CN209104121U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
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- CN209104121U CN209104121U CN201821709882.9U CN201821709882U CN209104121U CN 209104121 U CN209104121 U CN 209104121U CN 201821709882 U CN201821709882 U CN 201821709882U CN 209104121 U CN209104121 U CN 209104121U
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Abstract
The utility model provides a kind of effective substrate board treatment of reduction of maintenance frequency to discharge pipe derived from the drain made in liquid handling portion.Substrate board treatment (1) has: liquid treatment module (4), carries out liquid processing to substrate；Discharge pipe (20) exports drain from liquid treatment module (4)；And energy assigning unit (30), the physical energy for removing the attachment for the inner surface (20s) for being attached to discharge pipe (20) is assigned to discharge pipe (20).
Description
Technical field
This disclosure relates to substrate board treatment.
Background technique
Base plate processing system is disclosed in patent document 1.The base plate processing system has: coating nozzle for liquid, to guarantor
It holds and supplies coating liquid on the substrate of rotating holding portion；Liquid handling portion, to surround the substrate for being held rotating holding portion
The mode of side be arranged；And drain pipe, the waste liquid in liquid handling portion is discharged.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2012-33886 bulletin
Utility model content
Utility model will solve the problems, such as
The disclosure is designed to provide the frequency of the maintenance to discharge pipe derived from the drain made in liquid handling portion
The effective substrate board treatment of the reduction of degree.
The solution to the problem
The substrate board treatment of one technical solution of the disclosure has: liquid handling portion, carries out liquid processing to substrate；Row
Pipeline is put, exports drain from liquid handling portion；And energy assigning unit, discharge pipe is assigned for making to be attached to discharge
The physical energy of the attachment removing of the inner surface of pipeline.
According to the substrate board treatment, the attachment of the inner surface of discharge pipe is attached to using physical energy removing, because
This, is able to suppress attachment and is accumulated inner surface in discharge pipe.Thus, this substrate board treatment is to making from liquid handling
The reduction of the maintenance frequency of discharge pipe derived from drain in portion is effective.
Being also possible to discharge pipe has the multiple pipes for making the mutually different position from liquid handling portion export drain
Road meets at first manifold an of pipeline, and energy assigning unit is configured to, and the multiple pipelines of the first manifold of comparison on the upstream side are assigned
Give physical energy.It is easy to incline what the upstream side of discharge pipe was adhered in the presence of the attachment based on the drain from liquid handling portion
To.Thus, the structure that the pipeline of the first manifold on the upstream side assigns physical energy is compared using energy assigning unit, it can be more reliable
Ground inhibits the accumulation of the attachment in discharge pipe.
It is also possible to energy assigning unit to be configured to, also assigns physical energy to the first manifold.In this case, Neng Gougeng
It is reliably suppressed the accumulation of the attachment in discharge pipe.
Be also possible to discharge pipe have meet at the multiple pipelines for guiding the drain from multiple first manifolds respectively
Second manifold of one pipeline, energy assigning unit are configured to, and also assign physical energy to the second manifold.In this case, can
More reliably inhibit the accumulation of the attachment in discharge pipe.
It is also possible to energy assigning unit with oscillator, assigns the energy of the vibration of oscillator as physical energy.In the situation
Under, it can be to have used the easy structure of oscillator to assign physical energy.
Being also possible to energy assigning unit has the multiple oscillators arranged along discharge pipe.In this case, it can utilize
Multiple oscillators inhibit the accumulation of attachment in a wider context.
Being also possible to energy assigning unit also has conductive members, which includes: the first contact portion, with oscillator
Contact；And second contact portion, contacted with the area bigger than the area of the first contact portion with discharge pipe, the conductive members from
Vibration of first contact portion to the second contact portion transmitting oscillator.In this case, by contacting the vibration of oscillator to than first
Wide the second contact portion broadening ground transmitting in portion, can inhibit the accumulation of attachment in a wider context.
Being also possible to energy assigning unit also has conductive members, which includes: the first contact portion, with oscillator
Contact；And second contact portion, multiple pipeline contacts with discharge pipe, the conductive members connect from the first contact portion to second
The vibration of contact portion transmitting oscillator.In this case, physical energy can be assigned to multiple pipelines with easy structure.
Being also possible to the second contact portion is in the curved shape along the periphery of discharge pipe.It in this case, can be to row
Put the wider imparting physical energy of the inner surface of pipeline.
It is also possible to energy assigning unit and assigns the energy based on air pressure as physical energy.It in this case, can be with benefit
Physical energy is assigned with the easy structure of air pressure.
It is also possible to energy assigning unit with gas blowing unit, which is open in the inner surface of discharge pipe,
And spray the inner surface of gas towards discharge pipe, it is assigned using the gas that gas blowing unit is gushed out based on air pressure
Energy.In this case, gas pressure can be made in the attachment itself of the inner surface of discharge pipe.
It is also possible to energy assigning unit and includes multiple gas blowing units, is open in the inner surface of discharge pipe, and court
Gas is sprayed to the inner surface of discharge pipe；And multiple oscillators, alternately along discharge pipe and multiple gas blowing units
Arrangement, the energy of the air pressure of gas for assigning the energy of the vibration of oscillator to discharge pipe and being gushed out based on gas blowing unit
Amount is used as physical energy.In this case, can in a wide range of simultaneously using using vibration discharge pipe inner surface
The structure of physical energy is assigned in bigger range and makes gas pressure in the structure of attachment itself.
It is also possible to the substrate board treatment and is also equipped with control unit, which executes the control carried out to energy assigning unit
System, to assign physical energy to discharge pipe at the time of predetermined.It in this case, can be at the time of pre-set certainly
It is dynamic to execute imparting of the physical energy to discharge pipe.Therefore, it at the time of assigning physical energy by rightly setting, can be easy
Ground inhibits attachment to the accumulation of the inner surface of discharge pipe.
For example, it can be control unit controls energy assigning unit, so as at the time of have passed through the predetermined time pair
Discharge pipe assigns physical energy.
Alternatively, it is also possible to be, the control that control unit carries out energy assigning unit, to be carried out in the substrate to predetermined number
Liquid handling complete at the time of to discharge pipe assign physical energy.
Be also possible to control unit also execute to liquid handling portion carry out control, so as in energy assigning unit to delivery pipe
Solvent is supplied to discharge pipe when road imparting physical energy.In this case, by using physical energy to delivery pipe simultaneously
The imparting on road and the supply of solvent can more reliably inhibit the accumulation of attachment.
Be also possible to control unit also execute to energy assigning unit carry out control, so as to from the upstream side of discharge pipe to
Downstream side successively assigns physical energy.In this case, physical energy is correspondingly assigned by the movement with the attachment removed
Amount, can efficiently inhibit adhering to again for removed object.
It is also possible to discharge pipe to be formed by tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer.In this case, attached
Object got higher relative to the fissility of discharge pipe.Therefore, the physics that discharge pipe can be assigned using energy assigning unit
Energy removes attachment more reliably.
The effect of utility model
According to the disclosure, it is capable of providing the maintenance frequency to discharge pipe derived from the drain made in liquid handling portion
The effective substrate board treatment of reduction.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating the outline structure of substrate board treatment.
Fig. 2 is the cross-sectional view along the II-II line of Fig. 1.
Fig. 3 is the cross-sectional view along the III-III line of Fig. 2.
Fig. 4 is the schematic diagram for indicating the outline structure of discharge pipe.
Fig. 5 is the cross-sectional view along the V-V line of Fig. 4.
Fig. 6 is the block diagram for indicating the composition functionally of control unit.
Fig. 7 is the block diagram for indicating the hardware of control unit and constituting.
Fig. 8 is the flow chart for indicating liquid handling sequence.
Fig. 9 is the schematic diagram for indicating the variation of energy assigning unit.
Figure 10 is the schematic diagram for indicating the variation of energy assigning unit.
Figure 11 is the cross-sectional view along the XI-XI line of Figure 10.
Figure 12 is the schematic diagram for indicating the variation of energy assigning unit.
Figure 13 is the flow chart for indicating the variation of liquid handling sequence.
Description of symbols
1, substrate board treatment；U1, liquid-treatment unit (liquid handling portion)；20, discharge pipe；21,21A,21B,
21C, 21D, 21E, 23,25, pipeline；22, manifold (the first manifold)；24, manifold (the second manifold)；30, energy assigning unit；41,
Oscillator；43, conductive members；43a, the first contact portion；43b, 43c, the second contact portion；53, gas blowing unit；100, control unit；
W, wafer (substrate).
Specific embodiment
Hereinafter, referring to attached drawing, while explaining embodiment in detail.In explanation, to identical element or there is identical function
The element of energy marks identical appended drawing reference, and the repetitive description thereof will be omitted.
(substrate board treatment)
The substrate board treatment 1 of present embodiment is the device that the formation of photonasty overlay film is carried out to substrate.Process object
Substrate be such as semiconductor wafer W.Photonasty overlay film is such as resist film.
As depicted in figs. 1 and 2, substrate board treatment 1 has control unit 100 and carrier module 2 adjacent to each other and place
Manage module 3.
(carrier module)
Carrier module 2 carries out importing of the wafer W into substrate board treatment 1 and wafer W from leading in substrate board treatment 1
Out.Such as carrier module 2 can support multiple load-bearing parts 11 of wafer W, be built-in with handover arm A1.Load-bearing part 11 accommodates for example
Circular multiple wafers W.Join arm A1 and take out wafer W to the handover of processing module 3 from load-bearing part 11, receives crystalline substance from processing module 3
Circle W is returned in load-bearing part 11.
(processing module)
Processing module 3 has multiple processing modules 10 along up and down direction arrangement, discharge pipe 20, energy assigning unit 30
(referring to Fig. 4) and conveying arm A2.Each processing module 10 has liquid-treatment unit U1 (liquid handling portion) and thermal treatment unit
U2.Liquid-treatment unit U1 carries out liquid processing to wafer W.Liquid processing is known as the processing implemented using liquid to wafer W, including
The processing (hereinafter referred to as " coating processing ") that the treatment fluid of the formation of photonasty overlay film is applied to the surface of wafer W.In addition,
Liquid processing is not limited to coating processing, is also possible to such as cleaning treatment.Thermal treatment unit U2 is carried out by above-mentioned coating
Manage the heat treatment such as heating of overlay film formed.Conveying arm A2 conveys wafer W to liquid-treatment unit U1 and thermal treatment unit U2.?
2 side of carrier module in processing module 3 is provided with frame unit U10.Frame unit U10 is divided into along the more of up and down direction arrangement
A cell.Each cell is used to join the buffering of the wafer W between arm A1 and conveying arm A2.
(liquid-treatment unit)
As shown in figure 3, above-mentioned liquid-treatment unit U1 has multiple rotating holding portion 12, liquid supply unit 13, Yi Jiduo
A cup 14.Multiple rotating holding portion 12 keep multiple wafer W respectively and rotate multiple wafer W.Liquid supply unit 13 is to being kept
Wafer W to rotating holding portion 12 supplies treatment fluid.Treatment fluid is the chemical solution of such as formation of photonasty overlay film.Such as
Liquid supply unit 13 has nozzle 15a, 16a, liquid source 15b, 16b, valve 15c, 16c, nozzle conveying mechanism 15d, 16d, nozzle slot 17
And virtual assigned portion 18.
Nozzle 15a sprays treatment fluid.Nozzle 15a from the top of such as wafer W spray treatment fluid and to the surface of wafer W
Supply treatment fluid.Liquid source 15b supplies treatment fluid to nozzle 15a.Valve 15c is to from liquid source 15b to the opening and closing shape of the flow path of nozzle 15a
State switches over.Nozzle conveying mechanism 15d will carry out delivery nozzles 15a as power source such as electric motor.
Nozzle 16a sprays solvent.Solvent is the organic solvent such as diluent.Liquid source 16b supplies solvent to nozzle 16a.
Valve 16c is switched over to from liquid source 16b to the open and-shut mode of the flow path of nozzle 16a.Nozzle conveying mechanism 16d will for example electronic horse
Power source delivery nozzles 16a is used as up to equal.
Nozzle slot 17 accommodates in standby nozzle 15a, 16a (during not supplying treatment fluid to wafer W).Virtual assigned portion
The treatment fluid sprayed from nozzle 15a is accommodated when 18 virtual assigned for the purpose of to exclude bubble or foreign matter in flow path.
Multiple wafer W that 14 pairs of multiple cups remain to multiple rotating holding portion 12 respectively are accommodated respectively.14 pairs of each cup
The liquid fallen is got rid of from wafer W to be recycled.
(discharge pipe)
Discharge pipe 20 makes the drain of the liquid-treatment unit U1 from each processing module 10 to such as substrate board treatment 1
Outside plant emissions equipment export.As shown in Figure 3 and Figure 4, discharge pipe 20 has multiple pipelines 21, multiple manifolds 22
(the first manifold), multiple pipelines 23, manifold 24 (the second manifold) and pipeline 25.Discharge pipe 20 each portion (pipeline 21,23,
25 and manifold 22,24) can also be respectively by tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA:Perfluoro
Alkoxy alkane) it is formed.
Multiple pipelines 21 include pipeline 21A, 21B, 21C, 21D, 21E.Pipeline 21A, 21B, 21C, 21D, 21E are set to respectively
Processing module 10.Pipeline 21A, 21D export the drain from each cup 14.Pipeline 21B exports the drain from nozzle slot 17.
Pipeline 21C exports the drain from virtual assigned portion 18.Pipeline 21E is the tapping line of liquid source 15b, is made from liquid source 15b
Filter (not shown) etc. drain export.Discharge pipe 20 also can have multiple pipeline 21E.
Pipeline 23 is set to each processing module 10, make by pipeline 21A, 21B, 21C, 21D, 21E guide Lai drain it is downward
Swim side guidance.Pipeline 25 make by each processing module 10 pipeline 23 guidance Lai drain further downstream guide.
Multiple manifolds 22 are set to each processing module 10.It is empty that multiple discharges are respectively arranged under multiple processing modules 10
Between D, multiple manifolds 22 are respectively arranged at multiple emission quotas D.Manifold 22 makes pipeline 21A, 21B, 21C, 21D, 21E meet at pipe
Road 23.Pipeline 21A, 21B, 21C, 21D extend downward and enter emission quotas D in, midway to side be bent and and manifold
22 connections.Manifold 22 has collecting box 22a and exhaust portion 22b.
Pipeline 21A, 21B, 21C, 21D, 21E are connected in the top 22c of collecting box 22a.In the side of collecting box 22a
The lower portion of 22e is connected with pipeline 23.Collecting box 22a accumulates the drain flowed into from pipeline 21A, 21B, 21C, 21D, 21E, and
It is sent out to pipeline 23.Exhaust portion 22b is set to the side 22d of the opposite side of side 22e.Exhaust portion 22b is located at the upper of side 22e
Side section exports the gas in collecting box 22a to outside collecting box 22a.
Manifold 24 is configured at except processing module 3.Multiple pipelines 23 extend to side respectively from multiple emission quotas D,
Midway is bent downwards and connect with the top of manifold 24.Pipeline 25 is connected in the lower part of manifold 24.
Can also be with, part in pipeline 21A, 21B, 21C, 21D, guiding drain to side with towards downstream and
The mode being lower tilts.The inclination angle of the part that drain is guided to side with respect to the horizontal plane is either such as 5 degree~20
Degree, is also possible to 10 degree~15 degree.Alternatively, it is also possible to be, manifold 22 is also with being lower from side 22d towards side 22e
Mode tilts.The inclination angle with respect to the horizontal plane of manifold 22 is also possible to 10 degree~15 degree either such as 5 degree~20 degree.
(energy assigning unit)
Energy assigning unit 30 assigns the physical energy different from the physical energy of the flowing based on drain to discharge pipe 20.
Here, physical energy is attachment G (referring to Fig. 5) stripping for making the inner surface 20s (referring to Fig. 5) for being attached to discharge pipe 20
From physical energy.Physical energy means the energy based on the physical forces such as inertia force or fluid pressure.Energy assigning unit 30 includes
First unit U31 and second unit U32.
First unit U31 has such as oscillator 41 and oscillation device 42 (such as ultrasonic oscillator), to discharge pipe 20
The energy of the vibration of oscillator 41 is assigned as physical energy.Oscillator 41 is connect with oscillation device 42.The output of oscillation device 42 is used for
The driving power for vibrating oscillator 41.Oscillation device 42, which is also configured to allow hand over, vibrates such as oscillator 41 continuously
The driving power of continuous mode, the driving power for the intermittent mode for vibrating oscillator 41 intermittently and their mixed mode
The driving powers such as driving power mode.
First unit U31 is configured to, the energy to the vibration for for example assigning oscillator 41 than the pipeline 21 of manifold 22 on the upstream side
Amount.First unit U31 also can have multiple oscillators 41 corresponding with pipeline 21A, 21B, 21C, 21D difference.In addition, first
Unit U31 can also have multiple oscillators 41 for pipeline 21A, 21B, 21C, 21D respectively.
For example, as shown in figure 4, in the present embodiment, the longest pipeline 21A in pipeline 21A, 21B, 21C, 21D
It is provided with three oscillators 41 along pipeline 21A.In addition, the shortest pipeline 21D in pipeline 21A, 21B, 21C, 21D is arranged
There is an oscillator 41.Pipeline 21B is provided with two oscillators 41 along pipeline 21B.It is provided in pipeline 21C along pipeline
Two oscillators 41 of 21C.
In addition, first unit U31 is also configured to, the energy of the vibration of oscillator 41 is also assigned to manifold 22.For example,
The bottom 22f of manifold 22 can be provided with oscillator 41.As shown in figure 4, in the present embodiment, manifold 22 be provided with along
Two oscillators 41 arranged from side 22d towards the direction of side 22e.
In addition, first unit U31 is also configured to, the energy of the vibration of oscillator 41 is also assigned to pipeline 23.For example,
The multiple oscillators 41 arranged along pipeline 23 can be set.Moreover, first unit U31 is also configured to, also to manifold 24
Assign the energy of the vibration of oscillator 41.For example, it is also possible to be provided with oscillator 41 in the bottom of manifold 24.
Being also possible to first unit U31 also has conductive members 43.Conductive members 43 are the tabular components of such as metal,
A loaf of bread of conductive members 43 includes the first contact portion 43a contacted with oscillator 41.Another face of conductive members 43 include with
The second contact portion 43b that discharge pipe 20 contacts.Second contact portion 43b with the area bigger than the area of the first contact portion 43a with
Discharge pipe 20 contacts.Vibration of the conductive members 43 from the first contact portion 43a to the second contact portion 43b transmitting oscillator 41.
Conductive members 43 are either if flowering structure is (hereinafter, be known as " conductive members in the presence of by the conductive members 43 of the structure
The case where 43A "): including the multiple first contact portion 43a contacted respectively with multiple oscillators 41, between multiple oscillators 41 and row
It puts between pipeline 20, is also possible to if flowering structure is (hereinafter, be known as " conductive members 43B " in the presence of by the conductive members 43 of the structure
The case where): including the first contact portion 43a contacted with an oscillator 41, between an oscillator 41 and discharge pipe 20
Between.
For example, as shown in figure 4, in the present embodiment, the longest pipeline 21A in pipeline 21A, 21B, 21C, 21D
It is provided with conductive members 43A, between two oscillators 41 and pipeline 21A of upstream side；And conductive members 43B, it is situated between
Between an oscillator 41 and pipeline 21A in downstream side.In addition, the shortest pipeline 21D in pipeline 21A, 21B, 21C, 21D
The conductive members 43B being provided between an oscillator 41 and pipeline 21D.It is provided in pipeline 21C between two oscillators 41
Conductive members 43A between pipeline 21C.Pipeline 21B is provided with the conduction structure between two oscillators 41 and pipeline 21B
Part 43B.In addition, as shown in figure 5, the second contact portion 43b of conductive members 43 can also be in the periphery along discharge pipe 20
Curved shape.
Second unit U32 assigns the energy based on air pressure as physical energy to discharge pipe 20.Second unit U32 is constituted
For to energy of the imparting of pipeline 21 based on air pressure for example than manifold 22 on the upstream side.Second unit U32 includes triple valve 51.
Triple valve 51 is set to such as pipeline 21E.Triple valve 51 is to pipeline 21E and liquid source 15b the first connection status connecting and pipe
Road 21E is switched over the gas source 52a of non-active gas (such as nitrogen) the second connection status connecting.Utilizing triple valve 51
In a period of as the second connection status, non-active gas is supplied using gas source 52a, assigns air pressure to pipeline 21E.
(control unit)
Control unit 100 executes the control carried out to energy assigning unit 30, to assign at the time of predetermined to discharge pipe 20
Give physical energy.Such as control unit 100 can both control energy assigning unit 30, so as to have passed through the predetermined time when
It carves and assigns physical energy to discharge pipe 20, energy assigning unit 30 can also be controlled, so as in the crystalline substance to predetermined number
Physical energy is assigned to discharge pipe 20 at the time of the liquid handling (such as coating processing) that circle W is carried out is completed.In addition, control unit
100 can also control energy assigning unit 30, so as at the time of the batch of the wafer W of hand-off process object to delivery pipe
Road 20 assigns physical energy.In addition, control unit 100 can also control energy assigning unit 30, to carry out to wafer W
Coating processing after the completion of, before the liquid handling carried out to next wafer W starts process the time reached pre- timing
Between at the time of to discharge pipe 20 assign physical energy.
For example, as shown in fig. 6, there is control unit 100 coating control unit 101, input and output control unit 102, moment to determine
Portion 103, vibration control portion 104 and pressure control portion 105 are as composition (hereinafter referred to as " functional module ") functionally.
Coating control unit 101 controls liquid-treatment unit U1, to execute the liquid handling carried out to wafer W.Tool
For body, coating control unit 101 executes the control carried out to nozzle conveying mechanism 15d, so that nozzle 15a, which is located at, is held rotation
Turn the top of the wafer W of maintaining part 12, and execute the control carried out to valve 15c, so that from liquid source 15b to the stream of nozzle 15a
Road becomes open state.
Input and output control unit 102 executes the control carried out to conveying arm A2, so that wafer W is defeated to liquid-treatment unit U1
Enter, and execute the control carried out to conveying arm A2, so that wafer W is exported from liquid-treatment unit U1.
Moment determination unit 103 determines at the time of assigning physical energy to discharge pipe 20 to energy assigning unit 30.Example
Can both be determined as it being to assign physical energy to discharge pipe 20 when have passed through the predetermined time such as moment determination unit 103
Moment, the coating that can also be carried out in the wafer W to predetermined number handle be determined as being assigned to discharge pipe 20 when completion
At the time of giving physical energy.
Vibration control portion 104 controls the first unit U31 of energy assigning unit 30, to assign to discharge pipe 20
The energy of vibration as physical energy.Specifically, vibration control portion 104 is based on the information obtained from moment determination unit 103
Oscillation device 42 is controlled, so that oscillator 41 vibrates.
Pressure control portion 105 controls the second unit U32 of energy assigning unit 30, to assign to discharge pipe 20
The energy based on air pressure as physical energy.Specifically, pressure control portion 105 is based on obtaining from moment determination unit 103
Information controls triple valve 51, to switch over to above-mentioned first connection status and above-mentioned second connection status.
Control unit 100 is made of one or more control computers.For example, as shown in fig. 7, control unit 100 has electricity
Road 91.Circuit 91 has one or more processors 92, memory 93, memory 94, input/output port 95 and timer 96.
Input/output port 95 carries out between liquid-treatment unit U1, conveying arm A2, first unit U31 and second unit U32 etc.
The input and output of electric signal.Timer 96 is counted by the reference pulse to such as some cycles, to by the time into
Row metering.
Memory 94 has the storage medium that can be read by computer such as hard disk.It is storage medium recorded to have for making
Substrate board treatment 1 executes the program for the substrate processing method using same then discussed.Such as storage medium recorded have for constituting each function
The program of energy module.Storage medium is also possible to Jie that non-volatile semiconductor memory, disk and CD etc. can take out
Matter.Memory 93 temporarily records the operation result of the program and processor 92 that load from the storage medium of memory 94.Processor 92
Above procedure is executed and cooperating with memory 93, constitutes each functional module.
In addition, the hardware that the hardware composition of control unit 100 is not necessarily limited to be made of each functional module program is constituted.Such as it controls
ASIC (special applications collection made of each functional module in portion 100 processed can also be integrated as dedicated logic circuit or to it
At circuit, Application Specific Integrated Circuit) it constitutes.
(substrate processing method using same)
Next, an example as substrate processing method using same, to the sequence of liquid handling performed by substrate board treatment 1
It is illustrated.Fig. 8 is the flow chart for indicating liquid handling sequence.Firstly, control unit 100 successively executes step S01, S02, S03.
In step S01, input and output control unit 102 controls conveying arm A2, so that wafer W is defeated to liquid-treatment unit U1
Enter.Such as input and output control unit 102 controls conveying arm A2 so that wafer W inputted into liquid-treatment unit U1 and
Rotating holding portion 12 is set to keep wafer W.
In step S02, coating control unit 101 controls rotating holding portion 12 and liquid supply unit 13, at liquid
The wafer W managed in unit U1 implements coating processing.Such as coating control unit 101 on one side controls rotating holding portion 12, with
Wafer W is rotated, liquid supply unit 13 is controlled on one side, to supply treatment fluid to the surface of wafer W.Such as coating control
Portion processed controls nozzle conveying mechanism 15d, so that nozzle 15a is moved from nozzle slot 17 on wafer W, carries out to valve 15c
Control, so as to be opened from liquid source 15b to the flow path of nozzle 15a.In addition it is also possible to be to apply control unit 101 to nozzle conveyer
Structure 15d is controlled, so as to make nozzle 15a from nozzle slot 17 it is mobile on wafer W when via virtual assigned portion 18, to valve
15c is controlled, to open above-mentioned flow path temporarily in the state that nozzle 15a is located at virtual assigned portion 18.
In step S03, input and output control unit 102 controls conveying arm A2, so that wafer W is from liquid handling list
First U1 output.
Then, control unit 100 executes step S04.In step S04, moment determination unit 103 determines whether should be to row
At the time of putting the imparting physical energy of pipeline 20.Moment determination unit 103 is determined as it being pair when for example have passed through the predetermined time
At the time of discharge pipe 20 assigns physical energy.More specifically, moment determination unit 103 both can be from previous physical energy
Imparting be determined as when have passed through the predetermined time be at the time of assigning physical energy to discharge pipe 20, can also be
It is determined as being that assign physical energy to discharge pipe 20 when have passed through the time of the integral multiple in pre-set period
At the time of amount.
Moment determination unit 103 to predetermined number wafer W carry out coating handle complete when be determined as be should be to row
At the time of putting the imparting physical energy of pipeline 20.It is also possible to for example, moment determination unit 103 is in the tax from previous physical energy
It is determined as being that assign physical energy to discharge pipe 20 when having given the coating processing completion of the wafer W progress to predetermined number
At the time of.
In the case where at the time of being determined as is that assign physical energy to discharge pipe 20, control unit 100 executes step
Rapid S05.In step S05, vibration control portion 104 and pressure control portion 105 carry out first unit U31 or second unit U32
Control, so that physical energy starts the imparting of discharge pipe 20.Specifically, vibration control portion 104 to oscillation device 42 into
Row control, so that the vibration of oscillator 41 starts, pressure control portion 105 controls triple valve 51, so that above-mentioned first connection
State switches to above-mentioned second connection status.
Then, control unit 100 executes step S06.In step S06, vibration control portion 104 and pressure control portion 105 to
The machine predetermined time passes through.Predetermined time is preset to obtain the institute of the attachment G of the inner surface 20s for discharge pipe 20
Desired peeling effect.
After a predetermined time elapses, control unit 100 executes step S07.In step S07, vibration control portion 104 and air pressure
Control unit 105 makes to be stopped from the physical energy that energy assigning unit 30 carries out to the imparting of discharge pipe 20.Specifically, vibration control
Portion 104 processed controls oscillation device 42, so that the vibration of oscillator 41 stops, pressure control portion 105 carries out triple valve 51
Control, so that above-mentioned second connection status switches to above-mentioned first connection status.
Then, control unit 100 executes step S08.In step S04, it is being determined as it not being to assign object to discharge pipe 20
In the case where at the time of reason energy, control unit 100 does not execute step S05~S07, but executes step S08.In step S08,
Coating control unit 101 confirms to the presence or absence of the unfinished wafer W of coating processing.
In step S08, in the case where confirming in the presence of the unfinished wafer W of coating processing, control unit 100 makes to handle
Return step S01.After, the coating processing of wafer W is performed repeatedly until that in step S08, there is no coatings to handle not for confirmation
Until the wafer W of completion, execution assigns physical energy at the time of predetermined.
In step S08, in the case where confirming the wafer W for not applying and handling and not completing, control unit 100 completes liquid
The control sequence of body processing.In addition, at the time of being not carried out the coating processing to wafer W progress, being held in above-mentioned sequence
The imparting of row physical energy, but the imparting of physical energy can also be executed in the execution of the coating processing carried out to wafer W.
Alternatively, it is also possible to be, control unit 100 also executes the control carried out to energy assigning unit 30, so as to from discharge pipe
20 upstream side downstream successively assigns physical energy.In such as step S05, vibration control portion 104 can also be to oscillation
Device 42 is controlled, to vibrate since the oscillator 41 of upstream side is successively.That is, being also possible to the oscillation of 104 pairs of vibration control portion
Device 42 is controlled, so that along oscillators 41 in two oscillators 41 of the arrangement of discharge pipe 20, downstream side relative to upper
The oscillator 41 of trip side postpones and starts to vibrate.It is also possible in step S07, vibration control portion 104 carries out oscillation device 42
Control, successively to stop vibration from the oscillator 41 of upstream side.Oscillation device 42 is carried out that is, being also possible to vibration control portion 104
Control, so that the oscillator along oscillators 41 in two oscillators 41 of the arrangement of discharge pipe 20, downstream side relative to upstream side
41 postpone and stop vibration.
(effect of present embodiment)
As being illustrated above, substrate board treatment 1 has: liquid-treatment unit U1, carries out liquid to wafer W
Processing；Discharge pipe 20 exports drain from liquid-treatment unit U1；And energy assigning unit 30, discharge pipe 20 is assigned
Give the physical energy for removing the attachment G for the inner surface 20s for being attached to discharge pipe 20.
According to the substrate board treatment 1, the attachment of the inner surface 20s of discharge pipe 20 is attached to using physical energy removing
Therefore object G is able to suppress attachment G accumulation in the inner surface 20s of discharge pipe 20.Thus, substrate board treatment 1 is next to making
The reduction of the maintenance frequency of the discharge pipe 20 derived from the drain in liquid-treatment unit U1 is effective.
It is also possible to discharge pipe 20 and exports drain with the mutually different position made from liquid-treatment unit U1
Multiple pipelines 21 meet at the manifold 22 of a pipeline 23, and energy assigning unit 30 is configured to, the pipe of comparison manifold 22 on the upstream side
Road 21 assigns physical energy.It is easy in the presence of the attachment G based on the drain from liquid-treatment unit U1 in discharge pipe 20
The tendency of upstream side attachment.Thus, it is possible to which comparing the pipeline 21 of manifold 22 on the upstream side using energy assigning unit 30 assigns physics
The structure of energy more reliably inhibits the accumulation of the attachment G in discharge pipe 20.
It is also possible to energy assigning unit 30 to be configured to, also assigns physical energy to manifold 22.In this case, Neng Gougeng
It is reliably suppressed the accumulation of the attachment G in discharge pipe 20.
Be also possible to discharge pipe 20 have converge the multiple pipelines 23 for guiding the drain from multiple manifolds 22 respectively
In the manifold 24 of a pipeline 25, energy assigning unit 30 is configured to, and also assigns physical energy to manifold 24.In this case, energy
Enough accumulations for more reliably inhibiting the attachment G in discharge pipe 20.
The first unit U31 for being also possible to energy assigning unit 30 has oscillator 41, and the energy for assigning the vibration of oscillator 41 is made
For physical energy.It in this case, can be to have used the easy structure of oscillator 41 to assign physical energy.
The first unit U31 for being also possible to energy assigning unit 30 has the multiple oscillators 41 arranged along discharge pipe 20.
In this case, the accumulation of attachment G can be inhibited in the larger context using multiple oscillators 41.
Being also possible to energy assigning unit 30 also has conductive members 43, which includes: the first contact portion 43a,
It is contacted with oscillator 41；And the second contact portion 43b, with the area bigger than the area of the first contact portion 43a and discharge pipe
20 contacts, vibration of the conductive members 43 from the first contact portion 43a to the second contact portion 43b transmitting oscillator 41.In this case,
It, can be wider by transmitting the vibration of oscillator 41 to the second contact portion 43b broadening than the first contact portion 43a wide
The interior accumulation for inhibiting attachment G.
Being also possible to the second contact portion 43b is in the curved shape along the periphery of discharge pipe 20.In this case, energy
The wider imparting physical energy of enough inner surface 20s to discharge pipe 20.
It is also possible to energy assigning unit 30 and assigns the energy based on air pressure as physical energy.It in this case, can be with
The easy structure that air pressure is utilized assigns physical energy.
It is also possible to the substrate board treatment 1 and is also equipped with control unit 100, which executes to energy assigning unit 30
The control of progress, to assign physical energy to discharge pipe 20 at the time of predetermined.In this case, it can preset
Automatically imparting of the physical energy to discharge pipe 20 is executed at the time of good.Therefore, appropriate at the time of by imparting physical energy
Ground is set, can easily suppress inner surface 20s from attachment G to discharge pipe 20 accumulation.
It is also possible to control unit 100 and executes the control carried out to liquid-treatment unit U1, so as to right in energy assigning unit 30
Solvent is supplied to discharge pipe 20 when the imparting physical energy of discharge pipe 20.For example, supplying solvent to pipeline 21A, 21D
In the case of, control unit 100 controls liquid-treatment unit U1, to supply solvent into cup 14.Specifically, to nozzle
Conveying mechanism 16d is controlled, and nozzle 16a is configured on cup 14, is controlled valve 16c, so that from liquid source 16b to spray
The flow path of mouth 16a is opened.In the case where supplying solvent to pipeline 21B, nozzle conveying mechanism 16d is controlled, will be sprayed
Mouth 16a is configured in virtual assigned portion 18, is controlled valve 16c, so as to open from liquid source 16b to the flow path of nozzle 16a.?
In the case where supplying solvent to pipeline 21C, nozzle conveying mechanism 16d is controlled, nozzle 16a is configured at nozzle slot 17
On, valve 16c is controlled, so as to be opened from liquid source 16b to the flow path of nozzle 16a.In this way, assigning object to discharge pipe 20
In the case where supplying solvent to discharge pipe 20 when managing energy, by using imparting of the physical energy to discharge pipe 20 simultaneously
With the supply of solvent, it can more reliably inhibit the accumulation of attachment G.
Control unit 100 can also further execute the control carried out to energy assigning unit 30, so as to from discharge pipe 20
Upstream side downstream successively assigns physical energy.In this case, it is correspondingly assigned by the movement with the attachment G removed
Physical energy is given, adhering to again for removed object can be efficiently inhibited.
Discharge pipe 20 can also be formed by tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer.In this case, with row
Pipeline 20 is put by such as polytetrafluoroethylene (PTFE) (PTFE:polytetrafluoroethylene), stainless steel (SUS:Steel Use
) etc. Stainless the case where being formed compares, and attachment G is got higher relative to the fissility of discharge pipe 20.Therefore, Neng Gouli
Attachment G is removed more reliably with the physical energy that energy assigning unit 30 assigns discharge pipe 20.
More than, embodiment is illustrated, but the utility model may not be defined in above-mentioned embodiment, Neng Gou
It does not depart from and makes various changes in the range of its purport.
For example, as shown in figure 9, conductive members 43 also may include second contacted with multiple pipelines 21 of discharge pipe 20
Contact portion 43c substitutes the second contact portion 43b.In this case, physics can be assigned to multiple pipelines 21 with easy structure
Energy.In addition, the second contact portion 43c can also be in the part contacted with each pipeline 21 in the bending of the periphery along each pipeline 21
Shape.
In addition, as shown in Figure 10 and Figure 11, being also possible to second unit U32 with gas blowing unit 53, which sprays
Portion 53 is open in the inner surface 20s of discharge pipe 20, sprays gas towards the inner surface 20s of discharge pipe 20, assigns and be based on gas
The energy of the air pressure for the gas that body blowing unit 53 is sprayed.In this case, gas pressure can be made in discharge pipe 20
The attachment G of surface 20s itself.
In addition, second unit U32 also can have the gas blowing unit for spraying gas towards the inner surface of manifold 22,24
53.In addition, gas blowing unit 53 both can from the top of pipeline 21 or manifold 22,24 the pipeline 21 inner surface 20s or discrimination
The inner surface of pipe 22,24 is open, can also from the lower section of pipeline 21 or manifold 22,24 the pipeline 21 inner surface 20s or discrimination
The inner surface of pipe 22,24 is open.
Alternatively, it is also possible to be, as shown in figure 12, second unit U32 has multiple gas blowing units 53, first unit U31
With the multiple oscillators 41 being alternately arranged along discharge pipe 20 and multiple gas blowing units 53,30 pairs of energy assigning unit discharges
Pipeline 20 assigns the energy of the vibration of oscillator 41 and the energy of the air pressure of gas that is sprayed based on gas blowing unit 53 is as object
Manage energy.It in this case, can be a wide range of interior simultaneously using the comparison of the inner surface 20s using vibration in discharge pipe 20
The structure of physical energy is assigned in big range and makes gas pressure in the structure of attachment G itself.
Energy assigning unit 30 may be configured as follows: in identical pipeline (such as pipeline 21) while using based on vibration
The energy of the air pressure of the energy of the vibration of son 41 and the gas sprayed based on gas blowing unit 53 is as physical energy.Can
Simultaneously using in the structure of vibration and air pressure, control unit 100 can also be controlled energy assigning unit 30, to impart
After physical energy based on vibration, the physical energy based on air pressure is assigned.
Figure 13 is to be illustrated in impart the case where physical energy based on vibration assigns the physical energy based on air pressure later
Control sequence flow chart.Firstly, control unit 100 successively execute the step S11 same as step S01, S02, S03, S04,
S12,S13,S14.In step S14, in the case where at the time of being determined as is that assign physical energy to discharge pipe 20,
Control unit 100 successively executes step S15, S16, S17.In step S15, oscillation device 42 is controlled in vibration control portion 104
System, so that the vibration of oscillator 41 starts.In step s 16, the standby predetermined time of vibration control portion 104 passes through.Predetermined time quilt
It presets into, assigns the energy of the vibration of oscillator 41 for example, by energy assigning unit 30 and obtain in discharge pipe 20
The desired peeling effect of the attachment G of surface 20s.In step S17, vibration control portion 104 carries out oscillation device 42
Control, so that the vibration of oscillator 41 stops.
Then, control unit 100 successively executes step S18, S19, S20.In step S18, pressure control portion 105 is to gas
Blowing unit 53 is controlled, so that gas starts to the ejection of the inner surface 20s of discharge pipe 20.In step S19, air pressure control
The portion 105 processed standby predetermined time passes through.Predetermined time is preset to, and assigns for example, by energy assigning unit 30 and is based on air pressure
Energy and obtain the desired peeling effect of the attachment G of inner surface 20s for discharge pipe 20.In step S20,
Pressure control portion 105 controls gas blowing unit 53, so that the ejection of gas stops.
Then, control unit 100 executes step S21.In step S14, it is being determined as it not being to assign object to discharge pipe 20
In the case where at the time of reason energy, control unit 100 does not execute step S15~S20, but executes step S21.In the step s 21,
Coating control unit 101 confirms to the presence or absence of the unfinished wafer W of coating processing.
In the step s 21, in the case where confirming in the presence of the unfinished wafer W of coating processing, control unit 100 makes to handle
Return step S11.In the case where step S21 confirms the wafer W for not applying and handling and not completing, control unit 100 makes energy
The control of imparting processing is completed.
In this way, being based on after imparting the energy of vibration of oscillator 41 to discharge pipe 20, to the imparting of discharge pipe 20
In the case where the energy of the air pressure of gas blowing unit 53, using vibration make discharge pipe 20 inner surface 20s attachment G at
For that gas pressure can be made in attachment G itself after the state that is easily peeled off.Thus, it is possible to more reasonably simultaneously using vibration
The energy of the air pressure of the energy of the vibration of son 41 and the gas sprayed based on gas blowing unit 53.
In addition, substrate board treatment 1 is also configured to, other than implementing the formation of photonasty overlay film, also implementing should
The development of the exposure of photonasty overlay film and the photonasty overlay film.The substrate of process object is not limited to semiconductor crystal wafer, can also be with
It is such as glass substrate, mask substrate, FPD (flat-panel monitor, Flat Panel Display) etc..
Claims (18)
1. a kind of substrate board treatment, which is characterized in that have:
Liquid handling portion carries out liquid processing to substrate；
Discharge pipe exports drain from the liquid handling portion；And
Energy assigning unit, the attachment for assigning the inner surface for making to be attached to the discharge pipe to the discharge pipe are shelled
From physical energy.
2. substrate board treatment according to claim 1, which is characterized in that
There are the discharge pipe the multiple pipelines for making the mutually different position from the liquid handling portion export drain to converge
Together in the first manifold of a pipeline,
The energy assigning unit is configured to, and compares the multiple pipeline of first manifold on the upstream side and assigns the physical energy
Amount.
3. substrate board treatment according to claim 2, which is characterized in that
The energy assigning unit is configured to, and also assigns the physical energy to first manifold.
4. substrate board treatment according to claim 2 or 3, which is characterized in that
The discharge pipe, which has, makes the multiple pipelines for guiding the drain from multiple first manifolds respectively meet at one
Second manifold of pipeline,
The energy assigning unit is configured to, and also assigns the physical energy to second manifold.
5. substrate board treatment according to claim 2 or 3, which is characterized in that
The energy assigning unit has oscillator, assigns the energy of the vibration of the oscillator as the physical energy.
6. substrate board treatment according to claim 5, which is characterized in that
The energy assigning unit has the multiple oscillators arranged along the discharge pipe.
7. substrate board treatment according to claim 5, which is characterized in that
The energy assigning unit also has conductive members, which includes: the first contact portion, contacts with the oscillator；
And second contact portion, it is contacted with the area bigger than the area of first contact portion with the discharge pipe, the conduction structure
Part transmits the vibration of the oscillator from first contact portion to second contact portion.
8. substrate board treatment according to claim 5, which is characterized in that
The energy assigning unit also has conductive members, which includes: the first contact portion, contacts with the oscillator；
And second contact portion, multiple pipeline contacts with the discharge pipe, the conductive members are from first contact portion to institute
State the vibration that the second contact portion transmits the oscillator.
9. substrate board treatment according to claim 7, which is characterized in that
Second contact portion is in the curved shape along the periphery of the discharge pipe.
10. substrate board treatment according to claim 2 or 3, which is characterized in that
The energy assigning unit assigns the energy based on air pressure as the physical energy.
11. substrate board treatment according to claim 10, which is characterized in that
The energy assigning unit has gas blowing unit, which is open in the inner surface of the discharge pipe, and court
Gas is sprayed to the inner surface of the discharge pipe, is assigned using the gas that the gas blowing unit is sprayed described based on gas
The energy of pressure.
12. substrate board treatment according to claim 2 or 3, which is characterized in that
The energy assigning unit includes
Multiple gas blowing units are open in the inner surface of the discharge pipe, and spray towards the inner surface of the discharge pipe
Gas out；And
Multiple oscillators are alternately arranged along the discharge pipe and the multiple gas blowing unit,
The gas that is assigned by the energy of the vibration of the oscillator and is sprayed based on the gas blowing unit for the discharge pipe
Air pressure energy as the physical energy.
13. substrate board treatment according to claim 2 or 3, which is characterized in that
The substrate board treatment is also equipped with control unit, which executes the control that carries out to the energy assigning unit, so as to
The physical energy is assigned to the discharge pipe at the time of predetermined.
14. substrate board treatment according to claim 13, which is characterized in that
The control unit controls the energy assigning unit, so as at the time of have passed through the predetermined time to the delivery pipe
Road assigns the physical energy.
15. substrate board treatment according to claim 13, which is characterized in that
The control unit controls the energy assigning unit, so as at the liquid that the substrate to predetermined number carries out
The physical energy is assigned to the discharge pipe at the time of reason is completed.
16. substrate board treatment according to claim 14, which is characterized in that
The control unit also execute to the liquid handling portion carry out control, so as in the energy assigning unit to the discharge
Solvent is supplied to the discharge pipe when the pipeline imparting physical energy.
17. substrate board treatment according to claim 14, which is characterized in that
The control unit also executes the control carried out to the energy assigning unit, so as to downward from the upstream side of the discharge pipe
Trip side successively assigns the physical energy.
18. substrate board treatment according to claim 2 or 3, which is characterized in that
The discharge pipe is formed by tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2017-207474 | 2017-10-26 | ||
| JP2017207474A JP6928537B2 (en) | 2017-10-26 | 2017-10-26 | Substrate processing equipment, substrate processing method and storage medium |
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| CN209104121U true CN209104121U (en) | 2019-07-12 |
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| KR102289260B1 (en) * | 2019-10-18 | 2021-08-12 | 세메스 주식회사 | Gas exhaust apparatus and substrate treatment system including the same, gas exhaust method |
| JP7441664B2 (en) * | 2020-02-10 | 2024-03-01 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| JP7441665B2 (en) * | 2020-02-10 | 2024-03-01 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| JP7487013B2 (en) * | 2020-05-29 | 2024-05-20 | 株式会社Ｓｃｒｅｅｎホールディングス | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
| CN113073731A (en) * | 2021-04-07 | 2021-07-06 | 武汉合创四联科技发展有限公司 | High-rise building sewage pipeline cleaning device and using method thereof |
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| JPS59142399A (en) * | 1983-02-04 | 1984-08-15 | Mitsubishi Heavy Ind Ltd | Dust removing device of boiler tube by hammer stroke |
| JP2006086166A (en) * | 2004-09-14 | 2006-03-30 | Canon Inc | Method for removing silicon-containing substance and removing device |
| KR100793849B1 (en) * | 2006-09-01 | 2008-01-11 | 정치영 | The powder eliminator for vacuum line and it's method |
| JP4739390B2 (en) * | 2008-10-27 | 2011-08-03 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP5635452B2 (en) * | 2010-07-02 | 2014-12-03 | 東京エレクトロン株式会社 | Substrate processing system |
| JP6123698B2 (en) * | 2014-02-19 | 2017-05-10 | Ｊｆｅスチール株式会社 | Method for preventing dust accumulation in exhaust duct of sintering machine |
| JP3209679U (en) * | 2016-11-22 | 2017-04-06 | 新科産業有限会社 | Pipe cleaning device |
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