CN207642458U - A kind of metal substrate circuit plate welding tooling - Google Patents
A kind of metal substrate circuit plate welding tooling Download PDFInfo
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- CN207642458U CN207642458U CN201721872814.XU CN201721872814U CN207642458U CN 207642458 U CN207642458 U CN 207642458U CN 201721872814 U CN201721872814 U CN 201721872814U CN 207642458 U CN207642458 U CN 207642458U
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- metal substrate
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- backing plate
- pressing plate
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Abstract
A kind of metal substrate circuit plate welding tooling, including backing plate, the size of backing plate is consistent with metal substrate, and mounting hole corresponding with the threaded hole on metal substrate is also set on backing plate, spring screw is equipped on each mounting hole；The metal substrate circuit plate welding tooling further includes having pressing plate, and pressing plate bottom is fixed with spring；The backing plate interposition is equipped with a hollow-out parts, and the column for retaining spring is placed in hollow-out parts.
Description
Technical field
The utility model belongs to circuit board production techniques field more particularly to a kind of metal substrate circuit plate welding tooling.
Background technology
In prior art weld technique, metal substrate and soldering of printed boards, especially for the big Metal Substrate of thermal capacity
Plate welds, generally low using pre-heating station welding efficiency, and quality is difficult to control.According to reflow soldering, production effect can be greatly improved
Rate improves the reliability of welding, but during welding a kind of circuit board product of my company's production, there are following several respects
Problem：
1. metal substrate is different from printed board coefficient of thermal expansion, postwelding printed board will appear warpage phenomenon.
2. the printed circuit board with metal substrate welding：Printed circuit board is by three pieces of different shape specifications, different-thickness
Printed board（2 pieces of 25mil thickness, 1 piece of 10mil）Composition, and 13 installation through-holes are only distributed on printed board both sides, in printed board
Between position without through-hole, in addition printed board itself has certain angularity, metal substrate and printed board are combined into one by welding
How a entirety ensures that three pieces of printing plate faces can be in same level, and postwelding printed board is integrally adjacent to metal substrate.
3. if scaling powder volatilization is incomplete during metal substrate and soldering of printed boards, it is also easy to produce bubble, keeps cavity several
Rate improves, it is difficult to reach product electricity function index.The adjustable component of this product design is few, fully relies on micro-strip on PCB plates
The change in shape of line ensures the parameter and performance of circuit, will influence micro-strip parameter as generated cavity when welding, frequency is higher
It influences bigger.
4. melting since solder plate is heated thinning so that printed board is bonded not tight with metal substrate, causes to weld reliable
Property is poor.
Utility model content
The utility model provides a kind of metal substrate circuit plate welding tooling in order to solve the above problem.
The utility model is achieved by the following technical solution：
A kind of metal substrate circuit plate welding tooling, including backing plate, the size of backing plate is consistent with metal substrate, on backing plate also
If mounting hole corresponding with the threaded hole on metal substrate, spring screw is equipped on each mounting hole；The metal substrate
Welding circuit board tooling further includes having pressing plate, and pressing plate bottom is fixed with spring；The backing plate centre position is equipped with hollow-out parts, metal
The position being located on substrate in hollow-out parts is equipped with fixing threaded hole, and pressing plate is fixed by screws on fixing threaded hole, the pressing plate and
Hollow column is equipped between metal substrate, screw is passed through out of column；Pressing plate is propped certain altitude by column, and spring is in pressing plate
Under the action of pressure, to applying downward elastic force in the middle part of backing plate.
Further to improve, the backing plate is made of compound stone material.
Further to improve, the backing plate is divided into left backing plate and right backing plate two parts, has a notch on the left of right backing plate, lacks
Mouth and left backing plate cooperatively form hollow-out parts.
It is further to improve, it is evenly distributed with venthole on the backing plate.
Further to improve, the pressing plate is equipped with spring fixed hole, and the spring fixed hole is equipped with locating slot；Pressing plate
On baffle is also fixed with by screw, baffle is equipped with spring retainer groove, and spring is fixed in locating slot and spring retainer groove cooperation
In spring fixed hole；The pressing plate passes through screw vertical columns.
Further to improve, position corresponding with the spring of pressing plate bottom is equipped with spring retainer hole on the backing plate.
Further to improve, the spring is 4, is located at platen edge position；The column is two, is fixed on pressing plate
Bottom centre position.
The application method of this kind of metal substrate circuit plate welding tooling, includes the following steps：
Step 1）Solder plate is placed on metallic substrates, then circuit board is placed on to specified welding position, makes Metal Substrate
The screw hole on threaded hole and circuit board on plate is aligned one by one；
Step 2）With the force moment screw knife after calibration, by the spring screw on backing plate, uniformly fastening corresponds on metallic substrates
Threaded hole in, so that metal substrate, solder plate, circuit board and backing plate is fixed together；
Step 3）Column is placed in hollow-out parts, pressing plate and metal substrate are fixed together using screw, spring is being pressed
Under the action of plate pressure, to applying downward elastic force in the middle part of backing plate；
Step 4）The tooling fixed is put into reflow machine, solder plate is heated to melt thinning, spring and spring screw
Fastening pressure is automatically adjusted, circuit board and metal substrate are combined closely, completes welding.
Further to improve, the size of the solder plate is smaller 1.5mm than circuit board surrounding, thickness 0.5mm.
Compared with prior art, the utility model has the following advantages：
Spring screw can reach printed board by automatic pressure regulation and be combined with substrates into intimate, among the backing plate on position
Hollow slots are designed, using the spring of pressing plate bottom to the downward pressure of application in the middle part of circuit board, to constrain printed board deformation.In work
With multiple ventholes are beaten on dress backing plate, be conducive to the volatilization of scaling powder, reach the empty bubble of reduction welding and improve welding matter
The purpose of amount.Solder plate is heated in welding process melts thinning, and length elongation is automatic to increase fastening pressure, by printed board with
Substrates into intimate combines, and constrains printed board deformation, and bubble between plate is discharged, and completes weld job, reduces bubble, improve welding matter
Amount, ensure that the flatness of printing board surface, reaches the electricity function index of design requirement.
Description of the drawings
Fig. 1 is the metal substrate circuit plate schematic diagram to be processed of the utility model；
Fig. 2 is left backing plate schematic diagram；
Fig. 3 is right backing plate schematic diagram；
Fig. 4 is spring screw figure；
Fig. 5 is pressing plate schematic diagram；
Fig. 6 is baffle schematic diagram；
Fig. 7 is spring schematic diagram；
Fig. 8 is that pressing plate assembles one integral piece schematic diagram；
Fig. 9 is column schematic diagram；
Figure 10 uses schematic diagram for the utility model tooling.
Specific implementation mode
Embodiment 1
A kind of metal substrate circuit plate welding tooling as shown in Figure 10, the metal substrate circuit plate to be processed of such tooling
As shown in Figure 1, such circuit board product will weld 3 printed circuit boards 71,72 and 73, metal substrate 8 four on metal substrate 8
Week is equipped with the threaded hole for fixing circuit board.Field-effect tube to be installed, on metal substrate at this between circuit board 71 and 72
Equipped with fixing threaded hole, for fixing field-effect tube.Metal substrate 8 serves a dual purpose, and is both that product material is used to weld with circuit board 7
Integrated substrate is connect, and as tool base plate, for backing plate, the fixed installation of pressing plate assembling one integral piece.
Welding tooling includes backing plate, and venthole is evenly distributed on backing plate.As shown in Figure 2,3, backing plate is divided into 1 He of left backing plate
The left side of 2 two parts of right backing plate, right backing plate 2 has a notch, notch and left backing plate 1 to cooperatively form hollow-out parts.Backing plate be equipped with
The corresponding mounting hole of threaded hole on metal substrate 8 is equipped with spring screw on each mounting hole.As shown in figure 4, spring spiral shell
Nail is soket head cap screw, with 0.3N.m torque trip bolts, ensures that printed board entirety uniform force, design spring can play scolding tin
The heated thawing of piece is thinning, and the spring elongation of self made spring screw, Self-pressurizing agri makes printed circuit board closely be tied with metal substrate
It closes.Hugging is arranged at spring screw cap bottom, is used for retaining spring, prevents spring top from being deformed due to pressure.
