CN211601185U - Semiconductor refrigeration equipment for material testing - Google Patents
Semiconductor refrigeration equipment for material testing Download PDFInfo
- Publication number
- CN211601185U CN211601185U CN201922244028.0U CN201922244028U CN211601185U CN 211601185 U CN211601185 U CN 211601185U CN 201922244028 U CN201922244028 U CN 201922244028U CN 211601185 U CN211601185 U CN 211601185U
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- Prior art keywords
- semiconductor refrigeration
- fixedly connected
- threaded rod
- test box
- ring
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000005057 refrigeration Methods 0.000 title claims abstract description 38
- 238000004154 testing of material Methods 0.000 title claims description 10
- 238000012360 testing method Methods 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 23
- 230000006835 compression Effects 0.000 claims description 21
- 238000007906 compression Methods 0.000 claims description 21
- 238000005299 abrasion Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 239000003973 paint Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 238000000926 separation method Methods 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor refrigeration equipment for material test, which belongs to the technical field of semiconductor refrigeration, and comprises a test box, wherein the front and back inner walls of the test box are fixedly connected with a separation plate, a semiconductor refrigeration sheet is arranged in the separation plate, the left and right ends of the semiconductor refrigeration sheet are respectively provided with a heat dissipation end and a refrigeration end, the left end of the test box is provided with a pair of jacks, a threaded rod is inserted in the jack, the left end of the threaded rod is fixedly connected with a hand push plate, the outer end of the separation plate is provided with two alternating current holes which are symmetrical about the semiconductor refrigeration sheet, one end of the threaded rod far away from the hand push plate is fixedly connected with a closing plate, the closing plate is positioned at the right side of the separation plate, so that the cold air in the refrigeration end of the semiconductor refrigeration sheet is guided into the hot air in the heat dissipation end after the material low, thereby improving the efficiency of testing the material.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field, more specifically say, relate to a semiconductor refrigeration plant is used in material test.
Background
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. Its advantages are no slide part, limited space, high reliability and no pollution of refrigerant. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability.
At present, when testing the expend with heat and contract with cold nature of material, through in the test box in proper order observing the state of material under high temperature and low temperature, but among the prior art, after carrying out the low temperature test to the material, need wait for its temperature to reduce for its heat dissipation end and refrigeration end all recover to the normal atmospheric temperature and just can carry out cold and hot exchange, have reduced the efficiency to the material test.
Disclosure of Invention
1. Technical problem to be solved
To the problem that exists among the prior art, the utility model aims to provide a semiconductor refrigeration plant is used in material test, it can realize after the test of material low temperature, through with the leading-in hot-air in exothermic end of the cold air in the refrigeration end of semiconductor refrigeration piece to can accelerate the speed of the temperature recovery at the both ends of semiconductor refrigeration piece, thereby can improve the efficiency to the material test.
2. Technical scheme
In order to solve the above problems, the utility model adopts the following technical proposal.
A semiconductor refrigeration device for material testing comprises a testing box, wherein the front inner wall and the rear inner wall of the testing box are fixedly connected with a separation plate, a semiconductor refrigeration sheet is installed in the separation plate, the left end and the right end of the semiconductor refrigeration sheet are respectively a heat dissipation end and a refrigeration end, a pair of insertion holes are formed in the left end of the testing box, a threaded rod is inserted in the insertion holes, a hand push plate is fixedly connected with the left end of the threaded rod, two alternating current holes symmetrical about the semiconductor refrigeration sheet are formed in the outer end of the separation plate, a sealing plate is fixedly connected with one end, far away from the hand push plate, of the threaded rod, the sealing plate is positioned on the right side of the separation plate, a nut is in threaded connection with the outer end of the threaded rod, a retaining ring is fixedly connected with the outer end of the threaded, after the material low-temperature test can be realized, cold air in the refrigerating end of the semiconductor refrigerating sheet is guided into hot air in the heat releasing end, so that the temperature recovery speed of the two ends of the semiconductor refrigerating sheet can be accelerated, and the efficiency of the material test can be improved.
Furthermore, the left end of the test box is fixedly connected with an anti-abrasion ring, the anti-abrasion ring is located at the hole opening of the jack, and the possibility that the hole opening of the jack is abraded can be reduced by arranging the anti-abrasion ring, so that the heat-insulation pad at the outer end of the nut is not easy to damage.
Further, the equal fixedly connected with in one end of each examination level of shrouding and nut keeps warm and fills up, through setting up the heat preservation pad, can make shrouding and nut respectively with division board and test box when offsetting, fill up the transmission that can reduce the temperature through keeping warm.
Further, compression spring is made by stainless steel material, compression spring surface is scribbled and is equipped with the anti-rust paint, through using stainless steel material preparation compression spring and scribbling on its surface and be equipped with the anti-rust paint, can be so that compression spring is difficult for being rusted in long-term use to can improve compression spring's life.
Further, the inner wall of handing-over the orifice glues and is equipped with the sponge ring, the sponge ring bonds through the inner wall in double faced adhesive tape and interchange hole, through setting up the sponge ring, can absorb the water droplet of near cold and hot department of alternating condensation in hole of exchanging, will hand-over the orifice and bond with the sponge ring through using the double faced adhesive tape to conveniently hand-over the orifice and change.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages of:
(1) this scheme can realize to material low temperature test back, through with the leading-in hot-air to exothermic in the end of giving out heat of the cold air in the refrigeration end of semiconductor refrigeration piece to can accelerate the speed of the temperature recovery at the both ends of semiconductor refrigeration piece, thereby can improve the efficiency to material test.
(2) The left end of the test box is fixedly connected with the anti-abrasion ring, the anti-abrasion ring is located at the hole opening of the jack, and the possibility that the hole opening of the jack is abraded can be reduced by arranging the anti-abrasion ring, so that the heat-insulation pad at the outer end of the nut is not easy to damage.
(3) The equal fixedly connected with heat preservation of one end of each other examination level of shrouding and nut fills up, through setting up the heat preservation pad, can be so that shrouding and nut when offsetting with division board and test box respectively, fill up the transmission that can reduce the temperature through keeping warm.
(4) Compression spring is made by stainless steel material, and compression spring surface is scribbled and is equipped with the anti-rust paint, and through using stainless steel material preparation compression spring and scribbling on its surface and be equipped with the anti-rust paint, can be so that compression spring is difficult for being rusted in long-term use to can improve compression spring's life.
(5) The inner wall of handing-over hole glues and is equipped with the sponge ring, and the sponge ring bonds through the double faced adhesive tape and the inner wall of exchanging the hole, through setting up the sponge ring, can absorb the water droplet of near cold and hot department of alternating condensation of exchanging the hole, will hand over the hole and bond with the sponge ring through using the double faced adhesive tape to conveniently hand over the hole and change.
Drawings
Fig. 1 is an overall cross-sectional view of the present invention;
fig. 2 is a schematic structural diagram at a in fig. 1.
The reference numbers in the figures illustrate:
the testing device comprises a testing box 1, a separating plate 2, a semiconductor refrigerating piece 3, a jack 4, a threaded rod 5, a hand pushing plate 6, an alternating-current hole 7, a sealing plate 8, a nut 9, a retaining ring 10, a compression spring 11, an anti-abrasion ring 12 and a heat-insulating pad 13.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-2, a semiconductor refrigeration device for material testing includes a testing box 1, a partition plate 2 is fixedly connected to the front and rear inner walls of the testing box 1, a semiconductor refrigeration sheet 3 is installed in the partition plate 2, and a person skilled in the art can select a suitable semiconductor refrigeration sheet 3 according to actual needs, for example: the TEC1-12703T125, the left end and the right end of a semiconductor refrigerating sheet 3 are respectively a heat dissipation end and a refrigerating end, the left end of a test box 1 is chiseled with a pair of insertion holes 4, a threaded rod 5 is inserted in the insertion holes 4, the left end of the threaded rod 5 is fixedly connected with a hand push plate 6, the outer end of a partition plate 2 is chiseled with two alternating current holes 7 symmetrical about the semiconductor refrigerating sheet 3, one end of the threaded rod 5 far away from the hand push plate 6 is fixedly connected with a seal plate 8, the seal plate 8 is positioned on the right side of the partition plate 2, the outer end of the threaded rod 5 is in threaded connection with a nut 9, the nut 9 is positioned on the left side of the test box 1, the outer end of the threaded rod 5 is fixedly connected with a baffle ring 10, a compression spring 11 is fixedly connected between the baffle ring 10 and the inner wall of the test box, therefore, the speed of temperature recovery of the two ends of the semiconductor refrigerating sheet can be increased, and the efficiency of material testing can be improved.
Referring to fig. 1-2, the left end of the testing box 1 is fixedly connected with an anti-wear ring 12, the anti-wear ring 12 is located at the orifice of the jack 4, the possibility of abrasion at the orifice of the jack 4 can be reduced by arranging the anti-wear ring 12, so that the heat insulation pad 13 at the outer end of the nut 9 is not easily damaged, the heat insulation pads 13 are fixedly connected to the mutually examined ends of the sealing plate 8 and the nut 9, when the sealing plate 8 and the nut 9 abut against the partition plate 2 and the testing box 1 respectively by arranging the heat insulation pads 13, the temperature transmission can be reduced by the heat insulation pads 13, the compression spring 11 is made of stainless steel, the surface of the compression spring 11 is coated with anti-rust paint, the compression spring 11 is made of stainless steel and coated with anti-rust paint on the surface thereof, so that the compression spring 11 is not easily corroded in a long-term use process, thereby prolonging the service, the inner wall of the alternating current hole 7 is adhered with a sponge ring, the sponge ring is adhered with the inner wall of the alternating current hole 7 through a double faced adhesive tape, and the sponge ring is arranged, so that water drops condensed at the cold and hot alternation part near the alternating current hole 7 can be absorbed, and the alternating current hole 7 is adhered with the sponge ring through the double faced adhesive tape, so that the alternating current hole 7 is convenient to replace.
When an operator uses the utility model to perform cold and hot alternation, firstly, the operator uses the hand to rotate the nut 9, the nut 9 is rotated towards the direction close to the hand push plate 6, so that the threaded rod 5 slides in the jack 4 under the reset action of the compression spring 11, thereby the sealing plate 8 is separated from the division plate 2, thereby the cold air at the left side of the division plate 2 is contacted with the hot air at the right side of the division plate 2, secondly, the operator can rotate the nut 9 to the vicinity of the hand push plate 6, then the hand is used to pull the hand push plate 6 at the left side repeatedly, thereby the sealing plate 8 is translated repeatedly at the right side of the division plate 2, the cold air can be accelerated to enter into the hot air to be contacted with the hot air through the cross flow hole 7, compared with the prior art, the utility model can realize the cold air in the refrigerating end of the semiconductor refrigerating sheet 3 after the low-temperature test of the material, therefore, the speed of temperature recovery of the two ends of the semiconductor refrigerating sheet 3 can be accelerated, and the efficiency of material testing can be improved.
The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.
Claims (5)
1. The utility model provides a semiconductor refrigeration plant is used in material test, includes test box (1), its characterized in that: inner wall fixedly connected with division board (2) around test box (1), install semiconductor refrigeration piece (3) in division board (2), semiconductor refrigeration piece (3) is controlled both ends and is held with the refrigeration when respectively, test box (1) left end is dug and is had a pair of jack (4), jack (4) interpolation is equipped with threaded rod (5), threaded rod (5) left end fixedly connected with hand push pedal (6), division board (2) outer end is dug and is had two traffic hole (7) about semiconductor refrigeration piece (3) symmetry, threaded rod (5) keep away from one end fixedly connected with shrouding (8) of hand push pedal (6), shrouding (8) are located division board (2) right side, threaded rod (5) outer end threaded connection has nut (9), nut (9) are located test box (1) left side, threaded rod (5) outer end fixedly connected with fender ring (10), keep off fixedly connected with compression spring (11) between ring (10) and test box (1) inner wall, compression spring (11) are located the threaded rod (5) outside.
2. The semiconductor refrigeration device for material testing according to claim 1, wherein: the left end of the test box (1) is fixedly connected with an anti-abrasion ring (12), and the anti-abrasion ring (12) is located at the hole opening of the jack (4).
3. The semiconductor refrigeration device for material testing according to claim 1, wherein: the sealing plate (8) and the nut (9) are fixedly connected with a heat-insulating pad (13) at one end of each examination level.
4. The semiconductor refrigeration device for material testing according to claim 1, wherein: the compression spring (11) is made of stainless steel, and the surface of the compression spring (11) is coated with antirust paint.
5. The semiconductor refrigeration device for material testing according to claim 1, wherein: the inner wall of the cross flow hole (7) is adhered with a sponge ring, and the sponge ring is adhered with the inner wall of the cross flow hole (7) through double faced adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922244028.0U CN211601185U (en) | 2019-12-13 | 2019-12-13 | Semiconductor refrigeration equipment for material testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922244028.0U CN211601185U (en) | 2019-12-13 | 2019-12-13 | Semiconductor refrigeration equipment for material testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211601185U true CN211601185U (en) | 2020-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922244028.0U Expired - Fee Related CN211601185U (en) | 2019-12-13 | 2019-12-13 | Semiconductor refrigeration equipment for material testing |
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| Country | Link |
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| CN (1) | CN211601185U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112556236A (en) * | 2021-01-08 | 2021-03-26 | 东莞市静航电子商务有限公司 | Semiconductor cooling device for cooling small space |
-
2019
- 2019-12-13 CN CN201922244028.0U patent/CN211601185U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112556236A (en) * | 2021-01-08 | 2021-03-26 | 东莞市静航电子商务有限公司 | Semiconductor cooling device for cooling small space |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220211 Address after: 361000 west side of the third floor of plant 1, No. 275, Huanzhu Road, Jimei District, Xiamen City, Fujian Province (axis A-G) Patentee after: Xiamen aierkai Technology Co.,Ltd. Address before: 310000 room 139, building 1, no.1358, Bin'an Road, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: HANGZHOU XINHE ENGINEERING MANAGEMENT CONSULTATION Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200929 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |