CN109037131A - A kind of semiconductor and general semiconductor substrate transport transfer - Google Patents
A kind of semiconductor and general semiconductor substrate transport transfer Download PDFInfo
- Publication number
- CN109037131A CN109037131A CN201810942096.1A CN201810942096A CN109037131A CN 109037131 A CN109037131 A CN 109037131A CN 201810942096 A CN201810942096 A CN 201810942096A CN 109037131 A CN109037131 A CN 109037131A
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- semiconductor substrate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 238000005192 partition Methods 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 9
- 238000005299 abrasion Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Handcart (AREA)
Abstract
The invention discloses a kind of semiconductors and general semiconductor substrate to transport transfer, including under casing, the rotation axis top is fixedly connected with support plate, support plate top two sides pass through support frame and are fixedly connected with driver plate, driver plate bottom middle position is fixedly connected with lifting device, the driver plate top face and the back side are fixedly connected to partition, partition side middle position close to each other is provided with a plurality of live-rollers, electric telescopic rod is fixedly connected between live-roller at the top of the driver plate, the lifting device is rotatably connected to lifter plate far from one end of driver plate, the lifter plate bottom is located at electric telescopic rod corresponding position and is fixedly connected with clamp device, the present invention relates to semiconductor and general technical field of semiconductors.The device effectively fastens substrate, avoids it that surface abrasion occurs in transport process, and avoids colliding, protective substrate safety guarantees processing quality.
Description
Technical field
The present invention relates to semiconductor and general technical field of semiconductors, specially a kind of semiconductor and the transport of general semiconductor substrate
Transfer.
Background technique
With flourishing for China's semicon industry in recent years, Project business relies on local advantageous condition exploitation
Superior resources, deep-cut the production technology level that potentiality promote Project Product, this semiconductor crystal wafer and liquid crystal found the factory material, set
Standby, construction industry project will give full play to technological precedence advantage and talent advantage, be upgraded technologies by technological updating of enterprises,
Purchase advanced technical equipment, using large-scale production operation, semiconductor crystal wafer and liquid crystal found the factory material, equipment, apply semiconductor
And general semiconductor automation haulage equipment, automation equipment can produce needs according to client, for similar to semiconductor substrate, glass
Glass, solar panels etc. produce and process process for producing line, provide and transport and carry between the charging from substrate, process.It is existing partly to lead
In body and the processing of general semiconductor machining, substrate needs to carry out corner transhipment during transportation, fixes without protection accordingly
Mechanism collides in damage or transport so that it is easy to happen offset or landing during the adjustment so that surface generates, difficult
To guarantee processing quality.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of semiconductors and general semiconductor substrate to transport transfer, solves
In existing semiconductor and the processing of general semiconductor machining, substrate needs to carry out corner transhipment during transportation, do not have phase
The protection fixed mechanism answered, so that it is easy to happen offset or landing during the adjustment, so that surface generates damage or transport
In collide, it is difficult to the problem of guaranteeing processing quality.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of semiconductor and general semiconductor substrate fortune
Defeated transfer, including under casing, under casing intracavity bottom middle position are rotatably connected to rotation axis, the rotation axis outer surface
It is fixedly connected with driven wheel close to the position at top positioned under casing inner cavity, the under casing intracavity bottom is located at fixed on the left of rotation axis
It is connected with connecting rod, the connecting rod is fixedly connected with heat emission fan close to the side of rotation axis, and the under casing intracavity bottom is located at
It is fixedly connected with driving motor on the right side of rotation axis, the driving motor output end is fixedly connected with drive rod, and the drive rod is remote
One end from driving motor is rotatablely connected by kinematic link and driven wheel, and the rotation axis top is fixedly connected with support plate,
The support plate is fixedly connected with bracket far from the side intermediate symmetrical position of rotation axis, and it is left to be located at bracket at the top of the support plate
Side is fixedly connected with driving motor, and the driving motor output end is fixedly connected with driving pulley, two sides at the top of the support plate
Driver plate is fixedly connected with by support frame, driver plate bottom middle position is fixedly connected with lifting device, the biography
Movable plate top face and the back side are fixedly connected to partition, and partition side middle position close to each other is provided with a plurality of
Live-roller, the driver plate top are fixedly connected with electric telescopic rod between live-roller, and the lifting device is far from transmission
One end of plate is rotatably connected to lifter plate, and the lifter plate bottom is located at electric telescopic rod corresponding position and is fixedly connected with fastening dress
It sets.
Preferably, the heat emission fan includes heat emission fan case, and heat emission fan box cavity two sides outer wall offers blinds fan,
The heat emission fan box cavity is fixedly connected with radiating motor close to the side of connecting rod, and the radiating motor output end passes through shaft coupling
Device is fixedly connected with heat dissipation shaft, and the heat dissipation shaft is fixedly connected with radiating vane far from one end of radiating motor.
Preferably, the lifting device includes lifting motor, and the lifting motor output end is fixedly connected by shaft coupling
There is worm screw, the worm screw outer surface engaged transmission has worm gear, and the worm gear inner surface is threaded with lifting screw.
Preferably, the worm screw connect far from one end of lifting motor with holder pivots, the worm gear top and driver plate
Rotation connection, the lifting screw is through driver plate and extends at the top of driver plate.
Preferably, the clamp device includes hitch box, and fastening electricity is fixedly connected at the top of the inner wall of the hitch box side
Machine, the fastening motor output end are fixedly connected with driving pulley by shaft coupling, and the fastening box cavity is far from fastening motor
Side inner wall slidably connect spur rack, there is engaging tooth in the spur rack outer surface far from the side engaged transmission of hitch box
Wheel, the driving pulley outer surface is slidably connected by belt and meshing gear.
Preferably, the live-roller is fixedly connected with sprocket wheel close to positive one end, and the sprocket outer surface passes through chain
Intermeshing transmission.
Preferably, the live-roller, which is located on the left of partition and is located at sprocket wheel front, is fixedly connected with driven pulley, it is described from
Movable belt pulley outer surface is slidably connected by driving belt and driving pulley.
Preferably, the under casing two sides outer wall middle position offers net window, and under casing front and back bottom is equal
It is fixedly connected with mounting rail.
Preferably, a partition lateral roof close to each other is fixedly connected with neonychium, and the support plate surface is located at
Lifting device corresponding position is offered through through-hole.
Preferably, the rotation axis through under casing and extends at the top of under casing, and the support plate bottom is located at rotation axis two
Side is fixedly connected to supporting track wheel.
(3) beneficial effect
The present invention provides a kind of semiconductor and general semiconductor substrates to transport transfer, have it is following the utility model has the advantages that
The present invention passes through support frame by two sides at the top of support plate and is fixedly connected with driver plate, driver plate bottom middle position
It is fixedly connected with lifting device, driver plate top face and the back side are fixedly connected to partition, in partition side close to each other
Meta position, which installs, is equipped with a plurality of live-rollers, is fixedly connected with electric telescopic rod, lifting dress at the top of driver plate between live-roller
It sets one end far from driver plate and is rotatably connected to lifter plate, lifter plate bottom is located at electric telescopic rod corresponding position and is fixedly connected with
Clamp device fastens the device effectively to substrate, avoids it that surface abrasion occurs in transport process, and
It avoids colliding, protective substrate safety guarantees processing quality.
Detailed description of the invention
Fig. 1 is overall structure of the present invention；
Fig. 2 is radiating fan structure schematic diagram of the present invention；
Fig. 3 is clamp device structural schematic diagram of the present invention.
In figure: 1- under casing, 2- rotation axis, 3- driven wheel, 4- connecting rod, 5- heat emission fan, 51- heat emission fan case, 52- blinds
Fan, 53- radiating motor, 54- heat dissipation shaft, 55- radiating vane, 6- driving motor, 7- drive rod, 8- kinematic link, 9- support
Plate, 10- bracket, 11- driving motor, 12- driving pulley, 13- driver plate, 14- lifting device, 141- lifting motor, 142- snail
Bar, 143- worm gear, 144- lifting screw, 15- partition, 16- live-roller, 17- electric telescopic rod, 18- lifter plate, 19- fastening dress
It sets, 191- hitch box, 192- fastening motor, 193- driving pulley, 194- spur rack, 195- meshing gear, 20- sprocket wheel, 21- chain
Item, 22- driven pulley, 23- net window, 24- mounting rail, 25- neonychium, 26- run through through-hole, 27- supporting track wheel.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1-3, the present invention provides a kind of technical solution: a kind of semiconductor and the transport of general semiconductor substrate turn to dress
It sets, including under casing 1,1 intracavity bottom middle position of under casing is rotatably connected to rotation axis 2, and 2 outer surface of rotation axis is located under casing 1
Chamber is fixedly connected with driven wheel 3 close to the position at top, and 1 intracavity bottom of under casing, which is located on the left of rotation axis 2, is fixedly connected with connection
Bar 4, connecting rod 4 are fixedly connected with heat emission fan 5 close to the side of rotation axis 2, and heat emission fan 5 includes heat emission fan case 51, heat emission fan case
51 inner cavity two sides outer walls offer blinds fan 52, and 51 inner cavity of heat emission fan case is fixedly connected with heat dissipation close to the side of connecting rod 4
Motor 53,53 output end of radiating motor are fixedly connected with heat dissipation shaft 54 by shaft coupling, and the shaft 54 that radiates is far from radiating motor
53 one end is fixedly connected with radiating vane 55, and 1 intracavity bottom of under casing, which is located on the right side of rotation axis 2, is fixedly connected with driving motor 6,
6 output end of driving motor is fixedly connected with drive rod 7, the one end of drive rod 7 far from driving motor 6 by kinematic link 8 with from
Driving wheel 3 is rotatablely connected, and 2 top of rotation axis is fixedly connected with support plate 9, side intermediate symmetry position of the support plate 9 far from rotation axis 2
It sets and is fixedly connected with bracket 10, be located on the left of bracket 10 at the top of support plate 9 and be fixedly connected with driving motor 11, driving motor 11 is defeated
Outlet is fixedly connected with driving pulley 12, and 9 top two sides of support plate pass through support frame and are fixedly connected with driver plate 13, driver plate
13 bottoms middle position are fixedly connected with lifting device 14, and lifting device 14 includes lifting motor 141, and lifting motor 141 exports
End is fixedly connected with worm screw 142 by shaft coupling, and 142 outer surface of worm screw engaged transmission has worm gear 143,143 inner surface spiral shell of worm gear
Line is connected with lifting screw 144, and the one end of worm screw 142 far from lifting motor 141 and bracket 10 are rotatablely connected, 143 top of worm gear
It is rotatablely connected with driver plate 13, lifting screw 144 is through driver plate 13 and extends to 13 top of driver plate, and 13 top of driver plate is just
Face and the back side are fixedly connected to partition 15, and the side middle position close to each other of partition 15 is provided with a plurality of live-rollers 16,
Be fixedly connected with electric telescopic rod 17 at the top of driver plate 13 between live-roller 16, lifting device 14 far from driver plate 13 one
End is rotatably connected to lifter plate 18, and 18 bottom of lifter plate is located at 17 corresponding position of electric telescopic rod and is fixedly connected with clamp device
19, clamp device 19 includes hitch box 191, and fastening motor 192, fastening electricity are fixedly connected at the top of 191 side inner wall of hitch box
192 output end of machine is fixedly connected with driving pulley 193, side of 191 inner cavity of hitch box far from fastening motor 192 by shaft coupling
Inner wall slidably connects spur rack 194, and there is meshing gear in 194 outer surface of spur rack far from the side engaged transmission of hitch box 191
195,193 outer surface of driving pulley is slidably connected by belt with meshing gear 195, and live-roller 16 is fixed close to positive one end
It is connected with sprocket wheel 20, by the intermeshing transmission of chain 21, live-roller 16 is located at 15 left side of partition and is located at 20 outer surface of sprocket wheel
20 front of sprocket wheel is fixedly connected with driven pulley 22, and 22 outer surface of driven pulley is connected by driving belt and the sliding of driving pulley 12
It connects, 1 two sides outer wall middle position of under casing offers net window 23, and 1 front and back bottom of under casing is fixedly connected to mounting rail
24, the lateral roof close to each other of partition 15 is fixedly connected with neonychium 25, and 9 surface of support plate is located at the corresponding position of lifting device 14
It sets and offers through through-hole 26, rotation axis 2 is through under casing 1 and extends to 1 top of under casing, and 9 bottom of support plate is located at 2 liang of rotation axis
Side is fixedly connected to supporting track wheel 27.The device effectively fastens substrate, it is avoided to transport
Surface abrasion occurs in journey, and avoids colliding, protective substrate safety guarantees processing quality.
In use, starting electric telescopic rod 17 jacks up substrate on substrate transport to live-roller 16, the electricity of starting lifting later
Machine 141 is intermeshed worm screw 142 and worm gear 143, and makes lifting screw 144 that lifter plate 18 be driven to move vertically, and carries out
Position is adjusted, and starting fastening motor 192 makes driving pulley 193 drive meshing gear 195 to rotate by belt, so that spur rack
194 vertical movements fasten substrate, start driving motor 6 later and make drive rod 7 that kinematic link 8 be driven to move, so that
Driven wheel 3 drives rotation axis 2 to rotate, and carries out the adjusting of angle, unclamps clamp device 19 and electric telescopic rod 17 later, and starting passes
Dynamic motor 11 makes driving pulley 12 that driven pulley 22 be driven to rotate, so that sprocket wheel 20 is driven by chain 21, so that base
Plate is transported, and following process is carried out.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By the sentence " element limited including one, it is not excluded that including
There is also other identical elements in the process, method, article or equipment of element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of semiconductor and general semiconductor substrate transport transfer, including under casing (1), it is characterised in that: the under casing (1)
Intracavity bottom middle position is rotatably connected to rotation axis (2), and rotation axis (2) outer surface is located under casing (1) inner cavity close to top
The position in portion is fixedly connected with driven wheel (3), and under casing (1) intracavity bottom is located at the company of being fixedly connected on the left of rotation axis (2)
Extension bar (4), the connecting rod (4) are fixedly connected with heat emission fan (5) close to the side of rotation axis (2), the interior bottom of chamber of the under casing (1)
Portion, which is located on the right side of rotation axis (2), to be fixedly connected with driving motor (6), and driving motor (6) output end is fixedly connected with driving
Bar (7), the one end of the drive rod (7) far from driving motor (6) are rotatablely connected by kinematic link (8) and driven wheel (3), institute
It states rotation axis (2) top to be fixedly connected with support plate (9), side intermediate symmetry position of the support plate (9) far from rotation axis (2)
It sets and is fixedly connected with bracket (10), be located on the left of bracket (10) at the top of the support plate (9) and be fixedly connected with driving motor (11),
Driving motor (11) output end is fixedly connected with driving pulley (12), and two sides pass through support at the top of the support plate (9)
Frame is fixedly connected with driver plate (13), and driver plate (13) the bottom middle position is fixedly connected with lifting device (14), described
Driver plate (13) top face and the back side are fixedly connected to partition (15), the partition (15) side interposition close to each other
It installs and is equipped with a plurality of live-rollers (16), be fixedly connected with electronic stretch between live-roller (16) at the top of the driver plate (13)
Contracting bar (17), the lifting device (14) are rotatably connected to lifter plate (18), the lifter plate far from the one end of driver plate (13)
(18) bottom is located at electric telescopic rod (17) corresponding position and is fixedly connected with clamp device (19).
2. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Heat emission fan (5) includes heat emission fan case (51), and heat emission fan case (51) inner cavity two sides outer wall offers blinds fan (52), described
Heat emission fan case (51) inner cavity is fixedly connected with radiating motor (53) close to the side of connecting rod (4), and the radiating motor (53) is defeated
Outlet is fixedly connected with heat dissipation shaft (54) by shaft coupling, and the described one end of heat dissipation shaft (54) far from radiating motor (53) is solid
Surely radiating vane (55) are connected with.
3. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Lifting device (14) includes lifting motor (141), and lifting motor (141) output end is fixedly connected with worm screw by shaft coupling
(142), worm screw (142) the outer surface engaged transmission has worm gear (143), and worm gear (143) inner surface is threaded with liter
It drops screw rod (144).
4. a kind of semiconductor according to claim 3 and general semiconductor substrate transport transfer, it is characterised in that: described
Worm screw (142) one end and bracket (10) far from lifting motor (141) are rotatablely connected, worm gear (143) top and driver plate
(13) it is rotatablely connected, the lifting screw (144) is through driver plate (13) and extends at the top of driver plate (13).
5. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Clamp device (19) includes hitch box (191), is fixedly connected with fastening motor at the top of the inner wall of hitch box (191) side
(192), fastening motor (192) output end is fixedly connected with driving pulley (193), the hitch box by shaft coupling
(191) inner cavity slidably connects spur rack (194) far from the side inner wall of fastening motor (192), spur rack (194) appearance
Face has meshing gear (195) far from the side engaged transmission of hitch box (191), and driving pulley (193) outer surface passes through skin
Band is slidably connected with meshing gear (195).
6. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Live-roller (16) is fixedly connected with sprocket wheel (20) close to positive one end, and sprocket wheel (20) outer surface is mutual by chain (21)
Engaged transmission.
7. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Live-roller (16), which is located on the left of partition (15) and is located at sprocket wheel (20) front, is fixedly connected with driven pulley (22), the driven belt
Wheel (22) outer surface is slidably connected by driving belt with driving pulley (12).
8. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Under casing (1) two sides outer wall middle position offers net window (23), and under casing (1) the front and back bottom is fixedly connected to
Mounting rail (24).
9. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: described
Partition (15) lateral roof close to each other is fixedly connected with neonychium (25), and support plate (9) surface is located at lifting device
(14) corresponding position is offered through through-hole (26).
10. a kind of semiconductor according to claim 1 and general semiconductor substrate transport transfer, it is characterised in that: institute
Rotation axis (2) are stated through under casing (1) and are extended at the top of under casing (1), support plate (9) bottom is located at rotation axis (2) two sides
It is fixedly connected to supporting track wheel (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942096.1A CN109037131B (en) | 2018-08-17 | 2018-08-17 | Semiconductor and general semiconductor substrate transportation steering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942096.1A CN109037131B (en) | 2018-08-17 | 2018-08-17 | Semiconductor and general semiconductor substrate transportation steering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109037131A true CN109037131A (en) | 2018-12-18 |
| CN109037131B CN109037131B (en) | 2024-09-24 |
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ID=64631080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810942096.1A Active CN109037131B (en) | 2018-08-17 | 2018-08-17 | Semiconductor and general semiconductor substrate transportation steering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109037131B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281818A (en) * | 2021-04-13 | 2021-08-20 | 长春海关技术中心 | Detection equipment for chemical and mineral nonferrous metal |
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| CN209056472U (en) * | 2018-08-17 | 2019-07-02 | 浙江雅市晶科技有限公司 | A kind of semiconductor and general semiconductor substrate transport transfer |
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2018
- 2018-08-17 CN CN201810942096.1A patent/CN109037131B/en active Active
Patent Citations (4)
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|---|---|---|---|---|
| CN206840460U (en) * | 2017-06-08 | 2018-01-05 | 福建省将乐县长兴电子有限公司 | A kind of quartz oscillator substrate mitotic apparatus |
| CN107900579A (en) * | 2017-11-01 | 2018-04-13 | 湖州宏跃电子器件厂 | A kind of capacitance processing lead bonding device |
| CN108393638A (en) * | 2018-05-14 | 2018-08-14 | 安吉亿博家具有限公司 | A kind of bar chair annular base welder |
| CN209056472U (en) * | 2018-08-17 | 2019-07-02 | 浙江雅市晶科技有限公司 | A kind of semiconductor and general semiconductor substrate transport transfer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113281818A (en) * | 2021-04-13 | 2021-08-20 | 长春海关技术中心 | Detection equipment for chemical and mineral nonferrous metal |
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| Publication number | Publication date |
|---|---|
| CN109037131B (en) | 2024-09-24 |
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