pollution It closes.Using the Peltier effect of semiconductor material, when the galvanic couple that direct current is connected by two kinds of different semiconductor materials, Heat can be absorbed respectively at the both ends of galvanic couple and releases heat, and the purpose freezed and heated may be implemented.In existing cup In, the technology of semiconductor chilling plate is also utilized extensively, the water in cup is heated and freezed to realize.

Currently, semiconductor chilling plate is used in the patent in cup, semiconductor mainly is set on cup lid or cup holder Cooling piece, and by way of heat transfer, the water in cup body is heated or freezed to realize, such as: the patent No.: CN201510328882.9, entitled " a kind of open air solar refrigeration cup " and the patent No.: CN201320197879.4, Entitled " a kind of multi-functional cup holder " etc., all discloses the relevant technologies, but they have a defect that, semiconductor chilling plate is all It is placed in outside cup body, needs to realize that heat is conducted by warm medium is led, efficiency when so heating or freezing is lower, and deposits Energy loss.

Summary of the invention

To solve the above problems, the utility model discloses a kind of dual-purpose water of the high-efficiency cold-hot based on semiconductor chilling plate Cup.

In order to reach the goals above, the utility model provides the following technical solutions:

A kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate, including cup lid and cup body, the cup lid and cup body It is adapted, it is characterised in that: it further include leading Wen Zhu, it is described to lead Wen Zhuwei metal copper post or metallic aluminium column or graphene column, and lead Heat pipe is equipped in Wen Zhu, described lead is connected with scattered temperature portion, leads to be arranged with outside Wen Zhu and lead warm shell at the top of Wen Zhu, described to lead under Wen Zhu Section side is equipped at least one semiconductor chilling plate being vertically arranged, working face difference inside and outside the semiconductor chilling plate Abutting leads Wen Zhu and leads warm shell, and the space led in warm shell in addition to leading Wen Zhu and semiconductor chilling plate is filled in thermal insulation Lining, the cup lid middle part are equipped with through-hole compatible with warm shell is led.

Further, the scattered temperature portion includes shell, is equipped in the shell and dissipates warm piece and fan, and the scattered temperature piece is horizontal It is arranged in cup lid top surface, and dissipates warm piece bottom and connect with warm top end is led, the fan is arranged above scattered warm piece or side.

Further, it is evenly equipped on the shell and dissipates warm hole.

Further, described to lead warm shell as metal-back.

It further, further include suction pipe, the suction pipe is adapted with the middle through-hole of cup lid.

Compared with prior art, the utility model has the beneficial effects that:

1, semiconductor chilling plate is placed directly in cup body, and the semiconductor system of different number can be selected according to actual needs Cold, so that the energy of semiconductor chilling plate can be directly delivered in the intracorporal water of cup, to greatly reduce in energy transmission Loss, improve heating and refrigerating efficiency；

2, connected using Wen Zhuyu semiconductor chilling plate is led, so that the outside working face of semiconductor chilling plate is to water in cup body When being freezed, inward facing surface heat dissipation, inside heat can be transmitted to cup lid top surface by leading Wen Zhu, complete heat dissipation, and work as When the outside working face of semiconductor chilling plate heats water in cup body, inward facing surface refrigeration, inside cooling capacity is the same can It is transmitted to cup lid top surface by leading Wen Zhu, to ensure that the job stability of semiconductor chilling plate, securely and reliably；

3, Wen Zhu is led using hollow structure, and hollow space is embedded heat pipe inside it, thus by combining the fast of heat pipe Speed heat hereditary property can effectively ensure that the heat conduction efficiency for leading Wen Zhu, and then ensure semiconductor chilling plate energy trouble free service；

4, the space filling thermal insulation liner in warm shell in addition to leading Wen Zhu and semiconductor chilling plate is being led, is thus preventing half When conductor cooling piece works, temperature caused by domestic and foreign work face influences each other, and guarantees that leading stablizing for warm shell heats and freeze.

Detailed description of the invention

Fig. 1 is that fan setting is dissipating temperature in a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate of the utility model Structural schematic diagram above piece.

Fig. 2 is the cross-sectional view of A-A ' in Fig. 1.

Fig. 3 is that fan setting is dissipating temperature in a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate of the utility model The structural schematic diagram of piece side.

Reference signs list:

1- cup lid, 2- cup body, 3- lead Wen Zhu, and 4- dissipates temperature portion, 41- shell, and 411- dissipates warm hole, and 42- dissipates warm piece, 43- fan, 5- leads warm shell, 6- semiconductor chilling plate, 7- thermal insulation liner, 8- heat pipe.

Specific embodiment

With reference to the accompanying drawings and detailed description, the utility model is furtherd elucidate, it should be understood that following specific embodiment parties Formula is merely to illustrate the utility model rather than limitation the scope of the utility model.It should be noted that making in being described below Word "front", "rear", "left", "right", "up" and "down" refer to that the direction in attached drawing, word "inner" and "outside" respectively refer to Be directed towards or far from geometric center of specific component direction.

As shown, a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate, including cup lid 1 and cup body 2, cup lid 1 is adapted with cup body 2, further includes leading warm column 3, and leading warm column 3 is metal copper post or metallic aluminium column or graphene column, and leads warm column 3 Interior to be equipped with heat pipe 8, the top for leading warm column 3, which is connected with, dissipates temperature portion 4, leads to be arranged with outside warm column 3 and leads warm shell 5, leads warm 3 lower section side of column Equipped with the semiconductor chilling plate 6 that at least one is vertically arranged, working face is close to lead temperature respectively inside and outside semiconductor chilling plate 6 Column 3 and warm shell 5 is led, leads the space in warm shell 5 in addition to leading warm column 3 and semiconductor chilling plate 6 filled with thermal insulation liner 7, cup lid 1 Middle part is equipped with through-hole compatible with warm shell 5 is led.In the present embodiment, leading warm column 3 is prism-shaped, and lower section is fitted on side One semiconductor chilling plate 6, but those skilled in the art also may be selected of different shapes to lead warm column 3 and can be affixed with its side The semiconductor chilling plate 6 of conjunction, and can the half of different number be bonded on the vertical and horizontal direction for leading warm 3 outside of column as needed Conductor cooling piece.By being embedded heat pipe 8 leading in warm column 3, in conjunction with the quick thermal transport property of heat pipe 8, so that semiconductor refrigerating The heat of 6 inside of piece can quickly be passed out outside cup body 2 by leading warm column 3, so that it is guaranteed that semiconductor chilling plate 6 can safety and stability work Make, in addition, and those skilled in the art any metal can not be wrapped up outside heat pipe 8(i.e. heat pipe 8 leading warm column 3 and directly replacing with Layer), to reduce the volume of whole heating column 3.

Semiconductor chilling plate 6 is placed directly in cup body 2 by the utility model, and can according to the capacity of practical cup body 2, use The factors such as the needs of person and cost select the semiconductor chilling plate 6 of different number, when so that semiconductor chilling plate 6 working, Energy can be directly delivered in the liquid in cup body 2, to greatly reduce the loss in energy transmission, improve heating and system Cold efficiency, in addition, thermal insulation liner 7 is filled leading the space in warm shell 5 in addition to leading warm column 3 and semiconductor chilling plate 6, so as to When preventing semiconductor chilling plate 6 from working, temperature caused by domestic and foreign work face influences each other, and guarantees that leading stablizing for warm shell 5 heats And refrigeration.

In the present embodiment, dissipating temperature portion 4 includes shell 41, is equipped in shell 41 and dissipates warm piece 42 and fan 43, dissipates temperature piece 42 It is horizontally set on 1 top surface of cup lid, and dissipates warm 42 bottom of piece and is connect with warm 3 top of column is led, the setting of fan 43 is dissipating above warm piece 42 Or side, wherein be evenly equipped on shell 4 and dissipate warm hole 411.

So that inward facing surface dissipates when the outside working face of semiconductor chilling plate 6 freezes to liquid in cup body 2 Heat, inside heat can be transmitted on the scattered temperature piece 42 of cup lid top surface by leading warm column 3, in conjunction with fan 43, so as to effectively fast Speed heat dissipation, and when the outside working face of semiconductor chilling plate 6 heats liquid in cup body 2, inward facing surface refrigeration, Inside cooling capacity is the same to be transmitted on the scattered temperature piece 42 of cup lid top surface by leading warm column 3, in conjunction with fan 43, realize and quickly dissipate Temperature, to ensure that the job stability of semiconductor chilling plate 6, securely and reliably.

In the present embodiment, leading warm shell 5 is metal-back, and the heat transfer efficiency for leading warm shell 5 can be improved.

It in the present embodiment, further include suction pipe, suction pipe is adapted with the middle through-hole of cup lid 1, wait lead warm column 3 in cup body Liquid heating or refrigeration after the completion of, scattered temperature portion 4 can be taken out together together with warm column 3 is led, be inserted into suction pipe and drunk, torn open It fills easy to use, has a vast market foreground.

Further, it should be noted that the warm column 3 of leading in the application is not limited to that only the intracorporal liquid of cup is heated or freezed, Also can be suitably used for in different vessels different material and other there is the substance of heating or refrigeration demand to be heated accordingly Or refrigerating operation.

Technological means disclosed in the utility model is not limited only to technological means disclosed in above embodiment, also Including technical solution consisting of any combination of the above technical features.It should be pointed out that for the ordinary skill of the art For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit Decorations are also considered as the protection scope of the utility model.

Claims (5)

1. a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate, including cup lid (1) and cup body (2), the cup lid (1) It is adapted with cup body (2), it is characterised in that: further include leading Wen Zhu (3), described lead Wen Zhu (3) are metal copper post or metallic aluminium column Or graphene column, and lead in Wen Zhu (3) and be equipped with heat pipe (8), described lead is connected with scattered temperature portion (4) at the top of Wen Zhu (3), lead Wen Zhu (3) it is arranged with and leads warm shell (5) outside, Wen Zhu (3) the lower section side of leading is equipped at least one semiconductor chilling plate being vertically arranged (6), working face is close to lead Wen Zhu (3) respectively and be led warm shell (5) inside and outside the semiconductor chilling plate (6), described to lead temperature Space in shell (5) in addition to leading Wen Zhu (3) and semiconductor chilling plate (6) is filled with thermal insulation liner (7), in the cup lid (1) Portion is equipped with and leads the compatible through-hole of warm shell (5).

2. a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: institute Stating scattered temperature portion (4) includes shell (41), is equipped in the shell (41) and dissipates warm piece (42) and fan (43), the scattered temperature piece (42) It is horizontally set on cup lid (1) top surface, and dissipates warm piece (42) bottom and is connect with Wen Zhu (3) top is led, fan (43) setting exists Dissipate temperature piece (42) top or side.

3. a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate according to claim 2, it is characterised in that: institute It states to be evenly equipped on shell (41) and dissipates warm hole (411).

4. a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: institute Stating and leading warm shell (5) is metal-back.

5. a kind of high-efficiency cold-hot dual-purpose cup based on semiconductor chilling plate according to claim 1, it is characterised in that: also Including suction pipe, the suction pipe is adapted with the middle through-hole of cup lid (1).