CN209151462U - The shell of the TR component of integrated design - Google Patents
The shell of the TR component of integrated design Download PDFInfo
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- CN209151462U CN209151462U CN201821409846.0U CN201821409846U CN209151462U CN 209151462 U CN209151462 U CN 209151462U CN 201821409846 U CN201821409846 U CN 201821409846U CN 209151462 U CN209151462 U CN 209151462U
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- cavity
- cover board
- cold plate
- component
- shell
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Abstract
The utility model discloses the shell of the TR component of integrated design, including housing body, the first cover board and the second cover board;The housing body is divided into the first cavity and the second cavity by cold plate, and the first cavity and the second cavity are located at the two sides of cold plate, and the first cavity is for installing transmitting module, and the second cavity is for installing receiving module and power supply;First cover board is located on the first cavity by welding lid, and the second cover board is located on the second cavity by welding lid.It is designed using water-cooling and two-sided mounting arrangement, i.e., radio frequency and receiving module, power supply are assemblied in cold plate two sides respectively, and centre is separated by cold plate, and the cold plate liquid cooling runner of unique design flows through all power components that need to be radiated.Shell uses Al-brazing Process welding forming, shapes by cooling fluid path cover board, the welding integrated with assembly housing blank of cavity partition, then through Milling Process, component upper and lower cover plates uses metal electrical shielding, to shield electromagnetic leakage, T/R assembly surface applies three-proofing coating, improves corrosion resistance.
Description
Technical field
The utility model relates to technical field of micro communication, in particular to a kind of for installing Connectors for Active Phased Array Radar T/R
The shell of component.
Background technique
T/R component is component critically important in active phased array radar technology, structure design is main consider electromagnetic compatibility,
Key issues of heat dissipation, while being also contemplated that volume, weight and the three proofings for reducing component.Current Connectors for Active Phased Array Radar is universal
The structure type being separately laid out using receiving module, transmitting module and power supply, although can preferably solve electromagnetic compatibility and dissipate
Heat problem, but the overall weight and volume of component are increased, improve production cost, it is difficult to meet active phased array of new generation
The requirement of radar T/R component high-performance, small size, low cost, high reliability.
Summary of the invention
The purpose of this utility model is to provide the shells of the TR component of integrated design, solve prior art center T/R
Assembly volume, weight are big caused by the design that component is separately laid out due to module, transmitting module and power supply, high production cost
Technical problem.
To achieve the goals above, the utility model adopts the following technical scheme:
The shell of the TR component of integrated design, including housing body, the first cover board and the second cover board;The housing body
First cavity and the second cavity are divided by cold plate, and the first cavity and the second cavity are located at the two sides of cold plate, wherein the
One cavity is for installing transmitting module, and the second cavity is for installing receiving module and power supply;First cover board passes through welding lid
It is located on the first cavity, the second cover board is located on the second cavity by welding lid.
Transmitting module, receiving module and power supply integration are mounted in the shell, integrated level is high, and it is high to meet T/R component
The requirement of performance, small size, low cost, high reliability.
It is further improved, is recessed on the surface that the cold plate is located in the second cavity and forms liquid cooling runner, on liquid cooling runner
Cooling fluid path cover board is welded with using Al-brazing Process.Heat source component is using the installation for sharing cold plate, low thermal resistance in this application
Mode, cold plate select high thermal conductivity material, in favor of device thermal expansion, liquid cooling runner are arranged immediately below heat source, makes coolant liquid
It exchanges heat between cold plate abundant.
It is further improved, the liquid cooling runner is sequentially communicated by multistage groove to be formed, and liquid cooling area is increased, and improves heat dissipation effect
Fruit, adjacent two sections of texturearunaperpendiculars, and bending part use rounding off, to reduce flow resistance, fill heat exchange between coolant liquid and cold plate
Point.
It is further improved, is fixedly installed multiple partitions in first cavity, the second cavity, multiple partitions are set in parallel
It sets.In order to guarantee electromagnetic shielding requirements, it is provided with partition between each module, to reduce stress in partition processing, cold plate is avoided to become
Shape warpage.
It is further improved, the housing body, the first cover board, the second cover board and cooling fluid path cover board are plate aluminum alloy material
Matter is made.Housing body, the first cover board and the second cover board outer surface apply three-proofing coating, improve corrosion resistance.
The utility model has the following beneficial effects:
It is designed using water-cooling and two-sided mounting arrangement, i.e. radio frequency and receiving module, power supply is assemblied in cold plate two respectively
Side, centre are separated by cold plate, and the cold plate liquid cooling runner of unique design flows through all power components that need to be radiated.Shell uses aluminium
Soldering processes welding forming, by cooling fluid path cover board, the welding integrated with assembly housing blank of cavity partition, then through Milling Process
Forming, component upper and lower cover plates use metal electrical shielding, and to shield electromagnetic leakage, T/R assembly surface applies three-proofing coating, improve anticorrosive
Property.
In the utility model, it is contemplated that T/R component is a high density assembly, and structure is complicated, and functional module is more, module it
Between there are serious electromagnetic interferences, therefore before processing to cold plate blank, rational deployment is carried out to electronic component, it is each dry
It disturbs and partition offer shielding action is provided between module, and carry out grounding measures;Component upper and lower cover plates uses metal electrical shielding, with screen
Cover electromagnetic leakage.
Detailed description of the invention
Fig. 1 show the front view of first cavity of the utility model.
Fig. 2 show the front view of second cavity of the utility model.
Fig. 3 show the liquid cooling flow passage structure schematic diagram of the utility model.
Fig. 4 show the structural schematic diagram of the liquid cooling flow channel cross-section of the utility model.
Fig. 5 show the first covering plate structure schematic diagram of the utility model.
Fig. 6 show the structural schematic diagram of second cover board of the utility model.
Specific embodiment
To keep the purpose of this utility model and technical solution clearer, below in conjunction with the utility model embodiment to this
The technical solution of utility model is clearly and completely described.
As shown in Figure 1 and Figure 2, the shell of the TR component of integrated design, including housing body 1, the first cover board 8 and second
Cover board 9;The housing body is divided into the first cavity 2 and the second cavity 4 by cold plate, and the first cavity and the second cavity distinguish position
In the two sides of cold plate, wherein the first cavity is for installing transmitting module, the second cavity is for installing receiving module and power supply;It is described
First cover board 8 is located on the first cavity 2 by welding lid, and the second cover board 9 is located on the second cavity 4 by welding lid.
First by aluminium alloy blank material according to numerical control milling is carried out shown in Fig. 1, Fig. 2, retain 1.5 millimeters of machining allowance with
Just the finishing after being welded for the later period.Then according to shown in Fig. 3, liquid cooling runner 5 is carried out to cold plate 6 by machining center
Processing, 5 structure type of liquid cooling runner make coolant liquid by water as shown in figure 4, should ensure that precision in 5 process of liquid cooling runner
Road Shi Changtong, rapid heat dissipation.It is then cooled off the sealing welding of fluid path cover board 7, is guaranteed while guaranteeing capacity of heat transmission
Bear the pressure of 1.5MPa and water-tight, the welding of cooling fluid path cover board uses aluminium soldering, and welding distortion is small.Next according to figure
1, the finishing of T/R component cavity body structure is carried out shown in Fig. 2, to guarantee good capacity of heat transmission, cavity mounting surface it is smooth
Degree required precision reaches 0.1 millimeter hereinafter, being simultaneously guarantee electromagnetic shielding requirements, there are partition 3, partition processing between each module
In to reduce stress, avoid cold plate deform warpage.First cover board 8 and the second cover board 9 use metal electric screen, such as Fig. 5, Fig. 6
Shown, metal electric screen reduces the outside radiated electromagnetic wave of module for shielding electromagnetic leakage to influence other modules.Metal
Electric screen has good mechanical strength and rigidity simultaneously, prevents from being influenced and deformation or damage by external force.T/R package shell has
Certain degree of protection can prevent human body from touching charging member, be also possible to prevent into water.Housing body 1,8 and of the first cover board
The outer surface of second cover board 9 is coated with aviation three-proofing coating, improves corrosion resistance.
Do not done in the utility model illustrate be the prior art or can be realized by the prior art, Er Qieben
Specific implementation case described in utility model is only the preferable case study on implementation of the utility model, is not used to limit practical
Novel practical range.Equivalent changes and modifications made by i.e. all contents according to present utility model application the scope of the patents, should all make
For the technology scope of the utility model.
Claims (5)
1. the shell of the TR component of integrated design, which is characterized in that including housing body, the first cover board and the second cover board;Institute
It states housing body and the first cavity and the second cavity is divided by cold plate, and the first cavity and the second cavity are located at the two of cold plate
Side, wherein the first cavity is for installing transmitting module, the second cavity is for installing receiving module and power supply;
First cover board is located on the first cavity by welding lid, and the second cover board is located on the second cavity by welding lid.
2. the shell of the TR component of integrated design according to claim 1, which is characterized in that the cold plate is located at second
Recess forms liquid cooling runner on surface in cavity, uses Al-brazing Process to be welded with cooling fluid path cover board on liquid cooling runner.
3. the shell of the TR component of integrated design according to claim 2, which is characterized in that the liquid cooling runner is by more
Section groove is sequentially communicated to be formed, adjacent two sections of texturearunaperpendiculars, and bending part uses rounding off.
4. the shell of the TR component of integrated design according to any one of claim 1-3, which is characterized in that described
Multiple partitions are fixedly installed in one cavity, the second cavity, multiple partitions are arranged in parallel.
5. the shell of the TR component of integrated design according to claim 4, which is characterized in that the housing body,
One cover board, the second cover board and cooling fluid path cover board are that plate aluminum alloy material is made.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821409846.0U CN209151462U (en) | 2018-08-30 | 2018-08-30 | The shell of the TR component of integrated design |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821409846.0U CN209151462U (en) | 2018-08-30 | 2018-08-30 | The shell of the TR component of integrated design |
Publications (1)
Publication Number | Publication Date |
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CN209151462U true CN209151462U (en) | 2019-07-23 |
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CN201821409846.0U Active CN209151462U (en) | 2018-08-30 | 2018-08-30 | The shell of the TR component of integrated design |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113613463A (en) * | 2021-07-31 | 2021-11-05 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | General cold plate of airborne through liquid cooling module |
CN116995429A (en) * | 2023-09-26 | 2023-11-03 | 成都智芯雷通微系统技术有限公司 | T/R assembly structure based on millimeter wave active phased array |
-
2018
- 2018-08-30 CN CN201821409846.0U patent/CN209151462U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113613463A (en) * | 2021-07-31 | 2021-11-05 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | General cold plate of airborne through liquid cooling module |
CN113613463B (en) * | 2021-07-31 | 2023-09-26 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | General cold plate of airborne through liquid cooling module |
CN116995429A (en) * | 2023-09-26 | 2023-11-03 | 成都智芯雷通微系统技术有限公司 | T/R assembly structure based on millimeter wave active phased array |
CN116995429B (en) * | 2023-09-26 | 2023-12-12 | 成都智芯雷通微系统技术有限公司 | T/R assembly structure based on millimeter wave active phased array |
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