CN107971602A - A kind of metal substrate circuit plate welding tooling and its application method - Google Patents
A kind of metal substrate circuit plate welding tooling and its application method Download PDFInfo
- Publication number
- CN107971602A CN107971602A CN201711455459.0A CN201711455459A CN107971602A CN 107971602 A CN107971602 A CN 107971602A CN 201711455459 A CN201711455459 A CN 201711455459A CN 107971602 A CN107971602 A CN 107971602A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- plate
- spring
- backing plate
- welding tooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
Abstract
A kind of metal substrate circuit plate welding tooling, including backing plate, the size of backing plate is consistent with metal substrate, also set on backing plate with the corresponding mounting hole of threaded hole on metal substrate, be equipped with spring screw on each mounting hole；The metal substrate circuit plate welding tooling has further included pressing plate, and pressing plate bottom is fixed with spring；The backing plate interposition is equipped with a hollow-out parts, and the column for retaining spring is placed with hollow-out parts.
Description
Technical field
The invention belongs to circuit board production techniques field, more particularly to a kind of metal substrate circuit plate welding tooling and its make
Use method.
Background technology
In prior art weld technique, metal substrate and soldering of printed boards, especially for the big Metal Substrate of thermal capacity
Plate welds, and generally low using pre-heating station welding efficiency, quality is difficult to control.According to reflow soldering, production effect can be greatly improved
Rate, improves the reliability of welding, but during a kind of circuit board product of my company's production is welded, there are following several respects
Problem：
1. metal substrate is different from printed board thermal coefficient of expansion, warpage phenomenon occurs in postwelding printed board.
2. the printed circuit board with metal substrate welding：Printed circuit board is by three pieces of different shape specifications, different-thickness
Printed board（2 pieces of 25mil thickness, 1 piece of 10mil）Composition, and 13 installation through holes are only distributed with printed board both sides, in printed board
Between position without through hole, have certain angularity plus printed board itself, metal substrate and printed board be combined into one by welding
How a entirety, ensure that three pieces of printing plate faces can be in same level, postwelding printed board is integrally adjacent to metal substrate.
3. if scaling powder volatilization is incomplete during metal substrate and soldering of printed boards, bubble is also easy to produce, makes cavity several
Rate improves, it is difficult to reaches product electricity function index.The adjustable component of this product design is few, fully relies on micro-strip on PCB plates
The change in shape of line ensures the parameter of circuit and performance, will influence micro-strip parameter as produced cavity during welding, frequency is higher
Influence bigger.
4. due to solder plate be heated melt it is thinning so that printed board be bonded with metal substrate it is not tight, cause weld it is reliable
Property is poor.
The content of the invention
To solve the above problems, the present invention provides a kind of metal substrate circuit plate welding tooling.
The present invention is achieved through the following technical solutions：
A kind of metal substrate circuit plate welding tooling, including backing plate, the size of backing plate is consistent with metal substrate, also set on backing plate with
The corresponding mounting hole of threaded hole on metal substrate, is equipped with spring screw on each mounting hole；The metal substrate circuit
Plate welding tooling has further included pressing plate, and pressing plate bottom is fixed with spring；The backing plate centre position is equipped with hollow-out parts, metal substrate
The upper position in hollow-out parts is equipped with fixing threaded hole, and pressing plate is fixed by screws on fixing threaded hole, the pressing plate and metal
Hollow column is equipped between substrate, screw is passed through out of column；Pressing plate is propped certain altitude by column, and spring is in platen pressure
Under the action of, to applying downward elastic force in the middle part of backing plate.
Further to improve, the backing plate is made of compound stone material.
Further to improve, the backing plate is divided into left backing plate and right backing plate two parts, has a notch on the left of right backing plate, lacks
Mouth and left backing plate cooperatively form hollow-out parts.
It is further to improve, it is evenly distributed with venthole on the backing plate.
Further to improve, the pressing plate is equipped with spring fixed hole, and the spring fixed hole is equipped with locating slot；Pressing plate
On baffle is also fixed with by screw, baffle is equipped with spring retainer groove, and locating slot and spring retainer groove, which coordinate, fixes spring
In spring fixed hole；The pressing plate passes through screw vertical columns.
Further to improve, position corresponding with the spring of pressing plate bottom is equipped with spring retainer hole on the backing plate.
Further to improve, the spring is 4, positioned at platen edge position；The column is two, is fixed on pressing plate
Bottom centre position.
The application method of this kind of metal substrate circuit plate welding tooling, includes the following steps：
Step 1）Solder plate is placed on metallic substrates, then circuit board is placed on to the welding position specified, and is made on metal substrate
Threaded hole and circuit board on screw hole align one by one；
Step 2）The spring screw on backing plate is uniformly fastened into corresponding spiral shell on metallic substrates with the force moment screw knife after calibration
In pit, metal substrate, solder plate, circuit board and backing plate is set to be fixed together；
Step 3）Column is placed in hollow-out parts, pressing plate and metal substrate are fixed together using screw, spring is in pressing plate pressure
Under the action of power, to applying downward elastic force in the middle part of backing plate；
Step 4）The frock fixed is put into reflow machine, solder plate is heated, and thawing is thinning, and spring and spring screw are automatic
Fastening pressure is adjusted, circuit board and metal substrate are combined closely, completes welding.
Further to improve, the size of the solder plate is smaller 1.5mm than circuit board surrounding, thickness 0.5mm.
Compared with prior art, the present invention has the following advantages：
Spring screw can reach printed board by automatic pressure regulation and be combined with substrates into intimate, be designed on backing plate middle part
Hollow slots, using the spring of pressing plate bottom to the downward pressure of application in the middle part of circuit board, to constrain printed board deformation.In frock pad
With multiple ventholes are beaten on plate, be conducive to the volatilization of scaling powder, reach the empty bubble of reduction welding and improve welding quality
Purpose.Solder plate, which is heated, in welding process melts thinning, the automatic increasing fastening pressure of its length elongation, by printed board and substrate
Combine closely, constrain printed board deformation, discharge bubble between plate, complete weld job, reduce bubble, improve welding quality,
It ensure that the flatness of printing board surface, reach the electricity function index of design requirement.
Brief description of the drawings
Fig. 1 is the metal substrate circuit plate schematic diagram to be processed of the present invention；
Fig. 2 is left backing plate schematic diagram；
Fig. 3 is right backing plate schematic diagram；
Fig. 4 is spring screw figure；
Fig. 5 is pressing plate schematic diagram；
Fig. 6 is baffle schematic diagram；
Fig. 7 is spring schematic diagram；
Fig. 8 assembles one integral piece schematic diagram for pressing plate；
Fig. 9 is column schematic diagram；
Figure 10 uses schematic diagram for frock of the present invention.
Embodiment
Embodiment 1
A kind of metal substrate circuit plate welding tooling as shown in Figure 10, the metal substrate circuit plate to be processed of such a frock is as schemed
Shown in 1, such a circuit board product will weld 3 printed circuit boards 71,72 and 73 on metal substrate 8, and 8 surrounding of metal substrate is set
It is useful for the threaded hole of fixing circuit board.Field-effect tube to be installed between circuit board 71 and 72, is equipped with metal substrate at this
Fixing threaded hole, for fixing field-effect tube.Metal substrate 8 serves a dual purpose, and is both that product material is used for and the welding of circuit board 7 one
The substrate of body, and as tool base plate, for backing plate, the fixed installation of pressing plate assembling one integral piece.
Welding tooling includes backing plate, and venthole is evenly distributed with backing plate.As shown in Figure 2,3, backing plate is divided into left 1 He of backing plate
There is a notch in right 2 two parts of backing plate, the left side of right backing plate 2, and notch and left backing plate 1 cooperatively form hollow-out parts.Backing plate be equipped with
The corresponding mounting hole of threaded hole on metal substrate 8, is equipped with spring screw on each mounting hole.As shown in figure 4, spring spiral shell
Follow closely as soket head cap screw, with 0.3N.m torque trip bolts, ensure printed board entirety uniform force, design spring can play scolding tin
Piece is heated, and thawing is thinning, and the spring elongation of self made spring screw, Self-pressurizing agri, makes printed circuit board closely be tied with metal substrate
Close.Hugging is arranged at spring screw cap bottom, for retaining spring, prevents spring top from being deformed due to pressure.
During the entire process of to printed board and metal substrate welding, welding will be by ten rather in closed reflux stove
Clock, maximum temperature will reach 250 DEG C or so, and backing plate is made with metal material, its thermal capacity is relatively large, causes furnace temperature to be more difficult to
Reach welding temperature；Compound stone has the characteristics that high temperature is indeformable, heat-insulated, therefore, selects master of the compound stone material as backing plate
Material.
The metal substrate circuit plate welding tooling has further included pressing plate 3, and pressing plate assembles one integral piece structure as viewed in figures 5-8,
Four Thursday apertures of pressing plate 3 are used to install 2 baffles 5, and center vertical pivot holes is used to pressing plate assembling whole installation in metal
On substrate 8.Design four, for retaining spring 4, prevents 4 top of spring due to pressure with locating slot, the through hole in bottom surface You Wo holes
Power and deform.5 structure of baffle is as shown in figure 3, both sides long kidney-shaped hole is fixed baffle hole, after middle holes is used for the positioning of spring 4.
Slot hole on locating slot and baffle coordinates, and blocks the lug boss of spring top, prevents spring 4 from coming off.Whole Anchor plate kit spiral shell
Nail after installation is complete as shown in Figure 8.
Pressing plate 3 is fixed by screws on the fixing threaded hole of metal substrate 8, in being equipped between the pressing plate and metal substrate
Empty column 6（Shown in Fig. 9）, screw passes through out of column 6；Pressing plate 3 is propped certain altitude by column 6, and spring 4 is pressed in pressing plate 3
Under the action of power, to applying downward elastic force in the middle part of backing plate.
As shown in Figure 10, the application method of the metal substrate circuit plate welding tooling is：
Step 1）Solder plate 9 is placed on metal substrate 8, then circuit board 71,72,73 is placed on to the welding position specified, is made
The screw hole on threaded hole and circuit board on metal substrate aligns one by one；
Step 2）, put two pieces of backing plates well, the spring screw on backing plate be uniformly fastened on metal with the force moment screw knife after calibration
On substrate 8 in corresponding threaded hole, metal substrate 8, solder plate 9, circuit board 71,72,73 and backing plate 1,2 is set to be fixed together；
Step 3）Column 6 is placed in hollow-out parts, alignment and fixation screw hole；Pressing plate 3 and metal substrate 8 are fixed on using screw
Together, spring 4 is under the action of 3 pressure of pressing plate, to applying downward elastic force in the middle part of backing plate；
Step 4）The frock fixed is put into reflow machine, the heated thawing of solder plate 9 is thinning, and spring 4 and spring screw are certainly
It is dynamic to adjust fastening pressure, printed board 71,72,73 is combined closely with metal substrate 8, completes welding.
This frock of this secondary design, during welding printed board with metal substrate, can automatically adjust fastening pressure guarantor
Welding quality is demonstrate,proved, reaches the frock of product electricity function index.Self made spring screw in use can pass through telescopic spring power
Automatic pressure regulation reaches printed board and is combined with substrates into intimate, and spring screw cap is designed to interior hexagonal, can use the torque after calibration
Screwdriver uniformly fastens each screw, makes mounting screw stress in the same size, whole to print plate face uniform force, printed board postwelding
It can achieve the purpose that smooth.Installation spring eye is devised in backing plate middle part, pressing plate is assembled into one integral piece, is supported with 2 columns, profit
Pressing plate is installed with the fixing threaded hole of installation field-effect tube.One integral piece holddown spring is assembled by pressing plate, makes printed board 1,2 two butt joint edges
Middle part stress compresses, and constrains printed board deformation, ensure that postwelding printed board middle part is adjacent to, and the pressing plate assembling of assembling is whole
Part can reduce the man-hour assembled every time, improve production efficiency；With cellular aperture is beaten on frock backing plate, be conducive to scaling powder
Volatilization, achievees the purpose that to reduce the empty bubble of welding with improving product electric property；" solder plate " replacement " solder(ing) paste " is selected, by
Scaling powder volume accounts for 50% in tin cream, and tin amount is more, and soldering flux quantity is accordingly also more, and the empty probability of generation is bigger, because
This is difficult to meet design requirement using tin cream welding, using solder plate, the ratio of scaling powder in tin cream can be reduced, so as to effectively subtract
The probability in few product cavity caused by scaling powder volatilizees and produces bubble in welding, solder plate designed size are smaller than printed board surrounding
1.5mm, thickness 0.5mm, not only can guarantee that tin amount used in welding, but also can prevent tin amount from excessively flowing to four wall of metal substrate.
Above example is merely to illustrate the present invention, but is not limited to the scope of the present invention, every according to the present invention's
Any simple modification, equivalent change and modification that technical spirit makees following instance, still falls within technical solution of the present invention
In the range of.
Claims (9)
1. a kind of metal substrate circuit plate welding tooling, including backing plate, the size of backing plate is consistent with metal substrate, its feature exists
In, also set on backing plate with the corresponding mounting hole of threaded hole on metal substrate, be equipped with spring screw on each mounting hole；Institute
State metal substrate circuit plate welding tooling and further included pressing plate, pressing plate bottom is fixed with spring；The backing plate centre position is equipped with
Hollow-out parts, the position on metal substrate in hollow-out parts are equipped with fixing threaded hole, and pressing plate is fixed by screws on fixing threaded hole,
Hollow column is equipped between the pressing plate and metal substrate, screw is passed through out of column；Pressing plate is propped certain altitude by column,
Spring is under the action of platen pressure, to applying downward elastic force in the middle part of backing plate.
2. a kind of metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that the backing plate is compound stone
Material is made.
3. a kind of metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that the backing plate is divided into left pad
Plate and right backing plate two parts, have a notch on the left of right backing plate, notch and left backing plate cooperatively form hollow-out parts.
4. a kind of metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that uniformly divide on the backing plate
It is furnished with venthole.
5. a kind of metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that the pressing plate is equipped with bullet
Spring mounting hole, the spring fixed hole are equipped with locating slot；Baffle is also fixed with by screw on pressing plate, baffle is equipped with spring
Limiting slot, locating slot and spring retainer groove, which coordinate, is fixed on spring in spring fixed hole.
A kind of 6. metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that on the backing plate with pressing plate
The corresponding position of spring of bottom is equipped with spring retainer hole.
7. a kind of metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that the spring is 4, position
In platen edge position；The column is two, is fixed on pressing plate bottom centre position.
8. a kind of application method of metal substrate circuit plate welding tooling as claimed in claim 1, it is characterised in that including such as
Lower step：
Step 1）Solder plate is placed on metallic substrates, then circuit board is placed on to the welding position specified, and is made on metal substrate
Threaded hole and circuit board on screw hole align one by one；
Step 2）The spring screw on backing plate is uniformly fastened into corresponding spiral shell on metallic substrates with the force moment screw knife after calibration
In pit, metal substrate, solder plate, circuit board and backing plate is set to be fixed together；
Step 3）Column is placed in hollow-out parts, using screw by pressing plate together with metal substrate, spring is in platen pressure
Under effect, to applying downward elastic force in the middle part of backing plate；
Step 4）The frock fixed is put into reflow machine, solder plate is heated, and thawing is thinning, and spring and spring screw are automatic
Fastening pressure is adjusted, circuit board and metal substrate are combined closely, completes welding.
9. a kind of application method of metal substrate circuit plate welding tooling as claimed in claim 8, the size of the solder plate
It is smaller 1.5mm than circuit board surrounding, thickness 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711455459.0A CN107971602B (en) | 2017-12-28 | 2017-12-28 | Metal substrate circuit board welding tool and application method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711455459.0A CN107971602B (en) | 2017-12-28 | 2017-12-28 | Metal substrate circuit board welding tool and application method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107971602A true CN107971602A (en) | 2018-05-01 |
| CN107971602B CN107971602B (en) | 2023-09-12 |
Family
ID=62008031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711455459.0A Active CN107971602B (en) | 2017-12-28 | 2017-12-28 | Metal substrate circuit board welding tool and application method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107971602B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990374A (en) * | 2018-07-19 | 2018-12-11 | 芜湖奕辰模具科技有限公司 | One kind can shockproof metal plate |
| CN109068503A (en) * | 2018-09-14 | 2018-12-21 | 深圳市宇顺电子股份有限公司 | A kind of tin pressure jig and its application method |
| CN111843098A (en) * | 2020-07-23 | 2020-10-30 | 吉林大学 | Clamp for brazing aluminum honeycomb panel and brazing process |
| CN112692398A (en) * | 2021-03-23 | 2021-04-23 | 成都市克莱微波科技有限公司 | Welding fixture and welding method for solid-state microwave power amplifier assembly |
| CN113210780A (en) * | 2021-06-02 | 2021-08-06 | 深圳市兆兴博拓科技股份有限公司 | Electronic component welding method and welding jig |
| CN114453785A (en) * | 2021-12-14 | 2022-05-10 | 北京无线电测量研究所 | Tooling equipment |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990374A (en) * | 2018-07-19 | 2018-12-11 | 芜湖奕辰模具科技有限公司 | One kind can shockproof metal plate |
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| CN109068503A (en) * | 2018-09-14 | 2018-12-21 | 深圳市宇顺电子股份有限公司 | A kind of tin pressure jig and its application method |
| CN109068503B (en) * | 2018-09-14 | 2021-03-12 | 深圳市宇顺电子股份有限公司 | Tin pressing jig and using method thereof |
| CN111843098A (en) * | 2020-07-23 | 2020-10-30 | 吉林大学 | Clamp for brazing aluminum honeycomb panel and brazing process |
| CN111843098B (en) * | 2020-07-23 | 2021-05-04 | 吉林大学 | Clamp for brazing aluminum honeycomb panel and brazing process |
| CN112692398A (en) * | 2021-03-23 | 2021-04-23 | 成都市克莱微波科技有限公司 | Welding fixture and welding method for solid-state microwave power amplifier assembly |
| CN113210780A (en) * | 2021-06-02 | 2021-08-06 | 深圳市兆兴博拓科技股份有限公司 | Electronic component welding method and welding jig |
| CN114453785A (en) * | 2021-12-14 | 2022-05-10 | 北京无线电测量研究所 | Tooling equipment |
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| Publication number | Publication date |
|---|---|
| CN107971602B (en) | 2023-09-12 |
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