CN208985560U - A kind of display module and electronic equipment - Google Patents
A kind of display module and electronic equipment Download PDFInfo
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- CN208985560U CN208985560U CN201821797168.XU CN201821797168U CN208985560U CN 208985560 U CN208985560 U CN 208985560U CN 201821797168 U CN201821797168 U CN 201821797168U CN 208985560 U CN208985560 U CN 208985560U
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- driving chip
- radiating piece
- array substrate
- display module
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Abstract
This application provides a kind of display module and electronic equipments, the display module includes array substrate, driving chip, first radiating piece and the second radiating piece, array substrate includes control zone and the fill area adjacent with control zone, driving chip is set to control zone, first radiating piece is covered on driving chip, to receive at least partly heat of driving chip generation in a first direction, second radiating piece is set to side of the array substrate close to driving chip, and second projection of the radiating piece in array substrate be at least partially disposed in fill area driving chip be covered on by the first radiating piece, so that the second radiating piece of part receives at least partly heat of driving chip generation in a second direction, so that the even heat distribution that driving chip generates, prevent driving chip hot-spot.
Description
Technical field
This application involves the technical field of electronic equipment, it is specifically related to a kind of display module and electronic equipment.
Background technique
Driving chip can generate a large amount of heat as component part important in electronic equipment at work, these heats
Presence will lead to electronic equipment display screen temperature it is excessively high, the temperature for also resulting in driving chip is excessively high, so as to cause driving
Chip is damaged by high temperature or the speed of service declines.
In the prior art generally by the way that a graphite radiating part is arranged to prevent the temperature of driving chip in the top of driving chip
Height is spent, but the heat that the heat dissipation of this single direction will lead to driving chip generation is unevenly distributed, and then causes to drive
Chip hot-spot.
Utility model content
On the one hand the embodiment of the present application provides a kind of display module, the display module includes array substrate, driving core
Piece, the first radiating piece and the second radiating piece, the array substrate include control zone and the fill area adjacent with the control zone, institute
It states driving chip and is set to the control zone, first radiating piece is covered on the driving chip, and second radiating piece is set
The array substrate is placed in close to the side of the driving chip, and projection of second radiating piece in the array substrate
It is at least partially disposed in the fill area.
On the other hand the embodiment of the present application also provides a kind of electronic equipment, the electronic equipment includes display module and backlight
Mould group, the display module are stacked with the backlight module, wherein the display module includes array substrate, driving core
Piece, the first radiating piece and the second radiating piece, the array substrate include control zone and the fill area adjacent with the control zone, institute
It states driving chip and is set to the control zone, first radiating piece is covered on the driving chip, and second radiating piece is set
The array is placed in close to the side of the driving chip, and projection of second radiating piece in the array substrate is at least
Part is located in the fill area.
Backlight module provided by the embodiments of the present application is covered on driving chip by the first radiating piece, in a first direction
The upper at least partly heat for receiving driving chip and generating, the second radiating piece are set to side of the array substrate close to driving chip,
And second projection of the radiating piece in array substrate be at least partially disposed in fill area so that the second radiating piece of part is second
At least partly heat that driving chip generates is received on direction, so that the even heat distribution that driving chip generates, prevents
Driving chip hot-spot.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of electronic equipment embodiment provided by the present application；
Fig. 2 be in Fig. 1 II-II to schematic cross-section；
Fig. 3 be in Fig. 1 III-III to the schematic cross-section of an embodiment；
Fig. 4 be in Fig. 1 III-III to the schematic cross-section of another embodiment；
Fig. 5 be in Fig. 1 III-III to the schematic cross-section of another embodiment；
Specific embodiment
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement
Example is merely to illustrate the application, but is not defined to scope of the present application.Likewise, following embodiment is only the portion of the application
Point embodiment and not all embodiments, institute obtained by those of ordinary skill in the art without making creative efforts
There are other embodiments, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
It is the structural schematic diagram of 10 embodiment of electronic equipment provided by the present application, Fig. 2 also referring to Fig. 1 and Fig. 2, Fig. 1
Be in Fig. 1 II-II to schematic cross-section, wherein the electronic equipment 10 of the present embodiment include backlight module 20 and display module
30。
Backlight module 20 includes back frame 201, and optionally, which is metal back frame, such as iron frame.
It should be understood that backlight module 20 can be the normal work that electronic equipment 10 provides brightness to guarantee electronic equipment 10
Make, backlight module 20 further includes the structures such as backlight, light guide plate, and details are not described herein.
Jointly refering to Fig. 2 and Fig. 3, Fig. 3 be in Fig. 1 III-III to the schematic cross-section of an embodiment, wherein display mould
Group 30 includes array substrate 301, driving chip 302, the first radiating piece 303 and the second radiating piece 304.
Array substrate 301 can be made of underlay substrate and the thin film transistor (TFT) being set on underlay substrate, optionally, the lining
Substrate is glass substrate.
Wherein, array substrate 301 includes control zone 3011 and fill area 3012, and control zone 3011 is adjacent with fill area 3012
Setting.
Optionally, the quantity of fill area 3012 is two, and it is opposite that two fill areas 3012 are respectively arranged at control zone 3011
Two sides.
Driving chip 302 is set in array substrate 301 namely driving chip 302 is set to array substrate 301 far from back
The side of optical mode group 20.
Wherein, driving chip 302 is set on the control zone 3011 of array substrate 301.
First radiating piece 303 is covered on driving chip 302, in a first direction, namely as shown in Figure 2, in driving core
The top of piece 302 receives at least partly heat that driving chip 302 generates.
Optionally, the first radiating piece 303 includes heat radiator body portion 3031 and heat dissipation extension 3032, heat radiator body portion 3031
It is set to side of the driving chip 302 far from array substrate 301, and the projection in array substrate 301 is located at control zone 3011
It is interior, to receive at least partly heat that driving chip 302 generates in the top of driving chip 302 by heat radiator body portion 3031,
Heat dissipation extension 3032 and the bending of heat radiator body portion 3031 connect and extend to one of array substrate 301 far from driving chip 302
Side, in the present embodiment, heat dissipation extension 3032 and the bending of heat radiator body portion 3031 connect and extend to back frame 201 far from array
The side of substrate 301, so that at least partly heat transfer that heat radiator body portion 3031 is received in the generation of driving chip 302 is extremely carried on the back
Frame 201.
Refering to Fig. 4, Fig. 4 be in Fig. 1 schematic cross-section from III-III to another embodiment, in another embodiment,
One radiating piece 303 further includes supporting part 3033, and supporting part 3033 connect with heat radiator body portion 3031 and in array substrate 301
Projection is located in fill area 3012.
Optionally, the quantity of supporting part 3033 is two, projection difference of two supporting parts 3033 in array substrate 301
In two fill areas 3012.
Optionally, the first radiating piece 303 is graphite, the foam etc. for including but is not limited to.
Fig. 2 and Fig. 3 is further regarded to, the second radiating piece 304 is set to array substrate 301 close to the one of driving chip 302
Side, and the second radiating piece 304 is at least partially disposed in fill area 3012 in the projection in array substrate 301, so that part
Two radiating pieces 304 receive at least partly hot of the generation of driving chip 302 in the peripheral side of second direction namely driving chip 302
Amount, so that the even heat distribution that driving chip 302 generates, prevents 302 hot-spot of driving chip.
Optionally, the second radiating piece 304 is set to heat radiator body portion 3031 in control zone 3011 towards fill area 3012
Side namely the second radiating piece 304 on direction are set to the peripheral side of driving chip 302.
Optionally, the quantity of the second radiating piece 304 is two.
Optionally, graphite, thermally conductive gel etc. that the second radiating piece 304 includes but is not limited to.
Fig. 4 is further regarded to, in another embodiment, the supporting part 3033 of the second radiating piece 304 and the first radiating piece 303
It is stacked, in Fig. 4 by taking the second radiating piece 304 is set to the first side of the radiating piece 303 far from array substrate 301 as an example,
In other embodiments, the second radiating piece 304 also be can be set in the first radiating piece 303 close to the side of array basic 301.
Optionally, supporting part 3033 is additionally provided with the first filling member 305 far from the side of the second radiating piece 304, in this implementation
In example namely side of the supporting part 3033 far from array substrate 301 is equipped with the first filling member 305.
Optionally, which is luxuriant and rich with fragrance (Tuffy) glue of tower, which is coated on driving chip 302.
Refering to Fig. 5, Fig. 5 be in Fig. 1 schematic cross-section from III-III to another embodiment, in the another embodiment,
Two radiating pieces 304 are at least partially arranged between the heat radiator body portion 3031 and driving chip 302 of the first radiating piece 303.
Optionally, the second radiating piece 304 is coated on driving chip 302.
Wherein, the second radiating piece 304 is insulating radiation part, such as thermally conductive gel.
Optionally, the second radiating piece 304 is additionally provided with the second filling member 306 far from the side of array substrate 301.
Optionally, the second filling member 306 is silicone adhesive.
Term " first ", " second " in the application are used for description purposes only, and are not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one this feature.
Fig. 2 and Fig. 3 is further regarded to, the display module 30 in the present embodiment further includes cover board 307, cover board 307 and array
The setting of the interval of substrate 301 is to form a gap 3071, above-mentioned driving chip 302, at least partly the first radiating piece 303 and at least
The second radiating piece of part 304 is set in gap 3071, in the present embodiment, the heat radiator body portion 3031 of the first radiating piece 303
And second radiating piece 304 be set in gap 3071.
Wherein, thickness of second radiating piece 304 on the projecting direction of array substrate 301 is equal to array substrate 301 and lid
Spacing between plate 307, with make driving chip 302 generate even heat distribution while, filling array substrate 301 with
The structural integrity of display module 30 is improved in gap 3071 between cover board 307.
Fig. 4 is further regarded to, in another embodiment, the first filling member 305, supporting part 3033 and the second radiating piece
304 are equal to the spacing between array substrate 301 and cover board in the thickness on the projecting direction of array substrate 301, to dissipate second
While the even heat distribution that warmware 304 generates driving chip 302, fill between array substrate 301 and cover board 307
The structural integrity of display module 30 is improved in gap 3071.
Fig. 5 is further regarded to, in the another embodiment, the second filling member 306 and the second radiating piece 304 are in array substrate
Projecting direction on thickness be equal to spacing between cover board 307 and array substrate 301, to drive in the second radiating piece 304
While the even heat distribution that dynamic chip 302 generates, the gap 3071 between array substrate 301 and cover board 307 is filled, is improved
The structural integrity of display module 30.
Further regard to Fig. 2 and Fig. 3, the display module 30 in the present embodiment further includes shielding part 308, shielding part 308 to
Small part is set between heat radiator body portion 3031 and driving chip 302, to play the work of electrostatic screen to driving chip 302
With.
Optionally, shielding part 308 includes shielding body part 3081 and shielding extension 3082, and shielding body part 3081 is arranged
Between heat radiator body portion 3031 and driving chip 3032, shielding extension 3082 connects and prolongs with the shielding bending of body part 3081
Side of the array substrate 301 far from driving chip 302 is extended to, in the present embodiment, shielding extension 3082 and shielding body part
3081 bendings connect and extend to side of the back frame 201 far from array substrate 301.
Wherein, it at least partly is additionally provided with insulating layer 309 between shielding part 308 and driving chip 302, so that shielding part
Mutually insulated between 308 and driving chip 302, in the present embodiment, namely between shielding body part 3081 and driving chip 302
Equipped with insulating layer 309.
Optionally, which is insulating cement.
Fig. 5 is further regarded to, when the second radiating piece 304 is at least partially arranged at least partly shielding part 308 and driving core
It, can be in the same of the even heat distribution that the insulating radiation part generates driving chip between piece 302 and when being insulating radiation part
When so that mutually insulated between shielding part 308 and driving chip 302, without using above-mentioned insulating layer 309, save at
This.
Fig. 2 is further regarded to, the display module 30 in the present embodiment further includes the flexible circuit board of flexible circuit board 310
310 be electrically connected with driving chip 302 think driving chip 302 power.
Wherein, when the second radiating piece 304 it is as shown in Figure 5 when being coated on driving chip 302,304 part of the second radiating piece
It is set to the surface of flexible circuit board 310.
Optionally, the display module 30 in the present embodiment further includes down polaroid 311, and down polaroid 311 is set to array
Substrate 301 is close to the side of backlight module 20.
Optionally, the display module 30 in the present embodiment further includes color membrane substrates 312, color membrane substrates 312 and array substrate
301 are oppositely arranged, and are also filled with liquid crystal between the two.
Optionally, the display module 30 in the present embodiment further includes upper polaroid 313, and upper polaroid 313 is set to color film
Side of the substrate 312 far from array substrate 301.
It should be understood that above-mentioned color membrane substrates 312 and upper polaroid 313 are all set in gap 3071.
Optionally, bond 3131 is equipped between upper polaroid 313 and cover board 307, to be bonded upper polaroid 313 and cover board
307。
Optionally, bond 3131 is OCA ((Optically Clear Adhesive) glue.
Backlight module provided by the embodiments of the present application is covered on driving chip by the first radiating piece, in a first direction
The upper at least partly heat for receiving driving chip and generating, the second radiating piece are set to side of the array substrate close to driving chip,
And second projection of the radiating piece in array substrate be at least partially disposed in fill area so that the second radiating piece of part is second
At least partly heat that driving chip generates is received on direction, so that the even heat distribution that driving chip generates, prevents
Driving chip hot-spot.
The foregoing is merely the section Examples of the application, are not intended to limit the protection scope of the application, all utilizations
Equivalent device made by present specification and accompanying drawing content or equivalent process transformation are applied directly or indirectly in other correlations
Technical field, similarly include in the scope of patent protection of the application.
Claims (14)
1. a kind of display module, which is characterized in that the display module include array substrate, driving chip, the first radiating piece and
Second radiating piece, the array substrate include control zone and the fill area adjacent with the control zone, the driving chip setting
In the control zone, first radiating piece is covered on the driving chip, and second radiating piece is set to the array base
Plate is close to the side of the driving chip, and projection of second radiating piece in the array substrate is at least partially disposed at institute
It states in fill area.
2. display module according to claim 1, which is characterized in that the display module further includes cover board, the cover board
It is arranged with the array substrate interval to form a gap, the driving chip, at least partly described first radiating piece and at least
Part second radiating piece is set in the gap.
3. display module according to claim 2, which is characterized in that first radiating piece includes heat radiator body portion and dissipates
Hot extension, the heat radiator body portion are set to side of the driving chip far from the array substrate, and in the array
Projection on substrate is located in the control zone, and the heat dissipation extension and heat radiator body portion bending connect and extend to institute
State side of the array substrate far from the driving chip.
4. display module according to claim 3, which is characterized in that first radiating piece further includes supporting part, described
Supporting part connect with the heat radiator body portion and is located in the fill area in the projection in the array substrate, and described second dissipates
Warmware is stacked with the supporting part.
5. display module according to claim 4, which is characterized in that the supporting part far from second radiating piece one
Side is additionally provided with the first filling member, and first filling member, the supporting part and second radiating piece are in the array substrate
Thickness on projecting direction is equal to the spacing between the array substrate and the cover board.
6. display module according to claim 3, which is characterized in that second radiating piece is set to the heat radiator body
Portion in the control zone towards the side on the direction of the fill area, and the thickness on the projecting direction of the array substrate
Equal to the spacing between the array substrate and the cover board.
7. display module according to claim 3, which is characterized in that the display module further includes shielding part, the screen
Shield is at least partially arranged between the heat radiator body portion and the driving chip.
8. display module according to claim 7, which is characterized in that at least partly shielding part and the driving chip
Between be additionally provided with insulating layer.
9. display module according to claim 7, which is characterized in that second radiating piece is insulating radiation part, described
Insulating radiation part is at least partially arranged at described at least partly between shielding part and the driving chip.
10. display module according to claim 9, which is characterized in that the insulating radiation part is coated on the driving core
Piece.
11. display module according to claim 10, which is characterized in that the display module further includes flexible circuit board,
The flexible circuit board is electrically connected with the driving chip thinks the driving chip power supply, the setting of insulating radiation part part
In the surface of the flexible circuit board.
12. display module according to claim 10, which is characterized in that second radiating piece is far from the array substrate
Side be equipped with the second filling member, second filling member and second radiating piece are on the projecting direction of the array substrate
Thickness be equal to spacing between the cover board and the array substrate.
13. display module according to claim 7, which is characterized in that the shielding part includes shielding body part and shielding
Extension, the shielding body part are set between the heat radiator body portion and the driving chip, the shielding extension with
The shielding body part bending connects and extends to side of the array substrate far from the driving chip.
14. a kind of electronic equipment, which is characterized in that the electronic equipment includes display module and backlight module, the display mould
Group be stacked with the backlight module, wherein the display module include array substrate, driving chip, the first radiating piece and
Second radiating piece, the array substrate include control zone and the fill area adjacent with the control zone, the driving chip setting
In the control zone, first radiating piece is covered on the driving chip, and second radiating piece is set to the array and leans on
The side of the nearly driving chip, and projection of second radiating piece in the array substrate is at least partially disposed at described fill out
It fills in area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821797168.XU CN208985560U (en) | 2018-11-01 | 2018-11-01 | A kind of display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821797168.XU CN208985560U (en) | 2018-11-01 | 2018-11-01 | A kind of display module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208985560U true CN208985560U (en) | 2019-06-14 |
Family
ID=66790073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821797168.XU Active CN208985560U (en) | 2018-11-01 | 2018-11-01 | A kind of display module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208985560U (en) |
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2018
- 2018-11-01 CN CN201821797168.XU patent/CN208985560U/en active Active
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