CN209044233U - A kind of display module and electronic equipment - Google Patents
A kind of display module and electronic equipment Download PDFInfo
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- CN209044233U CN209044233U CN201821797167.5U CN201821797167U CN209044233U CN 209044233 U CN209044233 U CN 209044233U CN 201821797167 U CN201821797167 U CN 201821797167U CN 209044233 U CN209044233 U CN 209044233U
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- driving chip
- display module
- phase change
- heat conduction
- array substrate
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Abstract
This application provides a kind of display module and electronic equipments, the display module includes array substrate, driving chip and heat conduction with phase change part, driving chip is set in array substrate, heat conduction with phase change part is set to side of the driving chip far from array substrate, the at least partly heat for absorbing driving chip generation during phase transformation occurs in heat conduction with phase change part, so that the temperature of driving chip is maintained within a certain range, prevent the temperature of driving chip is excessively high from leading to problems such as the decline of the impaired or speed of service, display screen temperature excessively high.
Description
Technical field
This application involves the technical field of electronic equipment, it is specifically related to a kind of display module and electronic equipment.
Background technique
Driving chip can generate a large amount of heat as component part important in electronic equipment at work, these heats
Presence will lead to electronic equipment display screen temperature it is excessively high, the temperature for also resulting in driving chip is excessively high, so as to cause driving
Chip is damaged by high temperature or the speed of service declines.
Utility model content
On the one hand the embodiment of the present application provides a kind of display module, the display module includes array substrate, driving core
Piece and heat conduction with phase change part, the driving chip are set in the array substrate, and the heat conduction with phase change part is set to the driving
Side of the chip far from the array substrate, to absorb at least partly heat that the driving chip generates.
On the other hand the embodiment of the present application also provides a kind of electronic equipment, the electronic equipment includes display module and backlight
Mould group, the display module are stacked with the backlight module, wherein the display module includes array substrate, driving core
Piece and heat conduction with phase change part, the driving chip are set in the array substrate, and the heat conduction with phase change part is set to the driving
Side of the chip far from the array substrate, to absorb at least partly heat that the driving chip generates.
Display module provided by the embodiments of the present application is set to driving chip far from array substrate by heat conduction with phase change part
Side, at least partly heat for absorbing driving chip generation during phase transformation occurs in heat conduction with phase change part, to make
The temperature for obtaining driving chip is maintained within a certain range, and prevents the temperature of driving chip is excessively high from causing under the impaired or speed of service
Drop, the problems such as display screen temperature is excessively high.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of 10 embodiment of electronic equipment provided by the present application；
Fig. 2 be in Fig. 1 II-II to schematic cross-section；
Fig. 3 is the enlarged diagram of one embodiment of part A in Fig. 2；
Fig. 4 is the enlarged diagram of another embodiment of part A in Fig. 2；
Fig. 5 be in Fig. 1 V-V to schematic cross-section.
Specific embodiment
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement
Example is merely to illustrate the application, but is not defined to scope of the present application.Likewise, following embodiment is only the portion of the application
Point embodiment and not all embodiments, institute obtained by those of ordinary skill in the art without making creative efforts
There are other embodiments, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
It is the structural schematic diagram of 10 embodiment of electronic equipment provided by the present application, Fig. 2 also referring to Fig. 1 and Fig. 2, Fig. 1
Be in Fig. 1 II-II to schematic cross-section, wherein the electronic equipment 10 of the present embodiment include backlight module 20 and display module
30。
Backlight module 20 includes back frame 201, and optionally, which is metal back frame, such as iron frame.
It should be understood that backlight module 20 can be the normal work that electronic equipment 10 provides brightness to guarantee electronic equipment 10
Make, backlight module 20 further includes the structures such as backlight, light guide plate, and details are not described herein.
It is the enlarged diagram of one embodiment of part A in Fig. 2 also referring to Fig. 1, Fig. 2 and Fig. 3, Fig. 3, wherein display
Mould group 30 is stacked with backlight module 20, which includes array substrate 301, driving chip 302 and heat conduction with phase change
Part 303.
Array substrate 301 can be made of underlay substrate and the thin film transistor (TFT) being set on underlay substrate, optionally, the lining
Substrate is glass substrate.
Wherein, array substrate 301 includes control zone 3011 and fill area 3012, and control zone 3011 is adjacent with fill area 3012
Setting.
Optionally, the quantity of fill area 3012 is two, and it is opposite that two fill areas 3012 are respectively arranged at control zone 3011
Two sides.
Driving chip 302 is set in array substrate 301 namely driving chip 302 is set to array substrate 301 far from back
The side of optical mode group 20.
Wherein, driving chip 302 is set on the control zone 3011 of array substrate 301.
Heat conduction with phase change part 303 is set to side of the driving chip 302 far from array substrate 301, to absorb driving chip 302
At least partly heat generated, so that the temperature of driving chip 302 is maintained within a certain range, and then prevents driving chip
302 temperature is excessively high to lead to problems such as the decline of the impaired or speed of service, display screen temperature excessively high.
It should be understood that heat conduction with phase change part 303 is prepared by phase-change material, changed by phase-change material in phase
During can be absorbed driving chip 302 generation at least partly heat and by this at least partly heat store.
Optionally, the display module 30 in the present embodiment further includes shielding part 304, and shielding part 304 is covered on driving chip
303, to play the role of electrostatic screen to driving chip 303.
Optionally, shielding part 304 includes the first noumenon portion 3041 and the first extension 3042, and the first noumenon portion 3041 is arranged
In side of the driving chip 302 far from array substrate 301, the first extension 3042 bends connection with the first noumenon portion 3041 and prolongs
Side of the array substrate 301 far from driving chip 302 is extended to, in the present embodiment, the first extension 3042 and the first noumenon portion
3041 bendings connect and extend to side of the back frame 201 far from array substrate 301.
Optionally, shielding part 304 is metal screen, such as copper foil.
Further, above-mentioned heat conduction with phase change part 303 is set between shielding part 304 and driving chip 302, in this implementation
In example namely heat conduction with phase change part 303 is arranged between the first noumenon portion 3041 and driving chip 302 of shielding part 304, directly to inhale
At least partly heat that driving chip 302 generates is received, and shielding part 304 and driving chip 302 are made by heat conduction with phase change part 303
Mutually insulated.
It is the enlarged diagram of another embodiment of part A in Fig. 2 refering to Fig. 4, Fig. 4, in another embodiment, phase transformation is led
Warmware 303 is set to side of the shielding part 304 far from driving chip 302, and in the present embodiment namely heat conduction with phase change part 303 is set
The first noumenon portion 3041 of shielding part 304 is placed in far from the side of driving chip 302, so that driving chip 302 generates extremely
Minor heat is transferred to shielding part 304, then is absorbed by shielding part 304 by heat conduction with phase change part 303.
Optionally, when heat conduction with phase change part 303 can also be set to side of the shielding part 304 far from driving chip 302, screen
Insulating part 305 is additionally provided between shield 304 and driving chip 302, which makes shielding part 304 and driving chip 302
Mutually insulated.
Optionally, insulating part 305 is insulating cement.
Term " first ", " second " in the application are used for description purposes only, and are not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one this feature.
Fig. 2 is further regarded to, the display module 30 in the present embodiment further includes radiating piece 306, and radiating piece 306 is for receiving
At least partly heat that heat conduction with phase change part 303 absorbs, which is shed, so that heat conduction with phase change part 303
The sustainable at least partly heat for absorbing driving chip 302 and generating.
Fig. 3 and Fig. 4 is further regarded to, radiating piece 306 can be shown in Fig. 3, is at least partially arranged at shielding part 304 far from phase
Become the side of heat-conducting piece 303, to be attached at shielding part 304, to receive what heat conduction with phase change part 303 absorbed by shielding part 304
At least partly heat, or as shown in Figure 4, it is at least partially arranged at side of the heat conduction with phase change part 303 far from shielding part 304,
To be attached at heat conduction with phase change part 304, to directly receive at least partly heat of the absorption of heat conduction with phase change part 303.
Optionally, radiating piece 306 includes the second body part 3061 and the second extension 3062, the setting of the second body part 3061
In side or heat conduction with phase change part 303 side far from shielding part 304 of the shielding part 304 far from heat conduction with phase change part 303, in this implementation
In example namely the second body part 3061 is set to the first noumenon portion 3041 of shielding part 304 far from the side of heat conduction with phase change part 303
Or side of the heat conduction with phase change part 303 far from the first noumenon portion 3041, to receive heat conduction with phase change part 303 by the second body part 3061
At least partly heat absorbed, the second extension 3062 and the bending of the second body part 3061 connect and extend to array substrate 304
Side far from driving chip 302, in the present embodiment, the second extension 3062 bend connection with the second body part 3061 and prolong
Side of the back frame 201 far from array substrate 301 is extended to, by the received at least partly heat transfer of the second body part 3061 to back
Frame 201.
Optionally, radiating piece 306 is graphite, foam and the heat conductive silica gel etc. for including but is not limited to.
Jointly refering to Fig. 2 and Fig. 5, Fig. 5 be in Fig. 1 V-V to schematic cross-section, the display module 30 in the present embodiment is also
Including cover board 307, cover board 307 and the interval of array substrate 301 are arranged to form a gap 3071, and driving chip 302 and phase transformation are led
Warmware 303 is set in gap 3071, in the present embodiment, the of the first noumenon portion 3041 of shielding part 304 and radiating piece 306
Two body parts 3062 are all set in gap 3071.
Wherein, it is additionally provided with filling member 308 between cover board 307 and array substrate 301 to fill the gap 3071, improves display
The structural integrity of mould group 30.
Optionally, cover board 307 is glass cover-plate.
Optionally, filling member 308 includes the first sub- filling member 3081 and the second sub- filling member 3082, the first sub- filling member
3081 are coated on the periphery of driving chip 302 (in Fig. 5 in the shadow region of the first sub- filling member 3081 and the second sub- filling member 3082
Dotted portion be driving chip 302) namely the first sub- filling member 3081 be set in array substrate 301, second son filling
Part 3082 is filled between the first sub- filling member 3081 and cover board 307.
Optionally, the first sub- filling member 3081 is luxuriant and rich with fragrance (Tuffy) glue of tower, while filling gap 3081, to driving core
Piece 302 plays protective action, and the second sub- filling member 3082 is silicone adhesive, while filling gap 3081, is bonded cover board 307, into
The structural integrity of one step raising display module 30.
Optionally, the second filling member 3082 is located in fill area 3012 in the projection in array substrate 301, to prevent
Two filling members, 3082 gland driving chip 302 and cause driving chip 302 impaired.
Optionally, the quantity of the second filling member 3082 is two, and two the second filling members 3082 are in array substrate 301
Projection is located in two fill areas 3012.
Optionally, the display module 30 in the present embodiment further includes flexible circuit board 309, flexible circuit board 309 and driving
The electrical connection of chip 302 thinks that driving chip 302 is powered.
Optionally, one end of flexible circuit board 309 is electrically connected with driving chip 302, and it is separate that the other end is bent to back frame 201
The power supply of the backlight of backlight module 20 is in the side of array substrate 301.
Optionally, flexible circuit board 309 is equipped with gasket 3091, the first noumenon portion of shielding part 304 in the present embodiment
3041 and the second body part 3061 of radiating piece 306 be carried on gasket 3091, to prevent the second body part of shielding part 304
3042 and radiating piece 306 the bending of the second body part 3062 when puncture etc. and to damage.
Optionally, gasket 3091 is PET gasket.
Optionally, the display module 30 in the present embodiment further includes down polaroid 310, and down polaroid 310 is set to array
Substrate 301 is close to the side of backlight module 20.
Optionally, the display module 30 in the present embodiment further includes color membrane substrates 311, color membrane substrates 311 and array substrate
301 are oppositely arranged, and are also filled with liquid crystal between the two.
Optionally, the display module 30 in the present embodiment further includes upper polaroid 312, and upper polaroid 312 is set to color film
Side of the substrate 311 far from array substrate 301.
It should be understood that above-mentioned color membrane substrates 311 and upper polaroid 312 are all set in gap 3071.
Optionally, bond 3121 is equipped between upper polaroid 312 and cover board 307, to be bonded upper polaroid 312 and cover board
307。
Optionally, bond 3121 is OCA ((Optically Clear Adhesive) glue.
Display module provided by the embodiments of the present application is set to driving chip far from array substrate by heat conduction with phase change part
Side, at least partly heat for absorbing driving chip generation during phase transformation occurs in heat conduction with phase change part, to make
The temperature for obtaining driving chip is maintained within a certain range, and prevents the temperature of driving chip is excessively high from causing under the impaired or speed of service
Drop, the temperature such as display screen temperature is excessively high.
The foregoing is merely the section Examples of the application, are not intended to limit the protection scope of the application, all utilizations
Equivalent device made by present specification and accompanying drawing content or equivalent process transformation are applied directly or indirectly in other correlations
Technical field, similarly include in the scope of patent protection of the application.
Claims (15)
1. a kind of display module, which is characterized in that the display module includes array substrate, driving chip and heat conduction with phase change part,
The driving chip is set in the array substrate, and the heat conduction with phase change part is set to the driving chip far from the array
The side of substrate, to absorb at least partly heat that the driving chip generates.
2. display module according to claim 1, which is characterized in that the display module further includes shielding part, the screen
Shield is covered on the driving chip, and the heat conduction with phase change part is set between the shielding part and the driving chip or is arranged
In side of the shielding part far from the driving chip.
3. display module according to claim 2, which is characterized in that it is remote that the heat conduction with phase change part is set to the shielding part
Side from the driving chip is additionally provided with insulating part between the shielding part and the driving chip.
4. display module according to claim 2, which is characterized in that the display module further includes radiating piece, described to dissipate
Warmware is at least partially arranged at side or the heat conduction with phase change part of the shielding part far from the heat conduction with phase change part far from the shielding
The side of part.
5. display module according to claim 1, which is characterized in that the display module further includes cover board, the cover board
It is arranged with the array substrate interval to form a gap, the driving chip and the heat conduction with phase change part are set to the gap
It is interior, filling member is additionally provided between the cover board and the array substrate to fill the gap.
6. display module according to claim 5, which is characterized in that the filling member includes the first sub- filling member and second
Sub- filling member, the first sub- filling member are coated on the periphery of the driving chip, and the second sub- filling member is filled in described
Between first sub- filling member and the cover board.
7. display module according to claim 6, which is characterized in that the array substrate includes the control zone being disposed adjacent
And fill area, the driving chip are set to the control zone, projection of the second sub- filling member in the array substrate
In the fill area.
8. display module according to claim 2, which is characterized in that the shielding part includes that the first noumenon portion and first prolong
Extending portion, the first noumenon portion are set to side of the driving chip far from the array substrate, first extension with
The first noumenon portion bending connects and extends to side of the array substrate far from the driving chip.
9. display module according to claim 4, which is characterized in that the radiating piece includes that the second body part and second prolong
Extending portion, it is remote that second body part is set to side or the heat conduction with phase change part of the shielding part far from the heat conduction with phase change part
Side from the shielding part, second extension and second body part bending connect and extend to the array substrate
Side far from the driving chip.
10. display module according to claim 1, which is characterized in that the display module further includes flexible circuit board, institute
It states flexible circuit board and is electrically connected with the driving chip and think the driving chip power supply.
11. a kind of electronic equipment, which is characterized in that the electronic equipment includes display module and backlight module, the display mould
Group is stacked with the backlight module, wherein and the display module includes array substrate, driving chip and heat conduction with phase change part,
The driving chip is set in the array substrate, and the heat conduction with phase change part is set to the driving chip far from the array
The side of substrate, to absorb at least partly heat that the driving chip generates.
12. electronic equipment according to claim 11, which is characterized in that the display module further includes shielding part, described
Shielding part is covered on the driving chip, and the heat conduction with phase change part is set between the shielding part and the driving chip or sets
It is placed in side of the shielding part far from the driving chip.
13. electronic equipment according to claim 12, which is characterized in that the backlight module includes back frame, the shielding
Part includes the first noumenon portion and the first extension, and the first noumenon portion is set to the driving chip far from the array substrate
Side, first extension and the first noumenon portion bending connection and extend to the back frame far from the array substrate
Side.
14. electronic equipment according to claim 13, which is characterized in that the display module further includes radiating piece, described
Radiating piece is at least partially arranged at side or the heat conduction with phase change part of the shielding part far from the heat conduction with phase change part far from the screen
The side of shield.
15. electronic equipment according to claim 14, which is characterized in that the radiating piece includes the second body part and second
Extension, second body part are set to side or the heat conduction with phase change part of the shielding part far from the heat conduction with phase change part
Side far from the shielding part, the bending of second extension and second body part connects and to extend to the back frame remote
Side from the array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821797167.5U CN209044233U (en) | 2018-11-01 | 2018-11-01 | A kind of display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821797167.5U CN209044233U (en) | 2018-11-01 | 2018-11-01 | A kind of display module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN209044233U true CN209044233U (en) | 2019-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821797167.5U Active CN209044233U (en) | 2018-11-01 | 2018-11-01 | A kind of display module and electronic equipment |
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| CN (1) | CN209044233U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113903871A (en) * | 2021-10-09 | 2022-01-07 | 武汉华星光电半导体显示技术有限公司 | Display device and display terminal |
-
2018
- 2018-11-01 CN CN201821797167.5U patent/CN209044233U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113903871A (en) * | 2021-10-09 | 2022-01-07 | 武汉华星光电半导体显示技术有限公司 | Display device and display terminal |
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