CN209104119U - Wafer pingbian identifies deviation correcting device - Google Patents
Wafer pingbian identifies deviation correcting device Download PDFInfo
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- CN209104119U CN209104119U CN201820879100.XU CN201820879100U CN209104119U CN 209104119 U CN209104119 U CN 209104119U CN 201820879100 U CN201820879100 U CN 201820879100U CN 209104119 U CN209104119 U CN 209104119U
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- 230000007246 mechanism Effects 0.000 claims abstract description 73
- 230000000712 assembly Effects 0.000 claims abstract description 6
- 238000000429 assembly Methods 0.000 claims abstract description 6
- 230000009471 action Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 90
- 238000010586 diagram Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of wafer pingbian identification deviation correcting device, include: rotating mechanism, places the supporting part of wafer with one, is connected to the rotational control assemblies below the supporting part for driving the wafer to turn to predeterminated position when the platband position of the wafer deviates predeterminated position；Wafer guiding mechanism, the correcting driving mechanism of guiding mechanism and control the guiding mechanism movement including a control wafer correcting；Mechanism is imaged, is suspended in above the wafer, is connected with the rotating mechanism, is rotated for obtaining the image of the wafer, the platband position of the wafer being identified by described image and controls the rotating mechanism according to the platband position.The utility model can complete the identification and correction of wafer pingbian, substantially reduce the probability for manually putting wafer error, reduce the loss of product, improve production efficiency, reduce labor cost and production cost.
Description
Technical field
The utility model relates to technical field of semiconductors, equipment technical field is controlled more particularly to wafer, specially one
Kind wafer pingbian identifies deviation correcting device.
Background technique
The shape of wafer is the circle of one pingbian of band, and due to the demand of production technology, in certain techniques, wafer is in stone
The pingbian of pingbian direction and wafer in wafer frame box (cassette) in disc is towards there is strict requirements, at certain
There is fixed pingbian direction in a little graphite plates, and each towards difference, and then requires institute in wafer frame box (cassette)
There is pingbian upward.
Semicon industry is artificial loading and unloading mostly at present, the pingbian direction of wafer is manually put, in automation equipment
It just needs to carry out automatic identification.The wafer of semicon industry is all that wafer is put graphite by manually carrying out loading and unloading at present
In disk or wafer frame box (cassette), there may be certain deviations for the angle of pingbian, and work long hours, operator
Member is easy to produce the probability that fatigue increases error.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of identifications of wafer pingbian to entangle
Deflection device is easy to appear deviation for solving to put by manually putting wafer bring wafer pingbian in the prior art, malfunctions
The problem of rate height and labor intensive.
In order to achieve the above objects and other related objects, the utility model provides a kind of wafer pingbian identification deviation correcting device,
The wafer pingbian identification deviation correcting device includes: rotating mechanism, places the supporting part of wafer with one, is connected to the supporting part
The rotation control that lower section is used to drive the wafer to turn to predeterminated position when the platband position of the wafer deviates predeterminated position
Component processed；Wafer guiding mechanism, guiding mechanism and control the guiding mechanism movement including a control wafer correcting
Correcting driving mechanism；Mechanism is imaged, is suspended in above the wafer, is connected with the rotating mechanism, for obtaining the wafer
Image, identify by described image the platband position of the wafer and the rotating mechanism controlled according to the platband position and revolve
Turn.
In an embodiment of the utility model, the wafer pingbian identifies deviation correcting device further include: first support, including
It is used to support the support frame of the rotating mechanism and is installed at the top of support frame as described above and be used to support the wafer guiding mechanism
Support panel.
In an embodiment of the utility model, the guiding mechanism includes being installed in the supporting part two sides to be oppositely arranged
The first correcting clamping jaw and the second correcting clamping jaw.
In an embodiment of the utility model, the first correcting clamping jaw and the second correcting clamping jaw are respectively provided with one
For by the guiding fossaperturate of the wafer correcting and the interconnecting piece being connected with the correcting driving mechanism.
In an embodiment of the utility model, the correcting driving mechanism includes: that first correcting is driven to press from both sides respectively
The first guide pad and the second guide pad of pawl and the second correcting jaw action；It is led with first guide pad and described second
It is connected to block and controls the cylinder that first guide pad and second guide pad move.
In an embodiment of the utility model, the supporting part is a vacuum chuck.
In an embodiment of the utility model, the rotational control assemblies include: to drive below the connection supporting part
The shaft of the supporting part rotation and the servo motor for driving the shaft rotation.
In an embodiment of the utility model, the wafer pingbian identifies deviation correcting device further include: is used to support described
The photographing module to be suspended in the second support above the wafer by photographing module.
In an embodiment of the utility model, the photographing module includes a camera and is connected with the camera
Picture processing chip.
In an embodiment of the utility model, the camera shooting mechanism, which is connected with, provides the headlamp of light source for camera shooting.
As described above, a kind of wafer pingbian of the utility model identifies deviation correcting device, there are following advantageous effects:
1, the utility model puts wafer on rotating mechanism, drives correcting clamping jaw to lead wafer by clamping jaw cylinder
Just, the pingbian angle that wafer is identified by camera shooting mechanism, by driving rotating mechanism that wafer is made to go to required pingbian angle,
The identification and correction for completing wafer pingbian substantially reduce the probability for manually putting wafer error, reduce the loss of product, improve life
Efficiency is produced, labor cost and production cost are reduced.
2, the utility model structure is simple, and economy is convenient, practicability with higher.
Detailed description of the invention
Fig. 1 is shown as a kind of overall structure diagram of wafer pingbian identification deviation correcting device disclosed by the utility model.
The cylinder clamping status architecture that Fig. 2 is shown as a kind of wafer pingbian identification deviation correcting device disclosed by the utility model shows
It is intended to.
The cylinder releasing orientation structure that Fig. 3 is shown as a kind of wafer pingbian identification deviation correcting device disclosed by the utility model is shown
It is intended to.
Fig. 4 is shown as a kind of structure of the correcting driving mechanism of wafer pingbian identification deviation correcting device disclosed by the utility model
Schematic diagram.
Component label instructions
100 wafer pingbians identify deviation correcting device
110 rotating mechanisms
111 shafts
112 servo motors
120 wafer guiding mechanisms
121 guiding mechanisms
121a the first correcting clamping jaw
121a1 first is oriented to fossaperturate
121a2 first connecting portion
121b the second correcting clamping jaw
121b1 second is oriented to fossaperturate
121b2 second connecting portion
122 correcting driving mechanisms
The first guide pad of 122a
The second guide pad of 122b
122c cylinder
122d interconnecting piece
130 camera shooting mechanisms
140 first supports
141 support frames
142 support panels
150 second supports
160 headlamps
200 wafers
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.It should be noted that the case where not conflicting
Under, the feature in following embodiment and embodiment can be combined with each other.
Please refer to attached Fig. 1 to Fig. 4.It should be noted that diagram provided in following embodiment is only said in a schematic way
The basic conception of bright the utility model is only shown in schema with related component in the utility model rather than according to actual implementation then
When component count, shape and size draw, when actual implementation each component kenel, quantity and ratio can for it is a kind of arbitrarily
Change, and its assembly layout kenel may also be increasingly complex.
The present embodiment provides a kind of wafer pingbians to identify deviation correcting device 100, for solving in the prior art by manually putting
It puts wafer bring wafer pingbian and puts and be easy to appear deviation, the problem of error rate is high and labor intensive.It below will specifically
The principle and embodiment of wafer pingbian identification deviation correcting device 100, makes those skilled in the art not need to create in bright the present embodiment
The property made labour is appreciated that one of the present embodiment wafer pingbian identifies deviation correcting device 100.
As shown in Figure 1, the present embodiment provides a kind of wafer pingbians to identify deviation correcting device 100, the wafer pingbian identification is entangled
Deflection device 100100 includes: rotating mechanism 110, wafer guiding mechanism 120 and camera shooting mechanism 130.
The identification deviation correcting device 100 of wafer pingbian described in the present embodiment is described in detail below.
In this present embodiment, the rotating mechanism 110 has the supporting part of a placement wafer 200, is connected to the carrying
For driving the wafer 200 to turn to predeterminated position when the platband position of the wafer 200 deviates predeterminated position below portion
Rotational control assemblies.
Specifically, in this present embodiment, the supporting part is a vacuum chuck.Wafer 200 is grabbed by robot, by institute
It states wafer 200 to be placed on supporting part, the wafer 200 is sucked in vacuum chuck.
In this present embodiment, the rotational control assemblies include: to drive the supporting part to turn below the connection supporting part
Dynamic shaft 111 and the servo motor 112 for driving the shaft 111 to rotate.The servo motor 112 and the camera shooting mechanism
130 are connected, and drive the shaft 111 to rotate according to the control of the camera shooting mechanism 130, the shaft 111 drives the vacuum
Sucker rotation, the wafer 200 are rotated together with the vacuum chuck.
