CN208970557U - One kind is added lustre to LED light emission device - Google Patents
One kind is added lustre to LED light emission device Download PDFInfo
- Publication number
- CN208970557U CN208970557U CN201821569385.3U CN201821569385U CN208970557U CN 208970557 U CN208970557 U CN 208970557U CN 201821569385 U CN201821569385 U CN 201821569385U CN 208970557 U CN208970557 U CN 208970557U
- Authority
- CN
- China
- Prior art keywords
- zener
- glue
- chip
- silver coating
- gold thread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
One kind is added lustre to LED light emission device, and the utility model relates to LED encapsulation technology fields, it includes bracket bowl, chip, Zener, bonding gold thread, high reflectance glue and fluorescent glue;Bottom is equipped with silver coating in bracket bowl;Middle part is equipped with chip on silver coating;The side of chip is equipped with Zener;Zener and chip form reverse parallel connection circuit;Zener is fixed on silver coating;Bonding gold thread is respectively connected on the anode and cathode and Zener of chip;The other end of bonding gold thread is fixed on silver coating;Zener outer sheath is equipped with high reflection glue;The bonding gold thread being connected in Zener is inserted in high reflection glue;Fluorescent glue is equipped on the outside of high reflection glue, fluorescent glue, which is filled out, to be located in bracket bowl;It can be improved the reflectivity of LED silver coating, increase LED lamp bead brightness.
Description
Technical field
The utility model relates to LED encapsulation technology fields, and in particular to one kind is added lustre to LED light emission device.
Background technique
LED component due to having the characteristics that luminous efficiency height, little power consumption, pollution-free, be just widely used in television backlight,
The fields such as graphic display screen, decorative lighting.With the continuous improvement of luminous efficiency, the originals such as chip, encapsulating material, bracket bowl
Expect the reduction of cost, LED component has begun into the room lightings such as commercial lighting, lighting of home field.
It is well known that LED lamp bead is electrostatic sensitivity device, in the prior art, LED in order to prevent LED lamp bead by static shock
It wears, meeting one Zener of reverse parallel connection in LED lamp bead, although largely protecting LED lamp bead, LED bowl
Silver coating fixes a Zener, substantially reduces the reflectivity of LED silver coating, lowers LED lamp bead brightness;Urgently improve.
Summary of the invention
The purpose of this utility model is that in view of the drawbacks of the prior art and insufficient, provide that a kind of structure is simple, and design is closed
Reason, one kind easy to use are added lustre to LED light emission device, can be improved the reflectivity of LED silver coating, increase LED lamp bead brightness.
In order to achieve the above purposes, the technical solution adopted by the utility model is: it include bracket bowl, chip, Zener,
It is bonded gold thread, high reflectance glue and fluorescent glue;Bottom is equipped with silver coating in bracket bowl;Middle part is equipped with chip on silver coating;
The side of chip is equipped with Zener;Zener and chip form reverse parallel connection circuit;Zener is fixed on silver coating;Chip
Bonding gold thread is respectively connected in anode and cathode and Zener;The other end of bonding gold thread is fixed on silver coating;Zener
Outer sheath is equipped with high reflection glue;The bonding gold thread being connected in Zener is inserted in high reflection glue;It is equipped on the outside of high reflection glue
Fluorescent glue, fluorescent glue, which is filled out, to be located in bracket bowl.
Further, it is embedded in the bracket bowl and is fixed with normal society, normal society is set between chip and Zener.
Further, the high reflectance glue is hemispherical configuration.
After adopting the above structure, the utility model have the beneficial effect that one kind described in the utility model add lustre to LED shine dress
It sets, can be improved the reflectivity of LED silver coating, increase LED lamp bead brightness, practicability is stronger, and the utility model has structure letter
The advantages that list, setting is reasonable, low manufacture cost.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the utility model overlooking structure diagram.
Fig. 2 is bracket bowl and chip, Zener in the utility model, be bonded gold thread, high reflectance glue connection structure is shown
It is intended to.
Fig. 3 is A-A profile structure diagram in Fig. 1.
Description of symbols:
Bracket bowl 1, silver coating 1-1, chip 2, Zener 3, bonding gold thread 4, high reflectance glue 5, fluorescent glue 6, normal society
7。
Specific embodiment
The utility model will be further described below with reference to the accompanying drawings.
Referring to as shown in Figure 1 to Figure 3, present embodiment the technical solution adopted is that: it includes bracket bowl 1, core
Piece 2, Zener 3, bonding gold thread 4, high reflectance glue 5 and fluorescent glue 6;Silver coating 1-1 is coated in bracket bowl 1 on bottom;
Middle part is fixed with chip 2 by crystal-bonding adhesive on silver coating 1-1;Chip 2 is blue chip;The side of chip 2 is equipped with Zener 3;
Zener 3 and chip 2 form reverse parallel connection circuit;Zener 3 is fixed on silver coating 1-1 by conductive silver glue;Chip 2 is just
Bonding gold thread 4 is welded and connected on pole and cathode and Zener 3;The other end of bonding gold thread 4 is weldingly fixed on silver coating
On 1-1;3 outer sheath of Zener is equipped with high reflectance glue 5;High reflectance glue 5 is hemispherical configuration;High reflectance glue 5 is through excessively high
Temperature baking, is solidified into reflecting layer;The bonding gold thread 4 being connected in Zener 3 is inserted in reflectivity glue 5;Outside high reflectance glue 5
Side is equipped with fluorescent glue 6, and fluorescent glue 6 is filled out in the bowl for being located at bracket bowl 1;The glue amount of fluorescent glue 6 is no more than the cup of bracket bowl 1
Mouthful, by high-temperature baking, solidify fluorescent glue 6;It is embedded in the bracket bowl 1 and is fixed with normal society 7, normal society 7 is set to chip 2
Between Zener 3;2 surface of chip is equipped with fluorescent glue 6, and fluorescent glue 6 excites compound generation white light by chip 2;Zener 3 is solid
It is scheduled on silver coating 1-1, reduces the reflectivity of silver coating 1-1, high reflectance glue 5 increases reflectivity, to make luminance raising.
The working principle of this specific embodiment:: 2 surface of chip is equipped with fluorescent glue 6, and fluorescent glue 6 passes through chip 2
Excite compound generation white light;Zener 3 is fixed on silver coating 1-1, reduces the reflectivity of silver coating 1-1, high reflectance glue 5
Increase reflectivity, to make luminance raising, encapsulation is completed, and colour consistency is good, and colour temperature is concentrated, logical with LED light source in the market
It is consistent with property.
After adopting the above structure, present embodiment the utility model has the advantages that one kind described in present embodiment is added lustre to
LED light emission device can be improved the reflectivity of LED silver coating, increase LED lamp bead brightness, and practicability is stronger, the utility model tool
There is the advantages that structure is simple, and setting is reasonable, low manufacture cost.
The above is merely intended for describing the technical solutions of the present application, but not for limiting the present application, those of ordinary skill in the art couple
The other modifications or equivalent replacement that the technical solution of the utility model is made, without departing from technical solutions of the utility model
Spirit and scope should all cover in the scope of the claims of the utility model.
Claims (3)
- The LED light emission device 1. one kind is added lustre to, it is characterised in that: it includes bracket bowl (1), chip (2), Zener (3), bonding Gold thread (4), high reflectance glue (5) and fluorescent glue (6);Bracket bowl (1) interior bottom is equipped with silver coating (1-1);Silver coating (1- 1) middle part is equipped with chip (2) on;The side of chip (2) is equipped with Zener (3);Zener (3) and chip (2) form reverse parallel connection Circuit;Zener (3) is fixed on silver coating (1-1);It is respectively connected on the anode and cathode and Zener (3) of chip (2) It is bonded gold thread (4);The other end of bonding gold thread (4) is fixed on silver coating (1-1);Zener (3) outer sheath is equipped with high reflection Rate glue (5);The bonding gold thread (4) being connected on Zener (3) is inserted in high reflectance glue (5);On the outside of high reflectance glue (5) Equipped with fluorescent glue (6), fluorescent glue (6), which is filled out, to be located in bracket bowl (1).
- The LED light emission device 2. one kind according to claim 1 is added lustre to, it is characterised in that: the bracket bowl (1) is embedded If being fixed with normal society (7), normal society (7) is set between chip (2) and Zener (3).
- The LED light emission device 3. one kind according to claim 1 is added lustre to, it is characterised in that: the high reflectance glue (5) is Hemispherical configuration.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821569385.3U CN208970557U (en) | 2018-09-26 | 2018-09-26 | One kind is added lustre to LED light emission device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821569385.3U CN208970557U (en) | 2018-09-26 | 2018-09-26 | One kind is added lustre to LED light emission device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208970557U true CN208970557U (en) | 2019-06-11 |
Family
ID=66756485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821569385.3U Active CN208970557U (en) | 2018-09-26 | 2018-09-26 | One kind is added lustre to LED light emission device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208970557U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111509106A (en) * | 2020-04-17 | 2020-08-07 | 广东晶科电子股份有限公司 | Light-emitting device and manufacturing method thereof |
-
2018
- 2018-09-26 CN CN201821569385.3U patent/CN208970557U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111509106A (en) * | 2020-04-17 | 2020-08-07 | 广东晶科电子股份有限公司 | Light-emitting device and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201014273Y (en) | LED sun lamp integrating package | |
CN107086263B (en) | Display device and its four sides are light-emitting LED | |
CN208271890U (en) | A kind of flexible LED filament lamp bar | |
CN208970557U (en) | One kind is added lustre to LED light emission device | |
CN202513204U (en) | Packaging structure with white light surface attached with light emitting diode | |
CN211238290U (en) | CSP packaging structure and lamp strip based on CSP packaging structure | |
CN206370442U (en) | Display screen, light fixture and its LED encapsulation structure | |
CN208521956U (en) | A kind of moisture-proof LED lamp bead | |
CN209169186U (en) | A kind of device promoting LED light emission luminance | |
CN109285935A (en) | A kind of surface luminescent LED lamp pearl and lamp string | |
JP3117306U (en) | Light emitting diode | |
CN209418539U (en) | A kind of high-efficient large power LED light source encapsulating structure | |
CN209150154U (en) | A kind of encapsulating structure of COB light source | |
CN208862020U (en) | A kind of white chip adds the LED encapsulation structure of Zener chip | |
CN207068923U (en) | A kind of novel full color LED light source encapsulating structure and application | |
CN208753358U (en) | A kind of novel adopting surface mounted LED illuminating source packaging structure | |
CN108649110B (en) | LED packaging structure and preparation method thereof | |
CN201655851U (en) | Spatially uniform luminescent LED component | |
CN201053639Y (en) | LED full-color surface-mounted device | |
CN209418536U (en) | A kind of novel patch formula LED light source encapsulating structure | |
CN204905283U (en) | Light emitting diode | |
CN215496771U (en) | Lighting device and white light LED lamp bead | |
CN209418537U (en) | A kind of high illumination LED light source encapsulating structure | |
CN216447935U (en) | Novel LED lamp pearl support and LED lamp pearl | |
CN212085039U (en) | Ultra-high display full spectrum LED package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |