CN209071379U - LED of the CSP in conjunction with mounting bracket - Google Patents
LED of the CSP in conjunction with mounting bracket Download PDFInfo
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- CN209071379U CN209071379U CN201821201685.6U CN201821201685U CN209071379U CN 209071379 U CN209071379 U CN 209071379U CN 201821201685 U CN201821201685 U CN 201821201685U CN 209071379 U CN209071379 U CN 209071379U
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Abstract
There is provided a kind of LED of CSP in conjunction with mounting bracket comprising mounting bracket is equipped with cavity among the mounting bracket, it is characterized in that, it is provided with CSP in the cavity of the mounting bracket, is equipped with luminescence chip in the CSP, the top of the CSP and be surrounded by substratum transparent.Directly CSP, which is arranged, by the application fills transparent silica gel in mounting bracket, then in the gap around CSP and mounting bracket；Transparent silica gel is filled between CSP and mounting bracket, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it, is avoided being damaged or polluting in use process, is kept the optical color parameter of LED constant.
Description
[technical field]
This application involves light emitting device fields, more particularly, to a kind of LED.
[background technique]
Existing flip LED, as shown in Figure 1, welding flip-chip 120 in mounting bracket 110, then in flip-chip
The area filling fluorescent glue 130 that 120 tops and surrounding, mounting bracket are surrounded；Wherein fluorescent glue 130 is by fluorescent powder and organic silica gel
It stirs evenly, mix；The white light of the sending of this flip LED is swashed by the flip-chip (blue light-emitting) in mounting bracket
The light-emitting phosphor to fluoresce in glue, finally generates white light.
The technique of existing filling fluorescent glue is to be completed by dispenser, but this mode is unable to reach well
Even property and consistency, to reduce yields when LED batch production；In addition, existing flip LED, fluorescent powder have been dispersed in
In machine silica gel, the fluorescent powder grain remoter from frame bottom, heat dissipation path is longer, leads to the heat generated during LED operation
It is longer that the required time is distributed completely, and then heat is caused to be assembled inside LED, the final service life for reducing LED；
Existing flip LED, fluorescent glue is exposed, is easy to be damaged in use, pollute, to influence the optical color parameter of LED.
And in the industry cycle in conventional techniques, it is usually that will lead to after chip is mounted in mounting bracket, directly fills up
For fluorescent glue until upper surface flushly mounts with rack upper surface, this is all most directly most to hold for production equipment, production technology
Be readily conceivable that, and most usual flip LED structure, industry those skilled in the art in the case where no creative work only
It is contemplated that using this kind of flip LED structure and its production technology.So, this usual flip LED structure can not solve
Certainly above-mentioned various problems.These problems of the existing flip LED structure in this field are not able to satisfy it to LED hair
The increasing various demands such as light is uniform, consistency is good, optical color parameter is good, miniaturization, yield is high, is less likely to be damaged.
Therefore it provides a kind of filler uniformity consistency is high, the service life is long, be hardly damaged, the flip LED of good luminous performance actually
It is necessary.
[summary of the invention]
The application be designed to provide it is a kind of be hardly damaged, the LED of good luminous performance.
To realize the application purpose, the following technical schemes are provided:
There is provided a kind of LED of CSP in conjunction with mounting bracket comprising mounting bracket is equipped with sky among the mounting bracket
Chamber, which is characterized in that it is provided with CSP in the cavity of the mounting bracket, is equipped with luminescence chip in the CSP, the CSP's
Top and it is surrounded by substratum transparent.
Directly CSP is arranged in mounting bracket by the application, then fills in the gap around CSP with mounting bracket transparent
Silica gel；Transparent silica gel is filled between CSP and mounting bracket, can be played a protective role to the fluorescence coating of CSP, be made itself and outside
Isolation, avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.
In the industry cycle in conventional techniques, it is usually that will lead to after chip is mounted in mounting bracket, directly fills up glimmering
For optical cement until upper surface flushly mounts with rack upper surface, this is all most directly to be easiest to for production equipment, production technology
Expect, and most usual flip LED structure, industry those skilled in the art can only in the case where no creative work
Expect using this kind of flip LED structure and its production technology.So, this usual flip LED structure not can solve
Above-mentioned various problems.Those skilled in the art, which can not readily occur in using the structure of the application, solves above-mentioned refer to
Problem, technical scheme have unobviousness.
In some embodiments, the CSP is included in above the luminescence chip and surrounding is coated with fluorescent adhesive layer.Institute
Fluorescent adhesive layer photochromic uniformity with higher and consistency are stated, the light-emitting uniformity of LED entirety can be improved.
In some embodiments, the fluorescent adhesive layer is mixed by fluorescent powder and transparent organic silicon glue.
In some embodiments, the substratum transparent fills up the gap between the CSP and the mounting bracket.Specifically
, the fluorescent adhesive layer upper surface is lower than the mounting bracket upper surface, and the top of the fluorescent adhesive layer is equipped with the transparent adhesive tape
Layer, the substratum transparent upper surface are concordant with mounting bracket upper surface.
In some embodiments, the mounting bracket includes the copper material portion of bottom and the frame that is arranged in copper material portion
Portion, the CSP are mounted on copper material portion upper surface, and the frame section encloses the cavity in the copper material portion, described transparent
Glue-line is filled between the CSP and the mounting bracket.Specifically, the cavity inside shape of the mounting bracket is in reverse taper
Shape, cavity top radial dimension are greater than lower part radial dimension.
In some embodiments, the cross section of the cavity in the back taper bodily form is rectangle or circle.
In some embodiments, the CSP is the luminous CSP or cylindrical body CSP in five face of rectangular cylindrical body or hemispherical
CSP。
The prior art is compared, the application has the following advantages:
Directly CSP is arranged in mounting bracket by the application, then fills in the gap around CSP with mounting bracket transparent
Silica gel；Transparent silica gel is filled between CSP and mounting bracket, can be played a protective role to the fluorescence coating of CSP, be made itself and outside
Isolation, avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.
CSP is above luminescence chip and surrounding is coated with fluorescent adhesive layer, and the fluorescent adhesive layer is with higher photochromic uniform
Property and consistency, replace original fluorescent glue with the CSP of higher photochromic uniformity and fill, flip LED can be made to obtain higher
Photochromic uniformity and consistency improve yields when LED batch production.
The fluorescent glue of CSP is uniformly distributed in each face of luminescence chip, and fluorescent glue off-chip piece, frame bottom are closer, so that
Such flip LED has better heat-sinking capability, increases LED service life.
[Detailed description of the invention]
Fig. 1 is the structural schematic diagram of Conventional flip LED；
Fig. 2 is the cross section view of the embodiment one of LED of the application CSP in conjunction with mounting bracket；
Fig. 3 is the top view of the embodiment one of LED of the application CSP in conjunction with mounting bracket；
Fig. 4 is the top view of the mounting bracket in the embodiment of the present application one；
Fig. 5 is the cross section view of the embodiment two of LED of the application CSP in conjunction with mounting bracket；
Fig. 6 is the top view of the embodiment two of LED of the application CSP in conjunction with mounting bracket；
Fig. 7 is the top view of the mounting bracket in the embodiment of the present application two.
Fig. 8 is the top view of the embodiment three of LED of the application CSP in conjunction with mounting bracket；
Fig. 9 is the cross section view of the example IV of LED of the application CSP in conjunction with mounting bracket.
[specific embodiment]
Please refer to Fig. 2~4, LED of the CSP of the present embodiment one in conjunction with mounting bracket comprising mounting bracket 210,
CSP200 and substratum transparent 240.
The frame section 211 mounting bracket 210 the copper material portion 212 including bottom and be arranged in copper material portion 212, it is described
CSP200 is arranged in 212 upper surface of copper material portion, and the frame section 211 encloses described in receiving in the copper material portion 212
The cavity (not marking) of CSP200, the CSP200 are mounted on the cavity bottom of the mounting bracket 210.The CSP200 can lead to
The copper material portion 212 is crossed to radiate.
Top and the surrounding of the CSP is arranged in the substratum transparent 240, and fills up the CSP200 and the installation
Gap between bracket 210.Directly CSP is arranged in mounting bracket by the application, then the gap around CSP and mounting bracket
In fill transparent silica gel, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it, avoid in use process by
Damage or pollution, keep the optical color parameter of LED constant.
The CSP200 includes that luminescence chip 220 and 220 top of the luminescence chip and surrounding successively successively coat
Fluorescent adhesive layer 230.The fluorescent adhesive layer photochromic uniformity with higher and consistency, can be improved LED it is whole to go out light equal
Even property.The fluorescent adhesive layer 230 is mixed by fluorescent powder and transparent organic silicon glue.
Specifically, 230 upper surface of fluorescent adhesive layer is lower than the mounting bracket upper surface 214, the fluorescent adhesive layer 230
Top be equipped with the substratum transparent 240,240 upper surface 241 of substratum transparent is concordant with 210 upper surface 214 of mounting bracket.
240 thickness of substratum transparent above 230 thickness of fluorescent adhesive layer and the CSP200 is set as needed, and thickness can improve
Luminescent properties and protection luminescence chip are hardly damaged as the main purpose.Fluorescent adhesive layer off-chip piece, frame bottom are closer, so that this
The flip LED of sample has better heat-sinking capability, increases LED service life.
Specifically, the cavity inside shape of the mounting bracket is in the back taper bodily form, cavity top radial dimension is greater than lower part
Radial dimension.The cavity inner sidewall 213 of the mounting bracket 210 is in the inclined plane shape inwardly collapsed from top to down.The CSP200
Side wall 213 with 210 cavity of mounting bracket there are distance, the substratum transparent 240 be filled in the CSP200 with it is described
Space between the side wall 213 of 210 cavity of mounting bracket.
In example 1, the cross section of the cavity in the back taper bodily form is rectangle, and the CSP200 is in rectangular cylindrical
Body.
Please refer to 5~7, the embodiment of the present application two, LED of the present embodiment CSP in conjunction with mounting bracket, including mounting bracket
310, CSP300 and substratum transparent 340.
The frame section 311 mounting bracket 310 the copper material portion 312 including bottom and be arranged in copper material portion 312, it is described
CSP300 is arranged in 312 upper surface of copper material portion, and the frame section 311 encloses described in receiving in the copper material portion 312
The cavity (not marking) of CSP300, the CSP300 are mounted on the cavity bottom of the mounting bracket 310.The CSP300 can lead to
The copper material portion 312 is crossed to radiate.
Top and the surrounding of the CSP is arranged in the substratum transparent 340, and fills up the CSP300 and the installation
Gap between bracket 310.Directly CSP is arranged in mounting bracket by the application, then the gap around CSP and mounting bracket
In fill transparent silica gel, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it, avoid in use process by
Damage or pollution, keep the optical color parameter of LED constant.
The CSP300 includes that luminescence chip 320 and 320 top of the luminescence chip and surrounding are coated with fluorescent adhesive layer
330.The fluorescent adhesive layer 330 photochromic uniformity with higher and consistency, can be improved the light-emitting uniformity of LED entirety.
The fluorescent adhesive layer 330 is mixed by fluorescent powder and transparent organic silicon glue.The CSP300 is in rectangular cylindrical body.
Embodiment two is what is different from the first embodiment is that the cross section of the cavity in the back taper bodily form is circle.
Referring to Fig. 8, the embodiment of the present application three, embodiment three is consistent with two basic structure of embodiment, and described is in reverse taper
The cross section of the cavity of shape is circle, and embodiment three is from embodiment two unlike, and CSP301 is in cylindrical body.
Referring to Fig. 9, the embodiment of the present application four, LED of the present embodiment CSP in conjunction with mounting bracket, including mounting bracket
410, CSP400 and substratum transparent 440.
The frame section 411 mounting bracket 410 the copper material portion 412 including bottom and be arranged in copper material portion 412, it is described
CSP400 is arranged in 412 upper surface of copper material portion, and the frame section 411 encloses described in receiving in the copper material portion 412
The cavity (not marking) of CSP400, the CSP400 are mounted on the cavity bottom of the mounting bracket 410.The CSP400 can lead to
The copper material portion 412 is crossed to radiate.
Top and the surrounding of the CSP is arranged in the substratum transparent 440, and fills up the CSP400 and the installation
Gap between bracket 410.Directly CSP is arranged in mounting bracket by the application, then the gap around CSP and mounting bracket
In fill transparent silica gel, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it, avoid in use process by
Damage or pollution, keep the optical color parameter of LED constant.
The CSP400 includes that luminescence chip 420 and 420 top of the luminescence chip and surrounding are coated with fluorescent adhesive layer
430.The fluorescent adhesive layer 430 photochromic uniformity with higher and consistency, can be improved the light-emitting uniformity of LED entirety.
The fluorescent adhesive layer 430 is mixed by fluorescent powder and transparent organic silicon glue.The CSP400 is hemispherical CSP, therein glimmering
After optical cement layer 430 wraps up the luminescence chip 420, the shape of fluorescent adhesive layer 430 is hemispherical.
Directly CSP is arranged in mounting bracket by the application, then fills in the gap around CSP with mounting bracket transparent
Silica gel；Transparent silica gel is filled between CSP and mounting bracket, can be played a protective role to the fluorescence coating of CSP, be made itself and outside
Isolation, avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.Original fluorescent glue is substituted using CSP
Filling, making LED color, more evenly consistency is more preferable.CSP is above luminescence chip and surrounding is successively successively coated with diffusion colloid
Layer and fluorescent adhesive layer, the fluorescent adhesive layer photochromic uniformity with higher and consistency, can be improved LED it is whole to go out light equal
Even property.The diffusion colloid layer (being uniformly mixed containing the optical particle and transparent organic silicon glue for playing diffusion) of CSP is to indigo plant
The light that light issues is dispersed for the first time, reinforces the final light-emitting uniformity of LED.
The foregoing is merely the preferred embodiment of the application, the protection scope of the application is not limited thereto, any to be based on
Equivalent transformation in technical scheme belongs within the application protection scope.
Claims (7)
1. a kind of LED of CSP in conjunction with mounting bracket comprising mounting bracket, the mounting bracket centre is equipped with cavity, special
Sign is, CSP is provided in the cavity of the mounting bracket, is equipped with luminescence chip in the CSP, the top of the CSP and
It is surrounded by substratum transparent, the CSP is included in above the luminescence chip and surrounding is coated with fluorescent adhesive layer, the fluorescent glue
Layer upper surface is lower than the mounting bracket upper surface, and the top of the fluorescent adhesive layer is equipped with the substratum transparent, the transparent adhesive tape
Layer upper surface is concordant with mounting bracket upper surface, and the cavity inside shape of the mounting bracket is in the back taper bodily form, cavity top diameter
It is greater than lower part radial dimension to size.
2. LED of the CSP as described in claim 1 in conjunction with mounting bracket, which is characterized in that the fluorescent adhesive layer is by fluorescent powder
It is mixed with transparent organic silicon glue.
3. LED of the CSP as described in claim 1 in conjunction with mounting bracket, which is characterized in that the substratum transparent fills up described
Gap between CSP and the mounting bracket.
4. LED of the CSP as described in claim 1 in conjunction with mounting bracket, which is characterized in that the mounting bracket includes bottom
Copper material portion and the frame section that is arranged in copper material portion, the CSP be mounted on copper material portion upper surface, the frame section is in the copper
The cavity is enclosed in material portion, the substratum transparent is filled between the CSP and the mounting bracket.
5. LED of the CSP as described in claim 1 in conjunction with mounting bracket, which is characterized in that the cavity in the back taper bodily form
Cross section be rectangle or circle.
6. LED of the CSP as claimed in claim 5 in conjunction with mounting bracket, which is characterized in that the CSP and installation branch
There are distance, the substratum transparent is filled between the CSP and the side wall of the mounting bracket cavity side wall of aerial chamber
Space.
7. LED of the CSP as claimed in claim 6 in conjunction with mounting bracket, which is characterized in that the CSP is rectangular cylindrical body
Five faces shine CSP or cylindrical body CSP or hemispherical CSP.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821201685.6U CN209071379U (en) | 2018-07-27 | 2018-07-27 | LED of the CSP in conjunction with mounting bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821201685.6U CN209071379U (en) | 2018-07-27 | 2018-07-27 | LED of the CSP in conjunction with mounting bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209071379U true CN209071379U (en) | 2019-07-05 |
Family
ID=67089956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821201685.6U Active CN209071379U (en) | 2018-07-27 | 2018-07-27 | LED of the CSP in conjunction with mounting bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209071379U (en) |
-
2018
- 2018-07-27 CN CN201821201685.6U patent/CN209071379U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: 330012 No.199, Hujia Road, Changdong Industrial Park, Qingshanhu District, Nanchang City, Jiangxi Province (office building) (1st-3rd floor) Patentee after: Jiangxi zhaochi Guangyuan Technology Co.,Ltd. Address before: 518000 zhaochi Innovation Industrial Park, No.1, LiLang Road, xialilang community, Nanwan street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MTC OPTRONICS Co.,Ltd. |