CN209181196U - Air conditioner and integrated form air-conditioner controller - Google Patents
Air conditioner and integrated form air-conditioner controller Download PDFInfo
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- CN209181196U CN209181196U CN201820918459.3U CN201820918459U CN209181196U CN 209181196 U CN209181196 U CN 209181196U CN 201820918459 U CN201820918459 U CN 201820918459U CN 209181196 U CN209181196 U CN 209181196U
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Abstract
The utility model discloses a kind of air conditioners and integrated form air-conditioner controller, wherein controller includes: substrate；The device layer being formed on substrate, device layer include: the rectifier bridge being arranged on substrate；The PFC pfc circuit for being arranged on substrate and being connected with rectifier bridge；The compressor drive circuit that compressor is driven on substrate is set；The fan drive circuit that blower is driven on substrate is set；Drive the compressor control chip of compressor drive circuit；And the air-blower control chip of driving fan drive circuit；Covering and the filled layer for surrounding device layer；The heat sink being formed on filled layer.It is radiated as a result, by being formed in the two-side radiation plate on filled layer, to solve the problems, such as because the power module calorific value caused by integrated form air-conditioner controller is highly integrated is big, and then promotes the reliability of integrated form air-conditioner controller.
Description
Technical field
The utility model relates to electronic control technology field, in particular to a kind of integrated form air-conditioner controller and a kind of air-conditioning
Device.
Background technique
Currently, electric-controlled plate mainly includes rectifier bridge, PFC switch, compressor IPM (Intelligent outside convertible frequency air-conditioner room
Power Module, intelligent power module), blower IPM these four power devices.Electric-controlled plate outside the convertible frequency air-conditioner room of the relevant technologies
On these four power devices can be configured by way of integrated.
But the problem of the relevant technologies, is, existing integration mode be by by rectifier bridge, PFC switch, compressor IPM,
Blower IPM is mounted on pcb board with respective contact pin type, and this integration mode causes when component works, entire electric-controlled plate
Temperature can increase, and may result in the decline of electric-controlled plate performance or some components reduced lifetime, to influence electric-controlled plate
The problems such as reliability.
Utility model content
The utility model is intended to solve one of the technical problem in above-mentioned technology at least to a certain extent.For this purpose, this reality
It is to propose a kind of integrated form air-conditioner controller with a novel purpose, passes through the two-side radiation plate being formed on filled layer
It radiates, to solve the problems, such as because the power module calorific value caused by integrated form air-conditioner controller is highly integrated is big, in turn
Promote the reliability of integrated form air-conditioner controller.
Second purpose of the utility model is to propose a kind of air conditioner.
In order to achieve the above objectives, the integrated form air-conditioner controller that the utility model first aspect proposes includes: substrate；It is formed
Device layer on the substrate, the device layer include: the rectifier bridge being arranged on the substrate；It is arranged in the base
The PFC pfc circuit being connected on plate and with rectifier bridge, wherein the pfc circuit includes PFC switching tube and PFC
Diode；The compressor drive circuit that compressor is driven on the substrate is set, wherein the compressor drive circuit packet
Include the first to the 6th switching tube and the first to the 6th fast recovery diode with the described first to the 6th paralleled power switches；If
Set the fan drive circuit that blower is driven on the substrate, the fan drive circuit includes first to the 6th inverse leading
IGBT；The compressor control chip of the compressor drive circuit is driven, the compressor control chip is arranged in the substrate
On and be connected with the compressor drive circuit；And the air-blower control chip of the driving fan drive circuit, the wind
Machine control chip is arranged on the substrate and is connected with the fan drive circuit；It covers and surrounds filling out for the device layer
Fill layer；The heat sink being formed on the filled layer.
Integrated form sky according to the present utility model mentions controller, as a result, the two-side radiation by being formed on filled layer
Plate radiates, to solve the problems, such as because the power module calorific value caused by integrated form air-conditioner controller is highly integrated is big, into
And promote the reliability of integrated form air-conditioner controller.
In addition, can also have following additional technology according to the utility model integrated form air-conditioner controller set forth above
Feature:
In some instances, the device layer further include: microcontroller, microcontroller setting the substrate it
On, and the microcontroller is connected with the compressor control chip and air-blower control chip.
