CN208566577U - LED of the double-deck CSP in conjunction with mounting bracket - Google Patents
LED of the double-deck CSP in conjunction with mounting bracket Download PDFInfo
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- CN208566577U CN208566577U CN201821202522.XU CN201821202522U CN208566577U CN 208566577 U CN208566577 U CN 208566577U CN 201821202522 U CN201821202522 U CN 201821202522U CN 208566577 U CN208566577 U CN 208566577U
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Abstract
A kind of LED of bilayer CSP in conjunction with mounting bracket is provided, it includes mounting bracket, cavity is equipped among the mounting bracket, it is characterized in that, the double-deck CSP is provided in the cavity of the mounting bracket, it is equipped with luminescence chip in the bilayer CSP, the top of the bilayer CSP and is surrounded by substratum transparent.Directly the double-deck CSP, which is arranged, by the application fills transparent silica gel in mounting bracket, then in the gap around the double-deck CSP and mounting bracket；Transparent silica gel is filled between CSP and mounting bracket, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it, is avoided being damaged or polluting in use process, is kept the optical color parameter of LED constant.
Description
[technical field]
This application involves light emitting device fields, more particularly, to a kind of LED.
[background technique]
Existing flip LED, as shown in Figure 1, welding flip-chip 120 in mounting bracket 110, then in flip-chip
The area filling fluorescent glue 130 that 120 tops and surrounding, mounting bracket are surrounded；Wherein fluorescent glue 130 is by fluorescent powder and organic silica gel
It stirs evenly, mix；The white light of the sending of this flip LED is swashed by the flip-chip (blue light-emitting) in mounting bracket
The light-emitting phosphor to fluoresce in glue, finally generates white light.
The technique of existing filling fluorescent glue is to be completed by dispenser, but this mode is unable to reach well
Even property and consistency, to reduce yields when LED batch production；In addition, existing flip LED, fluorescent glue is exposed, makes
With being easy to be damaged in the process, pollute, to influence the optical color parameter of LED.
And in the industry cycle in conventional techniques, it is usually that will lead to after chip is mounted in mounting bracket, directly fills up
For fluorescent glue until upper surface flushly mounts with rack upper surface, this is all most directly most to hold for production equipment, production technology
Be readily conceivable that, and most usual flip LED structure, industry those skilled in the art in the case where no creative work only
It is contemplated that using this kind of flip LED structure and its production technology.So, this usual flip LED structure can not solve
Certainly above-mentioned various problems.These problems of the existing flip LED structure in this field are not able to satisfy it to LED hair
The increasing various demands such as light is uniform, consistency is good, optical color parameter is good, miniaturization, yield is high, is less likely to be damaged.
Therefore it provides a kind of filler uniformity consistency is high, the service life is long, be hardly damaged, the flip LED of good luminous performance actually
It is necessary.
[summary of the invention]
The application be designed to provide it is a kind of be hardly damaged, the LED of good luminous performance.
To realize the application purpose, the following technical schemes are provided:
There is provided a kind of LED of bilayer CSP in conjunction with mounting bracket comprising mounting bracket is set among the mounting bracket
There is cavity, which is characterized in that be provided with the double-deck CSP in the cavity of the mounting bracket, be equipped with the core that shines in the bilayer CSP
Piece, the top of the bilayer CSP and is surrounded by substratum transparent.
Directly the double-deck CSP is arranged in mounting bracket by the application, then in the gap around the double-deck CSP and mounting bracket
Fill transparent silica gel；Transparent silica gel is filled between CSP and mounting bracket, can be played a protective role, be made to the fluorescence coating of CSP
It is isolated from the outside, and avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.
In the industry cycle in conventional techniques, it is usually that will lead to after chip is mounted in mounting bracket, directly fills up glimmering
For optical cement until upper surface flushly mounts with rack upper surface, this is all most directly to be easiest to for production equipment, production technology
Expect, and most usual flip LED structure, industry those skilled in the art can only in the case where no creative work
Expect using this kind of flip LED structure and its production technology.So, this usual flip LED structure not can solve
Above-mentioned various problems.Those skilled in the art, which can not readily occur in using the structure of the application, solves above-mentioned refer to
Problem, technical scheme have unobviousness.
In some embodiments, the bilayer CSP is included in above the luminescence chip and surrounding successively successively coats
There are diffusion colloid layer and fluorescent adhesive layer.The fluorescent adhesive layer photochromic uniformity with higher and consistency, it is whole to can be improved LED
The light-emitting uniformity of body.
In some embodiments, diffusion the colloid layer optical particle of diffusion and transparent organic silicon glue by mix
It closes.In some embodiments, the fluorescent adhesive layer is mixed by fluorescent powder and transparent organic silicon glue.
In some embodiments, the substratum transparent fills up the gap between bilayer CSP and the mounting bracket.
Specifically, the fluorescent adhesive layer upper surface is lower than the mounting bracket upper surface, the top of the fluorescent adhesive layer is equipped with described
Gelatin layer, the substratum transparent upper surface are concordant with mounting bracket upper surface.
In some embodiments, the mounting bracket includes the copper material portion of bottom and the frame that is arranged in copper material portion
Portion, the bilayer CSP are mounted on copper material portion upper surface, and the frame section encloses the cavity in the copper material portion, described
Substratum transparent is filled between bilayer CSP and the mounting bracket.Specifically, the cavity inside shape of the mounting bracket
In the back taper bodily form, cavity top radial dimension is greater than lower part radial dimension.
In some embodiments, the cross section of the cavity in the back taper bodily form is rectangle or circle.
The prior art is compared, the application has the following advantages:
Directly the double-deck CSP is arranged in mounting bracket by the application, then in the gap around the double-deck CSP and mounting bracket
Fill transparent silica gel；Transparent silica gel is filled between CSP and mounting bracket, can be played a protective role, be made to the fluorescence coating of CSP
It is isolated from the outside, and avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.
The double-deck CSP is above luminescence chip and surrounding is successively successively coated with diffusion colloid layer and fluorescent adhesive layer, described glimmering
Optical cement layer photochromic uniformity with higher and consistency, can be improved the light-emitting uniformity of LED entirety.The diffusion of the double-deck CSP
Colloid layer disperses the light that blue light issues for the first time, reinforces the final light-emitting uniformity of LED.It is substituted using welded steel double CSP
Original fluorescent glue filling, making LED color, more evenly consistency is more preferable.
[Detailed description of the invention]
Fig. 1 is the structural schematic diagram of Conventional flip LED；
Fig. 2 is the cross section view of the embodiment one of LED of the application bilayer CSP in conjunction with mounting bracket；
Fig. 3 is the top view of the embodiment one of LED of the application bilayer CSP in conjunction with mounting bracket；
Fig. 4 is the top view of the mounting bracket in the embodiment of the present application one；
Fig. 5 is the cross section view of the embodiment two of LED of the application bilayer CSP in conjunction with mounting bracket；
Fig. 6 is the top view of the embodiment two of LED of the application bilayer CSP in conjunction with mounting bracket；
Fig. 7 is the top view of the mounting bracket in the embodiment of the present application two.
[specific embodiment]
Please refer to Fig. 2~4, LED of the double-deck CSP of the present embodiment one in conjunction with mounting bracket comprising mounting bracket
210, bilayer CSP200 and substratum transparent 250.
The frame section 211 mounting bracket 210 the copper material portion 212 including bottom and be arranged in copper material portion 212, it is described
The double-deck CSP200 is arranged in 212 upper surface of copper material portion, and the frame section 211 encloses described in receiving in the copper material portion 212
The cavity (not marking) of the double-deck CSP200, the bilayer CSP200 are mounted on the cavity bottom of the mounting bracket 210.It is described double
Layer CSP200 can be radiated by the copper material portion 212.
Top and the surrounding of the bilayer CSP is arranged in the substratum transparent 250, and fill up the bilayer CSP200 with
Gap between the mounting bracket 210.Directly the double-deck CSP is arranged in mounting bracket by the application, then in the double-deck CSP and peace
It fills and fills transparent silica gel in the gap of branch frame peripheral, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it,
It avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.
The bilayer CSP200 includes that luminescence chip 220 and 220 top of the luminescence chip and surrounding are successively successively wrapped
The diffusion colloid layer 230 and fluorescent adhesive layer 240 covered.The fluorescent adhesive layer photochromic uniformity with higher and consistency, can be with
Improve the light-emitting uniformity of LED entirety.
Diffusion colloid layer 230 optical particle of diffusion and transparent organic silicon glue by mix, described glimmering
Optical cement layer 240 is mixed by fluorescent powder and transparent organic silicon glue.
Specifically, 240 upper surface of fluorescent adhesive layer is lower than the mounting bracket upper surface 214, the fluorescent adhesive layer
Top is equipped with the substratum transparent, and 250 upper surface 251 of substratum transparent is concordant with 210 upper surface 213 of mounting bracket.It is described
240 thickness of fluorescent adhesive layer and 230 thickness of diffusion colloid layer are set as needed, in the present embodiment, thickness basic one
It causes, in addition, 250 thickness of substratum transparent above the bilayer CSP200 is set as needed, thickness can improve luminescent properties
And protection luminescence chip is hardly damaged as the main purpose.
Specifically, the cavity inside shape of the mounting bracket is in the back taper bodily form, cavity top radial dimension is greater than lower part
Radial dimension.The cavity inner sidewall 213 of the mounting bracket 210 is in the inclined plane shape inwardly collapsed from top to down.The bilayer
For the side wall 213 of CSP200 and 210 cavity of mounting bracket there are distance, the substratum transparent is filled in the bilayer CSP200
Space between the side wall 213 of 210 cavity of mounting bracket.
In example 1, the cross section of the cavity in the back taper bodily form is rectangle.
Please refer to 5~7, the embodiment of the present application two, LED of the present embodiment bilayer CSP in conjunction with mounting bracket, including installation
Bracket 310, bilayer CSP300 and substratum transparent 350.
The frame section 311 mounting bracket 310 the copper material portion 312 including bottom and be arranged in copper material portion 312, it is described
The double-deck CSP300 is arranged in 312 upper surface of copper material portion, and the frame section 311 encloses described in receiving in the copper material portion 312
The cavity (not marking) of the double-deck CSP300, the bilayer CSP300 are mounted on the cavity bottom of the mounting bracket 310.It is described double
Layer CSP300 can be radiated by the copper material portion 312.
Top and the surrounding of the bilayer CSP is arranged in the substratum transparent 350, and fill up the bilayer CSP300 with
Gap between the mounting bracket 310.Directly the double-deck CSP is arranged in mounting bracket by the application, then in the double-deck CSP and peace
It fills and fills transparent silica gel in the gap of branch frame peripheral, can play a protective role to the fluorescence coating of CSP, be isolated from the outside it,
It avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.
The bilayer CSP300 includes that luminescence chip 320 and 320 top of the luminescence chip and surrounding are successively successively wrapped
The diffusion colloid layer 330 and fluorescent adhesive layer 340 covered.The fluorescent adhesive layer photochromic uniformity with higher and consistency, can be with
Improve the light-emitting uniformity of LED entirety.
Diffusion colloid layer 330 optical particle of diffusion and transparent organic silicon glue by mix, described glimmering
Optical cement layer 340 is mixed by fluorescent powder and transparent organic silicon glue.
Embodiment two is what is different from the first embodiment is that the cross section of the cavity in the back taper bodily form is circle.
Directly the double-deck CSP is arranged in mounting bracket by the application, then in the gap around the double-deck CSP and mounting bracket
Fill transparent silica gel；Transparent silica gel is filled between CSP and mounting bracket, can be played a protective role, be made to the fluorescence coating of CSP
It is isolated from the outside, and avoids being damaged or polluting in use process, keeps the optical color parameter of LED constant.It is substituted using the double-deck CSP
Original fluorescent glue filling, making LED color, more evenly consistency is more preferable.The double-deck CSP above luminescence chip and surrounding successively by
Layer is coated with diffusion colloid layer and fluorescent adhesive layer, the fluorescent adhesive layer photochromic uniformity with higher and consistency, Ke Yiti
The light-emitting uniformity of high LED entirety.The diffusion colloid layer of the double-deck CSP is (containing playing the optical particle of diffusion and transparent organic
Silica gel is uniformly mixed) light of blue light sending is dispersed for the first time, reinforce the final light-emitting uniformity of LED.
The foregoing is merely the preferred embodiment of the application, the protection scope of the application is not limited thereto, any to be based on
Equivalent transformation in technical scheme belongs within the application protection scope.
Claims (10)
1. a kind of LED of bilayer CSP in conjunction with mounting bracket, which is characterized in that it includes mounting bracket, in the mounting bracket
Between be equipped with cavity, be provided with the double-deck CSP in the cavity of the mounting bracket, it is described equipped with luminescence chip in the bilayer CSP
The top of the double-deck CSP and it is surrounded by substratum transparent.
2. LED of the bilayer CSP in conjunction with mounting bracket as described in claim 1, which is characterized in that the bilayer CSP includes
Above the luminescence chip and surrounding is successively successively coated with diffusion colloid layer and fluorescent adhesive layer.
3. LED of the bilayer CSP in conjunction with mounting bracket as claimed in claim 2, which is characterized in that the diffusion colloid layer by
The optical particle and transparent organic silicon glue for playing diffusion mix.
4. LED of the bilayer CSP as claimed in claim 3 in conjunction with mounting bracket, which is characterized in that the fluorescent adhesive layer is by glimmering
Light powder and transparent organic silicon glue mix.
5. LED of the bilayer CSP as claimed in claim 2 in conjunction with mounting bracket, which is characterized in that the substratum transparent fills up
Gap between bilayer CSP and the mounting bracket.
6. LED of the bilayer CSP in conjunction with mounting bracket as claimed in claim 2, which is characterized in that the mounting bracket includes
The copper material portion of bottom and the frame section being arranged in copper material portion, the bilayer CSP are mounted on copper material portion upper surface, the frame section
The cavity is enclosed in the copper material portion, the substratum transparent is filled between bilayer CSP and the mounting bracket.
7. LED of the bilayer CSP as claimed in claim 2 in conjunction with mounting bracket, which is characterized in that table on the fluorescent adhesive layer
Face is lower than the mounting bracket upper surface, and the top of the fluorescent adhesive layer is equipped with the substratum transparent, table on the substratum transparent
Face is concordant with mounting bracket upper surface.
8. LED of the bilayer CSP as claimed in claim 2 in conjunction with mounting bracket, which is characterized in that the sky of the mounting bracket
Chamber interior shape is in the back taper bodily form, and cavity top radial dimension is greater than lower part radial dimension.
9. LED of the bilayer CSP as claimed in claim 8 in conjunction with mounting bracket, which is characterized in that described is in the back taper bodily form
The cross section of cavity is rectangle or circle.
10. LED of the bilayer CSP as claimed in claim 8 in conjunction with mounting bracket, which is characterized in that the bilayer CSP and institute
The side wall of mounting bracket cavity is stated there are distance, the substratum transparent is filled in the bilayer CSP and the mounting bracket cavity
Side wall between space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821202522.XU CN208566577U (en) | 2018-07-27 | 2018-07-27 | LED of the double-deck CSP in conjunction with mounting bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821202522.XU CN208566577U (en) | 2018-07-27 | 2018-07-27 | LED of the double-deck CSP in conjunction with mounting bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208566577U true CN208566577U (en) | 2019-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821202522.XU Active CN208566577U (en) | 2018-07-27 | 2018-07-27 | LED of the double-deck CSP in conjunction with mounting bracket |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110107861A (en) * | 2019-06-05 | 2019-08-09 | 华域视觉科技(上海)有限公司 | Vehicular illumination device |
-
2018
- 2018-07-27 CN CN201821202522.XU patent/CN208566577U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110107861A (en) * | 2019-06-05 | 2019-08-09 | 华域视觉科技(上海)有限公司 | Vehicular illumination device |
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Address after: 330012 No.199, Hujia Road, Changdong Industrial Park, Qingshanhu District, Nanchang City, Jiangxi Province (office building) (1st-3rd floor) Patentee after: Jiangxi zhaochi Guangyuan Technology Co.,Ltd. Address before: 518000 zhaochi Innovation Industrial Park, No.1, LiLang Road, xialilang community, Nanwan street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN MTC OPTRONICS Co.,Ltd. |