CN209169127U - A kind of electronic device and electronic device - Google Patents
A kind of electronic device and electronic device Download PDFInfo
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- CN209169127U CN209169127U CN201822124026.3U CN201822124026U CN209169127U CN 209169127 U CN209169127 U CN 209169127U CN 201822124026 U CN201822124026 U CN 201822124026U CN 209169127 U CN209169127 U CN 209169127U
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- electronic device
- edge protuberance
- workspace
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- marginal zone
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Abstract
The utility model embodiment provides a kind of electronic device and electronic device, and the circuit substrate of the electronic device has circuit connection face, which has workspace and the marginal zone around workspace；The workspace in the circuit connection face of circuit substrate is provided at least one functional module, while the marginal zone in the circuit connection face of circuit substrate being provided with edge protuberance structure, and cover encapsulating structure in functional module and at least partly edge protuberance structure.The utility model embodiment is by being provided with edge protuberance structure in the marginal zone in the circuit connection face of circuit substrate, reduce the difference in height between marginal zone and workspace, to alleviate the slump phenomenon of marginal zone covering encapsulating structure, improves the appearance of electronic device, improve electronic reliability.
Description
Technical field
The utility model relates to electrical application technology field more particularly to a kind of electronic devices and electronic device.
Background technique
Currently, as the development of Information technology and network technology, such as mobile phone, sports watch and radio frequency identification equipment etc. are more
Kind electronic device brings great convenience with consumption for people's lives, is increasingly becoming people's life, logistics transportation or industry manufacture neck
Indispensable a part in domain etc..Usually used electronic device is substantially all using printed circuit board (PCB) as its carrying
Handle the circuit substrate of the various functional chips such as chip or storage chip.Usually used printed circuit board is flat multilayer knot
Structure is electrically connected to printing electricity by common welding technique (such as surface mount technology, dual-in-line etc.) in functional chip
After the plate of road, also functional chip and printed circuit board can integrally be covered using epoxy resin etc., and carry out that hot pressing is admittedly equal to consolidate
Change processing forms final electronic device.
But since the functional chip of printed circuit board is arranged in central region mostly, the less arrangement functional chip of outer rim,
So that support of the outer edge area due to lacking as being provided in central region by its functional chip when progress hot pressing is solid, so that
There is uneven or slump in electronic device outer rim in finally formed epoxy resin shell after heat cure.It so on the one hand will cause phase
On the other hand powered-down sub-device bad order also can bury the hidden of electronic reliability in uneven or slump outer edge area
Suffer from.
Utility model content
The utility model embodiment provides a kind of electronic device and electronic device, is able to solve in the prior art due to electronics
The outer edge of device and central region height are inconsistent, cause outer edge when encapsulation uneven or slump occur, to cause electronics
The bad order of device, and there is technical issues that reliability.
In a first aspect, the utility model embodiment provides a kind of electronic device, comprising:
Circuit substrate, the circuit substrate include circuit connection face, and the circuit connection face includes workspace and around institute
State the marginal zone of workspace；
At least one functional module, positioned at the workspace of the circuit substrate；
Edge protuberance structure, positioned at the marginal zone of the workspace at least side；
And the encapsulating structure of the covering functional module and at least partly described edge protuberance structure.
Optionally, the encapsulating structure includes the first encapsulation region and the second encapsulation region；
First encapsulation region covers the functional module, and second encapsulation region covers at least partly described edge protuberance
Structure；
On the direction perpendicular to the circuit connection face, the thickness of first encapsulation region and second encapsulation region
The difference of thickness is less than or equal to 0.002cm.
Optionally, along the direction that the marginal zone is directed toward in the workspace, the edge protuberance structure has first
Width L1；
In second envelope for along the direction that the marginal zone is directed toward in the workspace, covering the edge protuberance structure
Filling area has the second width L2；
Wherein, 0.2*L1≤L2≤0.95*L1.
Optionally, the value range of first width are as follows: 0.1cm≤L1≤0.4cm
Optionally, at least one described functional module the nearest functional module of edge protuberance structure described in distance with it is described
There is first distance S1 between edge protuberance structure；
The value range of the first distance S1 is 0cm≤S1≤0.02cm.
Optionally, on the direction in the vertical circuit connection face, the edge protuberance structure has first thickness T1, institute
Functional module is stated with second thickness T2；
Wherein, 0.2*T2≤T1≤T2.
Optionally, the edge protuberance structure includes multiple sub- bulge-structures of bulk, is had between adjacent sub- bulge-structure
There is gap.
Optionally, the edge protuberance structure surrounds the workspace.
Optionally, the circuit substrate includes printed circuit board；The functional module includes integrated chip.
Second aspect, the utility model embodiment provide a kind of electronic device, including above-mentioned electronic device.
The utility model embodiment, which provides a kind of electronic device and electronic device, the circuit substrate of the electronic device, to be had
Circuit connection face, the circuit connection face have workspace and the marginal zone around workspace；In the circuit connection face of circuit substrate
Workspace be provided at least one functional module, while it is convex that the marginal zone in the circuit connection face of circuit substrate is provided with edge
Structure is played, and covers encapsulating structure in functional module and at least partly edge protuberance structure, so as to solve the prior art
In, due to electronic device marginal zone and workspace have biggish difference in height, cause electronic device marginal zone cover envelope
There is slump phenomenon in assembling structure, causes the bad order of electronic device, and there is technical issues that reliability.This is practical new
Type embodiment reduces marginal zone and work by being provided with edge protuberance structure in the marginal zone in the circuit connection face of circuit substrate
Difference in height between area improves the appearance of electronic device to alleviate the slump phenomenon of marginal zone covering encapsulating structure, improves electricity
Sub- device reliability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electronic device in the prior art；
Fig. 2 is the overlooking structure diagram before a kind of electron device package provided by the embodiment of the utility model；
Fig. 3 is a kind of structural schematic diagram of electronic device Section A-A provided by the embodiment of the utility model；
Fig. 4 is the overlooking structure diagram before another electron device package provided by the embodiment of the utility model；
Fig. 5 is the structural schematic diagram of another electronic device Section A-A provided by the embodiment of the utility model；
Fig. 6 is the overlooking structure diagram before another electron device package provided by the embodiment of the utility model；
Fig. 7 is the overlooking structure diagram before another electron device package provided by the embodiment of the utility model；
Fig. 8 is a kind of structural schematic diagram of electronic device provided by the embodiment of the utility model.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for
It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.
In the prior art, such as Fig. 1, at least one functional module is usually provided on the circuit substrate 11 of electronic device 10
12, which for example can be functional chip and/or other electron component.When functional module 12 is functional chip,
It such as can be processing chip and/or storage chip etc..The functional module 12 is located at being electrically connected on junction S of circuit substrate 11, and
Functional module 12 is electrically connected with circuit substrate 11.Electronic device 10 further includes the encapsulation of covering function module 12 and circuit substrate 11
Layer 13, the encapsulated layer 13 can techniques be formed in functional module 12 and circuit substrate 11 by the way that hot pressing is solid etc..
The junction S that is electrically connected of the circuit substrate 11 of usual electronic device 10 is flat surface, if by least one function mould
Block 12 is set to the central region S1 for the junction S that is electrically connected, then on the direction Y of 11 direction-pointing function module 12 of circuit substrate, function mould
The height of the height H1 of the fringe region S2 of circuit substrate 11 around block 12 and the central region S1 for being provided with functional module 12
There is biggish difference in height Δ H1 between H2.The presence of difference in height Δ H1, so that using hot pressure fixing process to electronic device 10
When being packaged, the encapsulated layer 13 on the fringe region S1 of circuit substrate 11 is relative to the middle part for being provided with functional module 12
There is uneven or slump in encapsulated layer 13 on the S2 of region, that is, the inclined-plane M that width is W1 occurs.Inclined-plane M minimum point be provided with
Encapsulated layer 13 on the central region S1 of functional module 12 has difference in height Δ H2, thus on the one hand will cause electronic device and deposits
In appearance bad, another aspect encapsulated layer can not play the function of packaging protection and electrical isolation protection to edge functional structure
Can, so that there are the hidden danger of reliability for electronic device.
A kind of electronic device is present embodiments provided, which for example can be the mould group with specific function.Fig. 2
It is the overlooking structure diagram before a kind of electron device package provided by the embodiment of the utility model, Fig. 3 is the utility model reality
A kind of structural schematic diagram of electronic device Section A-A of example offer is provided.In conjunction with Fig. 2 and Fig. 3, the electronic device 20 of the present embodiment is wrapped
Include circuit substrate 21, the circuit substrate 21 include circuit connection face 210, at least one functional module 22, edge protuberance structure 23,
And encapsulating structure 24.Wherein, circuit connection face 210 includes workspace 211 and the marginal zone 212 around workspace 211；At least
One functional module 22 is located at the workspace 211 of circuit substrate 21；Edge protuberance structure 23 is located at at least side of workspace 211
Marginal zone 212；24 covering function module 22 of encapsulating structure and at least partly edge protuberance structure 23.
It should be noted that the workspace 211 of circuit substrate 21 is provided at least one functional module in electronic device 20
22, i.e., the number of functional module 22 can be n in electronic device 20, and wherein n can be any positive integer, and when including two
Or when more than two functional modules 22, each functional module 22 can have identical or different functional structure.In addition, according to electronics
Corresponding edge protuberance structure 23 is arranged in the width of marginal zone 212 in device 20 around 21 workspace 211 of circuit substrate, such as
It can only can also be set in larger-size marginal zone 212 in X direction for edge protuberance structure 23 is arranged around workspace 211
Set edge protuberance structure 23.Such as Fig. 2 and Fig. 3, the present embodiment is merely exemplary to be provided with one with the workspace 211 of circuit substrate 21
For a functional module 22, and edge protuberance structure 23 only is set in larger-size marginal zone 212 in X direction, shows other
The number of functional module 22 may be the integer more than or equal to 2 in the scheme of example property, can equally be directed toward according to along workspace 211
The size in the direction top edge area of marginal zone 212 is along the corresponding edge protuberance structure 23 of setting, technical principle and this implementation
Example diagram 2 is similar with the exemplary arrangement of Fig. 3, and details are not described herein.
Specifically, the circuit connection face 210 of circuit substrate 21 has workspace 211 and surrounds workspace in electronic device 20
211 marginal zone 212.The workspace 211 in the circuit connection face 210 of circuit substrate 21 can be electrically connected with functional module 22, with
Electronic device 20 is set to can be realized corresponding function.For the workspace 211 and side for making the circuit substrate 11 of electronic device 20 after encapsulating
Edge area 212 has lesser thickness difference, and at least edge protuberance is arranged in the marginal zone 212 of side around workspace 211 before encapsulation
Structure 23.Wherein, the circuit substrate 21 in electronic device 20 is chosen as including printed circuit board, functional module 22 be chosen as include
Integrated chip.
Illustratively, such as Fig. 2 and Fig. 3, the size of the functional module 22 of 21 workspace 211 of circuit substrate in the Y direction is
T2.On the direction in 211 points toward edge area 212 of workspace, edge protuberance is provided on the marginal zone 212 with larger size W2
Structure 23, which is T1, so as to play padded effect to marginal zone 212,
So by reduce be provided with the workspace 211 of functional module 22 and be provided with edge protuberance structure 23 marginal zone 212 between
Difference in height.When being packaged using encapsulating structure 24, in the Y direction, the corresponding encapsulating structure 24 in workspace 211 and marginal zone pair
Maximum height difference Δ T between the encapsulating structure 24 answered reduces, so that the encapsulating structure 24 for being set to marginal zone 212 be avoided to occur
Apparent uneven or biggish slump phenomenon, and then improve the appearance of electronic device 20, improve the reliability of electronic device 20.Its
In, before there is apparent uneven or biggish slump phenomenon and practical application in the encapsulating structure 24 for improving marginal zone 212
It puts, the covering of encapsulating structure 24 at least partly edge protuberance structure 23, i.e. encapsulating structure 24 can be by whole edge protuberance structures
23 covering, can also covering part edge protuberance structure 23.