In some instances, the PFC switching tube includes the HEMT device of SiC MOSFET, SiC IGBT or GaN material
Part, PFC diode are Si material device.
In some instances, the described first to the 6th switching tube includes SiC MOSFET, SiC IGBT or GaN material
HEMT device, the described first to the 6th fast recovery diode are Si material device.
In some instances, the described first to the 6th inverse IGBT that leads is Si material device.
In some instances, the rectifier bridge, the pfc circuit, the compressor drive circuit, blower driving electricity
It is connected by plain conductor with metal jumper between road, the compressor control chip and the air-blower control chip.
In some instances, the integrated form air-conditioner controller is DIP encapsulation.
In some instances, the bottom of the substrate is exposed except DIP encapsulation.
In some instances, the rectifier bridge, the pfc circuit, the compressor drive circuit and fan drive circuit
In device be bare chip, the compressor control chip and the air-blower control chip are tube core.
In some instances, the heat sink has heat dissipation fold.
In some instances, the filled layer includes high thermal conductivity DIP encapsulating compound.
In order to achieve the above objectives, the utility model second aspect proposes a kind of air conditioner comprising above-mentioned integrated form is empty
Adjust controller.
According to the utility model proposes air conditioner, using above-mentioned integrated form air-conditioner controller, by being formed in filled layer
On two-side radiation plate radiate, with solve because integrated form air-conditioner controller it is highly integrated caused by power module fever
Big problem is measured, and then promotes the reliability of integrated form air-conditioner controller.
The additional aspect of the utility model and advantage will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The utility model is above-mentioned and/or additional aspect and advantage from the following description of the accompanying drawings of embodiments will
Become obvious and be readily appreciated that, wherein
Fig. 1 is the block diagram according to the integrated form controller of the utility model embodiment；
Fig. 2 is the circuit diagram according to the power module of one specific embodiment of the utility model；
Fig. 3 is according to the block diagram of the integrated form air-conditioner controller of the utility model one embodiment；
Fig. 4 is the schematic diagram of the section structure according to the power module of one specific embodiment of the utility model；
Fig. 5 is the block diagram according to the air conditioner of the utility model embodiment.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
The air conditioner and integrated form air-conditioner controller of the utility model embodiment described with reference to the accompanying drawing.
Fig. 1 is the block diagram according to the integrated form controller of the utility model embodiment.
As shown in Figure 1, integrated form air-conditioner controller 100 includes: substrate 1, device layer 2 and filled layer 3.
Specifically, device layer 2 is formed on substrate 1, and device layer 2 includes: the rectifier bridge 21 being arranged on substrate 1；
The PFC pfc circuit 22 for being arranged on substrate 1 and being connected with rectifier bridge 21, wherein pfc circuit 22 includes PFC
Switching tube and PFC diode；The compressor drive circuit 23 that compressor is driven on substrate 1 is set, wherein driven compressor
Circuit 23 includes the first to the 6th switching tube and the first to the 6th fast two pole of quick-recovery with the first to the 6th paralleled power switches
Pipe；The fan drive circuit 24 that blower is driven on substrate 1 is set, and fan drive circuit 24 includes first to the 6th inverse leading
IGBT；Drive compressor drive circuit 23 compressor control chip 25, compressor control chip 25 be arranged on substrate 1 and
It is connected with compressor drive circuit 23；And the air-blower control chip 26 of driving fan drive circuit 24, air-blower control chip 26
It is arranged on substrate 1 and is connected with fan drive circuit 24；Covering and the filled layer 3 for surrounding device layer 2；It is formed in filled layer
Heat sink 31 on 3.
In the utility model embodiment, the alternating current after the rectification of rectifier bridge 21 becomes direct current, can give power factor school
Positive pfc circuit 22, compressor drive circuit 23 and fan drive circuit 24 provide operating voltage, make integrated form air-conditioner controller
100 can work normally；PFC pfc circuit 22 can carry out PFC according to the electric current after rectification, that is, pass through
It compensates and exchanges power loss caused by the phase difference between electric current and voltage, improve electrical equipment power factor, that is, promoted
Effective use of the integrated form air-conditioner controller 100 to electric power.