In this present embodiment, the wafer guiding mechanism 120 includes the guiding mechanism of control 200 correcting of wafer
The 121 correcting driving mechanisms 122 moved with the control guiding mechanism 121.
Specifically, in this present embodiment, the guiding mechanism 121 includes being installed in what the supporting part two sides were oppositely arranged
First correcting clamping jaw 121a and the second correcting clamping jaw 121b.
Closer, as shown in Figures 2 and 3, the first correcting clamping jaw 121a and the second correcting clamping jaw 121b
One is respectively provided with to be used for the guiding fossaperturate of 200 correcting of wafer and the connection being connected with the correcting driving mechanism 122
Portion 122d.The i.e. described first correcting clamping jaw 121a has the first guiding fossaperturate 121a1 and first connecting portion 121a2；Described
Two correcting clamping jaw 121b have the second guiding fossaperturate 121b1 and second connecting portion 121b2.
In this present embodiment, as shown in figure 4, the correcting driving mechanism 122 includes: that first correcting is driven to press from both sides respectively
The the first guide pad 122a and the second guide pad 122b of pawl 121a and the second correcting clamping jaw 121b movement；It is led with described first
It is connected to block 122a with the second guide pad 122b and controls the first guide pad 122a and the second guide pad 122b fortune
Dynamic cylinder 122c.Wherein, the cylinder 122c controls the first guide pad 122a and second guiding by connector
Block 122b.
In addition, in this present embodiment, the wafer pingbian identifies deviation correcting device 100 further include: first support 140, including
It is used to support the support frame 141 of the rotating mechanism 110 and is installed at the top of support frame as described above 141 and be used to support the wafer and lead
The support panel 142 of positive mechanism 120.
In this present embodiment, the camera shooting mechanism 130 is suspended in 200 top of wafer, with 110 phase of rotating mechanism
Even, for obtaining the image of the wafer 200, identifying the platband position of the wafer 200 by described image and according to described
Platband position controls the rotating mechanism 110 and rotates.
Specifically, in this present embodiment, the photographing module includes a camera and the image that is connected with the camera
Handle chip.The camera obtains whole wafer towards the wafer 200, preferably vertically-aligned 200 top of the wafer
200 image.The pingbian of the wafer 200 is obtained by picture processing chip identification, and judges the pingbian and default pingbian
The distance of position determines the rotation angle of the wafer 200, wherein described image, which is handled, identifies that in image be pingbian in chip
And at a distance from default pingbian, determine that rotation angle is image ranging control algolithm mature in the prior art, it is no longer superfluous herein
It states.
In an embodiment of the utility model, the wafer pingbian identifies deviation correcting device 100 further include: is used to support institute
Photographing module is stated so that the photographing module to be suspended in the second support 150 of 200 top of wafer.Wherein, described second
Frame 150 can be arranged independently of the first support 140, be installed on 140 side of the first support or above, can also be with
The support frame 141 of the first support 140 is integrally formed.
The height of the second support 150 allows the camera to be directed at the shooting wafer 200, described to take the photograph
It is preferably but not limited to be 0.5 meter~1 meter at a distance from the wafer 200 as head, can guarantee that the camera is available described
The whole surface image of wafer 200 and the distance for ensuring clarity.
It in this present embodiment, is 200 fogging image of wafer for preventing insufficient light from causing to obtain, the camera shooting mechanism
The promising camera shooting of 130 connections provides the headlamp 160 of light source.Wherein, the headlamp 160 is preferably sheathed on the camera week
The circular lamp enclosed.
For make it is further understood that in the present embodiment wafer pingbian identify deviation correcting device 100 principle,
The course of work of wafer pingbian identification deviation correcting device 100 in the present embodiment is illustrated below.
Robot puts wafer 200 on rotating mechanism 110, and smooth surface is upward, after robot is put, due to putting
There may be errors for position, control guiding mechanism 121 by cylinder 122c first and wafer 200 is imported vacuum chuck, vacuum is inhaled
Wafer 200 is sucked in disk, and top camera identifies the relative position of pingbian and angle at this time, obtains rotation angle, rotating mechanism
110 rotation respective angles, to guarantee to rotate later pingbian angle agreement.
In addition, in order to protrude the innovative part of the utility model, it will not be with solution the utility model in the present embodiment
The technical issues of proposed, the less close feature of relationship introduced, but this does not indicate that there is no other structures in the present embodiment
And functional character.
It should be noted that diagram provided in the present embodiment only illustrates the basic structure of the utility model in a schematic way
Think, only shown in schema then with related component in the utility model rather than component count when according to actual implementation, shape and
Size is drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout type
State may also be increasingly complex.
In conclusion the utility model puts wafer on rotating mechanism, drive correcting clamping jaw will by clamping jaw cylinder
Wafer correcting identifies the pingbian angle of wafer by camera shooting mechanism, by flat required for driving rotating mechanism to go to wafer
Corner degree completes the identification and correction of wafer pingbian, substantially reduces the probability for manually putting wafer error, reduces the damage of product
Consumption improves production efficiency, reduces labor cost and production cost；The utility model structure is simple, and economy is convenient, has higher
Practicability.So the utility model effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of wafer pingbian identifies deviation correcting device, it is characterised in that: the wafer pingbian identifies that deviation correcting device includes:
Rotating mechanism is placed the supporting part of wafer with one, is connected to below the supporting part for the pingbian in the wafer
The wafer is driven to turn to the rotational control assemblies of predeterminated position when the deviation predeterminated position of position；
Wafer guiding mechanism, the correcting of guiding mechanism and control the guiding mechanism movement including a control wafer correcting
Driving mechanism；
Mechanism is imaged, is suspended in above the wafer, is connected with the rotating mechanism, for obtaining the image of the wafer, leading to
It crosses described image and identifies the platband position of the wafer and the rotating mechanism is controlled according to the platband position and rotate.
2. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the wafer pingbian identification correction
Device further include:
First support is used to support institute including being used to support the support frame of the rotating mechanism and being installed at the top of support frame as described above
State the support panel of wafer guiding mechanism.
3. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the guiding mechanism includes installing
In the first correcting clamping jaw and the second correcting clamping jaw that the supporting part two sides are oppositely arranged.
4. wafer pingbian according to claim 3 identifies deviation correcting device, it is characterised in that: the first correcting clamping jaw and institute
State the second correcting clamping jaw be respectively provided with one for by the guiding fossaperturate of the wafer correcting and with the correcting driving mechanism phase
Interconnecting piece even.
5. wafer pingbian according to claim 3 or 4 identifies deviation correcting device, it is characterised in that: the correcting driving mechanism
Include:
The first guide pad and the second guide pad of the first correcting clamping jaw and the second correcting jaw action are driven respectively；
It is connected with first guide pad and second guide pad and controls first guide pad and second guide pad fortune
Dynamic cylinder.
6. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the supporting part is vacuum suction
Disk.
7. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the rotational control assemblies packet
Include: connecting the shaft for driving the supporting part rotation below the supporting part and drive the servo motor of the shaft rotation.
8. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the wafer pingbian identification correction
Device further include: be used to support the camera shooting mechanism so that the camera shooting mechanism to be suspended in the second support above the wafer.
9. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the camera shooting mechanism is taken the photograph including one
As head and the picture processing chip being connected with the camera.
10. wafer pingbian according to claim 1 identifies deviation correcting device, it is characterised in that: the camera shooting mechanism is connected with
The headlamp of light source is provided for camera shooting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820879100.XU CN209104119U (en) | 2018-06-07 | 2018-06-07 | Wafer pingbian identifies deviation correcting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820879100.XU CN209104119U (en) | 2018-06-07 | 2018-06-07 | Wafer pingbian identifies deviation correcting device |
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| Publication Number | Publication Date |
|---|---|
| CN209104119U true CN209104119U (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820879100.XU Active CN209104119U (en) | 2018-06-07 | 2018-06-07 | Wafer pingbian identifies deviation correcting device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117253835A (en) * | 2023-11-20 | 2023-12-19 | 北京锐洁机器人科技有限公司 | Graphite disc positioning mechanism for loading wafer |
-
2018
- 2018-06-07 CN CN201820879100.XU patent/CN209104119U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117253835A (en) * | 2023-11-20 | 2023-12-19 | 北京锐洁机器人科技有限公司 | Graphite disc positioning mechanism for loading wafer |
| CN117253835B (en) * | 2023-11-20 | 2024-02-20 | 北京锐洁机器人科技有限公司 | Graphite disc positioning mechanism for loading wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Forsyte Robot Co.,Ltd. Address before: Room 305, Kaike building, area a, 1801 Hongmei Road, Xuhui District, Shanghai 200230 Patentee before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Fosaite Technology Co.,Ltd. Country or region after: China Address before: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee before: Shanghai Forsyte Robot Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |