CN208971840U - A kind of miniature high density interconnection wiring board - Google Patents
A kind of miniature high density interconnection wiring board Download PDFInfo
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- CN208971840U CN208971840U CN201821368842.2U CN201821368842U CN208971840U CN 208971840 U CN208971840 U CN 208971840U CN 201821368842 U CN201821368842 U CN 201821368842U CN 208971840 U CN208971840 U CN 208971840U
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- copper foil
- layer
- brownification
- main body
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- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A kind of miniature high density interconnection wiring board involved by the utility model comprising the various electronic components of plural number above PCB substrate are respectively welded in PCB substrate.Because PCB substrate includes base main body, the via hole being respectively arranged above base main body, buried via hole and blind hole；The base main body includes core layer, is respectively arranged at the PP layer of core layer upper and lower surface, is respectively arranged at the copper foil layer of PP layers of outer surface, is set to the PP layers of brownification layer between copper foil layer.The brownification layer is to utilize chemical treatment method; corrode and destroy copper foil surface; make to become rough surface by smooth surface; form layer protecting film; the protective film not only increases the PP layers of bonding force between copper foil layer; and can make the pcb board produced gas and moisture in Lead Free Reflow Soldering termination process that the external world be discharged in time, avoid PP layers of the phenomenon that generating a large amount of bubbles between copper foil layer and causing plate bursting generation.
Description
[technical field]
The utility model relates to a kind of miniature high density interconnection wiring boards in circuit board technology field.
[background technique]
Modern electronic equipment industry development is rapid, different with semiconductor transistor manufacturing technology along with silicon integrated circuit plate
It breaks through, electronic chip increasingly tends to densification, densification above printed circuit board, and high power direction is developed.Printed circuit board is
The substrate before electronic component is assembled, which is to be formed by electronic circuit by circuit board, by various electricity
Sub- component links together, to achieve the purpose that relay transmission.The substrate be as provide electronic component and
Main support body when the installation of electronics member device and grafting, is indispensable part in all electronic products.However, existing tradition is more
Laminate is by single force fit plate as semi-finished product, by drilling, the techniques such as plated hole and circuit etching and Lead Free Reflow Soldering connect it
Whole interconnection is formed afterwards.In Lead Free Reflow Soldering termination process, as the temperature being heated constantly increases, produced inside the circuit board
The more, most of bubble is intensively gathered in PP layers between copper foil layer to anger bubble more product, if the huge expansion of bubble formation of aggregation
Power, it is easy to cause to generate the generation of plate bursting phenomenon between copper foil layer and PP layers.
[utility model content]
In view of this, the technical problem to be solved by the utility model is to provide one kind in Lead Free Reflow Soldering termination process because
The miniature high density interconnection wiring board that a large amount of bubble coalescences cause plate bursting phenomenon to occur at PP layers between copper foil layer.
Above-mentioned technical problem is solved thus, and the technical solution in the utility model uses a kind of miniature high density interconnection line
Road plate comprising the various electronic components of plural number above PCB substrate are respectively welded in PCB substrate；PCB substrate includes substrate master
Body, the via hole being respectively arranged above base main body, buried via hole and blind hole；The base main body includes core layer, is set respectively
It is placed in the PP layer of core layer upper and lower surface, is respectively arranged at the copper foil layer of PP layers of outer surface, is set to PP layers between copper foil layer
Brownification layer.
It further limits, the brownification layer includes copper foil main body, the integration being embedded in inside copper foil body surfaces
Molding brownification substance, the brownification substance are that copper foil surface is made to form cuprous oxide russet by chemical treatment method
Substance.
It further limits, the brownification layer includes copper foil main body, and melting is formed in the brownification object of copper foil body surfaces
Matter, the brownification substance are the velutinous films of black that copper foil body surfaces are formed after handling by chemical solution, this is thin
Film is made of oxidation copper material.
Further limit, the brownification layer be by being formed in the uneven of copper foil body surfaces, it is a thin layer of with
Copper foil body surfaces pass through the organic metal film of chemical bonds.
The advantageous effects of the utility model: it because PCB substrate includes base main body, is respectively arranged above base main body
Via hole, buried via hole and blind hole；The base main body includes core layer, is respectively arranged at the PP layer of core layer upper and lower surface,
It is respectively arranged at the copper foil layer of PP layers of outer surface, is set to the PP layers of brownification layer between copper foil layer.The brownification layer is to utilize change
Processing method is learned, corrodes and destroys copper foil surface, make to become rough surface by smooth surface, form layer protecting film, the guarantor
Cuticula not only increases the PP layers of bonding force between copper foil layer, and the pcb board can be made in Lead Free Reflow Soldering termination process
In produced gas and moisture the external world is discharged in time, avoid PP layers and generate a large amount of bubbles between copper foil layer and cause plate bursting
Phenomenon occurs.
With reference to the accompanying drawings and examples, the technical solution of the utility model is described in further detail.
[Detailed description of the invention]
Fig. 1 is the side schematic view of miniature high density interconnection wiring board in the utility model.
[specific embodiment]
In order to be clearer and more clear technical problem to be solved in the utility model, technical solution and beneficial effect, with
Under in conjunction with the accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
Example is applied only to explain the utility model, is not used to limit the utility model.
It please refers to shown in Fig. 1, illustrates a kind of miniature high density interconnection wiring board below with reference to embodiment comprising PCB base
The various electronic components 1 of plural number above PCB substrate are respectively welded in plate.
PCB substrate includes base main body, the via hole being respectively arranged above base main body, buried via hole and blind hole.It is described
Base main body includes core layer 2, is respectively arranged at the PP layer of 2 upper and lower surface of core layer, is respectively arranged at the copper of PP layers of outer surface
Layers of foil is set to the PP layers of brownification layer between copper foil layer.
The brownification layer 3 includes the brownification object that copper foil main body is embedded in the integrated molding inside copper foil body surfaces
Matter, the brownification substance are the substances for making copper foil surface form cuprous oxide russet by chemical treatment method.The palm fibre
Changing layer 3 includes copper foil main body, and melting is formed in the brownification substance of copper foil body surfaces, which is to pass through chemical solution
The velutinous film of black of copper foil body surfaces is formed after liquid processing, which be made of oxidation copper material.It is described
Brownification layer 3 be by being formed in the uneven of copper foil body surfaces, it is a thin layer of to pass through chemistry with copper foil body surfaces
It is bonded the organic metal film closed.
The via hole, buried via hole and blind hole are all set to inside base main body, and the electronic component is welded on substrate
Body upper.The upper surface that the PP is placed on core layer is upper PP layer 4, and the lower surface that the PP is placed on core layer is
Lower PP layer 5, it is upper copper foil layer 6 that the copper foil, which is placed on 4 outer surface of PP layer, and the copper foil is placed on lower 5 outer surface of PP layer and is
Lower copper foil layer 7.
In Lead Free Reflow Soldering termination process, occur to divide between second of PP layer and sublevel copper foil layer pressed of the wiring board
From phenomenon, as plate bursting.As the temperature in Lead Free Reflow Soldering termination process constantly continues to increase, it is gathered near buried via hole mouth
Gas more product the more, very big turgor pressure is formed inside pcb board so that PP layer between copper foil layer generation one separate it is swollen
Expansive force is then deposited between copper foil layer at PP layers in the form of bubbles at this time if expansive force is less than the PP layers of binding force between copper foil layer
?.If expansive force is greater than the PP layers of binding force between copper foil layer, there is a phenomenon where plate burstings.
In the present embodiment, one layer of brownification layer 3 is formed on the surface of copper foil layer, which is exactly to pass through chemical mode
Or physics mode, layer protecting film is formed in copper foil layer surface, which is to form one after corroding original smooth surface
Surely the surface with roughness is seen, to realize bonding force between copper foil layer and PP layers.The protective film is formed at copper foil
Uneven, a thin layer of film for passing through chemical bonds with copper foil body surfaces of body surfaces.The protective film is not only
The PP layers of bonding force between copper foil layer is increased, and the pcb board can be made produced in Lead Free Reflow Soldering termination process
The external world is discharged in gas and moisture in time, avoid PP layers the phenomenon that generating a large amount of bubbles between copper foil layer and causing plate bursting hair
It is raw.
Above by reference to the preferred embodiment of Detailed description of the invention the utility model, not thereby limit to the right of the utility model
Range.Those skilled in the art do not depart from made any modification, equivalent replacement in the scope of the utility model and essence and change
Into should all be within the interest field of the utility model.
Claims (4)
1. a kind of miniature high density interconnection wiring board comprising PCB substrate, the plural number being respectively welded above PCB substrate are various
Electronic component；It is characterized by: PCB substrate includes base main body, and the via hole being respectively arranged above base main body, buried via hole,
And blind hole；The base main body includes core layer, is respectively arranged at the PP layer of core layer upper and lower surface, is respectively arranged at PP layers
The copper foil layer of outer surface is set to the PP layers of brownification layer between copper foil layer.
2. a kind of miniature high density interconnection wiring board according to claim 1, it is characterised in that: the brownification layer includes copper foil
Piece main body is embedded in the brownification substance of the integrated molding inside copper foil body surfaces, which is by chemistry
Reason method makes copper foil surface form the substance of cuprous oxide russet.
3. a kind of miniature high density interconnection wiring board according to claim 1, it is characterised in that: the brownification layer includes copper foil
Piece main body, melting are formed in the brownification substance of copper foil body surfaces, which formed after being handled by chemical solution
The velutinous film of the black of copper foil body surfaces, the film are made of oxidation copper material.
4. a kind of miniature high density interconnection wiring board according to claim 1, it is characterised in that: the brownification layer is by being formed
In the uneven of copper foil body surfaces, a thin layer of organic metal for passing through chemical bonds with copper foil body surfaces
Film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821368842.2U CN208971840U (en) | 2018-08-24 | 2018-08-24 | A kind of miniature high density interconnection wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821368842.2U CN208971840U (en) | 2018-08-24 | 2018-08-24 | A kind of miniature high density interconnection wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208971840U true CN208971840U (en) | 2019-06-11 |
Family
ID=66752595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821368842.2U Active CN208971840U (en) | 2018-08-24 | 2018-08-24 | A kind of miniature high density interconnection wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208971840U (en) |
-
2018
- 2018-08-24 CN CN201821368842.2U patent/CN208971840U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongxinhua Electronics Group Co., Ltd. Address before: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhongxinhua Electronics Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211025 Address after: 223000 Xingsheng Road North, Wangwang 2nd Road East, 235 provincial road south and Wangwang 5th Road West, Lianshui County, Huai'an City, Jiangsu Province Patentee after: Jiangsu Zhongxin Hua Electronic Technology Co.,Ltd. Address before: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhongxinhua Electronics Group Co.,Ltd. |