Further, compressor drive circuit 23 is connect with the compressor in air-conditioning, can drive compressor operating.Blower
Driving circuit 24 is connect with the blower in air-conditioning, blower can be driven to work.Specifically, the controllable pressure of compressor control chip 25
23 output drive signal of contracting drive circuit, drives compressor operating by driving signal；Air-blower control chip 26 can control wind
24 output drive signal of drive circuit, drives blower by driving signal.
Optionally, it is formed in the aluminum substrate that the heat sink 31 on filled layer 3 can be high for thermal conductivity, and is divided into backside radiator
Substrate and front heat-radiating substrate, wherein the backside radiator substrate surface being formed in the heat sink 31 on filled layer 3 is smooth,
It is easily installed additional heat sink, filled layer 3 is high thermal conductivity material, on the one hand provides insulation environment for circuit, on the other hand will
The heat that device layer 2 issues quickly passes to the backside radiator substrate in the heat sink 31 being formed on filled layer 3.
Further, as shown in Fig. 2, in some instances, device layer 2 further include: microcontroller 27, microcontroller 27 are set
It sets on substrate 1, and microcontroller 27 is connected with compressor control chip 25 and air-blower control chip 26.
In the utility model embodiment, air-conditioning can according to its practical refrigeration effect and the difference of target temperature to compressor with
Blower is further controlled, i.e., integrated form air-conditioner controller 100 can be by microcontroller 27 respectively to compressor control core
Piece 25 and air-blower control chip 26 send control instruction, when compressor control chip 25 and air-blower control chip 26 receive control
When instruction, controls compressor drive circuit 23 and fan drive circuit 24 works, wherein 23 output driving of compressor drive circuit
Signal drives compressor and 24 output drive signal of fan drive circuit by driving signal, drives wind by driving signal
Machine.As a result, by microcontroller can quick response and control Compressors and Fans output adjustment, promote the experience of user.
Optionally, rectifier bridge 21, PFC pfc circuit 22, compressor drive circuit 23 and blower on device layer 2
Driving circuit 24 may be provided at the side of device layer 2, form power device region, that is, power module, 24 He of compressor control chip
Air-blower control chip 25 may be provided at another layer of device layer 2, form control device region, that is, control module.
Fig. 3 is the circuit diagram according to the power module of one specific embodiment of the utility model.
As shown in figure 3, power module includes rectifier bridge 21, pfc circuit 22, compressor drive circuit 23 and blower driving electricity
Road 24, wherein rectifier bridge 21 includes diode 11, diode 12, diode 13, diode 14；Compressor drive circuit 23 wraps
Include the 211~216, first to the 6th fast recovery diode 221~226 of the first to the 6th switching tube and compressor IPM driving 23；
Fan drive circuit 24 includes that the first to the 6th inverse IGBT 311~316 and blower IPM that leads drives 33.
It is understood that above-mentioned power module is by by rectifier bridge 21, compressor drive circuit 23, fan drive circuit
24 are integrated on same heat-radiating substrate 1, can reduce the area of electric-controlled plate outside air conditioning chamber, can also purchase power module (rectifier bridge 21,
Compressor drive circuit 23 and fan drive circuit 24) selected by device be packaged production, further decrease manufacturing cost.
Further, in some instances, PFC switching tube includes SiC MOSFET, SiC IGBT or GaN material
HEMT device, PFC diode are Si material device.
Further, in some instances, the first to the 6th switching tube 211~216 includes SiC MOSFET, SiC IGBT
Or the HEMT device of GaN material, the first to the 6th fast recovery diode are Si material device.
It should be noted that being pressed if the first to the 6th switching tube 211~216 is designed as IGBT made of Si material
Contracting machine IPM drives 23 output voltages to be set as 14-16V, to respectively drive the first to the 6th switching tube 211~216；If first
It is designed as MOS or IGBT made of SiC material to the 6th switching tube 211~216, then compressor IPM drives 23 output voltages to set
It is set to 17~22V, to respectively drive the first to the 6th switching tube 211~216.
That is, when the first to the 6th switching tube 211~216 selects device MOS or IGBT made of SiC material, and
When driving voltage is promoted to 17~22V, the characteristics of SiC device low-power consumption can be given full play to, and reduce fever.
Further, in some instances, the first to the 6th inverse IGBT that leads is Si material device.
It is understood that by the first to the 6th of fan drive circuit it is inverse lead IGBT and be designed as Si material device, can
Power module size, and the characteristic small, low in energy consumption based on blower output electric current are reduced, reducing power module size can be further
Ground solves the problems, such as power module weak heat-dissipating and generates heat high.
Further, in some instances, rectifier bridge 21, pfc circuit 22, compressor drive circuit 23, blower driving electricity
It is connected by plain conductor with metal jumper between road 24, compressor control chip 25 and air-blower control chip 26.
Fig. 4 is the schematic diagram of the section structure according to the power module of one specific embodiment of the utility model.
As shown in figure 4, insulating layer 42 is bonded in the surface of backside radiator substrate 47, thin copper film 43 is located at 42 table of insulating layer
Face, pfc circuit 22, compressor drive circuit 23, the relevant bare chip 44 of fan drive circuit 24 are affixed on 43 surface of thin copper film, and
It is electrically connected with the formation of thin copper film 43.Metal wiring 45 is electrically connected bare chip 44 and thin copper film 43, high thermal conductivity plastic packaging material 46 are filled in
Module front, front heat-radiating substrate 47 are connect with high thermal conductivity plastic packaging material 46.
It should be noted that metal wiring 45 can form small radian, so that the thickness of high thermal conductivity plastic packaging material 46 reduces, thus
Increase the positive radiating rate of module.
Further, in some instances, integrated form air-conditioner controller 100 is DIP encapsulation.
It specifically, can be by using DIP packing forms (such as plastic packaging, encapsulating) to rectifier bridge 2, the PFC in internal circuit
The devices such as circuit 3, compressor drive circuit 4, fan drive circuit 5, compressor control chip 6 and air-blower control chip 7 carry out
Filling package, to play the protective effect to 100 internal circuit of integrated form air-conditioner controller.
Further, in some instances, the bottom of substrate 1 is exposed except DIP encapsulation.
It is understood that the bottom of substrate 1 is exposed except DIP encapsulation, there can be bigger contact area with the external world,
In order to radiate to integrated form air-conditioner controller 100.
Further, in some instances, rectifier bridge 21, pfc circuit 22, compressor drive circuit 23 and blower driving electricity
Device in road 24 is bare chip, and compressor control chip 25 and air-blower control chip 26 are tube core.
It is understood that power module (rectifier bridge 2, pfc circuit 3, compressor drive circuit 4 and fan drive circuit
5) device selected by is bare chip, and is installed on same heat-radiating substrate 1, in order to radiate to power module,
Promote the performance and its reliability of integrated form air-conditioner controller 100.
Further, in some instances, heat sink 31 has heat dissipation fold.
That is, 31 surface of heat sink has heat dissipation fold 571, it is possible to increase the surface area of heat sink 31, and then accelerate
With external heat exchange, to accelerate the heat dissipation of device layer 2.
Further, in some instances, filled layer 3 includes high thermal conductivity DIP encapsulating compound.
Optionally, filled layer 3 can be the high thermal conductivity DIP encapsulating compound of 70~150um thickness.
Specifically, on the one hand high thermal conductivity DIP encapsulating compound is used to protect the thin copper film 53, bare chip 54 and metal of power module
On the other hand wiring 55 is used to the heat that device layer 2 issues quickly passing to the first heat dissipation from the damage of machinery, moisture etc.
Plate 31.
To sum up, controller is mentioned according to the integrated form sky of the utility model embodiment, as a result, by being formed on filled layer
Two-side radiation plate radiate, with solve because the power module calorific value caused by integrated form air-conditioner controller is highly integrated it is big
The problem of, and then promote the reliability of integrated form air-conditioner controller.
Fig. 5 is the block diagram according to the air conditioner of utility model embodiment.As shown in figure 5, the air conditioner 1000 wraps
Include the integrated form air-conditioner controller 100 of above-described embodiment.
Passed through according to the air-conditioning that the utility model embodiment proposes using the integrated form air-conditioner controller of previous embodiment
The two-side radiation plate on filled layer is formed in radiate, with solve because integrated form air-conditioner controller it is highly integrated caused by
The big problem of power module calorific value, and then promote the reliability of integrated form air-conditioner controller.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is based on the figure
Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model
Limitation.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combination and combination.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
Inside it can make changes, modifications, alterations, and variations to the above described embodiments.
Claims (9)
1. a kind of integrated form air-conditioner controller characterized by comprising
Substrate；
The device layer being formed on the substrate, the device layer include:
Rectifier bridge on the substrate is set；
The PFC pfc circuit for being arranged on the substrate and being connected with rectifier bridge, wherein the pfc circuit packet
Include PFC switching tube and PFC diode；
The compressor drive circuit that compressor is driven on the substrate is set, wherein the compressor drive circuit includes
First to the 6th switching tube and the first to the 6th fast recovery diode with the described first to the 6th paralleled power switches；
The fan drive circuit that blower is driven on the substrate is set, and the fan drive circuit includes first to the 6th inverse
Lead IGBT；
Drive the compressor control chip of the compressor drive circuit, the compressor control chip setting the substrate it
Above and with the compressor drive circuit it is connected；And
Drive the air-blower control chip of the fan drive circuit, the air-blower control chip be arranged on the substrate and with
The fan drive circuit is connected；
Cover and surround the filled layer of the device layer；
The heat sink being formed on the filled layer；
The rectifier bridge, PFC pfc circuit, compressor drive circuit and fan drive circuit are arranged in the device
The side of layer forms power device region, and the device layer is arranged in the compressor control chip and air-blower control chip
The other side forms control device region.
2. integrated form air-conditioner controller as described in claim 1, which is characterized in that the described first to the 6th switching tube includes
The HEMT device of SiC MOSFET, SiC IGBT or GaN material, the described first to the 6th fast recovery diode are Si material
Device processed.
3. integrated form air-conditioner controller as described in claim 1, which is characterized in that the described first to the 6th inverse IGBT that leads is Si
Material device.
4. integrated form air-conditioner controller as described in claim 1, which is characterized in that the integrated form air-conditioner controller is DIP
Encapsulation.
5. integrated form air-conditioner controller as claimed in claim 4, which is characterized in that the bottom of the substrate is exposed described
Except DIP encapsulation.
6. integrated form air-conditioner controller as described in claim 1, which is characterized in that the rectifier bridge, the pfc circuit, institute
Stating the device in compressor drive circuit and fan drive circuit is bare chip, the compressor control chip and the blower
Controlling chip is tube core.
7. integrated form air-conditioner controller as described in claim 1, which is characterized in that the heat sink has heat dissipation fold.
8. integrated form air-conditioner controller as described in claim 1, which is characterized in that the filled layer includes high thermal conductivity DIP envelope
Charging.
9. a kind of air conditioner, which is characterized in that including the described in any item integrated form air-conditioner controllers of such as claim 1-8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820918459.3U CN209181196U (en) | 2018-06-13 | 2018-06-13 | Air conditioner and integrated form air-conditioner controller |
| PCT/CN2019/084121 WO2019237836A1 (en) | 2018-06-13 | 2019-04-24 | Highly integrated controller and electrical appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820918459.3U CN209181196U (en) | 2018-06-13 | 2018-06-13 | Air conditioner and integrated form air-conditioner controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209181196U true CN209181196U (en) | 2019-07-30 |
Family
ID=67357407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820918459.3U Active CN209181196U (en) | 2018-06-13 | 2018-06-13 | Air conditioner and integrated form air-conditioner controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209181196U (en) |
-
2018
- 2018-06-13 CN CN201820918459.3U patent/CN209181196U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230117 Address after: 400064 plant 1, No. 70, Meijia Road, Nan'an District, Chongqing Patentee after: Meiken Semiconductor Technology Co.,Ltd. Address before: 528311 Lingang Road, Beijiao Town, Shunde District, Foshan, Guangdong Patentee before: GD MIDEA AIR-CONDITIONING EQUIPMENT Co.,Ltd. Patentee before: MIDEA GROUP Co.,Ltd. |
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| TR01 | Transfer of patent right |