The utility model embodiment by being provided with edge protuberance structure in the marginal zone in the circuit connection face of circuit substrate,
Reduce the difference in height between marginal zone and workspace, to alleviate the slump phenomenon of marginal zone covering encapsulating structure, improves electronics
The appearance of device improves electronic reliability.
Optionally, Fig. 4 is the plan structure signal before another electron device package provided by the embodiment of the utility model
Figure；Fig. 5 is the structural schematic diagram of another electronic device Section A-A provided by the embodiment of the utility model.Such as Fig. 4 and Fig. 5, envelope
Assembling structure 24 includes the first encapsulation region 241 and the second encapsulation region 242.Wherein, 241 covering function module 22 of the first encapsulation region, the
Two encapsulation regions 242 covering at least partly edge protuberance structure 23, and on the direction perpendicular to circuit connection face 210, the first envelope
The difference for filling the thickness in area 241 and the thickness of the second encapsulation region 242 is less than or equal to 0.002cm.
It should be noted that in the present embodiment electronic device 20 include at least one functional module 22, it can for one,
Two or more functional modules 22；Edge protuberance structure 23 is set to all marginal zones 212 around workspace 211, can also set
It is placed in the part edge area 212 around workspace 211.Fig. 4 and Fig. 5 is only the illustrative attached drawing of the present embodiment, in other examples
Property scheme in, the number of functional module 22 can be any positive integer, and edge protuberance structure 23 may be disposed at workspace 211 weeks
Any marginal zone 212 enclosed, technical principle is similar with the illustrative scheme of the present embodiment, and details are not described herein.
Specifically, on the direction perpendicular to circuit connection face 210, i.e., in Y-direction, the thickness T2 of functional module 22, side
Edge bulge-structure 23 with a thickness of T1, i.e. thickness difference may be present in functional module 22 and edge protuberance structure 23, so can be certain
Raw material is saved in degree, reduces the precision of production equipment, to reduce production cost.In the direction perpendicular to circuit connection face 210
On, i.e., in Y-direction, since there may be thickness differences with edge protuberance structure 23 for functional module 22, using 24 envelope of encapsulating structure
When dress, the first encapsulation region 241 of covering function module 22 and the second encapsulation region 242 of covering edge protuberance structure 23 may also be deposited
In certain thickness difference.Under the premise of meeting 20 practical application of electronic device, the first encapsulation region 241 and the second encapsulation region 242
Thickness difference be smaller than equal to 0.002cm.Such as electronic device 20 is filled in electronics such as mobile phone, sports watch and radio frequency identification equipments
It sets in application, the assembly demand between electronic device and other devices, and the protective effect to electronic device 20 need to be met,
First encapsulation region 241 of encapsulating structure 24 covers whole functional modules 22, and the second encapsulation region 242 covering of encapsulating structure 24 is extremely
Least a portion of edge protuberance structure 23, and maximum thickness difference Δ T is less than between the first encapsulation region 241 and the second encapsulation region 242
Equal to 0.002cm.
Optionally, with continued reference to Fig. 4 and Fig. 5, on the direction along 211 points toward edge area 212 of workspace, edge protuberance knot
Structure 23 has the first width L1；On the direction along 211 points toward edge area 212 of workspace, the institute of edge protuberance structure 23 is covered
The second encapsulation region 242 is stated with the second width L2；Wherein, the relationship of the first width L1 and the second width L2 are as follows: 0.2*L1≤L2
≤0.95*L1。
Specifically, the 242 covering part edge protuberance structure 23 of the second encapsulation region of encapsulating structure 24, and cover edge protuberance
The width L2 of second encapsulation region 242 of structure 23 is 0.2 to 0.95 times of the width L1 of edge protuberance structure 23.Energy is arranged such
The difference Δ T for enough meeting the thickness T1 of the first encapsulation region 241 and thickness T2 of the second encapsulation region 242 is less than or equal to 0.002cm, to keep away
There is apparent uneven or biggish slump phenomenon in the encapsulating structure 24 for exempting to be set to marginal zone 212, so as to improve electronic device
20 appearance improves the reliability of electronic device 20.
Optionally, continuing with reference Fig. 4 and Fig. 5, the value range of edge protuberance structure 23 can for 0.1cm≤L1≤
0.4cm.Correspondingly, functional module nearest apart from edge protuberance structure 23 at least one functional module 22 in electronic device 20
There is first distance S1 between 22 and edge protuberance structure 23；And the value range of first distance S1 be chosen as 0cm≤S1≤
0.02cm。
Optionally, continuing with reference Fig. 4 and Fig. 5, on the direction of vertical circuit joint face 210, i.e., in Y-direction, side
Edge bulge-structure 23 has first thickness T1, and functional module 22 has second thickness T2；Wherein, 0.2*T2≤T1≤T2.
Specifically, the thickness T1 of edge protuberance structure 23 is at least the 20% of the thickness T2 of functional module 22, edge protuberance
The maximum gauge T1 of structure 23 can be equal with the thickness T2 of functional module 22.Illustratively, in the thickness of edge protuberance structure 23
In the case that T1 is equal with the thickness T2 of functional module 22, the first distance S1 of edge protuberance structure 23 and adjacent function modules 22
Value range can be 0cm≤S1≤0.02cm；The value range of first width L1 of edge protuberance structure 23 can be
0.1cm≤L1≤0.4cm；The thickness T1 of edge protuberance structure 23 can be the 25% of 22 thickness T2 of functional module adjacent thereto；
When the first distance S1 between edge protuberance structure 23 and adjacent functional module 22 is in the range of 0.01cm to 0.02cm
When, the first width L1 of edge protuberance structure 23 can be 0.2cm, and cover the of the encapsulating structure 24 of edge protuberance structure 23
Second width L2 of two encapsulation regions 242 can be the 20% to 95% of the width L1 of edge protuberance structure 23, illustratively, covering
Second width L2 of the second encapsulation region 242 of the encapsulating structure 24 of edge protuberance structure 23 can be the of edge protuberance structure 23
The 85% of one width L1.
Optionally, Fig. 6 is the plan structure signal before another electron device package provided by the embodiment of the utility model
Figure.In conjunction with Fig. 4 and Fig. 6, in the present embodiment, under the premise of meeting electron device package and requiring, edge protuberance structure 23 can be wrapped
The sub- bulge-structure 231 of multiple bulks is included, there is gap between adjacent sub- bulge-structure 231.
Optionally, Fig. 7 is the plan structure signal before another electron device package provided by the embodiment of the utility model
Figure.Such as Fig. 7, in the present embodiment, under the premise of meeting electron device package and requiring, edge protuberance structure 23 can surround workspace
211 settings.
Optionally, the material of edge bulge-structure may include copper or the first resin material；The material of encapsulating structure includes second
Resin material；Wherein, the elasticity modulus of the first resin material of edge protuberance structure is less than the second resin material of encapsulating structure
Elasticity modulus.
Specifically, the material of edge protuberance structure can be formed, but consider by the copper for being easier to obtain by way of plating
The resin material different from encapsulating structure also can be used in the higher cost of copper, edge protuberance structure.The of the edge protuberance structure
One resin for example can be the acrylic acid oligomer used in print circuit plates making.When second resin material of encapsulating structure
When elasticity modulus is greater than the elasticity modulus of the first resin material of edge protuberance structure, the second resin material of encapsulating structure is for example
It can be epoxy resin etc., it so can be when forming encapsulating structure using hot pressure fixing process etc., so that edge protuberance structure is protected
Hold shape invariance.
The utility model embodiment additionally provides a kind of electronic device, which can be for example mobile phone, movement hand
Table and radio frequency identification equipment etc..Fig. 8 is a kind of structural schematic diagram of electronic device provided by the embodiment of the utility model.Such as Fig. 8,
Electronic device 200 provided in this embodiment includes electronic device 20 provided by the embodiment of the utility model.
Electronic device 20 in electronic device 200 provided by the embodiment of the utility model passes through the circuit company in circuit substrate
The marginal zone of junction is provided with edge protuberance structure, reduces the difference in height between marginal zone and workspace, to alleviate marginal zone
The slump phenomenon of encapsulating structure is covered, the appearance of electronic device 20 is improved, improves 20 reliability of electronic device, and then facilitate electronics
The assembly of other devices in device 20 and electronic device 200, while improving the operational reliability of electronic device 20.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments
The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from
It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended
Scope of the claims determine.
Claims (10)
1. a kind of electronic device characterized by comprising
Circuit substrate, the circuit substrate include circuit connection face, and the circuit connection face includes workspace and around the work
Make the marginal zone in area；
At least one functional module, positioned at the workspace of the circuit substrate；
Edge protuberance structure, positioned at the marginal zone of the workspace at least side；
And the encapsulating structure of the covering functional module and at least partly described edge protuberance structure.
2. electronic device according to claim 1, which is characterized in that the encapsulating structure includes the first encapsulation region and second
Encapsulation region；
First encapsulation region covers the functional module, and second encapsulation region covers at least partly described edge protuberance knot
Structure；
On the direction perpendicular to the circuit connection face, the thickness of the thickness of first encapsulation region and second encapsulation region
Difference be less than or equal to 0.002cm.
3. electronic device according to claim 2, which is characterized in that in the side for being directed toward the marginal zone along the workspace
Upwards, the edge protuberance structure has the first width L1；
In second encapsulation region for along the direction that the marginal zone is directed toward in the workspace, covering the edge protuberance structure
With the second width L2；
Wherein, 0.2*L1≤L2≤0.95*L1.
4. electronic device according to claim 3, which is characterized in that the value range of first width are as follows: 0.1cm≤
L1≤0.4cm。
5. electronic device according to claim 2, which is characterized in that side described in distance at least one described functional module
There is first distance S1 between the nearest functional module of edge bulge-structure and the edge protuberance structure；
The value range of the first distance S1 is 0cm≤S1≤0.02cm.
6. electronic device according to claim 1, which is characterized in that on the direction in the vertical circuit connection face, institute
Edge protuberance structure is stated with first thickness T1, the functional module has second thickness T2；
Wherein, 0.2*T2≤T1≤T2.
7. electronic device according to claim 1, which is characterized in that the edge protuberance structure includes that multiple blocky sons are convex
Structure is played, there is gap between adjacent sub- bulge-structure.
8. electronic device according to claim 1, which is characterized in that the edge protuberance structure surrounds the workspace.
9. electronic device according to claim 1, which is characterized in that the circuit substrate includes printed circuit board；Institute
Stating functional module includes integrated chip.
10. a kind of electronic device characterized by comprising electronic device according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822124026.3U CN209169127U (en) | 2018-12-18 | 2018-12-18 | A kind of electronic device and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822124026.3U CN209169127U (en) | 2018-12-18 | 2018-12-18 | A kind of electronic device and electronic device |
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| CN209169127U true CN209169127U (en) | 2019-07-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449126A (en) * | 2018-12-18 | 2019-03-08 | 江苏卓胜微电子股份有限公司 | A kind of electronic device and preparation method thereof, electronic device |
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2018
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449126A (en) * | 2018-12-18 | 2019-03-08 | 江苏卓胜微电子股份有限公司 | A kind of electronic device and preparation method thereof, electronic device |
| CN109449126B (en) * | 2018-12-18 | 2024-04-12 | 江苏卓胜微电子股份有限公司 | Electronic device, preparation method thereof and electronic device |
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