CN209133500U - A kind of chip with staggeredly pad - Google Patents
A kind of chip with staggeredly pad Download PDFInfo
- Publication number
- CN209133500U CN209133500U CN201821991300.0U CN201821991300U CN209133500U CN 209133500 U CN209133500 U CN 209133500U CN 201821991300 U CN201821991300 U CN 201821991300U CN 209133500 U CN209133500 U CN 209133500U
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- pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a kind of chip with staggeredly pad, including multiple pads；Multiple pads positioned at the same side of the chip are arranged successively in a first direction, also, the adjacent pad of any two is dislocatedly distributed on the first direction and/or second direction, and the first direction is vertical with the second direction.Therefore, the soldered ball on any pad can be staggered with the soldered ball on adjacent pad and adjacent pad, so as to avoid ball shorts from influencing the normal work of chip.
Description
Technical field
The utility model relates to technical field of semiconductor device, more specifically to a kind of core with staggeredly pad
Piece.
Background technique
Currently, in order to improve the cost competitiveness of chip, chip size more does smaller, and the spacing between chip bonding pad is also cured
It does smaller.But when the spacing between chip bonding pad is too small, be easy to cause soldered ball on any pad and adjacent pad or
Soldered ball on adjacent pad connects to form short circuit, influences the normal work of chip.
Utility model content
In view of this, the present invention provides a kind of chips with staggeredly pad, to solve existing chip bonding pad
Between spacing it is too small, influence chip work normally the problem of.
To achieve the above object, the utility model provides the following technical solutions:
A kind of chip with staggeredly pad, including multiple pads；
Multiple pads positioned at the same side of the chip are arranged successively in a first direction, also, any two are adjacent
Pad be dislocatedly distributed on the first direction and/or second direction, the first direction is vertical with the second direction.
Optionally, described in multiple pads of the same side of the chip, the adjacent pad of any two is described
It is dislocatedly distributed in second direction.
Optionally, the area in region of any pad close to the side is equal to its region far from the side
Area.
Optionally, the shape of the pad is strip.
Optionally, in two adjacent pads, area of the pad close to the region of the side is greater than far from described
The area in the region of side, another pad are less than the face in the region far from the side close to the area in the region of the side
Product.
Optionally, the shape of the pad is T shape.
Optionally, the shape of the pad is L shape.
Optionally, the shape of the pad is triangle.
Optionally, described in multiple pads of the same side of the chip, the adjacent pad of any two is described
It is dislocatedly distributed on first direction, alternatively, the adjacent pad of any two misplaces on the first direction and the second direction
Distribution.
Optionally, the shape of the pad is triangle.
Compared with prior art, technical solution provided by the utility model has the advantage that
The chip with staggeredly pad provided by the utility model, due to being located at multiple welderings of the same side of the chip
In disk, the adjacent pad of any two is dislocatedly distributed on the first direction and/or second direction, therefore, on any pad
Soldered ball can be staggered with the soldered ball on adjacent pad and adjacent pad, so as to avoid ball shorts influence core
The normal work of piece.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is a kind of structural schematic diagram of the pad of chip provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram of pad shown in FIG. 1 and soldered ball；
Fig. 3 is the structural schematic diagram of the pad of another chip provided by the embodiment of the utility model；
Fig. 4 is the structural schematic diagram of pad shown in Fig. 3 and soldered ball；
Fig. 5 is the structural schematic diagram of the pad of another chip provided by the embodiment of the utility model；
Fig. 6 is the structural schematic diagram of the pad of another chip provided by the embodiment of the utility model；
Fig. 7 is the structural schematic diagram of the pad of another chip provided by the embodiment of the utility model.
Specific embodiment
It is the core concept of the utility model above, to enable the above objects, features, and advantages of the utility model more
Add and become apparent, the following will be combined with the drawings in the embodiments of the present invention, to the technical scheme in the embodiment of the utility model
It is clearly and completely described, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than complete
The embodiment in portion.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Every other embodiment obtained is put, is fallen within the protection scope of the utility model.
The utility model embodiment provides a kind of chip with staggeredly pad, which includes multiple pads, such as Fig. 1
Shown, which includes four sides A1, A2, A3, A4.Optionally, there are multiple pads 10 on each side.
Wherein, multiple pads 10 positioned at the same side of the chip are arranged successively in a first direction, also, any two
Adjacent pad 10 is dislocatedly distributed on the first direction and/or second direction, the first direction and the second direction
Vertically.
As shown in Figure 1, multiple pads 10 positioned at side A1 are arranged successively on X in a first direction, any two are adjacent
Pad 10 is dislocatedly distributed on X and/or second direction Y in a first direction.Multiple pads 10 positioned at side A2 are in a first direction on Y
It is arranged successively, the adjacent pad 10 of any two is dislocatedly distributed on X and/or second direction Y in a first direction.
It is described in multiple pads 10 of the same side of the chip in one embodiment of the utility model, appoint
Two adjacent pads 10 of anticipating are dislocatedly distributed in said first direction.Such as, positioned at multiple pads 10 of side A1 in first party
It is arranged successively on X, the adjacent pad 10 of any two is dislocatedly distributed on second direction Y；Positioned at multiple pads of side A2
10 are arranged successively on Y in a first direction, and the adjacent pad 10 of any two is dislocatedly distributed on second direction X.
Optionally, as shown in Figure 1, the area in region of any pad 10 close to the side is equal to it far from described
The area in the region of side.Area such as pad 10 close to the region of the side A1 is equal to its region far from the side A1
Area.Optionally, the shape of the pad 10 is strip.
Based on this, as shown in Fig. 2, after forming soldered ball 11 on pad 10, can make in subsequent wire bonding sequence
Soldered ball 11 is dislocatedly distributed on second direction X, so as to avoid soldered ball 11 on any pad 10 and adjacent pad 10 with
And 11 short circuit of soldered ball in adjacent pad 10, and then can be to avoid the normal work of 11 Effect of Short Circuit chip of soldered ball.
Also, the utility model embodiment can it is existing formed pad 10 capacity of equipment is constant and the interval of pad 10 most
In the case where small, avoid the soldered ball 11 on any pad 10 and the soldered ball 11 on adjacent pad 10 and adjacent pad 10 short
Road.
Optionally, in two adjacent pads, area of the pad close to the region of the side is greater than far from described
The area in the region of side, another pad are less than the face in the region far from the side close to the area in the region of the side
Product.
As shown in figure 3, area of the pad 10a close to the region of the side A1 is greater than in two adjacent pads
The area in the region far from the side A1, area of another pad 10b close to the region of the side A1 are less than far from institute
State the area in the region of side A1.
Based on this, as shown in figure 4, the soldered ball 11 on any pad 10 and adjacent pad 10 and adjacent can realized
While soldered ball 11 on pad 10 is dislocatedly distributed, increase the contact area of pad 10 with soldered ball 11 thereon, improves soldered ball 11
Crystallized ability prevents gold thread from falling off.
Optionally, as shown in figure 3, the shape of the pad 10 is T shape, also, in two adjacent pads 10, a weldering
The shape of disk 10 is T shape, and the shape of another pad 10 is the T shape stood upside down.Alternatively, as shown in figure 5, the shape of the pad 10
For L shape, also, in two adjacent pads 10, the shape of a pad 10 is L shape, and the shape of another pad 10 is to stand upside down
L shape.Alternatively, as shown in fig. 7, the shape of the pad 10 is triangle, also, in two adjacent pads 10, one is welded
The shape of disk 10 is triangle, and the shape of another pad 10 is the triangle to stand upside down.
It is described in multiple pads of the same side of the chip in another embodiment of the utility model, arbitrarily
Two adjacent pads are dislocatedly distributed in said first direction, that is to say, that the adjacent pad of any two is described second
It does not misplace on direction.Alternatively, the adjacent pad of any two is dislocatedly distributed on the first direction and the second direction.
Optionally, as shown in fig. 6, it is described in multiple pads 10 of the same side A1 of the chip, any two phase
Adjacent pad 10 is dislocatedly distributed on the first direction X, and optionally, the shape of the pad 10 is triangle, also, adjacent
Two pads in, the shape of a pad 10 is triangle, and the shape of another pad 10 be the triangle of handstand, so as to
To realize that the adjacent pad 10 of any two is dislocatedly distributed on the first direction X.
Further, as shown in fig. 7, it is described in multiple pads 10 of the same side A1 of the chip, any two
For adjacent pad 10 while being dislocatedly distributed on the first direction X, the adjacent pad 10 of any two is also in second direction Y
On be dislocatedly distributed, to further increase the distance between two neighboring soldered ball 11, further avoid 11 Effect of Short Circuit chip of soldered ball
Normal work.
It should be noted that only positioned at multiple pads 10 of the same side A1 of the chip in the utility model embodiment
For be illustrated, the distribution mode positioned at multiple pads 10 of chip same side A2, A3 or A4 is same, herein no longer
It repeats one by one.
There is the chip of staggeredly pad, due to being located at the same side of the chip provided by the utility model embodiment
In multiple pads, the adjacent pad of any two is dislocatedly distributed on the first direction and/or second direction, therefore, any
Soldered ball on pad can be staggered with the soldered ball on adjacent pad and adjacent pad, so as to avoid ball shorts
Influence the normal work of chip.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.To the upper of the disclosed embodiments
It states bright, can be realized professional and technical personnel in the field or using the utility model.Various modifications to these embodiments pair
It will be apparent for those skilled in the art, the general principles defined herein can not depart from this reality
In the case where with novel spirit or scope, realize in other embodiments.Therefore, the utility model is not intended to be limited to this
These embodiments shown in text, and it is to fit to the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. a kind of chip with staggeredly pad, which is characterized in that including multiple pads；
Multiple pads positioned at the same side of the chip are arranged successively in a first direction, also, the weldering that any two are adjacent
Disk is dislocatedly distributed on the first direction and/or second direction, and the first direction is vertical with the second direction.
2. chip according to claim 1, which is characterized in that multiple pads positioned at the same side of the chip
In, the adjacent pad of any two is dislocatedly distributed in this second direction.
3. chip according to claim 2, which is characterized in that the area in region of any pad close to the side
Equal to the area in its region far from the side.
4. chip according to claim 3, which is characterized in that the shape of the pad is strip.
5. chip according to claim 2, which is characterized in that in two adjacent pads, a pad is close to the side
The area in the region on side is greater than the area in the region far from the side, area of another pad close to the region of the side
Less than the area in the region far from the side.
6. chip according to claim 5, which is characterized in that the shape of the pad is T shape.
7. chip according to claim 5, which is characterized in that the shape of the pad is L shape.
8. chip according to claim 5, which is characterized in that the shape of the pad is triangle.
9. chip according to claim 1, which is characterized in that multiple pads positioned at the same side of the chip
In, the adjacent pad of any two is dislocatedly distributed in said first direction, alternatively, the adjacent pad of any two is described
It is dislocatedly distributed in one direction and the second direction.
10. chip according to claim 9, which is characterized in that the shape of the pad is triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821991300.0U CN209133500U (en) | 2018-11-29 | 2018-11-29 | A kind of chip with staggeredly pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821991300.0U CN209133500U (en) | 2018-11-29 | 2018-11-29 | A kind of chip with staggeredly pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133500U true CN209133500U (en) | 2019-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821991300.0U Active CN209133500U (en) | 2018-11-29 | 2018-11-29 | A kind of chip with staggeredly pad |
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| Country | Link |
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| CN (1) | CN209133500U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378305A (en) * | 2018-11-29 | 2019-02-22 | 合肥奕斯伟集成电路有限公司 | A kind of chip with staggeredly pad |
-
2018
- 2018-11-29 CN CN201821991300.0U patent/CN209133500U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378305A (en) * | 2018-11-29 | 2019-02-22 | 合肥奕斯伟集成电路有限公司 | A kind of chip with staggeredly pad |
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