CN208949300U - A kind of temperature-control circuit based on gene sequencing - Google Patents
A kind of temperature-control circuit based on gene sequencing Download PDFInfo
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- CN208949300U CN208949300U CN201821412620.6U CN201821412620U CN208949300U CN 208949300 U CN208949300 U CN 208949300U CN 201821412620 U CN201821412620 U CN 201821412620U CN 208949300 U CN208949300 U CN 208949300U
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- gene sequencing
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Abstract
The embodiments of the present invention disclose a kind of temperature-control circuit based on gene sequencing, and the temperature-control circuit based on gene sequencing includes constant current source module, signal enhanced processing module, master controller MCU, electrical isolation module, logical transition module, H bridge drive module, TEC module and the temperature sensor being mounted on controlled device.Temperature-control circuit provided by the embodiment of the utility model based on gene sequencing can be realized the high efficiency to biochemistry medical apparatus and instruments, high reliability, high automation, fast reaction stationary temperature control, meet the requirement of experiment of biochemistry instrument and equipment.
Description
Technical field
The embodiments of the present invention are related to technical field of temperature control, and in particular to a kind of temperature based on gene sequencing
Control circuit.
Background technique
In technical fields such as biochemistry, medical instrument, electronics industries, it is required to freeze using temperature control equipment
Or the operation of heating, temperature control is carried out to substances such as reagent, enzymes.Such as the instruments such as PCR instrument, gene sequencer are using
When, require the operation that physical reactions and chemical reaction are carried out to sample reagent.It just needs during the reaction according to different
The operation that period is heated up or cooled down.Such as: need temperature to reach 90 DEG C the denaturation of DNA, when DNA replication dna
It just needs to be maintained at 70 DEG C to expand etc..
Currently, the temprature control unit in most of biochemistry instrument and equipment is not able to satisfy reaction speed, precision, efficiency
Etc. requirement.
Utility model content
The utility model embodiment is designed to provide a kind of temperature-control circuit based on gene sequencing, to solve
The problem of existing biochemistry instrument and equipment temprature control unit requires in terms of not being able to satisfy reaction speed, precision, efficiency.
To achieve the above object, the technical solution of embodiment provided by the utility model are as follows: a kind of based on gene sequencing
Temperature-control circuit, including constant current source module, signal enhanced processing module, master controller MCU, electrical isolation module, logic turn
Change the mold block, H bridge drive module, TEC module and the temperature sensor being mounted on controlled device;
The output end of the constant current source module connects the input terminal of the temperature sensor, the output of the temperature sensor
End connects the input terminal of the signal enhanced processing module, and the output end of the signal enhanced processing module connects the main control
The ADC pin of device MCU, the input terminal of the output end connection electrical isolation module of the master controller MCU, the electrical isolation mould
The input terminal of the output end connection logical transition module of block, the output end connection H bridge drive module of the logical transition module
The output end of input terminal, the H bridge drive module connects TEC module, is realized by the temperature change of TEC module to controlled device
Temperature control;
The constant current source module is mainly by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th resistance R7, source of stable pressure
Q1 and voltage of voltage regulation VCC composition, one end of the 3rd resistance R3 are connect with voltage of voltage regulation VCC, and the other end is electric with the 5th respectively
Resistance R5, the 6th resistance R6, the 7th resistance R7 are connected with source of stable pressure Q1, and the 5th resistance R5 is resistance-changing resistor, and source of stable pressure Q1 is adjustable
The resistance value size of 5th resistance R5, the 5th resistance R5 is connect with source of stable pressure Q1, and is equipped between the 5th resistance R5 and source of stable pressure Q1
GND contact.
Among some embodiments, the signal enhanced processing module includes the 8th resistance R8, the 9th resistance R9, the 10th
Resistance R10, the 11st resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1, the second capacitor C2, operational amplifier U1
With voltage-stabiliser tube D1.
Among some embodiments, the electrical isolation module is mainly by the 1st resistance R1, the 2nd resistance R2, the 4th electricity
Hinder R4, the 13rd resistance R13 and photoelectrical coupler U2, U3 composition.
Among some embodiments, the logical transition module mainly by with door chip P4, P5 and NOT gate chip
P3 composition.
Among some embodiments, the H bridge drive module is mainly by 4 field-effect tube Q2, Q3, Q4, Q5 and 4
A diode D2, D3, D4, D5 composition.
Among some embodiments, the temperature sensor is platinum resistance temperature sensor.
Among some embodiments, the temperature sensor is fixed on controlled device by heat conductive silica gel.
Compared with prior art, the embodiments of the present invention have the advantages that the embodiments of the present invention provide
A kind of temperature-control circuit based on gene sequencing, including constant current source module, signal enhanced processing module, master controller MCU,
Electrical isolation module, logical transition module, H bridge drive module, TEC module and the temperature sensing being mounted on controlled device
Device;It can be realized by using the temperature-control circuit provided by the embodiment of the utility model based on gene sequencing to biochemistry
The high efficiency of medical apparatus and instruments, high reliability, height automate, the stationary temperature of fast reaction controls, and meet biochemistry
The requirement of experiment of instrument and equipment.
Detailed description of the invention
Fig. 1 is the comprising modules frame in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing
Figure;
Fig. 2 a is at the signal amplification in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing
Manage the circuit diagram of module;
Fig. 2 b is the temperature sensor in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing
Circuit diagram;
Fig. 3 is the electrical isolation module in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing
Circuit diagram;
Fig. 4 is the logical transition module in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing
Circuit diagram;
Fig. 5 is the H bridge drive module in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing
Circuit diagram.
Specific embodiment
The following examples illustrate the utility model, but is not intended to limit the scope of the present invention.
The embodiments of the present invention are described in detail in the following with reference to the drawings and specific embodiments, the utility model
Embodiment disclose a kind of temperature-control circuit based on gene sequencing, including constant current source module, signal enhanced processing module,
Master controller MCU, electrical isolation module, logical transition module, H bridge drive module, TEC module and it is mounted on controlled device
On temperature sensor;
The output end of the constant current source module connects the input terminal of the temperature sensor, the output of the temperature sensor
End connects the input terminal of the signal enhanced processing module, and the output end of the signal enhanced processing module connects the main control
The ADC pin of device MCU, the input terminal of the output end connection electrical isolation module of the master controller MCU, the electrical isolation mould
The input terminal of the output end connection logical transition module of block, the output end connection H bridge drive module of the logical transition module
The output end of input terminal, the H bridge drive module connects TEC module, is realized by the temperature change of TEC module to controlled device
Temperature control;
The constant current source module is mainly by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th resistance R7, source of stable pressure
Q1 and voltage of voltage regulation VCC composition.Wherein, one end of the 3rd resistance R3 is connect with voltage of voltage regulation VCC, the other end respectively with
5th resistance R5, the 6th resistance R6, the 7th resistance R7 are connected with source of stable pressure Q1, and the 5th resistance R5 is resistance-changing resistor, source of stable pressure Q1
The resistance value size of adjustable 5th resistance R5, the 5th resistance R5 are connect with source of stable pressure Q1, and the 5th resistance R5 and source of stable pressure Q1 it
Between be equipped with GND contact.
Further, the signal enhanced processing module includes the 8th resistance R8, the 9th resistance R9, the 10th resistance R10, the
11 resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1, the second capacitor C2, operational amplifier U1 and voltage-stabiliser tube
D1。
Further, the electrical isolation module is mainly by the 1st resistance R1, the 2nd resistance R2, the 4th resistance R4, the 13rd electricity
Hinder R13 and photoelectrical coupler U2, U3 composition.
Further, the logical transition module with door chip P4, P5 and NOT gate chip P3 mainly by forming.
Further, the H bridge drive module is mainly by 4 field-effect tube Q2, Q3, Q4, Q5 and 4 diodes
D2, D3, D4, D5 composition.
Further, the temperature sensor is preferably platinum resistance temperature sensor, but not limited to this.
Further, the temperature sensor is fixed on controlled device by heat conductive silica gel, but not limited to this.
In addition, the embodiments of the present invention additionally provide a kind of biochemistry instrument of temperature-controllable, including any one
The above-mentioned temperature-control circuit based on gene sequencing.
The embodiments of the present invention are described in detail below with reference to several exemplary embodiments.
As shown in Figure 1, temperature control circuit of the utility model based on gene sequencing, comprising: master controller MCU, temperature sensing
Device, signal enhanced processing module, electrical isolation module, logical transition module, H bridge drive module, input equipment and display unit
Point.
As shown in Fig. 2, by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th resistance R7, high-precision voltage stabilizing source Q1 with
And the high precise current source part of voltage of voltage regulation VCC composition generates constant current, and injects a current into platinum resistance temperature sensor,
Platinum resistance temperature sensor resistance value is converted into voltage signal to realize.Wherein platinum resistance temperature sensor passes through heat conductive silica gel
Fixed and temperature control device surface.By the variation of platinum resistance self-resistance value, then voltage signal is transmitted to subsequent by the 8th
Resistance R8, the 9th resistance R9, the 10th resistance R10, the 11st resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1,
The amplifying circuit that two capacitor C2, operational amplifier U1, voltage-stabiliser tube D1 are formed.Then by being transmitted to master control coremaking after amplification filtering
The ADC pin of piece.
As shown in figure 3, the real time temperature surveyed by master controller MCU by obtaining sensor after calculating, it then will be real
Shi Wendu is compared with the set temperature for being written to master controller MCU by input equipment, is calculated by pid algorithm
PWM control amount, output phase answer the PWM square wave and low and high level of duty ratio.It is transmitted to by the 1st resistance R1, the 2nd resistance R2, the 4th
The electrical isolation module of resistance R4, the 13rd resistance R13 and photoelectrical coupler U2, U3 composition.
As shown in figure 4, by electrical isolation module outflow signal pass through by with door chip P4, P5 and NOT gate chip P3
The logical transition module of composition.
As shown in figure 5, signal is transmitted to H bridge drive module after logical transition module.This module is by 4 field-effects
Pipe Q2, Q3, Q4, Q5 and 4 diode D2, D3, D4, D5 compositions.By the MCU PWM transmitted and direction signal and surely
Constant voltage VDD to carry out TEC module (P2) control of current direction and size.It is quickly anti-with the temperature for reaching TEC generation
It answers and keeps stable temperature.
The principles of the present invention are:
The circuit of the utility model embodiment is using platinum resistance temperature sensor, by the way that temperature sensor to be fixed on
On controlled device, and the resistance value of itself is converted by the electric current of the high precise current source injection in signal enhanced processing module
It is transmitted to the operational amplifier of signal enhanced processing module for voltage signal, is then transmit to the ADC pin of master controller MCU.
The real time temperature surveyed by obtaining sensor after calculating, is then written to master controller by real time temperature and by input equipment
The set temperature of MCU is compared, PWM (the Pulse Width Modulation) control amount being calculated by pid algorithm,
Output phase answers the PWM square wave and low and high level of duty ratio.It exports by electrical isolation module, logical transition module to H bridge and drives
Dynamic model block, thus the output voltage size and Orientation that control is output on TEC.TEC, that is, Thermo Electric
Cooler, also known as semiconductor cooler are made of the Peltier effect using semiconductor material.So-called Peltier effect, refers to
When the galvanic couple that DC current is made up of two kinds of semiconductor materials, one end heat absorption, the phenomenon that the heat release of one end.The N of heavy doping
The bismuth telluride of type and p-type is mainly used as the semiconductor material of TEC, and Bismuth Telluride elements are to generate heat parallel using electrically coupled in series.
TEC includes some p-types and N-type to (group), they are connected together by electrode, and is clipped between two ceramic electrodes;When having
When electric current is flowed through from TEC, the heat that electric current generates can pass to the other side from the side of TEC, and " heat " side and " cold " are generated on TEC
The heating and refrigeration of TEC are realized in side.
Although above having made detailed description to the utility model with generality explanation and specific embodiment,
On the basis of the utility model, it can be made some modifications or improvements, this is apparent to those skilled in the art
's.Therefore, these modifications or improvements on the basis of without departing from the spirit of the present invention, belong to the utility model and want
Seek the range of protection.
Claims (7)
1. a kind of temperature-control circuit based on gene sequencing, it is characterised in that: including constant current source module, signal enhanced processing mould
Block, master controller MCU, electrical isolation module, logical transition module, H bridge drive module, TEC module and it is mounted on controlled set
Standby upper temperature sensor;The output end of the constant current source module connects the input terminal of the temperature sensor, and the temperature passes
The output end of sensor connects the input terminal of the signal enhanced processing module, the output end connection of the signal enhanced processing module
The ADC pin of the master controller MCU, the input terminal of the output end connection electrical isolation module of the master controller MCU are described
The input terminal of the output end connection logical transition module of electrical isolation module, the output end of the logical transition module connect H bridge
The output end of the input terminal of drive module, the H bridge drive module connects TEC module, is realized by the temperature change of TEC module
Temperature control to controlled device;The constant current source module is mainly by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th
Resistance R7, source of stable pressure Q1 and voltage of voltage regulation VCC composition, one end of the 3rd resistance R3 is connect with voltage of voltage regulation VCC, another
End is connect with the 5th resistance R5, the 6th resistance R6, the 7th resistance R7 and source of stable pressure Q1 respectively, and the 5th resistance R5 is resistance-changing resistor,
The resistance value size of the 5th resistance R5 is adjusted in source of stable pressure Q1, and the 5th resistance R5 connect with source of stable pressure Q1, and the 5th resistance R5 with surely
GND contact is equipped between potential source Q1.
2. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the signal amplification
Processing module includes the 8th resistance R8, the 9th resistance R9, the 10th resistance R10, the 11st resistance R11, the 12nd resistance R12, the 14th resistance
R14, the 1st capacitor C1, the second capacitor C2, operational amplifier U1 and voltage-stabiliser tube D1.
3. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the electrical isolation
Module is mainly made of the 1st resistance R1, the 2nd resistance R2, the 4th resistance R4, the 13rd resistance R13 and photoelectrical coupler U2, U3.
4. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the logical transition
Module with door chip P4, P5 and NOT gate chip P3 mainly by forming.
5. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the H bridge driving
Module is mainly made of 4 field-effect tube Q2, Q3, Q4, Q5 and 4 diodes D2, D3, D4, D5.
6. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the temperature sensing
Device is platinum resistance temperature sensor.
7. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the temperature sensing
Device is fixed on controlled device by heat conductive silica gel.
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CN109161477A (en) * | 2018-08-30 | 2019-01-08 | 北京龙基高科生物科技有限公司 | A kind of temperature-control circuit and its application based on gene sequencing |
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CN109161477A (en) * | 2018-08-30 | 2019-01-08 | 北京龙基高科生物科技有限公司 | A kind of temperature-control circuit and its application based on gene sequencing |
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