During the entire process of to printed board and metal substrate welding, welding will be by ten rather in closed reflux stove
Clock, maximum temperature will reach 250 DEG C or so, make backing plate with metal material, thermal capacity is relatively large, and furnace temperature is caused more to be difficult to
Reach welding temperature；Compound stone has the characteristics that high temperature is indeformable, heat-insulated, therefore, selects master of the compound stone material as backing plate
Material.
The metal substrate circuit plate welding tooling further includes having pressing plate 3, and pressing plate assembles one integral piece structure as viewed in figures 5-8,
Four Thursday apertures of pressing plate 3 are used to pressing plate assembling whole installation in metal for installing 2 baffles 5, center vertical pivot holes
On substrate 8.Through-hole of the design four with locating slot, the bottom surface holes You Wo, is used for retaining spring 4, prevents 4 top of spring due to pressure
Power and deform.5 structure of baffle is as shown in figure 3, both sides long kidney-shaped hole is fixed baffle hole, after intermediate holes is positioned for spring 4.
Slot hole cooperation on locating slot and baffle, blocks the lug boss of spring top, prevents spring 4 from falling off.Entire Anchor plate kit spiral shell
Nail after installation is complete as shown in Figure 8.
Pressing plate 3 is fixed by screws on the fixing threaded hole of metal substrate 8, in being equipped between the pressing plate and metal substrate
Empty column 6（Shown in Fig. 9）, screw passes through out of column 6；Pressing plate 3 is propped certain altitude by column 6, and spring 4 is pressed in pressing plate 3
Under the action of power, to applying downward elastic force in the middle part of backing plate.
As shown in Figure 10, the application method of the metal substrate circuit plate welding tooling is：
Step 1）Solder plate 9 is placed on metal substrate 8, then circuit board 71,72,73 is placed on specified welding position
It sets, the screw hole on threaded hole and circuit board on metal substrate is made to be aligned one by one；
Step 2）, put two pieces of backing plates well, be uniformly fastened on the spring screw on backing plate with the force moment screw knife after calibration
On metal substrate 8 in corresponding threaded hole, metal substrate 8, solder plate 9, circuit board 71,72,73 and backing plate 1,2 is made to be fixed on one
It rises；
Step 3）Column 6 is placed in hollow-out parts, alignment and fixation screw hole；Pressing plate 3 and metal substrate 8 are consolidated using screw
It is scheduled on together, spring 4 is under the action of 3 pressure of pressing plate, to applying downward elastic force in the middle part of backing plate；
Step 4）The tooling fixed is put into reflow machine, solder plate 9 is heated to melt thinning, spring 4 and spring spiral shell
Nail automatic adjustment fastening pressure, printed board 71,72,73 is combined closely with metal substrate 8, completes welding.
This tooling of this secondary design can automatically adjust fastening pressure guarantor during welding printed board with metal substrate
Welding quality is demonstrate,proved, the tooling of product electricity function index is reached.Self made spring screw in use can pass through telescopic spring power
Automatic pressure regulation reaches printed board and is combined with substrates into intimate, and spring screw cap is designed to interior hexagonal, can use the torque after calibration
Screwdriver uniformly fastens each screw, keeps mounting screw stress in the same size, entire to print plate face uniform force, printed board postwelding
It can achieve the purpose that smooth.Position devises installation spring eye among backing plate, and pressing plate is assembled one integral piece, is supported with 2 columns, profit
Pressing plate is installed with the fixing threaded hole of installation field-effect tube.One integral piece holddown spring is assembled by pressing plate, makes printed board 1,2 two butt joint edges
Intermediate position stress compresses, and constrains printed board deformation, ensure that position is adjacent among postwelding printed board, and the pressing plate assembling of assembling is whole
Part can reduce the working hour assembled every time, improve production efficiency；With cellular aperture is beaten on tooling backing plate, be conducive to scaling powder
Volatilization achievees the purpose that reduce the empty bubble of welding and improves product electric property；" solder plate " replacement " solder(ing) paste " is selected, by
Scaling powder volume accounts for 50% in tin cream, and tin amount is more, and soldering flux quantity is accordingly also more, and the probability in the cavity of generation is bigger, because
This is difficult to meet design requirement using tin cream welding, using solder plate, can reduce the ratio of scaling powder in tin cream, to effectively subtract
The probability in few product cavity caused by scaling powder volatilizees and generates bubble in welding, solder plate designed size are smaller than printed board surrounding
1.5mm, thickness 0.5mm not only can guarantee welding tin amount used, but also can prevent tin amount from excessively flowing to four wall of metal substrate.
Above example is merely to illustrate the utility model, but is not intended to limit the scope of the present invention, every foundation
The technical essence of the utility model still falls within this reality to any simple modification, equivalent change and modification made by following instance
In the range of new technique scheme.
Claims (7)
1. a kind of metal substrate circuit plate welding tooling, including backing plate, the size of backing plate is consistent with metal substrate, and feature exists
In also setting mounting hole corresponding with the threaded hole on metal substrate on backing plate, spring screw be equipped on each mounting hole；Institute
It further includes having pressing plate to state metal substrate circuit plate welding tooling, and pressing plate bottom is fixed with spring；The backing plate centre position is equipped with
Hollow-out parts, the position being located on metal substrate in hollow-out parts are equipped with fixing threaded hole, and pressing plate is fixed by screws on fixing threaded hole,
Hollow column is equipped between the pressing plate and metal substrate, screw is passed through out of column；Pressing plate is propped certain altitude by column,
Spring is under the action of platen pressure, to applying downward elastic force in the middle part of backing plate.
2. a kind of metal substrate circuit plate welding tooling as described in claim 1, it is characterised in that the backing plate is compound stone
Material is made.
3. a kind of metal substrate circuit plate welding tooling as described in claim 1, which is characterized in that the backing plate is divided into left pad
Plate and right backing plate two parts have a notch, notch and left backing plate to cooperatively form hollow-out parts on the left of right backing plate.
4. a kind of metal substrate circuit plate welding tooling as described in claim 1, which is characterized in that uniformly divide on the backing plate
It is furnished with venthole.
5. a kind of metal substrate circuit plate welding tooling as described in claim 1, which is characterized in that the pressing plate is equipped with bullet
Spring mounting hole, the spring fixed hole are equipped with locating slot；Baffle is also fixed with by screw on pressing plate, baffle is equipped with spring
Spring is fixed in spring fixed hole by limiting slot, locating slot and spring retainer groove cooperation.
6. a kind of metal substrate circuit plate welding tooling as described in claim 1, it is characterised in that on the backing plate with pressing plate
The corresponding position of spring of bottom is equipped with spring retainer hole.
7. a kind of metal substrate circuit plate welding tooling as described in claim 1, it is characterised in that the spring is 4, position
In platen edge position；The column is two, is fixed on pressing plate bottom centre position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721872814.XU CN207642458U (en) | 2017-12-28 | 2017-12-28 | A kind of metal substrate circuit plate welding tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721872814.XU CN207642458U (en) | 2017-12-28 | 2017-12-28 | A kind of metal substrate circuit plate welding tooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207642458U true CN207642458U (en) | 2018-07-24 |
Family
ID=62876725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721872814.XU Active CN207642458U (en) | 2017-12-28 | 2017-12-28 | A kind of metal substrate circuit plate welding tooling |
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| Country | Link |
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| CN (1) | CN207642458U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107971602A (en) * | 2017-12-28 | 2018-05-01 | 北京北广科技股份有限公司 | A kind of metal substrate circuit plate welding tooling and its application method |
| CN109570867A (en) * | 2018-12-10 | 2019-04-05 | 安徽华东光电技术研究所有限公司 | For improving the welding tooling and its welding method of large-area substrates welding penetration rate |
-
2017
- 2017-12-28 CN CN201721872814.XU patent/CN207642458U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107971602A (en) * | 2017-12-28 | 2018-05-01 | 北京北广科技股份有限公司 | A kind of metal substrate circuit plate welding tooling and its application method |
| CN107971602B (en) * | 2017-12-28 | 2023-09-12 | 北京北广科技股份有限公司 | Metal substrate circuit board welding tool and application method thereof |
| CN109570867A (en) * | 2018-12-10 | 2019-04-05 | 安徽华东光电技术研究所有限公司 | For improving the welding tooling and its welding method of large-area substrates welding penetration rate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200430 Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing, Daxing District Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100000 No. 26, Tianzhu Road, A District, Tianzhu Airport Industrial Zone, Beijing, Shunyi District Patentee before: Beijing BBEF Science & Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |