CN208913022U - A kind of metal-oxide-semiconductor pin apparatus for bending - Google Patents
A kind of metal-oxide-semiconductor pin apparatus for bending Download PDFInfo
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- CN208913022U CN208913022U CN201821592417.1U CN201821592417U CN208913022U CN 208913022 U CN208913022 U CN 208913022U CN 201821592417 U CN201821592417 U CN 201821592417U CN 208913022 U CN208913022 U CN 208913022U
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Abstract
The utility model provides a kind of metal-oxide-semiconductor pin apparatus for bending, includes the open cabinet of one side, and hold-down devices, power module, push control button and control unit at support plate；The hold-down devices include lower air cylinder, connecting plate, the first pressing down section and lower platen；The ontology of lower air cylinder is fixed on cabinet upper end vertically, and piston end is fixedly connected with connecting plate and protrudes into box house；First pressing down section is adjacent with lower platen and is arranged in parallel, wherein the first pressing down section and connecting plate elastic connection, lower platen are fixedly connected with connecting plate；Lower platen is equipped with chamfering inclined-plane between the side wall and lower platen bottom of the first pressing down section side；The support plate is equipped with metal-oxide-semiconductor limiting slot；The metal-oxide-semiconductor limiting slot includes pin limiting slot, the side edge of pin limiting slot and support plate long side.The utility model proposes a kind of metal-oxide-semiconductor pin apparatus for bending can accelerate metal-oxide-semiconductor processing efficiency, while guaranteeing that processing quality is consistent and the safety of personnel.
Description
Technical field
The utility model relates to metal-oxide-semiconductor processing technique fields, and in particular to a kind of metal-oxide-semiconductor pin apparatus for bending.
Background technique
Due to the demand of product structure and processing technology, the stitch of straight-line metal-oxide-semiconductor is needed according to different size bending part
Reason.Existing apparatus for bending is realized by manual compression mould, since the dynamics manually controlled is uneven, the manufacture of one side all big enterprises
Metal-oxide-semiconductor specification it is different, the bending demand being on the other hand installed on circuit board is different, and that causes each batch is bent into quality
Measure it is irregular, sometimes in process since impulse force unevenness tilts the ontology of metal-oxide-semiconductor, or even because misoperation roll over
Disconnected pin damages part, and metal-oxide-semiconductor is caused to waste.It needs operating personnel that metal-oxide-semiconductor is placed into station when operation, and is operating
It sees whether suitably to be adjusted in suitable position in the process, processing efficiency is not high.Since metal-oxide-semiconductor is smaller, it is easy to hand clamping,
Cause safety coefficient low.Therefore, the metal-oxide-semiconductor bending tool that especially needed one kind more standardizes at present.
Utility model content
Problem to be solved in the utility model is to provide a kind of metal-oxide-semiconductor for the above-mentioned deficiency in the presence of the prior art
Pin apparatus for bending can make the bending quality more standard, uniformly of metal-oxide-semiconductor, keep metal-oxide-semiconductor Bending Processing more efficient, simultaneously
Guarantee the safety of operating personnel's operation.
To achieve the above object, the utility model uses a kind of the following technical solution: metal-oxide-semiconductor pin apparatus for bending,
It include the open cabinet of one side, hold-down devices, power module, push control button and control unit at support plate；The pushing
Device includes lower air cylinder, connecting plate, the first pressing down section and lower platen；The ontology of lower air cylinder is fixed on cabinet upper end vertically,
Its piston end is fixedly connected with connecting plate and protrudes into box house；First pressing down section is adjacent with lower platen and is arranged in parallel,
Wherein the first pressing down section and connecting plate elastic connection, lower platen are fixedly connected with connecting plate；Lower platen leans on the first pressing down section side
Side wall and lower platen bottom between be equipped with chamfering inclined-plane；The support plate is equipped with metal-oxide-semiconductor limiting slot；The MOS pipe limiting slot
Include pin limiting slot, the side edge of pin limiting slot and support plate long side；The output of control unit and the triggering of lower air cylinder
Control terminal is connected；The input of control unit is connected to power module feeder ear through pushing control button.
Compared with the prior art, the utility model has the following beneficial effects:
Bending efficiency can be improved, is saved manpower and time with the multiple metal-oxide-semiconductors of simultaneous processing；It is controlled down by lower air cylinder
Pressing plate function is in metal-oxide-semiconductor, pin uniform force, and quality is unified and easily operated；Connected by the first pressing down section and connecting plate elasticity
Fixed metal-oxide-semiconductor when pushing is connect, prevents from shifting in metal-oxide-semiconductor process, accelerates processing efficiency, ensure the peace of operating personnel
Entirely；Lower platen is equipped with chamfering inclined-plane between the side wall and lower platen bottom of the first pressing down section side, protects in process
Pin, and inclined-plane can in pin bending process round and smooth contact pin radian, prevent due to lower platen bottom and pin contact surface
Product is small and scratches pin, and metal-oxide-semiconductor limiting slot further fixes metal-oxide-semiconductor；The side edge of pin limiting slot and support plate long side, pin
Pin limiting slot one end is stretched out, pin is processed convenient for lower platen；The output of control unit and the triggering control of lower air cylinder
End processed is connected；The input of control unit is pushed control button and is connected to power module power supply termination, makes to operate safer, simple
Just.
The further advantage, target and feature of the utility model will be partially reflected by the following instructions, and part will also pass through
Research and practice to the utility model and be understood by the person skilled in the art.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of metal-oxide-semiconductor pin apparatus for bending of the utility model；
Fig. 2 is the structural schematic diagram of the utility model support plate；
Fig. 3 is the schematic diagram of the utility model lower platen and the second pressing down section；
Fig. 4 is the structural schematic diagram of the second pressing down section of the utility model；
Fig. 5 is the utility model shaping moudle structure schematic diagram；
Fig. 6 is utility model works schematic illustration.
Cabinet 1, pushes control button 3, lower air cylinder 4, connecting plate 5, the first pressing down section 6, lower platen 7, chamfering at support plate 2
Inclined-plane 71, boss 72, the second pressing down section 8, strip through-hole 81, baffle 82, support plate 9, metal-oxide-semiconductor limiting slot 10, pin limiting slot
101, caging bolt 11, side push away control button 12, side push cylinder 13, shaping mould 14, infrared emission light curtain 15, metal-oxide-semiconductor tube body 16,
Metal-oxide-semiconductor pin 17.
Specific embodiment
In order to make technological means of the utility model, creation characteristic, reach purpose and effect is more clear and is easy to
Understand, the utility model be further elaborated with reference to the accompanying drawings and detailed description:
The utility model embodiment as shown in figs. 1 to 6, as shown in Figure 1, a kind of metal-oxide-semiconductor pin apparatus for bending, includes one
The open cabinet 1 in side, support plate 92, power module, pushes control button 3 and control unit at hold-down devices；The hold-down devices
Including lower air cylinder 124, connecting plate 5, the first pressing down section 6 and lower platen 7；The ontology of lower air cylinder 124 is fixed on cabinet 1 vertically
Upper end, piston end are fixedly connected with connecting plate 5 and protrude into inside cabinet 1；First pressing down section 6 it is adjacent with lower platen 7 and
It is arranged in parallel, wherein the first pressing down section 6 and 5 elastic connection of connecting plate, lower platen 7 are fixedly connected with connecting plate 5；Lower platen 7 leans on
Chamfering inclined-plane 71 is equipped between 7 bottom of side wall and lower platen of first pressing down section, 6 side；Preferably, chamfer is stretched along pin
Metal-oxide-semiconductor tube body direction tilts down out.As shown in Fig. 2, the structural schematic diagram of support plate 92, the support plate 92 is limited equipped with metal-oxide-semiconductor
Position slot 10；The metal-oxide-semiconductor limiting slot 10 includes pin limiting slot 101, the edge phase of pin limiting slot 101 and 92 long side of support plate
It connects；The output of control unit is connected with the trigger control end of lower air cylinder 124；The input of control unit is through pushing control button 3
It is connected to power module feeder ear.
When the utility model is used or tested, non-bending metal-oxide-semiconductor is fixed by metal-oxide-semiconductor limiting slot 10, metal-oxide-semiconductor pin edge
Pin limiting slot 101 stretches out 92 one end of support plate.The input of control unit is pushed control button 3 and is connected to power module power supply
End, the output of control unit are connected with the trigger control end of lower air cylinder 124, press and push first processing of the starting of control button 3
Subordinate's pressure.First pressing down section 6 is adjacent with lower platen 7 and is arranged in parallel, wherein the first pressing down section 6 and 5 elastic connection of connecting plate, the
One pressing down section 6 is touched and is fixed support plate 92 due to elastic acting force after support plate 92, and the pushing of lower platen 7 makes pin along vertical
The bending in direction.Since lower platen 7 is equipped with chamfering inclined-plane 71 between 7 bottom of side wall and lower platen of 6 side of the first pressing down section,
The movement that 7 bottom surface of lower platen pushes after contacting with pin bends pin, pin and pushing when 7 bottom surface of lower platen is set as plane
The contact area of 7 bottom of plate is gradually decrease to line contact, scratch pin is easy to, so being arranged to the round and smooth contact in chamfering inclined-plane 71
Pin after bending prevents 7 line of lower platen contact pin from pin being caused to scratch.Preferably, chamfer stretches out metal-oxide-semiconductor pipe along pin
Body direction tilts down, and 7 bottom surface of lower platen and pin contact area increase when making to push, better protection pin.It is pressed after processing
Pushing control button 3 closes lower air cylinder 124, and lower platen 7 removes metal-oxide-semiconductor pin upwards.
As shown in figure 3,8 schematic diagram of lower platen 7 and the second pressing down section, the side wall of the lower platen 7 is equipped with boss 72；It is corresponding
, the hold-down devices also include the second pressing down section 8；The matched of second pressing down section 8 and lower platen 7, second pushes
Portion 8 is equipped with longitudinal perforative strip through-hole 81；Lower platen 7 is arranged in strip through-hole 81；As shown in figure 4, the second pressing down section 8
Structural schematic diagram, the minimum widith of strip through-hole 81 between the maxima and minima of 7 sidewall thickness of lower platen, specifically,
It is realized by being equipped with baffle 82 corresponding with boss 72 in strip through-hole 81；Second pressing down section 8 is flexibly connected with connecting plate 5.
Sliding panel is driven to push by lower air cylinder 124, to upper activity after the second pressing down section 8 touches support plate 92, by
Pin is bent downwards in the lower platen 7 in the second activity upwards of pressing down section 8, strip through-hole 81.Due to the boss 72 of lower platen 7
Setting, and the minimum widith of strip through-hole 81, between the maxima and minima of 7 sidewall thickness of lower platen, lower platen 7 is adding
After the complete pin of work, the second pressing down section 8 limits the lower pan position of lower platen 7 due to the boss 72 on 7 side wall of lower platen, prevents from pushing
7 bottom of plate excessively pushes and damages.And the matched of the second pressing down section 8 and lower platen 7, the second pressing down section 8 are set in down
It can also play the role of protecting pressing down section outside pressing plate 7.It is pushed by adjusting the position of baffle 82 in the vertical direction to be arranged
The depression distance of plate 7, to adapt to the different bending angle of metal-oxide-semiconductor pin.
It also include several caging bolts 13；The caging bolt 13 passes through connecting plate 5 and is threadedly coupled with the second pressing down section 8.
Under the action of caging bolt 13 and connecting plate 5 offset, the second pressing down section 8 is no longer moved upwards relative to band movable plate, that is, is pushed
Plate 7 is no longer to pin bending.And then lower platen 7 is stretched out by the second pressing down section 8 length by the active length of setting caging bolt 13
Degree matches with pin bending angle.
Control button 14 also is pushed away comprising side and side pushes into type processing department；The side pushes into type processing department equipped with side push cylinder
15, shaping mould 16；The ontology level of side push cylinder 15 is fixed on the side of cabinet 1, and piston end is connect and deep with shaping mould 16
Enter inside cabinet 1；Shaping mould 16 is opposite close to 101 one end of pin limiting slot with support plate 92 far from 15 one end of side push cylinder.Such as Fig. 5
Shown, 16 structural schematic diagram of shaping mould, side wall of the shaping mould 16 far from 15 side of side push cylinder includes to limit with support plate 92 by pin
The identical or opposite curve form of the side wall of position 101 side of slot；The output of control unit and the trigger control end of side push cylinder 15
It is connected, the feeder ear of power module is independently connected through side button push with another input terminal of control unit.
In order to meet the requirement of metal-oxide-semiconductor varying strength, installation space, type processing department is pushed into pin by side after bending
Radian further processing.Control button 14, open side push cylinder 15 are pushed away by downside.Since shaping mould 16 is far from side push cylinder
The side wall of 15 sides includes the identical or opposite curve form of the side wall with support plate 92 by 101 side of pin limiting slot, shaping mould
16 offset with support plate 92 processes pin radian.
Side wall upper part of the support plate 2 by 101 side of pin limiting slot includes inner sunken face, and one end of inner sunken face and pin limit
Position slot 101 is connected by circular arc chamfering, the other end of inner sunken face and the tangent connection of support plate lower sidewall.
It also include infrared emission light curtain 17 and safety relay；The infrared emission light curtain 17 is set to 1 open side of cabinet
Both ends, the feeder ear of infrared emission light curtain 17 is connected with power module, the output of infrared emission light curtain 17 and safety relay
Triggering end be connected；Switch motion end of the output of power module through safety relay and lower air cylinder 124, side push cylinder 15
Triggering feeder ear be connected.The effect of infrared emission light curtain 17 is hand clamping when avoiding work.
As shown in fig. 6, operation principle schematic diagram, control unit, safety relay J-1, infrared emission light curtain 17 with electricity
The control units such as PLC or single-chip microcontroller can be used in source module connection, control unit.Control unit be respectively received pushing control by
After button 3 and side push away the signal of control button 12, control unit sends signal triggering pushing solenoid valve and side pushes away under solenoid valve instruction
Air cylinder 124 and side push cylinder 15 execute corresponding actions, and the switch L for connecting safety relay is red to open during operation of the device
Outside to penetrating light curtain.
When it is that hold-down devices are opened that control unit, which collects signal, infrared emission light curtain 17 is opened, and side push cylinder 15 will
After shaping mould 16 is pushed into original position, lower air cylinder 124 pushes the bending that pin is carried out to vertical direction；It is molding when collecting signal
When mould 16 is opened, infrared emission light curtain 17 is opened, and after lower air cylinder 124 moves up, shaping mould 16 is pushed into and is carried by side push cylinder 15
92 side of plate offsets, and pin radian is processed；It is infrared right when collecting signal is hold-down devices and the closing of shaping mould 16
The closing of light curtain 17 is penetrated, lower air cylinder 124 rises to original position, and side push cylinder 15 retracts shaping mould 16 to original position.
Finally, it is stated that above embodiments are merely intended for describing the technical solutions of the present application, but not for limiting the present application, it can be right
The technical solution of the utility model is modified or replaced equivalently, without departing from the objective and model of technical solutions of the utility model
It encloses, should all cover in the scope of the claims of the utility model.
Claims (6)
1. a kind of metal-oxide-semiconductor pin apparatus for bending, include the open cabinet of one side, hold-down devices, support plate, power module, under
Press control button and control unit；It is characterized in that, the hold-down devices include lower air cylinder, connecting plate, the first pressing down section and
Lower platen；The ontology of lower air cylinder is fixed on cabinet upper end vertically, and piston end is fixedly connected with connecting plate and protrudes into cabinet
Portion；First pressing down section is adjacent with lower platen and is arranged in parallel, wherein the first pressing down section and connecting plate elastic connection, lower platen
It is fixedly connected with connecting plate；Lower platen is equipped with chamfering inclined-plane between the side wall and lower platen bottom of the first pressing down section side；Institute
Support plate is stated equipped with metal-oxide-semiconductor limiting slot；The metal-oxide-semiconductor limiting slot includes pin limiting slot, pin limiting slot and support plate long side
Side edge；The output of control unit is connected with the trigger control end of lower air cylinder；The input of control unit is pressed through pushing control
Button is connected to power module feeder ear.
2. a kind of metal-oxide-semiconductor pin apparatus for bending as described in claim 1, it is characterised in that: the side wall of lower platen is equipped with boss；
Corresponding, the hold-down devices also include the second pressing down section；The matched of second pressing down section and lower platen, second pushes
Portion is equipped with longitudinal perforative strip through-hole；Lower platen is arranged in strip through-hole；The minimum widith of strip through-hole is in lower platen side
Between the maxima and minima of wall thickness, the second pressing down section is flexibly connected with connecting plate.
3. a kind of metal-oxide-semiconductor pin apparatus for bending as claimed in claim 2, it is characterised in that: also include several caging bolts；Institute
Caging bolt is stated to be threadedly coupled across connecting plate with the second pressing down section.
4. a kind of metal-oxide-semiconductor pin apparatus for bending as described in claim 1, it is characterised in that: also comprising side push away control button with
Side pushes into type processing department；The side pushes into type processing department equipped with side push cylinder, shaping mould；The ontology level of side push cylinder is fixed on
The side of cabinet, piston end connect with shaping mould and go deep into box house；Side wall packet of the shaping mould far from side push cylinder side
Containing the identical or opposite curve form of the side wall with support plate by pin limiting slot side；The output of control unit and side push cylinder
Trigger control end is connected, and the feeder ear of power module is independently connected through side button push with another input terminal of control unit.
5. a kind of metal-oxide-semiconductor pin apparatus for bending as claimed in claim 4, it is characterised in that: support plate leans on pin limiting slot side
Side wall upper part include inner sunken face, one end of inner sunken face is connected with pin limiting slot by circular arc chamfering, inner sunken face
The other end and the tangent connection of support plate lower sidewall.
6. a kind of metal-oxide-semiconductor pin apparatus for bending as claimed in claim 4, it is characterised in that: also comprising infrared emission light curtain with
Safety relay；The infrared emission light curtain is set to the both ends of cabinet open side, the feeder ear and power supply of infrared emission light curtain
Module is connected, and the output of infrared emission light curtain is connected with the triggering end of safety relay；The output of power module is through safety relay
The switch motion end of device is connected with the triggering feeder ear of lower air cylinder, side push cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821592417.1U CN208913022U (en) | 2018-09-28 | 2018-09-28 | A kind of metal-oxide-semiconductor pin apparatus for bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821592417.1U CN208913022U (en) | 2018-09-28 | 2018-09-28 | A kind of metal-oxide-semiconductor pin apparatus for bending |
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| Publication Number | Publication Date |
|---|---|
| CN208913022U true CN208913022U (en) | 2019-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821592417.1U Active CN208913022U (en) | 2018-09-28 | 2018-09-28 | A kind of metal-oxide-semiconductor pin apparatus for bending |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114406133A (en) * | 2022-03-31 | 2022-04-29 | 三河建华高科有限责任公司 | Electric stitch equipment of bending |
-
2018
- 2018-09-28 CN CN201821592417.1U patent/CN208913022U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114406133A (en) * | 2022-03-31 | 2022-04-29 | 三河建华高科有限责任公司 | Electric stitch equipment of bending |
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