CN209030473U - A kind of Reflow Soldering carrier - Google Patents
A kind of Reflow Soldering carrier Download PDFInfo
- Publication number
- CN209030473U CN209030473U CN201821432965.8U CN201821432965U CN209030473U CN 209030473 U CN209030473 U CN 209030473U CN 201821432965 U CN201821432965 U CN 201821432965U CN 209030473 U CN209030473 U CN 209030473U
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- fixedly installed
- circuit board
- end outer
- reflow soldering
- board slot
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Abstract
The utility model discloses a kind of Reflow Soldering carriers, including carrier body, the center outer surface of the carrier body is fixedly installed with circuit board slot, the surrounding outer surface of the circuit board slot is fixedly installed with rectangular frame, the two sides inner surface of the rectangular frame is fixedly installed with meter calibration tank, the upper end surrounding outer surface of the carrier body is fixedly installed with fixation hole, the lower end inner surface of the circuit board slot is fixedly installed with contact layer, the lower end outer surface of the contact layer is fixedly installed with buffer spring, the lower end outer surface of the buffer spring is fixedly installed with stress layer.A kind of Reflow Soldering carrier described in the utility model, equipped with buffer spring, stablize bolt and movable positioning plate, it can be avoided when component is contacted with carrier and damage, and compressing dynamics when adjustment circuit plate is fixed can be carried out according to the actual situation, carrier can also be made to adapt to the circuit board fixed demand of different model, bring better prospect of the application.
Description
Technical field
The utility model relates to carrier field, in particular to a kind of Reflow Soldering carrier.
Background technique
Solder reflow techniques are not strange in electronic manufacturing field, and the element on various boards that we use in computer is all
It is welded on wiring board by this technique, there is a heater circuit in the inside of this equipment, and air or nitrogen are heated to
Sufficiently high temperature after-blow bonds after allowing the solder of elements on either side to melt with mainboard to the wiring board for having posted element, this
The advantage of technique is that temperature is easily controllable, and oxidation is also avoided that in welding process, and manufacturing cost is also easier to control；Existing time
There are certain drawbacks in fluid welding carrier, firstly, component is to be easy to damage because of extruding when the carrier contact of bottom when in use
It is bad, secondly, the size of compressing dynamics can not be adjusted when preventing circuit board from falling off, it is unfavorable for the use of people, in addition, for difference
Circuit board need to frequently replace the carrier of different model, certain adverse effect is brought to the use process of people, for this purpose,
It is proposed that a kind of Reflow Soldering carrier.
Utility model content
The main purpose of the utility model is to provide a kind of Reflow Soldering carriers, can effectively solve asking in background technique
Topic.
To achieve the above object, the technical solution that the utility model is taken are as follows:
A kind of Reflow Soldering carrier, including carrier body, the center outer surface of the carrier body are fixedly installed with circuit board
Slot, the surrounding outer surface of the circuit board slot are fixedly installed with rectangular frame, and the two sides inner surface of the rectangular frame is solid
Dingan County is equipped with meter calibration tank, and the upper end surrounding outer surface of the carrier body is fixedly installed with fixation hole, the circuit board slot
Lower end inner surface is fixedly installed with contact layer, and the lower end outer surface of the contact layer is fixedly installed with buffer spring, the buffering
The lower end outer surface of spring is fixedly installed with stress layer, and the upper end of the rectangular frame is fixedly installed with anticreep baffle, described anti-
One side external surface of upper end of off-gear piece is fixedly installed with vertical pivot, and another side external surface in upper end of the anticreep baffle is fixedly installed with
Stablize bolt, the upper end outer surface of the stable bolt is fixedly installed with rotary valve, and the inside of the circuit board slot is fixedly mounted
There is movable positioning plate, the upper end outer surface of the movable positioning plate is fixedly installed with movable block, the upper center of the movable block
Outer surface is fixedly installed with support frame, and the side of support frame as described above is fixedly installed with support spring, outside the upper end of support frame as described above
Surface is fixedly installed with locating rack, and the upper end outer surface of the circuit board slot is fixedly installed with locating slot.
Above-mentioned contact layer is proposed with soft materials, and be more advantageous to prevents component impaired because squeezing in this way.
Above-mentioned carrier body is proposed with the materials such as oxidation resistant aluminium, and whole service life can be improved in this way.
Preferably, the upper end outer surface of the stress layer connects by the way that the lower end outer surface of buffer spring and contact layer is fixed
It connects.
Preferably, one side external surface of upper end of the anticreep baffle is fixed by the upper end outer surface of vertical pivot and rectangular frame
Connection, the lower end outer surface of the rotary valve is fixedly connected by stablizing bolt with another side external surface in the upper end of anticreep baffle.
Preferably, movable axis, the middle part lower end outer surface of the locating rack are provided between the locating rack and support frame
It is fixedly connected by movable axis with the upper end outer surface of support frame.
Preferably, the outer surface of the rotary valve and locating rack is provided with antiskid thread.
Preferably, the upper end outer surface of support frame as described above is fixedly connected by locating rack with the inner surface of locating slot.
