CN208967760U - A kind of high-power LED heat radiating device - Google Patents
A kind of high-power LED heat radiating device Download PDFInfo
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- CN208967760U CN208967760U CN201821814107.XU CN201821814107U CN208967760U CN 208967760 U CN208967760 U CN 208967760U CN 201821814107 U CN201821814107 U CN 201821814107U CN 208967760 U CN208967760 U CN 208967760U
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- Prior art keywords
- power led
- fin
- inner cavity
- heat radiating
- fins set
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- 239000007788 liquid Substances 0.000 claims abstract description 23
- 239000003507 refrigerant Substances 0.000 claims abstract description 20
- 238000003860 storage Methods 0.000 claims abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000013019 agitation Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000002309 gasification Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000003570 air Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000243 photosynthetic effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 206010020852 Hypertonia Diseases 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Abstract
The utility model discloses a kind of high-power LED heat radiating devices, including bottom plate and radiating part, the radiating part is fixed on the upper surface of the bottom plate, it further include having liquid refrigerant, the base plate interior is equipped with inner cavity, cavity is equipped in the middle part of the radiating part, the inner cavity and the cavity are formed through a confined space, the liquid refrigerant storage and the intracavity bottom.A kind of high-power LED heat radiating device of the utility model passes through the structure in bottom plate construction inner cavity, put aside liquid refrigerant endothermic gasification using built-in microflute group drives heat transmission into radiating part at gaseous working medium, improve the efficiency of heat transfer and heated conveying, whole uniform temperature is set to get a promotion, the fin of radiating part interlocks, equal difference is distributed, the air for exchanging fin with air is left to staggeredly, increase the agitation of air-flow, to strengthen the heat exchanger efficiency of radiating part, the convection transfer rate for enhancing fin and air, realizes the rapid cooling of great power LED.
Description
Technical field
The utility model belongs to field, specifically, being related to a kind of high-power LED heat radiating device.
Background technique
Light emitting diode (LED) is a kind of solid-state semiconductor device that can convert electrical energy into visible light, LED relative to
The common lamp source such as incandescent lamp has energy conservation and environmental protection, long service life, fast, the potential high photosynthetic efficiency of response, small in size and narrow spectrum etc.
Advantage, thus in terms of illumination using increasingly extensive.But also just because of its small size and high photosynthetic efficiency, LED, which is applied, to be radiated
The restriction of problem.Most of electric energy is converted into thermal energy during LED operation, these thermal energy buildups will lead to inside lamp body
LED generates serious light decay, accelerates chip aging, it is also possible to scolding tin be caused to melt and make chip failure.Especially for big function
For rate LED chip, heat dissipation problem is at the matter of utmost importance for influencing luminescent properties and service life.Heat dissipation problem has chip interior
Heat dissipation and two aspect of external cooling, internal heat dissipating is related to device encapsulation, and external cooling is related to substrate and takes heat, thermotransport and appearance
The heat convection in face and air.It is defeated to improve heat using adding the measures such as heat-conducting silicone grease, heat pipe to reduce thermal resistance for many heat sink conceptions at present
Link to be transported, the uniform of heat transfer is but ignored, heat finally relies on the outer surface of heat radiation module to be exchanged heat with cross-ventilation to distribute, if
Heat radiation module surface temperature distribution is seriously uneven, and temperature can be caused to substantially reduce compared with lower part efficiency, it is difficult to by heat from fever
Source is quickly transmitted to heat sink section bar, takes thermal resistance high, will lead to radiator bulk temperature unevenness, and uniform temperature is poor.
The prior art comes from CN201621367528.3.Its radiator includes heat sink section bar and aluminum substrate, the heat dissipation
Profile bottom surface is connected with aluminum substrate, and profile is provided with fin on top surface, including be located at heat sink section bar both ends the first fin and
The second fin right above heat sink section bar top surface；Second fin is located between the first fin of two sides, every the first fin of side
The height of piece is in arithmetic progression and is incremented by distribution.
Utility model content
Technical problem to be solved of the invention is to provide that a kind of rate of heat dispation is fast, the strong great power LED of uniform temperature
Radiator.
The technical solution of present invention solution above-mentioned technical problem are as follows:
A kind of high-power LED heat radiating device, including bottom plate and radiating part, the radiating part are fixed on the upper table of the bottom plate
Face further includes having liquid refrigerant, and the base plate interior is equipped with inner cavity, is equipped with cavity, the inner cavity and institute in the middle part of the radiating part
It states cavity and is formed through a confined space, the liquid refrigerant storage and the intracavity bottom.
Specifically, the intracavity bottom is equipped with microflute group, the microflute group covers the entire bottom of the inner cavity, the liquid
State working medium is placed in the microflute group.
Specifically, the radiating part includes middle part fins set and side fins set, the side fins set and the middle part
Fins set is disposed adjacent, and the inside of any fin of the middle part fins set and the side fins set offers the sky
Chamber.
Specifically, the two sides of the fin are equipped with several longitudinal grooves, the longitudinal direction of the two sides of the fin is recessed
Slot is interspersed.
Specifically, the side fins set is two groups, it is separately fixed at the two sides of the middle part fins set.
Preferably, relative to the middle part of the bottom plate, both sides taper off arrangement forwards, backwards for the arrangement of the fin.
Specifically, the middle part fins set differs 1 ~ 3 with the quantity of the fin of the side fins set, it is described in
Portion's fins set is interspersed with the side fins set.
Preferably, the microflute group is formed by several groove combinations less than 0.1mm.
Preferably, the bottom plate is integrally formed with the radiating part.
Preferably, it is negative pressure that the inner cavity and the cavity, which are formed by the pressure state in confined space,.
The structure having the advantages that by building inner cavity in bottom plate of the utility model, utilizes built-in microflute
Group's savings liquid refrigerant endothermic gasification drives heat transmission into radiating part at gaseous working medium, improves the effect of heat transfer and heated conveying
Rate.Radiating part takes the condensation chamber of gaseous working medium, and gaseous working medium can be effectively liquefied as to liquid refrigerant again and prolong fin
Cavity surrounding flow back into inner cavity, guarantee the progress of the continuous and effective of heat transfer, so that whole uniform temperature is got a promotion, radiating part
Fin staggeredly, equal difference distribution, the air for exchange fin with air is left to the agitation for staggeredly increasing air-flow, so that reinforcing is scattered
The heat exchanger efficiency in hot portion enhances the convection transfer rate of fin and air, realizes the rapid cooling of great power LED.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of high-power LED heat radiating device of the utility model.
Fig. 2 is a kind of overlooking structure diagram of high-power LED heat radiating device of the utility model.
Fig. 3 is a kind of side structure schematic diagram of high-power LED heat radiating device of the utility model.
Fig. 4 is a kind of front cross-sectional structural schematic diagram of high-power LED heat radiating device of the utility model.
Fig. 5 is the enlarged structure schematic diagram at the position the utility model A.
The meaning that each serial number indicates in attached drawing is as follows:
1 bottom plate, 2 inner cavities, 3 microflute groups, 4 liquid refrigerants, 5 fins, 6 longitudinal grooves.
Specific embodiment
It elaborates with reference to the accompanying drawing to the utility model.
Embodiment:
A kind of high-power LED heat radiating device of the utility model embodiment is as shown in Figs 1-4, including bottom plate 1 and radiating part,
The radiating part is fixed on the upper surface of the bottom plate 1, further includes having liquid refrigerant 4, and inner cavity 2, institute are equipped with inside the bottom plate 1
It states and is equipped with cavity in the middle part of radiating part, the inner cavity 2 is formed through a confined space with the cavity, and the liquid refrigerant 4 stores up
It deposits and 2 bottom of inner cavity.Specifically, 2 bottom of inner cavity is equipped with microflute group 3, the microflute group 3 covers the inner cavity 2
Entire bottom, the liquid refrigerant 4 are placed in the microflute group 3.Preferably, the microflute group 3 is by several ditches less than 0.1mm
Slot is composed.
The lower surface of bottom plate 1 is affixed with LED substrate again after generally coated with thermally conductive layer of silica gel, guarantees that bottom plate 1 can be effective
The heat for being transmitted to LED substrate, when the amount of heat that gives out of great power LED work is transmitted to bottom plate by heat conduction silicone
After 1, the liquid refrigerant 4 in inner cavity 2 is due to putting aside in the microflute group 3 of 2 bottom of inner cavity, in the effect of highly dense conduit capillary force
Under, liquid working substance can uniformly be put aside in microflute group 3.It is arranged on the lower surface of inner cavity 2 due to microflute group 3, is at the first time
The component being in contact with heat, the internal violent boiling because heated fast will form of liquid refrigerant 4, makes the liquid refrigerant on surface
4 gasify, and are evaporated into gaseous working medium, and gaseous working medium directly up conveys heat, transport in the cavity in radiating part,
And even heat is conducted to each section of radiating part, after radiating part is that ambient air stream carries out heat exchange, heat is excluded,
The gaseous working medium that heat conduction finishes will be liquefied as liquid refrigerant 4 again, flow back in the inner cavity 2 of bottom plate 1, form lasting heat
Switch mode.
Preferably, it is negative pressure that the inner cavity 2, which is formed by the pressure state in confined space with the cavity,.Negative pressure state
Confined space, can reduce the boiling point of interior liquid working medium 4, while can prevent liquid refrigerant 4 in Quick-gasifying at gaseous state
Working medium makes, and volume expansion causes hypertonia in confined space, guarantees the stability of radiating part.Preferably, the bottom plate 1 and institute
Radiating part is stated to be integrally formed.It is integrally formed the negative pressure holding for being more advantageous to confined space, reduces the difficulty of production, in addition, also
It is avoided that additional thermal contact resistance.
Specifically, the radiating part includes middle part fins set and side fins set, the side fins set and the middle part
Fins set is disposed adjacent, and the inside of any fin 5 of the middle part fins set and the side fins set offers the sky
Chamber.Fin 5 is that have aluminium alloy, copper or copper alloy support, surface anodization processing.Specifically, the two sides of the fin 5 are all provided with
There are several longitudinal grooves 6, the longitudinal groove 6 of the two sides of the fin 5 is interspersed.Longitudinal groove 6 can make to condense
Liquid refrigerant 4 after aggregation is preferably guided in the inner cavity 2 of bottom plate 1, additionally it is possible to which the surface area for increasing fin 5 makes itself and sky
The contact surface of gas becomes larger, moreover it is possible to play the role of reinforcing rib, fin 5 is made to have more rigidity.Specifically, the side fin
Group is two groups, is separately fixed at the two sides of the middle part fins set.Preferably, the arrangement of the fin 5 is relative to the bottom plate 1
Both sides taper off arrangement forwards, backwards at middle part.Arrangement of successively decreasing is arranged using arithmetic progression, is capable of increasing fin 5 and is changed convection of heat sky
Between and radiation space, the radiating efficiency of fin 5 can be made stronger, it is preferred that the fin 5 of contour distribution include at least 3 height.
Specifically, the middle part fins set differs 1 ~ 3 with the quantity of the fin 5 of the side fins set, the middle part fin
Group is interspersed with the side fins set.The middle part fins set and side fins set being interspersed make external air currents
Channel is interlaced, and then makes air be in the circulation of agitating type, and then destroy the formation of 5 surface boundary layer of fin, and then guarantee
What fin 5 can continue is in contact with extraneous air, improves the coefficient of heat transfer.
According to existing technological achievement, the thermal coefficient of aluminium alloy is about 200 W/ (m K), and the thermal coefficient of copper is about
390 W/ (m K), a kind of composite phase-change of high-power LED heat radiating device provided by the utility model take the theoretical maximum of heat to take heat
Heat flow density can reach the order of magnitude of 10000W/cm2.Therefore, confined space is formed in radiator, passes through 3 knot of microflute group
Structure, integrated phase transformation take heat function, and thermal energy can more rapidly and uniformly be carried out to the surface for being transmitted to fin 5, improve heat dissipation dress
The uniform temperature set, while the structure of fin 5, distribution are optimized, the heat exchange efficiency of fin 5 and external environment is improved, effectively
Improvement mountain thermal integral heat sink effect.
The above content is the further descriptions done in conjunction with specific preferred embodiment to the utility model, cannot
Assert that the specific implementation of the utility model is only limited to these instructions.For the ordinary skill of the utility model technical field
For personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, should all regard
To belong to the protection scope of the utility model.
Claims (10)
1. a kind of high-power LED heat radiating device, including bottom plate (1) and radiating part, the radiating part are fixed on the bottom plate (1)
Upper surface, it is characterised in that: further include having liquid refrigerant (4), be equipped with inner cavity (2) inside the bottom plate (1), in the radiating part
Portion is equipped with cavity, and the inner cavity (2) and the cavity are formed through a confined space, liquid refrigerant (4) storage and institute
State inner cavity (2) bottom.
2. high-power LED heat radiating device according to claim 1, it is characterised in that: inner cavity (2) bottom is equipped with microflute
Group (3), the microflute group (3) cover the entire bottom of the inner cavity (2), and the liquid refrigerant (4) is placed in the microflute group (3)
In.
3. high-power LED heat radiating device according to claim 2, it is characterised in that: the radiating part includes middle part fin
Group and side fins set, the side fins set are disposed adjacent with the middle part fins set, the middle part fins set and the side
The inside of any fin (5) of face fins set offers the cavity.
4. high-power LED heat radiating device according to claim 3, it is characterised in that: the two sides of the fin (5) are equipped with
The longitudinal groove (6) of several longitudinal grooves (6), the two sides of the fin (5) is interspersed.
5. high-power LED heat radiating device according to claim 3, it is characterised in that: the side fins set is two groups, point
It is not fixed on the two sides of the middle part fins set.
6. high-power LED heat radiating device according to claim 3, it is characterised in that: the arrangement of the fin (5) relative to
Both sides taper off arrangement forwards, backwards at the middle part of the bottom plate (1).
7. according to high-power LED heat radiating device described in claim 3-6 any one, it is characterised in that: the middle part fin
Group differs 1 ~ 3 with the quantity of the fin (5) of the side fins set, the middle part fins set and the side fins set
It is interspersed.
8. according to high-power LED heat radiating device described in claim 2-6 any one, it is characterised in that: the microflute group (3)
It is composed of several nano-scale grooves.
9. high-power LED heat radiating device described in -6 any one according to claim 1, it is characterised in that: the bottom plate (1) with
The radiating part is integrally formed.
10. high-power LED heat radiating device described in -6 any one according to claim 1, it is characterised in that: the inner cavity (2)
Being formed by the pressure state in confined space with the cavity is negative pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821814107.XU CN208967760U (en) | 2018-11-06 | 2018-11-06 | A kind of high-power LED heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821814107.XU CN208967760U (en) | 2018-11-06 | 2018-11-06 | A kind of high-power LED heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208967760U true CN208967760U (en) | 2019-06-11 |
Family
ID=66760284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821814107.XU Active CN208967760U (en) | 2018-11-06 | 2018-11-06 | A kind of high-power LED heat radiating device |
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| Country | Link |
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| CN (1) | CN208967760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024077761A1 (en) * | 2022-10-10 | 2024-04-18 | 南方电网科学研究院有限责任公司 | Heat dissipation apparatus used in gas-liquid mixed medium and preparation method therefor |
-
2018
- 2018-11-06 CN CN201821814107.XU patent/CN208967760U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024077761A1 (en) * | 2022-10-10 | 2024-04-18 | 南方电网科学研究院有限责任公司 | Heat dissipation apparatus used in gas-liquid mixed medium and preparation method therefor |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240412 Address after: Floor 3-4, Building A, Mingfengda Industrial Park, Baoshan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, Guangdong 518000 Patentee after: Guangdong Jingrui Semiconductor Co.,Ltd. Country or region after: China Address before: 518000 North 5th Floor, Building 3, Hongfa Innovation Park, Huangmabu Community, Hangcheng Street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN JINYUAN CENTURY TECHNOLOGY Co.,Ltd. Country or region before: China |