CN208961366U - Double-station Transmission system for laser processing - Google Patents
Double-station Transmission system for laser processing Download PDFInfo
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- CN208961366U CN208961366U CN201821612684.0U CN201821612684U CN208961366U CN 208961366 U CN208961366 U CN 208961366U CN 201821612684 U CN201821612684 U CN 201821612684U CN 208961366 U CN208961366 U CN 208961366U
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- blanking
- laser
- machine table
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 41
- 238000012545 processing Methods 0.000 title claims abstract description 36
- 230000003287 optical effect Effects 0.000 claims abstract description 49
- 238000012546 transfer Methods 0.000 claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 39
- 229910052710 silicon Inorganic materials 0.000 claims description 39
- 239000010703 silicon Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 32
- 239000000523 sample Substances 0.000 claims description 16
- 238000003754 machining Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000035611 feeding Effects 0.000 description 75
- 235000012431 wafers Nutrition 0.000 description 36
- 238000000034 method Methods 0.000 description 8
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Abstract
The utility model provides a kind of double-station Transmission system for laser processing, including two machine tables corresponding with laser optical path and transmission device；Transmission device includes feeding mould group, feeding transfer mould group, blanking transfer mould group and blanking die group；Feeding mould group shifts mould group and is used to shift processed product to two machine tables in turn from feeding mould group for transmitting processed product, feeding, and blanking shifts mould group for shifting machined product from two machine tables to blanking die group in turn；When wherein laser optical path laser machines one of machine table all the way, the transfer of machined product and processed product and preparatory action of mould group and feeding transfer mould group completion to another machine table are shifted in blanking.Double-station is arranged on same transmission lines in the utility model, is processed respectively according to the laser optical path time difference, determines production efficiency by " optical path switch speed+laser processing speed ", improves production capacity compared with traditional technology, and guarantee machining accuracy and stability.
Description
Technical field
The utility model belongs to technical field of laser processing, and in particular to a kind of double-station transmission system for laser processing
System.
Background technique
The light splitting technology of laser has energy light splitting and timesharing to be divided two kinds, and Chinese utility model patent CN204855952U is public
A kind of timesharing light splitting optical path is opened comprising Focusable laser device collimates cylinder, 45 degree of mirror bases, high-speed motor seat and optical fiber coupling
Close seat composition.This light splitting technology belongs to timesharing light splitting, due to having used fiber coupling, optical path debugging difficulty in the optical path
Greatly, coupling efficiency is unable to reach 100%.In addition, the reliability of the optical path is bad, in the case where high power or optical path are shaken, deposit
In the risk that optical fiber coupling head is burnt out.
Existing silicon wafer laser process equipment, it is general to be processed using the corresponding galvanometer of a laser, equipment
Process velocity depends on rapid laser carving time and chip transmission time, since the transmission of silicon wafer can only use mechanical means,
When single station is processed, under a piece of silicon wafer must wait the silicon wafer completion of processing in machining position and could transmit in place, this at
The short slab of laser processing efficiency is improved for limitation, the short slab of chip transmission time makes equipment capacity be difficult to further increase.
Utility model content
Technical problem to be solved by the utility model is: providing a kind of double-station Transmission system for laser processing, energy
Enough improve processing efficiency.
A kind of technical solution that the utility model is taken to solve above-mentioned technical problem are as follows: duplex for laser processing
Position Transmission system, it is characterised in that: including two machine tables corresponding with laser optical path and transmission device；Transmission device packet
Include feeding mould group, feeding transfer mould group, blanking transfer mould group and blanking die group；Feeding mould group is used to transmit processed product, on
Material transfer mould group is used to shift processed products to two machine tables in turn from feeding mould group, blanking shift mould group in turn from
Two machine tables shift machined product to blanking die group；
The laser optical path, machine table, feeding transfer mould group, the positional relationship between blanking transfer mould group are as follows: when it
In when laser optical path laser machines one of machine table all the way, mould group is shifted in blanking and feeding transfer mould group is completed pair
The machined product and processed product of another machine table shift and preparatory action.
According to the above scheme, the transmission device only has one group, and the end of feeding mould group is provided only with a feeding position, blanking
The front end of mould group is provided only with a splicing position；
The feeding transfer mould group includes feeding rotary shaft, 2 feeding linking arms with feeding rotation axis connection, feeding
The end of linking arm, which is equipped with, produces product fixing device；Angle between the position of feeding rotary shaft and 2 feeding linking arms makes: one
When the end of a feeding linking arm is located in machine table, the end of another feeding linking arm is located in the feeding position；On
Expect the reciprocal stepping rotation of rotary shaft；
The blanking transfer mould group includes blanking rotary shaft, 2 blanking linking arms with blanking rotation axis connection, blanking
The end of linking arm, which is equipped with, produces product fixing device；Angle between the position of blanking rotary shaft and 2 blanking linking arms makes: one
When the end of a blanking linking arm is located in machine table, the end of another blanking linking arm is located on the splicing position；Under
Expect the reciprocal stepping rotation of rotary shaft.
According to the above scheme, each machine table is rotation machine table, including rotating part and driving portion, driving portion are used for
It drives rotating part stepping rotation and is recycled between upper material position, machining position and lower material position and stopped, shifted respectively with the feeding
Mould group, probe and blanking transfer mould group matching；It rotates machine table and is equipped with production product fixing device.
According to the above scheme, the feeding rotary shaft is arranged on the midpoint of upper material position line of 2 machine tables, and feeding
Position is located on the center line of the upper material position line of 2 machine tables, and the angle of 2 feeding linking arms is 90 degree；
The blanking rotary shaft is arranged on the midpoint of lower material position line of 2 machine tables, and splicing position is located at 2 and adds
On the center line of the lower material position line of work platform, the angle of 2 blanking linking arms is 90 degree.
According to the above scheme, the product is the silicon wafer for being used to prepare solar battery.
According to the above scheme, the feeding mould group and blanking die group are belt transmission module.
The utility model has the following beneficial effects:
1, double-station is arranged on same transmission lines in the utility model, add respectively according to the laser optical path time difference
Work determines that the production method of production efficiency is changed into that " optical path is cut for traditional with " chip transmission speed+laser processing speed "
Throw-over degree+laser processing speed " determines production efficiency；Since optical path switch speed optical path switch speed is far faster than chip transmission speed
Degree avoids this slow short slab of chip transmission speed, monolithic process velocity can be improved 20%, so that laser processing is set
Standby production capacity improves 20% or so.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of an embodiment of the present invention laser splitting device.
Fig. 2 is an embodiment of the present invention silicon wafer processing method schematic diagram, and wherein a is that laser passes through first laser optical path
For the first machine table machining sketch chart, it by second laser optical path is the second machine table machining sketch chart that b, which is laser,.
Fig. 3 is the structural schematic diagram of an embodiment of the present invention laser process equipment.
Fig. 4 is the structural schematic diagram of an embodiment of the present invention double-station Transmission system.
In figure: 100- laser light source, the first total reflection mirror of 101-, 102- single shaft galvanometer system, the second total reflection mirror of 103-,
104- third total reflection mirror, the 4th total reflection mirror of 105-, the first probe of 106-, the second probe of 107-, 108- first are expanded
Mirror, the second beam expanding lens of 109-, the first machine table of 201-, the second machine table of 202-；
1- laser splitting device, 301- feeding mould group, 302- feeding shift mould group, and mould group is shifted in 303- blanking, under 304-
Expect mould group, 4- workbench, the upper material position of 5-, 6- machining position, material position under 7-；3021- feeding rotary shaft, the connection of the first feeding of 3022-
Arm, 3023- the second feeding linking arm, 3031- blanking rotary shaft, 3032- the first blanking linking arm, the second blanking of 3033- connection
Arm.
Specific embodiment
The utility model is described further below with reference to specific example and attached drawing.
The utility model only by taking the silicon wafer for being used to prepare solar battery is processed as an example, carries out the structure of the utility model
Explanation.The utility model is suitable for all fields processed using laser to single product.
As shown in Figure 1, the present embodiment provides a kind of laser splitting devices being used cooperatively with the utility model, for providing
The laser optical path of 2 tunnel timesharing, including laser light source 100, laser optical path and probe, the present apparatus further include uniaxial galvanometer system
102；The laser optical path is 2 tunnels, and the end of every road laser optical path is equipped with a probe, and each probe respectively corresponds
One machine table, probe include processing galvanometer and field lens；2 road laser optical paths are uniaxial in uniaxial galvanometer system 102 by controlling
The mechanical corner of galvanometer and realize switching.
Uniaxial galvanometer system 102 includes uniaxial galvanometer and matched mark card, the principle of uniaxial galvanometer are by motor band
Dynamic mirror deflection, in the technical program, there are two position, when first position, optical path is without reflecting mirror, when the second position,
Optical path is reflected by reflecting mirror, changes optical path.
As shown in Figure 2 to Figure 3, in the present embodiment, the laser that laser light source 100 issues is reflected through the first total reflection mirror 101,
When laser is not reflected by uniaxial galvanometer system 102, directly constituted via the second total reflection mirror 103, the first beam expanding lens 108
First laser optical path, reach the first probe 106, the silicon wafer in the first machine table 201 is processed, the second machine table
202 prepare；When uniaxial galvanometer system 102 deflects into predetermined position, laser is after the reflection of the first total reflection mirror 101, through single shaft
The uniaxial vibration mirror reflected of galvanometer system 102 is to by 109 structure of third total reflection mirror 104, the 4th total reflection mirror 105 and the second beam expanding lens
At second laser optical path, reach the second probe 107, the silicon wafer in the second machine table 202 is processed, the first machine table
201 prepare.Uniaxial galvanometer system 102 constantly deflects between the two positions, and laser is successively continuous according to chronological order
Be directed into first laser optical path and second laser optical path.
Using above-mentioned laser splitting device or other devices for being capable of providing two-way laser optical path, rationally design different
A certain laser optical path may be implemented in processing in positional relationship between each equipment of time, and another laser optical path is corresponding
Workpiece be ready in machining position, can save in this way single light path processing when wait workpiece transmission time, improve produce
Energy.
Based on above-mentioned thinking, the utility model provides a kind of double-station Transmission system for laser processing, with laser
Light-dividing device is used cooperatively.Specifically, two laser processing stations are arranged under laser splitting device, respectively correspond first and swash
Light optical path and second laser optical path to fixed silicon wafer, and complete the processing of silicon wafer here.It further include silicon wafer transmission device,
Transmitting silicon wafers to two laser processing stations respectively, and the silicon wafer completed the process is sent to subsequent processing respectively.
As shown in Figure 3 and Figure 4, the double-station Transmission system for laser processing is arranged in the laser splitting device 1
Top provides two-way laser optical path.The utility model includes two machine tables corresponding with probe and transmission device；It passes
Sending device includes feeding mould group 301, feeding transfer mould group 302, blanking transfer mould group 303 and blanking die group 304；Feeding mould group
301 for transmitting silicon wafer to be processed, and feeding shifts mould group 302 for be added to 2 machine tables transfers in turn from feeding mould group 301
Work silicon wafer, blanking transfer mould group 303 is for shifting machined silicon wafer from 2 machine tables to blanking die group 304 in turn.
Positional relationship under different time between each equipment is as follows: when laser is through wherein laser optical path is incident on correspondence all the way
Probe, when being laser machined to one of machine table, blanking shift mould group and feeding transfer mould group complete to another
The machined silicon wafer of a machine table and silicon wafer to be processed transfer and preparatory action.
As a preferred embodiment, the transmission device only has one group, and the end of feeding mould group 301 is provided only with one and takes
Material position, the front end of blanking die group 304 are provided only with a splicing position.In this way a half space can be saved in width direction.Feeding mould
Group 301 and blanking die group 304 are preferably belt transmission module.
2 feedings that the feeding transfer mould group 302 includes feeding rotary shaft 3021, connect with feeding rotary shaft 3021
Linking arm, i.e. the first feeding linking arm 3022 and the second feeding linking arm 3023, the end of feeding linking arm are fixed equipped with silicon wafer
Device, such as sucker or folder is grabbed, for adsorbing silicon wafer.Folder between the position of feeding rotary shaft 3021 and 2 feeding linking arms
Angle makes: when the end of a feeding linking arm is located in machine table, the end of another feeding linking arm is located at described take
In material position；Feeding rotary shaft 3021 is driven by driving device, such as servo motor, to realize reciprocal stepping rotation.
2 blankings that the blanking transfer mould group 303 includes blanking rotary shaft 3031, connect with blanking rotary shaft 3031
Linking arm, i.e. the first blanking linking arm 3032 and the second blanking linking arm 3033, the end of blanking linking arm are fixed equipped with silicon wafer
Device, such as sucker or folder is grabbed, for adsorbing silicon wafer.Folder between the position of blanking rotary shaft 3031 and 2 blanking linking arms
Angle makes: when the end of a blanking linking arm is located in machine table, the end of another blanking linking arm is located at described connect
In material position；Feeding rotary shaft 3021 is driven by driving device, such as servo motor, to realize reciprocal stepping rotation.
Each machine table is rotation machine table, including rotating part and driving portion, and driving portion is for driving rotating part
Stepping rotation, which simultaneously recycles between upper material position 5, machining position 6 and lower material position 7, to stop, respectively with the described feeding transfer mould group 302,
Probe and blanking transfer mould group 303 match；It rotates machine table and is equipped with fixing device for silicon piece, such as sucker.
In the present embodiment, two machine table spacing parallel arranging settings.The feeding rotary shaft 3021 is arranged in 2 machine tables
5 line of upper material position midpoint on, and feeding position is located on the center line of 5 line of upper material position of 2 machine tables, and 2 feedings connect
The angle for connecing arm is 90 degree；The blanking rotary shaft 3031 is arranged on the midpoint of 7 line of lower material position of 2 machine tables, and
Splicing position is located on the center line of 7 line of lower material position of 2 machine tables, and the angle of 2 blanking linking arms is 90 degree.More details
, on the same line, the first machine table 201 and the second machine table 202 are symmetrically set for feeding mould group 301 and blanking die group 304
It sets in the straight line two sides.
The silicon wafer processing method realized using above equipment, if machine table is the first machine table 201 and the second machine table
202, laser optical path corresponding with the first machine table 201 is first laser optical path, laser optical path corresponding with the second machine table 202
For second laser optical path.
This method the following steps are included:
The laser that laser light source 100 issues is through first laser optic path, to the silicon wafer to be processed in the first machine table 201
It is laser machined；At the same time, machined silicon wafer is transferred to blanking from the second machine table 202 by blanking transfer mould group 303
Mould group 304, then feeding shifts mould group 302 and shifts silicon wafer to be processed from feeding mould group 301 to the second machine table 202.
When the laser processing work in the first machine table 201 is completed, the preparation of silicon wafer to be processed in the second machine table 202
Work is completed, and is controlled the mechanical corner of uniaxial galvanometer in uniaxial galvanometer system 102 at this time, is carried out laser optical path switching.
The laser that laser light source 100 issues is through second laser optic path, to the silicon wafer to be processed in the second machine table 202
It is laser machined；At the same time, machined silicon wafer is transferred to blanking from the first machine table 201 by blanking transfer mould group 303
Mould group 304, then feeding shifts mould group 302 and shifts silicon wafer to be processed from feeding mould group 301 to the first machine table 201.
When the laser processing work in the second machine table 202 is completed, the preparation of silicon wafer to be processed in the first machine table 201
Work is completed, and is controlled the mechanical corner of uniaxial galvanometer in uniaxial galvanometer system 102 at this time, is carried out laser optical path switching.
It loops back and forth like this.
It further refines, the transmission device only has one group, and blanking shifts mould group 303 from the second machine table 202
When machined silicon wafer is transferred to blanking die group 304, under the rotating forward of blanking rotary shaft 3031, the second blanking linking arm
3033 move to blanking die group 304 from the second machine table 202, and the first blanking linking arm 3032 moves to from blanking die group 304
One machine table 201 is waited；Machined silicon wafer is transferred to blanking die from the first machine table 201 by blanking transfer mould group 303
When group 304, under the rotating backward of blanking rotary shaft 3031, the first blanking linking arm 3032 is moved to from the first machine table 201
Blanking die group 304, the second blanking linking arm 3033 move to the second machine table 202 from blanking die group 304 and are waited.
When feeding transfer mould group 302 shifts silicon wafer to be processed to the second machine table 202 from feeding mould group 301, revolved in feeding
Under the rotating forward of shaft 3021, the second feeding linking arm 3023 moves to the second machine table 202 from feeding mould group 301, and first
Feeding linking arm 3022 moves to feeding mould group 301 from the first machine table 201 and is waited；Feeding shifts mould group 302 from feeding
When mould group 301 shifts silicon wafer to be processed to the first machine table 201, under the rotating backward of feeding rotary shaft 3021, the first feeding
Linking arm 3022 moves to the first machine table 201 from feeding mould group 301, and the second feeding linking arm 3023 is from the second machine table 202
Feeding mould group 301 is moved to be waited.
Further, each machine table is rotation machine table, including rotating part and driving portion, and driving portion is for driving
Dynamic rotating part stepping rotation simultaneously recycles stop between upper material position 5, machining position 6 and lower material position 7, shifts respectively with the feeding
Mould group 302, probe and blanking transfer mould group 303 match；It rotates machine table and is equipped with fixing device for silicon piece.
More details, driving portion is the driving devices such as DD motor, is fixed on workbench 4, and driving end is upward.Rotating part is
Cross-shaped rotary bracket, middle part are fixed on the driving end of driving portion, and free end has set up Suction cup assembly.Rotating part can be
Under driving portion drives, 90 degree of stepping rotations.In rotary course, free end can successively pass through upper material position 5, machining position 6 and blanking
Position 7, and can be stopped in above-mentioned position, carry out feeding, processing and blanking operation.Wherein, upper material position 5 is set close to feeding mould group 301
It sets, the first probe 106 of laser splitting device 1 or the underface of the second probe 107, lower material position 7 is arranged in machining position 6
It is arranged close to blanking die group 304.
The utility model by it is traditional with " chip transmission speed+laser processing speed " determine production efficiency production method
It is changed into " optical path switch speed+laser processing speed " and determines production efficiency.And optical path switch speed optical path switch speed is far fast
In chip transmission speed, the embodiment of the utility model substantially increases processing speed, the production capacity of laser process equipment can be mentioned
It is high by 20% or so.Laser splitting device ensure that laser processing precision and stability simultaneously.
Above embodiments are merely to illustrate the design philosophy and feature of the utility model, in the art its object is to make
Technical staff can understand the content of the utility model and implement accordingly, and the protection scope of the utility model is not limited to above-mentioned implementation
Example.So it is all according to equivalent variations or modification made by the revealed principle of the utility model, mentality of designing, it is practical at this
Within novel protection scope.
Claims (6)
1. a kind of double-station Transmission system for laser processing, it is characterised in that: including two it is corresponding with laser optical path plus
Work platform and transmission device；Transmission device includes feeding mould group, feeding transfer mould group, blanking transfer mould group and blanking die group；On
Material mould group shifts mould group for be processed to two machine tables transfers in turn from feeding mould group for transmitting processed product, feeding
Product, blanking shift mould group for shifting machined product from two machine tables to blanking die group in turn；
The laser optical path, machine table, feeding transfer mould group, the positional relationship between blanking transfer mould group are as follows: when wherein one
When road laser optical path laser machines one of machine table, mould group is shifted in blanking and feeding transfer mould group is completed to another
The machined product and processed product of a machine table shift and preparatory action.
2. the double-station Transmission system according to claim 1 for laser processing, it is characterised in that: the transmission dress
Only one group is set, the end of feeding mould group is provided only with a feeding position, and the front end of blanking die group is provided only with a splicing position；
The feeding transfer mould group includes feeding rotary shaft, 2 feeding linking arms with feeding rotation axis connection, feeding connection
The end of arm, which is equipped with, produces product fixing device；Angle between the position of feeding rotary shaft and 2 feeding linking arms makes: on one
When the end of material linking arm is located in machine table, the end of another feeding linking arm is located in the feeding position；Feeding rotation
The reciprocal stepping rotation of shaft；
The blanking transfer mould group includes blanking rotary shaft, 2 blanking linking arms with blanking rotation axis connection, blanking connection
The end of arm, which is equipped with, produces product fixing device；Angle between the position of blanking rotary shaft and 2 blanking linking arms makes: under one
When the end of material linking arm is located in machine table, the end of another blanking linking arm is located on the splicing position；Blanking rotation
The reciprocal stepping rotation of shaft.
3. the double-station Transmission system according to claim 2 for laser processing, it is characterised in that: each described adds
Work platform is rotation machine table, including rotating part and driving portion, driving portion for drive rotating part stepping rotate and in upper material position plus
It recycles and stops between station and lower material position, matched respectively with the feeding transfer mould group, probe and blanking transfer mould group；Rotation
Turn machine table and is equipped with production product fixing device.
4. the double-station Transmission system according to claim 3 for laser processing, it is characterised in that: the feeding rotation
Shaft is arranged on the midpoint of upper material position line of 2 machine tables, and feeding position is located in the upper material position line of 2 machine tables
On heart line, the angle of 2 feeding linking arms is 90 degree；
The blanking rotary shaft is arranged on the midpoint of lower material position line of 2 machine tables, and splicing position is located at 2 machine tables
Lower material position line center line on, the angle of 2 blanking linking arms is 90 degree.
5. the double-station Transmission system according to claim 1 for laser processing, it is characterised in that: the product is
It is used to prepare the silicon wafer of solar battery.
6. the double-station Transmission system according to claim 1 for laser processing, it is characterised in that: the feeding mould
Group and blanking die group are belt transmission module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821612684.0U CN208961366U (en) | 2018-09-30 | 2018-09-30 | Double-station Transmission system for laser processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821612684.0U CN208961366U (en) | 2018-09-30 | 2018-09-30 | Double-station Transmission system for laser processing |
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| CN208961366U true CN208961366U (en) | 2019-06-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497102A (en) * | 2019-08-27 | 2019-11-26 | 武汉帝尔激光科技股份有限公司 | A kind of material transmission system and laser process equipment |
-
2018
- 2018-09-30 CN CN201821612684.0U patent/CN208961366U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497102A (en) * | 2019-08-27 | 2019-11-26 | 武汉帝尔激光科技股份有限公司 | A kind of material transmission system and laser process equipment |
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Address after: No. 88 Jiulonghu Street, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: 430000 Hubei city of Wuhan province Optics Valley Industrial Park of East Lake Development Zone, Shiyuan two Road No. four Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. |