Compared with prior art, the utility model has the following beneficial effects: a kind of Reflow Soldering carrier, passes through setting
Buffer spring, can component on circuit boards and carrier when contacting, make to be bonded according to the shape of component it is closer, from
And reduce spoilage, there is certain convenience, by the stabilization bolt of setting, can on circuit boards square anticreep when, according to when
Between situation adjustment compressing dynamics, be conducive to the use of people, the setting of movable positioning plate can be in fixed different model circuit
When plate, the frequency of carrier replacement is reduced, carrier can be made to better adapt to the circuit board of different model, entire Reflow Soldering carrier knot
Structure is simple, easy to operate, and the effect used is more preferable relative to traditional approach.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of Reflow Soldering carrier of the utility model.
Fig. 2 is a kind of partial view of Reflow Soldering carrier of the utility model.
Fig. 3 is the explosion views of A in a kind of Fig. 2 of Reflow Soldering carrier of the utility model.
Fig. 4 is the explosion views of B in a kind of Fig. 2 of Reflow Soldering carrier of the utility model.
Fig. 5 is the explosion views of C in a kind of Fig. 2 of Reflow Soldering carrier of the utility model.
In figure: 1, carrier body；2, rectangular frame；3, meter calibration tank；4, circuit board slot；5, fixation hole；6, contact layer；7, delay
Rush spring；8, stress layer；9, vertical pivot；10, rotary valve；11, anticreep baffle；12, stablize bolt；13, locating rack；14, bullet is supported
Spring；15, locating slot；16, movable block；17, movable positioning plate；18, support frame.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
As shown in Figs. 1-5, a kind of Reflow Soldering carrier, including carrier body 1, the fixed peace of the center outer surface of carrier body 1
Equipped with circuit board slot 4, the surrounding outer surface of circuit board slot 4 is fixedly installed with rectangular frame 2, table in the two sides of rectangular frame 2
Face is fixedly installed with meter calibration tank 3, and the upper end surrounding outer surface of carrier body 1 is fixedly installed with fixation hole 5, circuit board slot 4
Lower end inner surface be fixedly installed with contact layer 6, the lower end outer surface of contact layer 6 is fixedly installed with buffer spring 7, buffer spring
7 lower end outer surface is fixedly installed with stress layer 8, and the upper end of rectangular frame 2 is fixedly installed with anticreep baffle 11, anticreep baffle 11
One side external surface of upper end be fixedly installed with vertical pivot 9, another side external surface in the upper end of anticreep baffle 11 is fixedly installed with stable spiral shell
Bolt 12, the upper end outer surface for stablizing bolt 12 are fixedly installed with rotary valve 10, and it is fixed that the inside of circuit board slot 4 is fixedly installed with activity
Position plate 17, the upper end outer surface of movable positioning plate 17 are fixedly installed with movable block 16, and the upper center outer surface of movable block 16 is solid
Dingan County is equipped with support frame 18, and the side of support frame 18 is fixedly installed with support spring 14, and the upper end outer surface of support frame 18 is fixed
Locating rack 13 is installed, the upper end outer surface of circuit board slot 4 is fixedly installed with locating slot 15.
The upper end outer surface of stress layer 8 is fixedly connected by buffer spring 7 with the lower end outer surface of contact layer 6, is conducive to
Circuit board is stablized；One side external surface of upper end of anticreep baffle 11 connects by the way that the upper end outer surface of vertical pivot 9 and rectangular frame 2 is fixed
It connecing, the lower end outer surface of rotary valve 10 is fixedly connected by stablizing bolt 12 with another side external surface in the upper end of anticreep baffle 11,
Be conducive to the stronger of fixation；Movable axis is provided between locating rack 13 and support frame 18, outside the middle part lower end of locating rack 13
Surface is fixedly connected by movable axis with the upper end outer surface of support frame 18, and the sliding of movable positioning plate 17 is conducive to；Rotary valve
10 are provided with antiskid thread with the outer surface of locating rack 13, are conducive to user's operation；The upper end outer surface of support frame 18 is logical
It crosses locating rack 13 to be fixedly connected with the inner surface of locating slot 15, is conducive to the adjustment of 17 position of movable positioning plate.
It should be noted that the utility model is a kind of Reflow Soldering carrier, when in use, we can be in electricity to be processed
Corresponding position places component on the plate of road, and then circuit board is being put into circuit board slot 4, left back that carrier body 1 is whole
It is a to be put into the machine that uses of processing, and the adjustment of position can be carried out by meter calibration tank 3, or by fixation hole 5 into
The a large amount of circuit boards of row will when carry out arrangement fixation, so as to subsequent arrangement, in practical operation, size, model of component etc. be all
It has nothing in common with each other, so the fixation before Reflow Soldering just has certain inconvenience, encountering such case then can be by by component
Insert on circuit boards, then it is anti-by the component side downward, such component can be contacted with contact layer 6, then plus
The weight of upper circuit board can depress buffer spring 7, so that each different component can be abundant
Be fixed, and stress layer 8 can provide sufficient stability in process, and circuit board sideslip is avoided to cause to weld
Failure, when being just fixed in face of circuit board, traditional elastic slice is fixed because dynamics can not adjust, and is easy to component
It damages, thus bolt then can will be stablized by rotary valve 10 by the way that anticreep baffle 11 is gone to circuit board
It, in this way can be according to practical situation come dynamics additional when adjusting fixed, to effectively avoid causing when fixed under 12 turns
Component damage, whole processing quality is also improved from side because the entire substrate model of circuit board be also it is different,
In order to avoid needing to frequently replace different carrier bodies 1, it is possible in fixing circuit board by pressing support spring 14,
It is positioned such that frame 13 can be lifted from locating slot 15, then can be mobile along the edge of circuit board slot 4 by movable block 16,
To which movable positioning plate 17 can form different rectangles in the inside of circuit board slot 4, thus can preferably fix not
With the circuit board of model, it is also more convenient to operate, and whole operation is simple and fast, more practical.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. a kind of Reflow Soldering carrier, including carrier body (1), it is characterised in that: the center outer surface of the carrier body (1) is solid
Dingan County is equipped with circuit board slot (4), and the surrounding outer surface of the circuit board slot (4) is fixedly installed with rectangular frame (2), the square
The two sides inner surface of shape frame (2) is fixedly installed with meter calibration tank (3), and the upper end surrounding outer surface of the carrier body (1) is equal
It is fixedly installed with fixation hole (5), the lower end inner surface of the circuit board slot (4) is fixedly installed with contact layer (6), the contact layer
(6) lower end outer surface is fixedly installed with buffer spring (7), the lower end outer surface of the buffer spring (7) be fixedly installed with by
The upper end of power layer (8), the rectangular frame (2) is fixedly installed with anticreep baffle (11), the upper end one of the anticreep baffle (11)
Side external surface is fixedly installed with vertical pivot (9), and another side external surface in upper end of the anticreep baffle (11) is fixedly installed with stable spiral shell
The upper end outer surface of bolt (12), the stable bolt (12) is fixedly installed with rotary valve (10), the inside of the circuit board slot (4)
It being fixedly installed with movable positioning plate (17), the upper end outer surface of the movable positioning plate (17) is fixedly installed with movable block (16),
The upper center outer surface of the movable block (16) is fixedly installed with support frame (18), the fixed peace in the side of support frame as described above (18)
Equipped with support spring (14), the upper end outer surface of support frame as described above (18) is fixedly installed with locating rack (13), the circuit board slot
(4) upper end outer surface is fixedly installed with locating slot (15).
2. a kind of Reflow Soldering carrier according to claim 1, it is characterised in that: the upper end outer surface of the stress layer (8)
It is fixedly connected by buffer spring (7) with the lower end outer surface of contact layer (6).
3. a kind of Reflow Soldering carrier according to claim 1, it is characterised in that: the upper end side of the anticreep baffle (11)
Outer surface is fixedly connected by vertical pivot (9) with the upper end outer surface of rectangular frame (2), the lower end outer surface of the rotary valve (10)
It is fixedly connected by stablizing bolt (12) with another side external surface in upper end of anticreep baffle (11).
4. a kind of Reflow Soldering carrier according to claim 1, it is characterised in that: the locating rack (13) and support frame (18)
Between be provided with movable axis, the middle part lower end outer surface of the locating rack (13) passes through outside the upper end of movable axis and support frame (18)
Surface is fixedly connected.
5. a kind of Reflow Soldering carrier according to claim 1, it is characterised in that: the rotary valve (10) and locating rack (13)
Outer surface be provided with antiskid thread.
6. a kind of Reflow Soldering carrier according to claim 1, it is characterised in that: the upper end outer surface of support frame as described above (18)
It is fixedly connected by locating rack (13) with the inner surface of locating slot (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821432965.8U CN209030473U (en) | 2018-09-03 | 2018-09-03 | A kind of Reflow Soldering carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821432965.8U CN209030473U (en) | 2018-09-03 | 2018-09-03 | A kind of Reflow Soldering carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209030473U true CN209030473U (en) | 2019-06-25 |
Family
ID=66876873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821432965.8U Active CN209030473U (en) | 2018-09-03 | 2018-09-03 | A kind of Reflow Soldering carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209030473U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112299365A (en) * | 2020-11-11 | 2021-02-02 | 无锡红光微电子股份有限公司 | Carrier for MEMS chip process machining |
| CN114269085A (en) * | 2022-01-11 | 2022-04-01 | 苏州易启康电子科技有限公司 | Reflow soldering carrier for integrated circuit board and process thereof |
-
2018
- 2018-09-03 CN CN201821432965.8U patent/CN209030473U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112299365A (en) * | 2020-11-11 | 2021-02-02 | 无锡红光微电子股份有限公司 | Carrier for MEMS chip process machining |
| CN114269085A (en) * | 2022-01-11 | 2022-04-01 | 苏州易启康电子科技有限公司 | Reflow soldering carrier for integrated circuit board and process thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |