CN208949300U - A kind of temperature-control circuit based on gene sequencing - Google Patents

A kind of temperature-control circuit based on gene sequencing Download PDF

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Publication number
CN208949300U
CN208949300U CN201821412620.6U CN201821412620U CN208949300U CN 208949300 U CN208949300 U CN 208949300U CN 201821412620 U CN201821412620 U CN 201821412620U CN 208949300 U CN208949300 U CN 208949300U
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resistance
module
temperature
control circuit
gene sequencing
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CN201821412620.6U
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杨金禄
赵光磊
埃塞基耶尔·提托·马丁斯·科埃略
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Beijing Genendra Biotech Co Ltd
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Beijing Genendra Biotech Co Ltd
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Abstract

The embodiments of the present invention disclose a kind of temperature-control circuit based on gene sequencing, and the temperature-control circuit based on gene sequencing includes constant current source module, signal enhanced processing module, master controller MCU, electrical isolation module, logical transition module, H bridge drive module, TEC module and the temperature sensor being mounted on controlled device.Temperature-control circuit provided by the embodiment of the utility model based on gene sequencing can be realized the high efficiency to biochemistry medical apparatus and instruments, high reliability, high automation, fast reaction stationary temperature control, meet the requirement of experiment of biochemistry instrument and equipment.

Description

A kind of temperature-control circuit based on gene sequencing
Technical field
The embodiments of the present invention are related to technical field of temperature control, and in particular to a kind of temperature based on gene sequencing Control circuit.
Background technique
In technical fields such as biochemistry, medical instrument, electronics industries, it is required to freeze using temperature control equipment Or the operation of heating, temperature control is carried out to substances such as reagent, enzymes.Such as the instruments such as PCR instrument, gene sequencer are using When, require the operation that physical reactions and chemical reaction are carried out to sample reagent.It just needs during the reaction according to different The operation that period is heated up or cooled down.Such as: need temperature to reach 90 DEG C the denaturation of DNA, when DNA replication dna It just needs to be maintained at 70 DEG C to expand etc..
Currently, the temprature control unit in most of biochemistry instrument and equipment is not able to satisfy reaction speed, precision, efficiency Etc. requirement.
Utility model content
The utility model embodiment is designed to provide a kind of temperature-control circuit based on gene sequencing, to solve The problem of existing biochemistry instrument and equipment temprature control unit requires in terms of not being able to satisfy reaction speed, precision, efficiency.
To achieve the above object, the technical solution of embodiment provided by the utility model are as follows: a kind of based on gene sequencing Temperature-control circuit, including constant current source module, signal enhanced processing module, master controller MCU, electrical isolation module, logic turn Change the mold block, H bridge drive module, TEC module and the temperature sensor being mounted on controlled device;
The output end of the constant current source module connects the input terminal of the temperature sensor, the output of the temperature sensor End connects the input terminal of the signal enhanced processing module, and the output end of the signal enhanced processing module connects the main control The ADC pin of device MCU, the input terminal of the output end connection electrical isolation module of the master controller MCU, the electrical isolation mould The input terminal of the output end connection logical transition module of block, the output end connection H bridge drive module of the logical transition module The output end of input terminal, the H bridge drive module connects TEC module, is realized by the temperature change of TEC module to controlled device Temperature control;
The constant current source module is mainly by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th resistance R7, source of stable pressure Q1 and voltage of voltage regulation VCC composition, one end of the 3rd resistance R3 are connect with voltage of voltage regulation VCC, and the other end is electric with the 5th respectively Resistance R5, the 6th resistance R6, the 7th resistance R7 are connected with source of stable pressure Q1, and the 5th resistance R5 is resistance-changing resistor, and source of stable pressure Q1 is adjustable The resistance value size of 5th resistance R5, the 5th resistance R5 is connect with source of stable pressure Q1, and is equipped between the 5th resistance R5 and source of stable pressure Q1 GND contact.
Among some embodiments, the signal enhanced processing module includes the 8th resistance R8, the 9th resistance R9, the 10th Resistance R10, the 11st resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1, the second capacitor C2, operational amplifier U1 With voltage-stabiliser tube D1.
Among some embodiments, the electrical isolation module is mainly by the 1st resistance R1, the 2nd resistance R2, the 4th electricity Hinder R4, the 13rd resistance R13 and photoelectrical coupler U2, U3 composition.
Among some embodiments, the logical transition module mainly by with door chip P4, P5 and NOT gate chip P3 composition.
Among some embodiments, the H bridge drive module is mainly by 4 field-effect tube Q2, Q3, Q4, Q5 and 4 A diode D2, D3, D4, D5 composition.
Among some embodiments, the temperature sensor is platinum resistance temperature sensor.
Among some embodiments, the temperature sensor is fixed on controlled device by heat conductive silica gel.
Compared with prior art, the embodiments of the present invention have the advantages that the embodiments of the present invention provide A kind of temperature-control circuit based on gene sequencing, including constant current source module, signal enhanced processing module, master controller MCU, Electrical isolation module, logical transition module, H bridge drive module, TEC module and the temperature sensing being mounted on controlled device Device;It can be realized by using the temperature-control circuit provided by the embodiment of the utility model based on gene sequencing to biochemistry The high efficiency of medical apparatus and instruments, high reliability, height automate, the stationary temperature of fast reaction controls, and meet biochemistry The requirement of experiment of instrument and equipment.
Detailed description of the invention
Fig. 1 is the comprising modules frame in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing Figure;
Fig. 2 a is at the signal amplification in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing Manage the circuit diagram of module;
Fig. 2 b is the temperature sensor in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing Circuit diagram;
Fig. 3 is the electrical isolation module in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing Circuit diagram;
Fig. 4 is the logical transition module in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing Circuit diagram;
Fig. 5 is the H bridge drive module in one exemplary embodiments of the utility model for the temperature-control circuit of gene sequencing Circuit diagram.
Specific embodiment
The following examples illustrate the utility model, but is not intended to limit the scope of the present invention.
The embodiments of the present invention are described in detail in the following with reference to the drawings and specific embodiments, the utility model Embodiment disclose a kind of temperature-control circuit based on gene sequencing, including constant current source module, signal enhanced processing module, Master controller MCU, electrical isolation module, logical transition module, H bridge drive module, TEC module and it is mounted on controlled device On temperature sensor;
The output end of the constant current source module connects the input terminal of the temperature sensor, the output of the temperature sensor End connects the input terminal of the signal enhanced processing module, and the output end of the signal enhanced processing module connects the main control The ADC pin of device MCU, the input terminal of the output end connection electrical isolation module of the master controller MCU, the electrical isolation mould The input terminal of the output end connection logical transition module of block, the output end connection H bridge drive module of the logical transition module The output end of input terminal, the H bridge drive module connects TEC module, is realized by the temperature change of TEC module to controlled device Temperature control;
The constant current source module is mainly by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th resistance R7, source of stable pressure Q1 and voltage of voltage regulation VCC composition.Wherein, one end of the 3rd resistance R3 is connect with voltage of voltage regulation VCC, the other end respectively with 5th resistance R5, the 6th resistance R6, the 7th resistance R7 are connected with source of stable pressure Q1, and the 5th resistance R5 is resistance-changing resistor, source of stable pressure Q1 The resistance value size of adjustable 5th resistance R5, the 5th resistance R5 are connect with source of stable pressure Q1, and the 5th resistance R5 and source of stable pressure Q1 it Between be equipped with GND contact.
Further, the signal enhanced processing module includes the 8th resistance R8, the 9th resistance R9, the 10th resistance R10, the 11 resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1, the second capacitor C2, operational amplifier U1 and voltage-stabiliser tube D1。
Further, the electrical isolation module is mainly by the 1st resistance R1, the 2nd resistance R2, the 4th resistance R4, the 13rd electricity Hinder R13 and photoelectrical coupler U2, U3 composition.
Further, the logical transition module with door chip P4, P5 and NOT gate chip P3 mainly by forming.
Further, the H bridge drive module is mainly by 4 field-effect tube Q2, Q3, Q4, Q5 and 4 diodes D2, D3, D4, D5 composition.
Further, the temperature sensor is preferably platinum resistance temperature sensor, but not limited to this.
Further, the temperature sensor is fixed on controlled device by heat conductive silica gel, but not limited to this.
In addition, the embodiments of the present invention additionally provide a kind of biochemistry instrument of temperature-controllable, including any one The above-mentioned temperature-control circuit based on gene sequencing.
The embodiments of the present invention are described in detail below with reference to several exemplary embodiments.
As shown in Figure 1, temperature control circuit of the utility model based on gene sequencing, comprising: master controller MCU, temperature sensing Device, signal enhanced processing module, electrical isolation module, logical transition module, H bridge drive module, input equipment and display unit Point.
As shown in Fig. 2, by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th resistance R7, high-precision voltage stabilizing source Q1 with And the high precise current source part of voltage of voltage regulation VCC composition generates constant current, and injects a current into platinum resistance temperature sensor, Platinum resistance temperature sensor resistance value is converted into voltage signal to realize.Wherein platinum resistance temperature sensor passes through heat conductive silica gel Fixed and temperature control device surface.By the variation of platinum resistance self-resistance value, then voltage signal is transmitted to subsequent by the 8th Resistance R8, the 9th resistance R9, the 10th resistance R10, the 11st resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1, The amplifying circuit that two capacitor C2, operational amplifier U1, voltage-stabiliser tube D1 are formed.Then by being transmitted to master control coremaking after amplification filtering The ADC pin of piece.
As shown in figure 3, the real time temperature surveyed by master controller MCU by obtaining sensor after calculating, it then will be real Shi Wendu is compared with the set temperature for being written to master controller MCU by input equipment, is calculated by pid algorithm PWM control amount, output phase answer the PWM square wave and low and high level of duty ratio.It is transmitted to by the 1st resistance R1, the 2nd resistance R2, the 4th The electrical isolation module of resistance R4, the 13rd resistance R13 and photoelectrical coupler U2, U3 composition.
As shown in figure 4, by electrical isolation module outflow signal pass through by with door chip P4, P5 and NOT gate chip P3 The logical transition module of composition.
As shown in figure 5, signal is transmitted to H bridge drive module after logical transition module.This module is by 4 field-effects Pipe Q2, Q3, Q4, Q5 and 4 diode D2, D3, D4, D5 compositions.By the MCU PWM transmitted and direction signal and surely Constant voltage VDD to carry out TEC module (P2) control of current direction and size.It is quickly anti-with the temperature for reaching TEC generation It answers and keeps stable temperature.
The principles of the present invention are:
The circuit of the utility model embodiment is using platinum resistance temperature sensor, by the way that temperature sensor to be fixed on On controlled device, and the resistance value of itself is converted by the electric current of the high precise current source injection in signal enhanced processing module It is transmitted to the operational amplifier of signal enhanced processing module for voltage signal, is then transmit to the ADC pin of master controller MCU. The real time temperature surveyed by obtaining sensor after calculating, is then written to master controller by real time temperature and by input equipment The set temperature of MCU is compared, PWM (the Pulse Width Modulation) control amount being calculated by pid algorithm, Output phase answers the PWM square wave and low and high level of duty ratio.It exports by electrical isolation module, logical transition module to H bridge and drives Dynamic model block, thus the output voltage size and Orientation that control is output on TEC.TEC, that is, Thermo Electric Cooler, also known as semiconductor cooler are made of the Peltier effect using semiconductor material.So-called Peltier effect, refers to When the galvanic couple that DC current is made up of two kinds of semiconductor materials, one end heat absorption, the phenomenon that the heat release of one end.The N of heavy doping The bismuth telluride of type and p-type is mainly used as the semiconductor material of TEC, and Bismuth Telluride elements are to generate heat parallel using electrically coupled in series. TEC includes some p-types and N-type to (group), they are connected together by electrode, and is clipped between two ceramic electrodes;When having When electric current is flowed through from TEC, the heat that electric current generates can pass to the other side from the side of TEC, and " heat " side and " cold " are generated on TEC The heating and refrigeration of TEC are realized in side.
Although above having made detailed description to the utility model with generality explanation and specific embodiment, On the basis of the utility model, it can be made some modifications or improvements, this is apparent to those skilled in the art 's.Therefore, these modifications or improvements on the basis of without departing from the spirit of the present invention, belong to the utility model and want Seek the range of protection.

Claims (7)

1. a kind of temperature-control circuit based on gene sequencing, it is characterised in that: including constant current source module, signal enhanced processing mould Block, master controller MCU, electrical isolation module, logical transition module, H bridge drive module, TEC module and it is mounted on controlled set Standby upper temperature sensor;The output end of the constant current source module connects the input terminal of the temperature sensor, and the temperature passes The output end of sensor connects the input terminal of the signal enhanced processing module, the output end connection of the signal enhanced processing module The ADC pin of the master controller MCU, the input terminal of the output end connection electrical isolation module of the master controller MCU are described The input terminal of the output end connection logical transition module of electrical isolation module, the output end of the logical transition module connect H bridge The output end of the input terminal of drive module, the H bridge drive module connects TEC module, is realized by the temperature change of TEC module Temperature control to controlled device;The constant current source module is mainly by the 3rd resistance R3, the 5th resistance R5, the 6th resistance R6, the 7th Resistance R7, source of stable pressure Q1 and voltage of voltage regulation VCC composition, one end of the 3rd resistance R3 is connect with voltage of voltage regulation VCC, another End is connect with the 5th resistance R5, the 6th resistance R6, the 7th resistance R7 and source of stable pressure Q1 respectively, and the 5th resistance R5 is resistance-changing resistor, The resistance value size of the 5th resistance R5 is adjusted in source of stable pressure Q1, and the 5th resistance R5 connect with source of stable pressure Q1, and the 5th resistance R5 with surely GND contact is equipped between potential source Q1.
2. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the signal amplification Processing module includes the 8th resistance R8, the 9th resistance R9, the 10th resistance R10, the 11st resistance R11, the 12nd resistance R12, the 14th resistance R14, the 1st capacitor C1, the second capacitor C2, operational amplifier U1 and voltage-stabiliser tube D1.
3. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the electrical isolation Module is mainly made of the 1st resistance R1, the 2nd resistance R2, the 4th resistance R4, the 13rd resistance R13 and photoelectrical coupler U2, U3.
4. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the logical transition Module with door chip P4, P5 and NOT gate chip P3 mainly by forming.
5. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the H bridge driving Module is mainly made of 4 field-effect tube Q2, Q3, Q4, Q5 and 4 diodes D2, D3, D4, D5.
6. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the temperature sensing Device is platinum resistance temperature sensor.
7. the temperature-control circuit according to claim 1 based on gene sequencing, it is characterised in that: the temperature sensing Device is fixed on controlled device by heat conductive silica gel.
CN201821412620.6U 2018-08-30 2018-08-30 A kind of temperature-control circuit based on gene sequencing Active CN208949300U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109161477A (en) * 2018-08-30 2019-01-08 北京龙基高科生物科技有限公司 A kind of temperature-control circuit and its application based on gene sequencing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109161477A (en) * 2018-08-30 2019-01-08 北京龙基高科生物科技有限公司 A kind of temperature-control circuit and its application based on gene sequencing

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