CN209087766U - A kind of wafer scraping machine - Google Patents

Abstract

The utility model discloses a kind of wafer scraping machine, the scraping machine includes: rack, is provided with fixed platform and platen, and circumferentially distributed along the fixed platform has multiple magazines for being used to place wafer；Feeding module is set in the fixed platform, and the feeding module includes the manipulator of the sucker and the driving sucker for drawing wafer；Conveyor module is arranged on the platen, the fixation kit that Y-axis Power Component is provided on the conveyor module and is arranged on the Y-axis Power Component；The upper end of the conveyor module is arranged in scraping module, and the driving assembly of rose reamer and the driving rose reamer or more and transverse shifting is provided in the scraping module；Detection module comprising the first CCD camera and tool setting gauge.Wafer scraping machine provided by the utility model can scrape off the deposition of wafer surrounding and coating, take a short time, substantially increase production efficiency.

Description

A kind of wafer scraping machine

Technical field

The utility model relates to technical field of automation equipment, specifically, the utility model relates to a kind of wafer scraping machines.

Background technique

Wafer is the basic material for manufacturing semiconductor chip, has deposition and coating in wafer periphery, is carrying out taking crystal grain When operation, it is necessary first to deposition and coating around wafer be wiped off, then carried out at grinding to the sheet glass of crystal column surface again Reason is to obtain crystal grain, and existing frequently-used removal wafer periphery deposits and the method for coating is handled using machining center, On machining tool, position sensing is first carried out using surrounding of the probe to wafer, then use cutter by wafer periphery deposition and coating Machine away, due to probe detection need take a significant amount of time, therefore using machining center handled when, generally require cost 90~ The time of 120 seconds time, cost are longer, and production efficiency is low.

Utility model content

For the shortcomings of the prior art, the purpose of the utility model is to provide a kind of wafer scraping machine, institutes The rose reamer having on wafer scraping machine for cutting is stated, after being detected using the first CCD camera to crystal round fringes position, Rose reamer can automatically strike off the deposition of wafer periphery and coating, take a short time, substantially increase production efficiency.

The utility model discloses a kind of wafer scraping machine, comprising:

Rack is provided with fixed platform and platen, and the platen is placed in the side of the fixed platform, along described The circumferentially distributed of fixed platform has multiple magazines for being used to place wafer；

Feeding module is set in the fixed platform, and the feeding module includes the sucker for drawing wafer And the manipulator of the driving sucker；

Conveyor module is arranged on the platen, and Y-axis Power Component is provided on the conveyor module and setting exists Fixation kit on the Y-axis Power Component, the fixation kit is for carrying wafer, described in the Y-axis Power Component driving Fixation kit along the rack longitudinal movement；

Scraping module is arranged in the upper end of the conveyor module, is provided with rose reamer and drive in the scraping module Move the driving assembly of the rose reamer or more and transverse shifting；

Detection module comprising the rose reamer is arranged in the first CCD camera and tool setting gauge, first CCD camera Side, for calibrating the wafer coordinate on fixation kit, the side of the fixation kit is arranged in the tool setting gauge, for detecting The height of the rose reamer.

Preferably, the medial surface uniform intervals of the magazine are provided with multiple for placing the partition of wafer, two neighboring Gap between the partition is greater than the thickness of wafer, and the sum of the block board thickness and gap are greater than the sucker thickness and crystalline substance The sum of circle thickness.

Preferably, the sucker is U-shaped plate structure, is equipped with a cavity among the sucker, and set on the sucker It is equipped with sucker and baffle.

Preferably, the Y-axis Power Component includes: the first screw rod being arranged on the platen and is movably arranged on institute The first nut on the first screw rod is stated, and first screw rod is driven by a first motor and rotated.

Preferably, the fixation kit includes:

Y-axis platform is fixed on first nut；

Light source fixing plate is arranged on the Y-axis platform, offers the first circle at the center of the light source fixing plate Through slot；

Bottom plate is fixed on the top of the light source fixing plate by multiple support frames, distinguishes in the two sides of the bottom plate It is provided with one first sliding rail, multiple first sliding blocks are movably set on first sliding rail, and open at the center of the bottom plate Equipped with the second round through slot；

Annular light source, setting is in the described second round through slot, and the annular light source passes through multiple light sources support frame It is fixed in the light source fixing plate；

Fixing sucking disk is placed in the top of the annular light source, and the first air channel is offered on the fixing sucking disk, described Fixing sucking disk lower end is provided with fixed carrier, and the fixed carrier passes through the annular light source and the first round through slot and the Y Shaft platform is connected；

Fixed core is movably arranged on the center of the fixing sucking disk and connect with one first cylinder-driven, the fixation The second air channel is provided on core, and the fixed core is adapted with the cavity of the sucker；

Air port, is arranged in the surrounding of the fixing sucking disk, and the air port includes the first suction opening of activity setting relatively With the second suction opening, air duct is provided on first suction opening and the second suction opening, and in first suction opening and second The two side ends of suction opening are respectively arranged with engaging lug, and the engaging lug is fixed on corresponding first sliding block, described A connecting plate, and the connecting plate and one are respectively fixed on the engaging lug of the different sides of one suction opening and the second suction opening The connection of two cylinder-drivens；

Wherein, one end of second suction opening is provided with a gas outlet, the gas outlet is connected with the air duct.

Preferably, crossbeam is provided on the platen, the driving component is arranged on the crossbeam, and the driving Component includes X-axis driving unit and vertical drive units, and the X-axis driving unit is used to drive the rose reamer transverse shifting, The vertical drive units are for driving the rose reamer to move up and down.

Preferably, the X-axis driving unit includes: the second screw rod being arranged on the crossbeam and is movably arranged on institute The second nut on the second screw rod is stated, second screw rod is rotated by one second motor driven, and is set on second nut It is equipped with an X-axis platform, the vertical drive units are arranged on the X-axis platform.

Preferably, the vertical drive units include:

Lead screw is connected with a third motor drive, and a third nut is provided on the lead screw；

A pair of second sliding rail, sets up separately in the two sides of the lead screw, is movably set with one second on second sliding rail Sliding block；

Support plate is fixedly linked with the third nut, and the side of the support plate is fixed on second sliding block On；

Floating grinding head is fixed in the support plate, and the rose reamer is fixed on floating grinding head lower end.

Preferably, the bottom surface of the rose reamer be conical camber, and the longitudinal section of the rose reamer bottom end formed folder The angle at angle is 160 °~175 °.

The beneficial effects of the utility model are:

1) the wafer scraping machine that the utility model discloses, includes detection module, is provided with first on the detection module CCD camera can get the position coordinates of crystal round fringes by first CCD camera, and speed is fast, reduces process time, mentions High production efficiency.

2) the wafer scraping machine that the utility model discloses, cuts crystal round fringes by rose reamer, the bottom of rose reamer Face is conical camber, and the angle of the angle of the bottom end formation of the longitudinal section of the rose reamer is 160 °~175 °, thus described Rose reamer can strike off the deposition of crystal round fringes and coating can guarantee that rose reamer will not damage on wafer during the cutting process again Crystal grain.

3) the wafer scraping machine that the utility model discloses, fixed wafer, the fixation kit are carried using fixation kit On be provided with fixing sucking disk and fixed core, by the cooperation of fixed core and sucker, the wafer on sucker can be transferred to fixation On core, and air port is additionally provided on fixation kit, the air port includes the first suction opening and second of activity setting relatively Suction opening, neither interferes the illumination of annular light source, and can be siphoned away the dust in cutting process by the air duct on air port, powder The impurity such as dirt can be discharged effectively, and working environment is cleaner and tidier, and the impurity such as dust will not fall in crystal column surface, avoid Interference is generated to the cutting of rose reamer.

Detailed description of the invention

In order to illustrate more clearly of the embodiment of the present disclosure or technical solution in the prior art, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Disclosed some embodiments for those of ordinary skill in the art without creative efforts, can be with Other attached drawings are obtained according to these figures.

Fig. 1 is a kind of structural schematic diagram for wafer scraping machine that one embodiment of the disclosure provides；

Fig. 2 is a kind of partial structure diagram for wafer scraping machine that one embodiment of the disclosure provides；

Fig. 3 is a kind of structural schematic diagram for feeding module that one embodiment of the disclosure provides；

Fig. 4 is a kind of structural schematic diagram at another visual angle of feeding module that one embodiment of the disclosure provides；

Fig. 5 is a kind of structural schematic diagram for sucker that one embodiment of the disclosure provides；

Fig. 6 is the structural representation of a kind of conveyor module, scraping module and detection module that one embodiment of the disclosure provides Figure；

Fig. 7 is another visual angle of a kind of conveyor module, scraping module and detection module that one embodiment of the disclosure provides Structural schematic diagram；

Fig. 8 is a kind of structural schematic diagram for fixation kit that one embodiment of the disclosure provides；

Fig. 9 is a kind of structural schematic diagram for vertical drive units that one embodiment of the disclosure provides；

Figure 10 is a kind of structural schematic diagram for rose reamer that one embodiment of the disclosure provides；

Figure 11 is a kind of vertical section structure schematic diagram for rose reamer that one embodiment of the disclosure provides.

Specific embodiment

The following describes the utility model in further detail with reference to the accompanying drawings, the aforementioned and other mesh of the utility model , features, aspects and advantages will be apparent, to enable those skilled in the art's refer to the instruction text real accordingly It applies.In the accompanying drawings, for clarity, shape and size can be amplified, and identical attached drawing mark will be used in all figures Note is to indicate the same or similar component.In the following description, such as center, thickness, height, length, front, back, rear portion, The words such as the left side, the right, top, bottom, top, lower part are to be based on the orientation or positional relationship shown in the drawings.Particularly, " high Degree " is equivalent to size from the top to the bottom, and " width " is equivalent to size from left to right, and " depth " is equivalent to be arrived in the past Size afterwards.These relative terms are to be not intended to need specifically to be orientated for convenience and usually.Be related to attachment, Connection etc. term (for example, " connection " and " attachment ") refer to these structures pass through intermediate structure directly or indirectly to one another fixation or The relationship of attachment and movable or rigidly attached or relationship, unless otherwise clearly stating.

Fig. 1 and Fig. 2 is the wafer scraping machine that one embodiment of the disclosure provides, and the scraping machine includes: rack, feeding mould Block, conveyor module, scraping module and detection module.Wherein, it is provided with fixed platform 101 and platen 102 in rack, described Plate 102 is placed in the side of the fixed platform 101, along the fixed platform 101 it is circumferentially distributed have it is multiple for placing crystalline substance Round magazine 103；Feeding module is set in the fixed platform 101, and the feeding module includes for drawing wafer The manipulator 220 of sucker 210 and the driving sucker 210, the manipulator 220 are four axis robots；Conveyor module setting On the platen 102, it is provided with Y-axis Power Component on the conveyor module and is arranged on the Y-axis Power Component Fixation kit, the fixation kit drive the fixation kit along the rack for carrying wafer, the Y-axis Power Component Longitudinal direction moved；The upper end of the conveyor module is arranged in scraping module, is provided with rose reamer 401 in the scraping module And the driving rose reamer 401 moves up and down and the driving assembly of transverse shifting；Detection module comprising the first CCD phase The side of the rose reamer 401 is arranged in machine 502 and tool setting gauge 501, first CCD camera 502, and the tool setting gauge 501 is set It sets in the side of the fixation kit, the position that first CCD camera 502 is used to obtain the crystal round fringes on fixation kit is sat Mark, the tool setting gauge 501 are used to detect the height of the rose reamer 401.The detection module further includes having the second CCD camera 104, second CCD camera 104 is arranged in the movement routine of sucker 210, the lower section of sucker 210 is placed in, for calibrating It is placed in the coordinate of the wafer on the sucker 210.

As shown in Figure 3 and Figure 4, the medial surface uniform intervals of the magazine 103 are provided with multiple partitions, two neighboring described Gap between partition is greater than the thickness of the wafer, and when wafer is placed on the partition, partition will not generate wafer Interference, and the sum of the block board thickness and the gap are greater than the sum of the sucker thickness and wafer thickness, so that the suction Disk 210, which can protrude into, draws wafer in magazine 103.

As shown in figure 5, sucker 210 is U-shaped plate structure, it is equipped with a cavity 214 among the sucker 210, and described It is provided with sucker 211 and baffle 212 on sucker 210, air entry 213 is provided on sucker 210, the air entry 213 can To be connected by air intake duct with getter device, the getter device can be asepwirator pump, be also provided on the sucker 210 Position sensor, the position sensor can be used to detect the position for the wafer being placed in magazine 103, and the position passes Sensor can be photoelectrical position sensor.When sucker 210 draws wafer, four axis robots 220 control sucker 210, which is moved to, to be put It is equipped at the charging tray of wafer, according to the position for the wafer to be taken that position sensor detects, four axis robots 220 control sucker 210 lower sections for moving up or moving down into the wafer to be drawn then control the translation of sucker 210 and are inserted into magazine 103, work as wafer When touching baffle 212, sucker 210 stops movement, and wafer drops on sucker 210, and getter device starting, sucker 210 will be brilliant Circle is adsorbed on sucker 210, and the wafer is then driven to remove out of charging tray 103.After taking out wafer, surrounding manipulator 220 Controlling the sucker 210 drives wafer to be moved at the second CCD camera 104, and the wafer that the second 104 pairs of CCD camera is taken out carries out It shoots to obtain the position coordinates of wafer, then adjusts 210 position of sucker according to the position coordinates of acquisition to compensate the position of wafer Deviation is set, wafer is placed on the designated position of fixation kit by sucker 210.

The structure of conveyor module is as shown in Figure 6 and Figure 7, it can be seen that being provided with Y-axis power packages on the conveyor module Part and fixation kit, the Y-axis Power Component include: that the first screw rod 301 being arranged on the platen 102 and activity are set The first nut on first screw rod 301 is set, and first screw rod 301 is driven by a first motor and rotated.It is described solid Determine component to be arranged on first nut, when first motor starting, the first nut drives fixation kit at first It is moved on bar 301, so that fixation kit can move back and forth between feeding module and scraping module, when fixation kit exists When at feeding module, wafer is placed on fixation kit by sucker 210, and then first motor driving fixation kit is moved to scraping Module lower end, the rose reamer 401 in scraping module carry out scraping processing to wafer.

The structure of fixation kit is as shown in figure 8, it can be seen that the fixation kit includes: that Y-axis platform 321, light source are solid Fixed board 322, bottom plate 323, annular light source 340, fixing sucking disk 328, fixed core 327 and air port.Wherein, Y-axis platform 321 is solid It is scheduled on first nut；Light source fixing plate 322 is arranged on the Y-axis platform 321, in the light source fixing plate 322 Center offers the first round through slot；Bottom plate 323 is fixed on the upper of the light source fixing plate 322 by multiple support frames 3231 Side, is respectively arranged with one first sliding rail 330 in the two sides of the bottom plate 323, is movably set on first sliding rail of cunning 330 Multiple first sliding blocks 331 offer one second round through slot at the center of the bottom plate 323；Annular light source 340 is arranged described In second round through slot, and the annular light source 340 is fixed on the upper of the light source fixing plate 322 by multiple light sources support frame Side；Fixing sucking disk 328 is placed in the top of the annular light source 340, offers the first air channel on the fixing sucking disk 328 3281, the fixing sucking disk 328 is fixed on the Y-axis platform 321 by being placed under it the fixation carrier at end, the fixed load Tool is connected across the described first round through slot and annular light source 340 with the fixing sucking disk 328, in the fixing sucking disk 328 Central movable is provided with a fixed core 327, and the fixed core 327 is adapted with the cavity 214 of the sucker 210, and described solid Determine to be provided with the second air channel 3271 on core 327, the fixed core 327 is connect with one first cylinder-driven, the fixing sucking disk 328 the first air channel 3281 and the second air channel 3271 of fixed core 327 are connected with a suction inlet respectively, the fixing sucking disk 328 and fixed core 327 for carrying fixed wafer, when wafer being placed in fixing sucking disk 328 and fixed core 327, wafer Air between fixing sucking disk 328 and fixed core 327 is inhaled by the first air channel 3281 and the second air channel 3271 by suction inlet It walks, under gas pressure, wafer is attracted on fixing sucking disk 328 and fixed core 327.When not placing wafer, the fixation Core 327 protrudes from the surface of fixing sucking disk 328, and during wafer is placed on fixed core 327, sucker 210 moves sucker 210 Dynamic, fixed core 327 is placed in the cavity 214 of sucker 210, thus will not interfere with the movement of sucker 210, it is solid wafer to be placed into When determining the designated position of core 327, wafer adsorption is fixed on the surface of fixed core 327 by fixed core 327, after sucker 210 is removed The starting of first cylinder, draws the fixed core 327 and is moved to the position flushed with fixing sucking disk 328, so that wafer is fixed In fixed core 327 and fixing sucking disk 328.The surrounding of the fixing sucking disk 328 is arranged in air port, and the air port includes relatively living First suction opening 325 of dynamic setting and with the second suction opening 326, be arranged on first suction opening 325 and the second suction opening 326 There is air duct 3252, and be respectively arranged with engaging lug 3251 in the two side ends of first suction opening 325 and the second suction opening 326, The engaging lug 3251 is fixed on corresponding first sliding block 331, in first suction opening 325 and the second suction opening A connecting plate 332, and the connecting plate 332 and one second cylinder are respectively fixed on the engaging lug 3251 of 326 different sides 324 transmission connections；One end of second suction opening 326 is provided with a gas outlet 329, the gas outlet 329 and the wind Road 3252 is connected, and the gas outlet 329 is connected by hose with air extractor.When the first CCD camera 502 is to fixing sucking disk 328 and fixed core 327 on wafer take pictures the coordinate for obtaining crystal round fringes when, second cylinder 324 pushes connecting plate 332, so that the first suction opening 325 and the second suction opening 326 are backwards to movement, separated by a distance between the two, ring light Source 340 is exposed, and annular light source 340 illuminates wafer, and the position coordinates of crystal round fringes are obtained convenient for the first CCD camera 502.It is taking a picture After the completion, the telescopic rod retraction of the second cylinder 324, so that the first suction opening 325 and the second suction opening 326 move toward one another, until The two connects, and when rose reamer 401 carries out the processing of wafer scraping, can generate clast dust, air extractor work, meeting constantly will be broken Bits dust is entered in hose by gas outlet 329 by air duct 3252 and is finally emitted, so that rose reamer 401 is being cut During cutting, the impurity such as dust can be discharged effectively, and working environment is cleaner and tidier, and the impurity such as dust will not fall in crystalline substance Circular surfaces generate interference so as to avoid the cutting to rose reamer.

Rose reamer 401 is driven by the second driving assembly, and the structure of second driving assembly can be gone to reference to Fig. 6 and figure 7, crossbeam 402 is provided on the platen 102, second driving assembly is arranged on the crossbeam 402, and described second Driving assembly includes X-axis driving unit and vertical drive units, and the X-axis driving unit is horizontal for driving the rose reamer 401 To movement, the vertical drive units are for driving the rose reamer 401 to move up and down.The X-axis driving unit includes: setting The second screw rod 403 on the crossbeam 402 and the second nut 404 being movably arranged on second screw rod 403, it is described Second screw rod 403 is rotated by one second motor driven, and an X-axis platform 405 is provided on second nut 404, described Vertical drive units are arranged on the X-axis platform 405.The structure of the vertical drive units is as shown in figure 9, can from figure To see, the vertical drive units include: lead screw 412, a pair of second sliding rail 413, support plate 414 and floating grinding head 415, In, lead screw 412 and a third motor 411 are sequentially connected, and a third nut is provided on the lead screw 412；A pair second Sliding rail 413 sets up separately in the two sides of the silk 412, and one second sliding block 416 is movably set on second sliding rail 413；Support Plate 414 is fixedly linked with the third nut, and the side of the support plate 414 is fixed on second sliding block 416；It floats Grinding head 415 is fixed in the support plate 414, and first CCD camera 502 is also secured in the support plate 414, The rose reamer 401 is fixed on 415 lower end of floating grinding head.When third motor 411 starts, third nut drives support plate 414 move up and down along the lead screw 412, move down on the rose reamer so that the floating grinding head 415 in support plate 414 drives It is dynamic.Vertical drive units are used to adjust the height of rose reamer 401, so that the bottom end of rose reamer 401 and being fixed on fixing sucking disk 328 On wafer surface be adapted, before rose reamer 401 is cut, X-axis driving unit drive rose reamer be moved to knife 501 top of instrument, the height for the rose reamer 401 that vertical drive units are measured according to tool setting gauge 501 move down on rose reamer 401 to control It is dynamic, so that the bottom end height of rose reamer 401 is adapted with the crystal column surface being fixed on fixing sucking disk 328, then according to first CCD camera 502 obtains the position coordinates of crystal round fringes, and X-axis driving unit controls 401 transverse shifting of rose reamer, Y-axis driving assembly Wafer longitudinal movement is controlled, by the cooperation of the two, rose reamer 401 can be moved along the edge of wafer with by crystal round fringes Deposition and coating scrape off.

The structure of rose reamer 401 may refer to shown in Figure 10 and Figure 11, and the bottom surface of the rose reamer 401 is conical camber, And the angle of the angle of the bottom end formation of the longitudinal section of the rose reamer 401 is 160 °~175 °.In the present embodiment, it is described fall The angle for the angle that the bottom end of the longitudinal section of angle knife is formed is 170 °, so that the rose reamer 401 both can guarantee and strike off wafer The deposition and coating at edge can guarantee that rose reamer during the cutting process will not damage the crystal grain on wafer again.

The application method of wafer scraping machine are as follows:

Manipulator 220 controls sucker 210 and is moved at the charging tray 103 for being placed with wafer, according to the position of wafer to be taken, machine Tool hand 220 controls the lower section that sucker 210 moved up or be displaced downwardly to wafer to be taken, and then controls the translation of sucker 210 and is inserted into magazine 103 It is interior；

When taking wafer contacts to baffle 212, sucker 210 stops movement, and wafer to be taken is fallen into sucker 210, inhales Disk 210 is drawn drives wafer to be taken to remove out of charging tray 103 after taking wafer；

It taking out after taking wafer, manipulator 220 controls sucker 210 and wafer is driven to be moved at the second CCD camera 104, The wafer that second 104 pairs of CCD camera is taken out is taken pictures to obtain the position coordinates of wafer, and then manipulator 220 is according to acquisition Position coordinates adjustment 210 position of sucker to compensate the position deviation of wafer；

First motor starting, the first nut drive fixation kit to move on the first screw rod 301, until fixation kit is mobile To 210 position of sucker, sucker 210 is mobile at the fixed core 327 on fixation kit, and wafer is being placed into fixed core When 327 designated position, fixed core 327 is by wafer adsorption on its surface, and the first cylinder starts after sucker 210 is removed, traction Fixed core 327 is moved to the position flushed with fixing sucking disk 328, so that wafer is absorbed and fixed at fixed core 327 and fixed suction On disk 328, then first motor driving fixation kit is moved to scraping module lower end；

X-axis driving unit drives rose reamer to be moved to the top of tool setting gauge 501, tool setting gauge 501 to the height of rose reamer 401 into Row detection, vertical drive units adjust rose reamer 401 according to the height of rose reamer and move up and down, so that the bottom of rose reamer 401 End height is adapted with the wafer upper surface being fixed on fixation kit；

The first CCD camera 502 of X-axis driving unit drive is moved to the top of wafer, and the second cylinder 324 pushes connecting plate 332, so that the first suction opening 325 and the second suction opening 326 are backwards to movement, up to exposing annular light source 340, ring light Wafer is illuminated in source 340, and the first CCD camera 502 takes pictures to the wafer on fixation kit to obtain the position of crystal round fringes seat Mark, after the completion of taking pictures, the telescopic rod of the second cylinder 324 bounces back, so that the first suction opening 325 and the second suction opening 326 are opposite Movement, until the two connects；

According to the position coordinates of crystal round fringes, X-axis driving unit controls 401 transverse shifting of rose reamer, Y-axis driving assembly control Combinations circle longitudinal movement, enables rose reamer 401 to move along the edge of wafer to cut the deposition of crystal round fringes and coating It goes, in 401 cutting process of rose reamer, dust is discharged by air duct 3252 from gas outlet 329.

It is not only in the description and the implementation although the embodiments of the present invention have been disclosed as above Listed utilization, it can be applied to various fields suitable for the present invention completely, for those skilled in the art, Other modifications may be easily implemented, therefore without departing from the general concept defined in the claims and the equivalent scope, this reality It is not limited to specific details with novel.

Claims (9)

1. a kind of wafer scraping machine characterized by comprising

Rack, is provided with fixed platform (101) and platen (102), and the platen (102) is placed in the fixed platform (101) side, circumferentially distributed along the fixed platform (101) have multiple magazines (103) for being used to place wafer；

Feeding module is set on the fixed platform (101), and the feeding module includes the sucker for drawing wafer (210) and the manipulator (220) of the driving sucker (210)；

Conveyor module is arranged on the platen (102), Y-axis Power Component and setting is provided on the conveyor module Fixation kit on the Y-axis Power Component, the fixation kit drive institute for carrying wafer, the Y-axis Power Component Fixation kit is stated along the longitudinal movement of the rack；

The upper end of the conveyor module is arranged in scraping module, and rose reamer (401) is provided in the scraping module and is driven Move the rose reamer (401) up and down and the driving assembly of transverse shifting；

Detection module comprising the first CCD camera (502) and tool setting gauge (501), first CCD camera (502) are arranged in institute The side for stating rose reamer (401), for obtaining the position coordinates of the crystal round fringes on fixation kit, the tool setting gauge (501) is set It sets in the side of the fixation kit, for detecting the height of the rose reamer (401).

2. scraping machine as described in claim 1, which is characterized in that the medial surface uniform intervals of the magazine (103) are provided with It is multiple for placing the partitions of wafer, the gap between the two neighboring partition is greater than the thickness of wafer, and the partition is thick The sum of degree and gap are greater than the sum of the sucker thickness and wafer thickness.

3. scraping machine as described in claim 1, which is characterized in that the sucker (210) is U-shaped plate structure, the sucker (210) intermediate to be equipped with a cavity (214), and sucker (211) and baffle (212) are provided on the sucker (210).

4. scraping machine as claimed in claim 3, which is characterized in that the Y-axis Power Component includes: to be arranged in the platen (102) the first screw rod (301) on and the first nut being movably arranged on first screw rod (301), and described first Screw rod (301) is driven by a first motor to be rotated.

5. scraping machine as claimed in claim 4, which is characterized in that the fixation kit includes:

Y-axis platform (321) is fixed on first nut；

Light source fixing plate (322) is arranged on the Y-axis platform (321), opens at the center of the light source fixing plate (322) Equipped with the first round through slot；

Bottom plate (323) is fixed on the top of the light source fixing plate (322) by multiple support frames (3231), at the bottom The two sides of plate (323) are respectively arranged with one first sliding rail (330), and multiple are movably set on first sliding rail (330) One sliding block (331), and the second round through slot is offered at the center of the bottom plate (323)；

Annular light source (340), setting is in the described second round through slot, and the annular light source (340) passes through multiple light sources Support frame is fixed on the light source fixing plate (322)；

Fixing sucking disk (328) is placed in the top of the annular light source (340), offers first on the fixing sucking disk (328) Air channel (3281), fixing sucking disk (328) lower end are provided with fixed carrier, and the fixed carrier passes through the annular light source (340) it is connected with the first round through slot with the Y-axis platform (321)；

Fixed core (327) is movably arranged on the center of the fixing sucking disk (328) and connect with one first cylinder-driven, institute It states and is provided on fixed core (327) the second air channel (3271), and the cavity of the fixed core (327) and the sucker (210) (214) it is adapted；

Air port, is arranged the surrounding in the fixing sucking disk (328), and the air port includes the first suction opening of activity setting relatively (325) and the second suction opening (326), air duct is provided on first suction opening (325) and the second suction opening (326) (3252), and in the two side ends of first suction opening (325) and the second suction opening (326) it is respectively arranged with engaging lug (3251), the engaging lug (3251) is fixed on corresponding first sliding block (331), in first suction opening (325) It is respectively fixed with a connecting plate (332) on the engaging lug (3251) of the different sides of the second suction opening (326), and the connection Plate (332) and one second cylinder (324) are sequentially connected；

Wherein, be provided with a gas outlet (329) in one end of second suction opening (326), the gas outlet (329) with it is described Air duct (3252) is connected.

6. scraping machine as claimed in claim 5, which is characterized in that be provided with crossbeam (402), institute on the platen (102) It states driving assembly to be arranged on the crossbeam (402), and the driving component includes X-axis driving unit and vertical drive units, The X-axis driving unit for driving the rose reamer (401) transverse shifting, the vertical drive units for drive it is described fall Angle knife (401) moves up and down.

7. scraping machine as claimed in claim 6, which is characterized in that the X-axis driving unit includes: to be arranged in the crossbeam (402) the second screw rod (403) on and the second nut (404) being movably arranged on second screw rod (403), described Two screw rods (403) are rotated by one second motor driven, and an X-axis platform (405) is provided on second nut (404), The vertical drive units are arranged on the X-axis platform (405).

8. scraping machine as claimed in claim 7, which is characterized in that the vertical drive units include:

Lead screw (412) is connected with a third motor (411) transmission, and is provided with a third spiral shell on the lead screw (412) It is female；

A pair of second sliding rail (413), sets up the two sides in the lead screw (412) separately, activity is set on second sliding rail (413) It is equipped with one second sliding block (416)；

Support plate (414) is fixedly linked with the third nut, and the side of the support plate (414) is fixed on described On two sliding blocks (416)；

Floating grinding head (415) is fixed on the support plate (414), and the rose reamer (401) is fixed on the floating and beats Bistrique (415) lower end.

9. scraping machine as described in claim 1, which is characterized in that the bottom surface of the rose reamer (401) is conical camber, and institute The angle for stating the angle of the bottom end formation of the longitudinal section of rose reamer (401) is 160 °~175 °.