CN209056472U - A kind of semiconductor and general semiconductor substrate transport transfer - Google Patents
A kind of semiconductor and general semiconductor substrate transport transfer Download PDFInfo
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- CN209056472U CN209056472U CN201821330295.9U CN201821330295U CN209056472U CN 209056472 U CN209056472 U CN 209056472U CN 201821330295 U CN201821330295 U CN 201821330295U CN 209056472 U CN209056472 U CN 209056472U
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- fixedly connected
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- rotation axis
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- semiconductor substrate
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Abstract
The utility model discloses a kind of semiconductors and general semiconductor substrate to transport transfer, including under casing, the rotation axis top is fixedly connected with support plate, support plate top two sides pass through support frame and are fixedly connected with driver plate, driver plate bottom middle position is fixedly connected with lifting device, the driver plate top face and the back side are fixedly connected to partition, partition side middle position close to each other is provided with a plurality of live-rollers, electric telescopic rod is fixedly connected between live-roller at the top of the driver plate, the lifting device is rotatably connected to lifter plate far from one end of driver plate, the lifter plate bottom is located at electric telescopic rod corresponding position and is fixedly connected with clamp device, the utility model relates to semiconductor and general technical field of semiconductors.The device effectively fastens substrate, avoids it that surface abrasion occurs in transport process, and avoids colliding, protective substrate safety guarantees processing quality.
Description
Technical field
The present invention relates to semiconductor and general technical field of semiconductors, specially a kind of semiconductor and the transport of general semiconductor substrate
Transfer.
Background technique
With flourishing for China's semicon industry in recent years, Project business relies on local advantageous condition exploitation
Superior resources, deep-cut the production technology level that potentiality promote Project Product, this semiconductor crystal wafer and liquid crystal found the factory material, set
Standby, construction industry project will give full play to technological precedence advantage and talent advantage, be upgraded technologies by technological updating of enterprises,
Purchase advanced technical equipment, using large-scale production operation, semiconductor crystal wafer and liquid crystal found the factory material, equipment, apply semiconductor
And general semiconductor automation haulage equipment, automation equipment can produce needs according to client, for similar to semiconductor substrate, glass
Glass, solar panels etc. produce and process process for producing line, provide and transport and carry between the charging from substrate, process.It is existing partly to lead
In body and the processing of general semiconductor machining, substrate needs to carry out corner transhipment during transportation, fixes without protection accordingly
Mechanism collides in damage or transport so that it is easy to happen offset or landing during the adjustment so that surface generates, difficult
To guarantee processing quality.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of semiconductors and general semiconductor substrate to transport transfer,
It solves in existing semiconductor and the processing of general semiconductor machining, substrate needs to carry out corner transhipment during transportation, does not have
Have corresponding protection fixed mechanism so that it is easy to happen offset or landing during the adjustment so that surface generate damage or
It collides in transport, it is difficult to the problem of guaranteeing processing quality.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of semiconductor and general semiconductor-based
Plate transports transfer, including under casing, and under casing intracavity bottom middle position is rotatably connected to rotation axis, outside the rotation axis
Surface is located under casing inner cavity and is fixedly connected with driven wheel close to the position at top, and the under casing intracavity bottom is located on the left of rotation axis
It is fixedly connected with connecting rod, the connecting rod is fixedly connected with heat emission fan, the under casing intracavity bottom close to the side of rotation axis
It is fixedly connected with driving motor on the right side of rotation axis, the driving motor output end is fixedly connected with drive rod, the driving
The one end of bar far from driving motor is rotatablely connected by kinematic link and driven wheel, and the rotation axis top is fixedly connected with support
Plate, the support plate are fixedly connected with bracket far from the side intermediate symmetrical position of rotation axis, are located at branch at the top of the support plate
It is fixedly connected with driving motor on the left of frame, the driving motor output end is fixedly connected with the first driving pulley, the support plate
Top two sides pass through support frame and are fixedly connected with driver plate, and driver plate bottom middle position is fixedly connected with lifting dress
It sets, the driver plate top face and the back side are fixedly connected to partition, and partition side interposition close to each other installs
A plurality of live-rollers are equipped with, are fixedly connected with electric telescopic rod, the lifting dress at the top of the driver plate between live-roller
It sets one end far from driver plate and is rotatably connected to lifter plate, the lifter plate bottom is located at the fixed company of electric telescopic rod corresponding position
It is connected to clamp device.
Preferably, the heat emission fan includes heat emission fan case, and heat emission fan box cavity two sides outer wall offers blinds fan,
The heat emission fan box cavity is fixedly connected with radiating motor close to the side of connecting rod, and the radiating motor output end passes through shaft coupling
Device is fixedly connected with heat dissipation shaft, and the heat dissipation shaft is fixedly connected with radiating vane far from one end of radiating motor.
Preferably, the lifting device includes lifting motor, and the lifting motor output end is fixedly connected by shaft coupling
There is worm screw, the worm screw outer surface engaged transmission has worm gear, and the worm gear inner surface is threaded with lifting screw.
Preferably, the worm screw connect far from one end of lifting motor with holder pivots, the worm gear top and driver plate
Rotation connection, the lifting screw is through driver plate and extends at the top of driver plate.
Preferably, the clamp device includes hitch box, and fastening electricity is fixedly connected at the top of the inner wall of the hitch box side
Machine, the fastening motor output end are fixedly connected with the second driving pulley by shaft coupling, and the fastening box cavity is far from fastening
The side inner wall of motor slidably connects spur rack, and there is engagement in the spur rack outer surface far from the side engaged transmission of hitch box
Gear, second driving pulley outer surface are slidably connected by belt and meshing gear.
Preferably, the live-roller is fixedly connected with sprocket wheel close to positive one end, and the sprocket outer surface passes through chain
Intermeshing transmission.
Preferably, the live-roller, which is located on the left of partition and is located at sprocket wheel front, is fixedly connected with driven pulley, it is described from
Movable belt pulley outer surface is slidably connected by driving belt and the first driving pulley.
Preferably, the under casing two sides outer wall middle position offers net window, and under casing front and back bottom is equal
It is fixedly connected with mounting rail.
Preferably, a partition lateral roof close to each other is fixedly connected with neonychium, and the support plate surface is located at
Lifting device corresponding position is offered through through-hole.
Preferably, the rotation axis through under casing and extends at the top of under casing, and the support plate bottom is located at rotation axis two
Side is fixedly connected to supporting track wheel.
(3) beneficial effect
The present invention provides a kind of semiconductor and general semiconductor substrates to transport transfer, have it is following the utility model has the advantages that
The present invention passes through support frame by two sides at the top of support plate and is fixedly connected with driver plate, among driver plate bottom
Position is fixedly connected with lifting device, and driver plate top face and the back side are fixedly connected to partition, partition it is close to each other one
Side middle position is provided with a plurality of live-rollers, and electric telescopic rod is fixedly connected between live-roller at the top of driver plate, rises
Falling unit is rotatably connected to lifter plate far from one end of driver plate, and lifter plate bottom is located at the fixed company of electric telescopic rod corresponding position
It is connected to clamp device, which effectively fastens substrate, avoids it that surface mill occurs in transport process
Damage, and avoid colliding, protective substrate safety guarantees processing quality.
Detailed description of the invention
Fig. 1 is overall structure of the present invention；
Fig. 2 is radiating fan structure schematic diagram of the present invention；
Fig. 3 is clamp device structural schematic diagram of the present invention.
In figure: 1- under casing, 2- rotation axis, 3- driven wheel, 4- connecting rod, 5- heat emission fan, 51- heat emission fan case, 52- blinds
Fan, 53- radiating motor, 54- heat dissipation shaft, 55- radiating vane, 6- driving motor, 7- drive rod, 8- kinematic link, 9- support
Plate, 10- bracket, 11- driving motor, the first driving pulley of 12-, 13- driver plate, 14- lifting device, 141- lifting motor,
142- worm screw, 143- worm gear, 144- lifting screw, 15- partition, 16- live-roller, 17- electric telescopic rod, 18- lifter plate, 19-
Clamp device, 191- hitch box, 192- fasten motor, the second driving pulley of 193-, 194- spur rack, 195- meshing gear, 20-
Sprocket wheel, 21- chain, 22- driven pulley, 23- net window, 24- mounting rail, 25- neonychium, 26- run through through-hole, 27- supporting track
Wheel.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1-3, the present invention provides a kind of technical solution: a kind of semiconductor and the transport of general semiconductor substrate turn to dress
It sets, including under casing 1,1 intracavity bottom middle position of under casing is rotatably connected to rotation axis 2, and 2 outer surface of rotation axis is located under casing 1
Chamber is fixedly connected with driven wheel 3 close to the position at top, and 1 intracavity bottom of under casing, which is located on the left of rotation axis 2, is fixedly connected with connection
Bar 4, connecting rod 4 are fixedly connected with heat emission fan 5 close to the side of rotation axis 2, and heat emission fan 5 includes heat emission fan case 51, heat emission fan case
51 inner cavity two sides outer walls offer blinds fan 52, and 51 inner cavity of heat emission fan case is fixedly connected with heat dissipation close to the side of connecting rod 4
Motor 53,53 output end of radiating motor are fixedly connected with heat dissipation shaft 54 by shaft coupling, and the shaft 54 that radiates is far from radiating motor
53 one end is fixedly connected with radiating vane 55, and 1 intracavity bottom of under casing, which is located on the right side of rotation axis 2, is fixedly connected with driving motor 6,
6 output end of driving motor is fixedly connected with drive rod 7, the one end of drive rod 7 far from driving motor 6 by kinematic link 8 with from
Driving wheel 3 is rotatablely connected, and 2 top of rotation axis is fixedly connected with support plate 9, side intermediate symmetry position of the support plate 9 far from rotation axis 2
It sets and is fixedly connected with bracket 10, be located on the left of bracket 10 at the top of support plate 9 and be fixedly connected with driving motor 11, driving motor 11 is defeated
Outlet is fixedly connected with the first driving pulley 12, and 9 top two sides of support plate pass through support frame and are fixedly connected with driver plate 13, passes
13 bottom middle position of movable plate is fixedly connected with lifting device 14, and lifting device 14 includes lifting motor 141, lifting motor 141
Output end is fixedly connected with worm screw 142 by shaft coupling, and 142 outer surface of worm screw engaged transmission has worm gear 143, table in worm gear 143
Face is threaded with lifting screw 144, and the one end of worm screw 142 far from lifting motor 141 and bracket 10 are rotatablely connected, worm gear 143
Top and driver plate 13 are rotatablely connected, and lifting screw 144 is through driver plate 13 and extends to 13 top of driver plate, and driver plate 13 pushes up
Portion's front and back is fixedly connected to partition 15, and the side middle position close to each other of partition 15 is provided with a plurality of live-rollers
16, electric telescopic rod 17 is fixedly connected between live-roller 16 at the top of driver plate 13, lifting device 14 is far from driver plate 13
One end be rotatably connected to lifter plate 18,18 bottom of lifter plate is located at 17 corresponding position of electric telescopic rod and is fixedly connected with fastening dress
19 are set, clamp device 19 includes hitch box 191, is fixedly connected with fastening motor 192, fastening at the top of 191 side inner wall of hitch box
192 output end of motor is fixedly connected with the second driving pulley 193 by shaft coupling, and 191 inner cavity of hitch box is far from fastening motor 192
Side inner wall slidably connect spur rack 194,194 outer surface of spur rack is nibbled far from the side engaged transmission of hitch box 191
Gear 195 is closed, 193 outer surface of the second driving pulley is slidably connected by belt with meshing gear 195, and live-roller 16 is close to front
One end be fixedly connected with sprocket wheel 20,20 outer surface of sprocket wheel is located at partition 15 by the intermeshing transmission of chain 21, live-roller 16
Left side and it is located at 20 front of sprocket wheel and is fixedly connected with driven pulley 22,22 outer surface of driven pulley is led by driving belt with first
Movable belt pulley 12 is slidably connected, and 1 two sides outer wall middle position of under casing offers net window 23, and 1 front and back bottom of under casing is solid
Surely it is connected with mounting rail 24, the lateral roof close to each other of partition 15 is fixedly connected with neonychium 25, and 9 surface of support plate, which is located at, to rise
14 corresponding position of falling unit is offered through through-hole 26, and rotation axis 2 is through under casing 1 and extends to 1 top of under casing, 9 bottom of support plate
Portion is located at 2 two sides of rotation axis and is fixedly connected to supporting track wheel 27.The device effectively fastens substrate,
It avoids it that surface abrasion occurs in transport process, and avoids colliding, protective substrate safety guarantees processing quality.
In use, starting electric telescopic rod 17 jacks up substrate on substrate transport to live-roller 16, the electricity of starting lifting later
Machine 141 is intermeshed worm screw 142 and worm gear 143, and makes lifting screw 144 that lifter plate 18 be driven to move vertically, and carries out
Position is adjusted, and starting fastening motor 192 makes the second driving pulley 193 drive meshing gear 195 to rotate by belt, so that directly
The vertical movement of rack gear 194 fastens substrate, starts driving motor 6 later and makes drive rod 7 that kinematic link 8 be driven to move,
So that driven wheel 3 drives rotation axis 2 to rotate, the adjusting of angle is carried out, clamp device 19 and electric telescopic rod 17 is unclamped later, opens
Dynamic driving motor 11 makes the first driving pulley 12 that driven pulley 22 be driven to rotate, so that sprocket wheel 20 is passed by chain 21
It is dynamic, so that substrate is transported, carry out following process.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By the sentence " element limited including one, it is not excluded that including
There is also other identical elements in the process, method, article or equipment of element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of semiconductor and general semiconductor substrate transport transfer, including under casing (1), it is characterised in that: the under casing (1)
Intracavity bottom middle position is rotatably connected to rotation axis (2), and rotation axis (2) outer surface is located under casing (1) inner cavity close to top
The position in portion is fixedly connected with driven wheel (3), and under casing (1) intracavity bottom is located at the company of being fixedly connected on the left of rotation axis (2)
Extension bar (4), the connecting rod (4) are fixedly connected with heat emission fan (5) close to the side of rotation axis (2), the interior bottom of chamber of the under casing (1)
Portion, which is located on the right side of rotation axis (2), to be fixedly connected with driving motor (6), and driving motor (6) output end is fixedly connected with driving
Bar (7), the one end of the drive rod (7) far from driving motor (6) are rotatablely connected by kinematic link (8) and driven wheel (3), institute
It states rotation axis (2) top to be fixedly connected with support plate (9), side intermediate symmetry position of the support plate (9) far from rotation axis (2)
It sets and is fixedly connected with bracket (10), be located on the left of bracket (10) at the top of the support plate (9) and be fixedly connected with driving motor (11),
Driving motor (11) output end is fixedly connected with the first driving pulley (12), and two sides pass through at the top of the support plate (9)
Support frame is fixedly connected with driver plate (13), and driver plate (13) the bottom middle position is fixedly connected with lifting device (14),
Driver plate (13) top face and the back side are fixedly connected to partition (15), in the partition (15) side close to each other
Meta position, which installs, to be equipped with a plurality of live-rollers (16), is fixedly connected with electricity between live-roller (16) at the top of the driver plate (13)
Dynamic telescopic rod (17), the lifting device (14) are rotatably connected to lifter plate (18), the liter far from the one end of driver plate (13)
Drop plate (18) bottom is located at electric telescopic rod (17) corresponding position and is fixedly connected with clamp device (19).
2. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Heat emission fan (5) includes heat emission fan case (51), and heat emission fan case (51) inner cavity two sides outer wall offers blinds fan (52), described
Heat emission fan case (51) inner cavity is fixedly connected with radiating motor (53) close to the side of connecting rod (4), and the radiating motor (53) is defeated
Outlet is fixedly connected with heat dissipation shaft (54) by shaft coupling, and the described one end of heat dissipation shaft (54) far from radiating motor (53) is solid
Surely radiating vane (55) are connected with.
3. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Lifting device (14) includes lifting motor (141), and lifting motor (141) output end is fixedly connected with worm screw by shaft coupling
(142), worm screw (142) the outer surface engaged transmission has worm gear (143), and worm gear (143) inner surface is threaded with liter
It drops screw rod (144).
4. a kind of semiconductor according to claim 3 and general semiconductor substrate transport transfer, it is characterised in that: described
Worm screw (142) one end and bracket (10) far from lifting motor (141) are rotatablely connected, worm gear (143) top and driver plate
(13) it is rotatablely connected, the lifting screw (144) is through driver plate (13) and extends at the top of driver plate (13).
5. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Clamp device (19) includes hitch box (191), is fixedly connected with fastening motor at the top of the inner wall of hitch box (191) side
(192), fastening motor (192) output end is fixedly connected with the second driving pulley (193), the hitch box by shaft coupling
(191) inner cavity slidably connects spur rack (194) far from the side inner wall of fastening motor (192), spur rack (194) appearance
Face has meshing gear (195) far from the side engaged transmission of hitch box (191), and the second driving pulley (193) outer surface is logical
Belt is crossed to be slidably connected with meshing gear (195).
6. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Live-roller (16) is fixedly connected with sprocket wheel (20) close to positive one end, and sprocket wheel (20) outer surface is mutual by chain (21)
Engaged transmission.
7. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Live-roller (16), which is located on the left of partition (15) and is located at sprocket wheel (20) front, is fixedly connected with driven pulley (22), the driven belt
Wheel (22) outer surface is slidably connected by driving belt with the first driving pulley (12).
8. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Under casing (1) two sides outer wall middle position offers net window (23), and under casing (1) the front and back bottom is fixedly connected to
Mounting rail (24).
9. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Partition (15) lateral roof close to each other is fixedly connected with neonychium (25), and support plate (9) surface is located at lifting device
(14) corresponding position is offered through through-hole (26).
10. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: institute
Rotation axis (2) are stated through under casing (1) and are extended at the top of under casing (1), support plate (9) bottom is located at rotation axis (2) two sides
It is fixedly connected to supporting track wheel (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821330295.9U CN209056472U (en) | 2018-08-17 | 2018-08-17 | A kind of semiconductor and general semiconductor substrate transport transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821330295.9U CN209056472U (en) | 2018-08-17 | 2018-08-17 | A kind of semiconductor and general semiconductor substrate transport transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209056472U true CN209056472U (en) | 2019-07-02 |
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ID=67047620
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821330295.9U Active CN209056472U (en) | 2018-08-17 | 2018-08-17 | A kind of semiconductor and general semiconductor substrate transport transfer |
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| Country | Link |
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| CN (1) | CN209056472U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037131A (en) * | 2018-08-17 | 2018-12-18 | 浙江雅市晶科技有限公司 | A kind of semiconductor and general semiconductor substrate transport transfer |
| CN110695789A (en) * | 2019-11-15 | 2020-01-17 | 耒阳市鑫顺石材有限公司 | Stone material is polished and is used strutting arrangement |
-
2018
- 2018-08-17 CN CN201821330295.9U patent/CN209056472U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037131A (en) * | 2018-08-17 | 2018-12-18 | 浙江雅市晶科技有限公司 | A kind of semiconductor and general semiconductor substrate transport transfer |
| CN110695789A (en) * | 2019-11-15 | 2020-01-17 | 耒阳市鑫顺石材有限公司 | Stone material is polished and is used strutting arrangement |
| CN110695789B (en) * | 2019-11-15 | 2022-01-21 | 荣成市利威石材有限公司 | Stone material is polished and is used strutting arrangement |
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