CN208923118U - A kind of three-dimensional encapsulation SIP module - Google Patents
A kind of three-dimensional encapsulation SIP module Download PDFInfo
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- CN208923118U CN208923118U CN201821518149.9U CN201821518149U CN208923118U CN 208923118 U CN208923118 U CN 208923118U CN 201821518149 U CN201821518149 U CN 201821518149U CN 208923118 U CN208923118 U CN 208923118U
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- printed circuit
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Abstract
The utility model relates to a kind of three-dimensional encapsulation SIP modules, including microprocessor chip, and the memory chip and transponder chip being connect respectively with microprocessor chip, it further include the muti-piece printed circuit board stacked from bottom to up, muti-piece printed circuit board includes a pin printed circuit board and at least two pieces storing printed circuit boards on pin printed circuit board, microprocessor chip, memory chip and transponder chip, which are set to, to be put on printed circuit board but is not set on same storing printed circuit board entirely, muti-piece printed circuit board is integrated by epoxy resin encapsulated, pin printed circuit board is encapsulated using PGA, pin printed circuit board is equipped with the pin for external connection.The SIP module of the utility model uses three-dimensional encapsulation, avoids all chips of juxtaposition in a printed circuit board, reduces the plane space of printed circuit board occupancy, suitable for each complicated, narrow workplace.
Description
Technical field
The utility model relates to the technical field of electronic module, especially a kind of three-dimensional encapsulation SIP module.
Background technique
Major part integrated circuit is all made of planar package form at present, i.e., integrates the envelope of one single chip in the same plane
Dress technology.Due to being limited by area, it is difficult to integrate muti-piece chip in the same plane.So-called three-dimensional encapsulation is one close
A kind of in the past few years emerging integrated antenna package technology breaches the concept of conventional planar encapsulation, it is in three-dimensional space
It is interior to realize the encapsulation technology that muti-piece chip (having encapsulated chip or bare die) is stacked in single package body.
Due to having to certain occupied plane spaces of the equipment using printed circuit board certain in some particular places
Limitation, just may need to reduce the area of plane of printed circuit board, especially be widely used in the SIP in the fields such as Aeronautics and Astronautics
Module.
Utility model content
For overcome the deficiencies in the prior art, the purpose of the utility model is to provide a kind of three-dimensional encapsulation SIP module, energy
The plane space that relative reduction printed circuit board occupies.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of three-dimensional encapsulation SIP module, is deposited including microprocessor chip and respectively with what the microprocessor chip was connect
Memory chip and transponder chip further include the muti-piece printed circuit board stacked from bottom to up, the muti-piece printed circuit
Plate includes a pin printed circuit board and at least two pieces storing printed circuit boards on the pin printed circuit board, described
Microprocessor chip, memory chip and transponder chip are set on the storing printed circuit board but are not set to same storing entirely
On printed circuit board, the muti-piece printed circuit board is integrated by epoxy resin encapsulated, and the pin printed circuit board uses
PGA encapsulation, the pin printed circuit board are equipped with the pin for external connection, and the pin is used as module and externally accesses letter
Number and external output signal physical connection object.
Further, the memory chip includes first memory chip and second memory chip, first storage
Device chip and second memory chip are connect with the microprocessor chip respectively, and the first memory chip is deposited using SRAM
Memory chip, the second memory chip use FLASH memory chip.
Further, the storing printed circuit board includes four pieces, and first puts printed circuit board for the first storage to be arranged
Device chip, the second storing printed circuit board are put printed circuit board and are received for being arranged for second memory chip, third to be arranged
Device chip is sent out, the 4th storing printed circuit board is for being arranged microprocessor chip.
Further, the transponder chip uses 1553B transponder chip.
Further, the microprocessor chip uses the SOC microprocessor chip of SPARC V8 framework.
Further, the muti-piece printed circuit board is encapsulated using PGA, and is integrated by epoxy resin encapsulated.
The beneficial effects of the utility model are: the SIP module of the utility model uses three-dimensional encapsulation, avoids and printed at one piece
All chips of juxtaposition on printed circuit board reduce the plane space of printed circuit board occupancy, suitable for each complicated, narrow work
Place.
Detailed description of the invention
Specific embodiment of the present utility model is further described with reference to the accompanying drawing:
Fig. 1 is the structural schematic diagram of the utility model.
Specific embodiment
In order to make those skilled in the art better understand the scheme of the utility model, practical to this below in conjunction with attached drawing
Technical solution in new embodiment is clearly and completely described, it is clear that described embodiment is only the utility model
The embodiment of a part, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The model of the utility model protection all should belong in the every other embodiment obtained without creative efforts
It encloses.
Referring to Fig.1, a kind of three-dimensional encapsulation SIP module, including microprocessor chip 51 and respectively with the microprocessor core
First memory chip 21, second memory chip 31 and the transponder chip 41 that piece 51 connects, further include carrying out from bottom to up
Five printed circuit boards stacked, five printed circuit board include a pin printed circuit board 1 and print positioned at the pin
Four pieces of storing printed circuit boards on printed circuit board 1, first storing printed circuit board 2 for be arranged first memory chip 21 and
Peripheral capacitance resistance ware, the second storing printed circuit board 3 are set for second memory chip 31 and peripheral capacitance resistance ware, third to be arranged
Printed circuit board 4 is put for transponder chip 41 and peripheral capacitance resistance ware to be arranged, the 4th storing printed circuit board 5 is micro- for being arranged
Muti-piece printed circuit board described in processor chips 51, clock crystal oscillator chip and peripheral capacitance resistance ware is by 7 encapsulating of epoxy resin
One, the pin printed circuit board 1 are encapsulated using PGA, and the pin printed circuit board 1 is equipped with drawing for external connection
Foot 6, the pin 6 are used as the physical connection object that module externally accesses signal and external output signal.
The first memory chip 21 uses the SRAM memory that memory capacity is 32 for 1Mb, data-bus width
Chip, the second memory chip 31 use FLASH memory chip, and the transponder chip 41 uses 1553B transceiver
Chip, it for 4Gb, data-bus width is 32 based on SPARC V8 framework that the microprocessor chip 51, which uses memory capacity,
SOC microprocessor chip.Five printed circuit boards expose printed circuit lines after encapsulating, cutting on periphery, and in appearance
Face is equipped with plating gold bonding wire, plates gold bonding wire for the printed circuit lines exposed in five printed circuit board and is associated company
It connects, the three-dimensional envelope of to form a RAM memory capacity be 1Mb, ROM memory capacity 128Mb, data-bus width is 32 one
Fill SIP module.The signal that the three-dimensional encapsulation SIP module can be drawn includes 1553B bus transfer signal, CAN bus transmission
Signal, Space Wire data transfer signal, I2C interface signal, SPI interface signal, jtag interface signal, UART interface signal
Deng.
The preparation process of the three-dimensional encapsulation SIP module is as follows:
(1) SRAM memory chip and peripheral capacitance resistance ware are seated on the first storing printed circuit board 2, FLAS is deposited
Memory chip and peripheral capacitance resistance ware are seated on the second storing printed circuit board 3, by 1553B transponder chip and peripheral capacitance-resistance
Device is seated in third and puts on printed circuit board 4, by SOC microprocessor chip, clock crystal oscillator chip and peripheral capacitance resistance ware
It is seated on the 4th storing printed circuit board 5；
(2) pin printed circuit board 1, first is put into printed circuit board 2, second and puts printed circuit board 3, third storing
Printed circuit board the 4, the 4th is put printed circuit board 5 and is stacked from bottom to up；
(3) five printed circuit boards are potted using epoxy resin 7, five printed circuit boards after encapsulating is carried out
Cutting allows five printed circuit boards to expose electrical connection pin on respective periphery；
(4) surface gold-plating is carried out to form Gold plated Layer to five printed circuit boards, at this point, Gold plated Layer is printed with four pieces of storings
Circuit board exposes electrical connection pin on respective periphery, and the electrical connection pin of exposing is connected with each other, is connected to simultaneously
On pin 6 on pin printed circuit board 1；
(5) in order to which the signal node of the separation is separated, line engraving in surface is carried out to form gold-plated company to Gold plated Layer
The electrical connection pin of exposing is associated by wiring, plating gold bonding wire.
In conclusion above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；Although ginseng
The utility model is described in detail according to previous embodiment, those skilled in the art should understand that；It is still
It can modify the technical solutions described in the foregoing embodiments, or equally be replaced to being wherein no lack of technical characteristic
It changes, and these are modified or replaceed, the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution
Spirit and scope.
Claims (5)
1. a kind of three-dimensional encapsulation SIP module, it is characterised in that: including microprocessor chip (51) and respectively with the micro process
The memory chip and transponder chip (41) of device chip (51) connection further include the muti-piece printing electricity stacked from bottom to up
Road plate, the muti-piece printed circuit board include a pin printed circuit board (1) and are located on the pin printed circuit board (1)
At least two pieces storing printed circuit boards, the microprocessor chip (51), memory chip and transponder chip (41) are set to institute
It states and puts on printed circuit board but be not set on same storing printed circuit board entirely, the muti-piece printed circuit board passes through asphalt mixtures modified by epoxy resin
Rouge (7) encapsulating is integrated, and the pin printed circuit board (1) is encapsulated using PGA, and the pin printed circuit board (1) is equipped with
For the pin (6) of external connection, the pin (6) is used as the physical connection that module externally accesses signal and external output signal
Object.
2. three-dimensional encapsulation SIP module according to claim 1, it is characterised in that: the memory chip is deposited including first
Memory chip (21) and second memory chip (31), the first memory chip (21) and second memory chip (31) point
It not being connect with the microprocessor chip (51), the first memory chip (21) uses SRAM memory chip, and described the
Two memory chips (31) use FLASH memory chip.
3. three-dimensional encapsulation SIP module according to claim 2, it is characterised in that: the storing printed circuit board includes four
Block, first puts printed circuit board (2) for being arranged first memory chip (21), and second, which puts printed circuit board (3), is used for
It is arranged second memory chip (31), third puts printed circuit board (4) for being arranged transponder chip (41), and the 4th puts print
Printed circuit board (5) is for being arranged microprocessor chip (51).
4. three-dimensional encapsulation SIP module according to claim 1 or 3, it is characterised in that: the transponder chip (41) uses
1553B transponder chip.
5. three-dimensional encapsulation SIP module according to claim 1 or 3, it is characterised in that: the microprocessor chip (51) is adopted
With the SOC microprocessor chip of SPARC V8 framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821518149.9U CN208923118U (en) | 2018-09-17 | 2018-09-17 | A kind of three-dimensional encapsulation SIP module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821518149.9U CN208923118U (en) | 2018-09-17 | 2018-09-17 | A kind of three-dimensional encapsulation SIP module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208923118U true CN208923118U (en) | 2019-05-31 |
Family
ID=66705933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821518149.9U Active CN208923118U (en) | 2018-09-17 | 2018-09-17 | A kind of three-dimensional encapsulation SIP module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208923118U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128980A (en) * | 2019-12-04 | 2020-05-08 | 珠海欧比特宇航科技股份有限公司 | Heat dissipation processing method for three-dimensional packaging internal device |
-
2018
- 2018-09-17 CN CN201821518149.9U patent/CN208923118U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128980A (en) * | 2019-12-04 | 2020-05-08 | 珠海欧比特宇航科技股份有限公司 | Heat dissipation processing method for three-dimensional packaging internal device |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 102-17, 1st Floor, Building 2, No. 88 Xiangshan Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province, 519000 Patentee after: Zhuhai Tanyuxin Technology Co.,Ltd. Address before: 3 / F, R & D building, 1 Baisha Road, Dongan, Tangjiawan Town, Zhuhai, Guangdong 519080 Patentee before: ZHUHAI ORBITA ELECTRONIC Co.,Ltd. |
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| CP03 | Change of name, title or address |