CN208904027U - Photosensory assembly, camera module and corresponding terminal device - Google Patents

Abstract

The utility model provides a kind of photosensory assembly, camera module and corresponding terminal device, and wherein photosensory assembly includes: sensitive chip；And wiring board, sensitive chip are installed on the surface of wiring board, the outer profile on the surface of wiring board is in unfilled corner rectangle, and unfilled corner rectangle has at least one unfilled corner.The utility model additionally provides corresponding camera module and terminal device.The utility model can reduce photosensitive region center at a distance from mobile phone frame fillet, improve screen accounting, and improve the whole visual effect of mobile phone front.

Description

Photosensory assembly, camera module and corresponding terminal device

Technical field

The utility model relates to optical technical fields, specifically, the utility model relates to photosensory assembly, camera module and Corresponding terminal device.

Background technique

With the rapid development of smart phone and other electronic equipments, since mobile phone screen is increasingly intended to shield comprehensively Change, is lightening therefore more more and more intense to the miniature requirement of camera module.Wherein, screen design is shown by being promoted comprehensively Area reaches the full display effect of technology sense in the accounting of Mobile telephone front panel, and come with trend be then front panel work Skill design and device layout problem.

The screen display area of people's expectation smart phone is close to mobile phone top frame, however front camera (is taken the photograph As mould group) presence cause screen display area that must make corresponding evacuation, this causes the screen accounting of mobile phone limited, affects Visual effect.A kind of resolving ideas is the corner that front camera is arranged in mobile phone.Fig. 1 is shown front camera 30 The example of the corner of mobile phone 10 is set.In this example, if the screen display area of mobile phone only avoids corner portion, The screen accounting of mobile phone can be promoted further, and then improve the whole visual effect of mobile phone front.

However, the shape of camera module is usually the anisotropic approach of circular upper part and square lower part.Fig. 2 shows an allusion quotations in the prior art The shape stereoscopic schematic diagram of the camera module of type.The camera module includes the lens assembly 601 being located above and underlying Photosensory assembly 602.Wherein lens assembly is rounded in a top view, and photosensory assembly is square in a top view, and lens group Part bears against and is fixed on (such as fixing by adhesive glue) photosensory assembly to form complete camera module.Further, photosensitive The components such as sensitive chip, gold thread, electronic component and various wirings are often set on component, and are based on optical principle, camera lens Optical centre need to usually be directed at the center of photosensitive region.The above characteristic causes, when preposition camera module is mounted on handset shell When inside, the wedge angle of photosensory assembly can be interfered with the fillet of mobile phone frame, cause front camera cannot ultimate attainmently close to At the fillet of mobile phone frame, it is unfavorable for improving the whole visual effect of mobile phone front.

Utility model content

The utility model is intended to provide a kind of solution of at least one defect that can overcome the prior art.

One aspect according to the present utility model provides a kind of photosensory assembly, comprising:

Sensitive chip；And

Wiring board, the sensitive chip are installed on the surface of the wiring board, and the outer profile on the surface of the wiring board is in Unfilled corner rectangle, and the unfilled corner rectangle has at least one unfilled corner.

Wherein, the unfilled corner is chamfering, wherein the chamfering is suitable for and the terminal device of the vertical view rounded rectangle of profile Fillet adaptation.

Wherein, the sensitive chip has the photosensitive region in rectangle, and

The photosensory assembly further include:

Colour filter is attached at the surface of the sensitive chip；And

Lens assembly microscope base, is mounted or formed at the PCB surface, and the center of the lens assembly microscope base has Through-hole, annular bottom surface of the top surface of the lens assembly microscope base suitable for bearing against lens assembly, and the lens assembly microscope base The shape adaptation of the outer profile on the surface of the shape of the outer profile of top surface and the wiring board.

Wherein, the lens assembly microscope base is molded section, is formed in the PCB surface by moulding technology, surrounds The sensitive chip simultaneously extends to the sensitive chip and contacts the sensitive chip；And

The photosensory assembly further include:

Annular support is arranged in the surface of the sensitive chip and is centered around around the photosensitive region, and The colour filter is attached at the surface of the sensitive chip by the annular support.

Wherein, it is suitable for bearing against mirror that the molded section, which contacts the side of the colour filter and the top surface of the molded section, The flat surface of seat.

Wherein, the sensitive chip has around the non-photo-sensing region of the photosensitive region, and the non-photo-sensing region is equipped with Weld pad, and the weld pad passes through metal wire and the circuit board electrical connection.

Wherein, the photosensory assembly further includes electronic component, is set to the PCB surface, and the molded section is covered Cover the electronic component and the metal wire.

Wherein, the top surface of the molded section is the flat surface formed by mold pressing, and the molded section covers At least part fringe region of the upper surface of the colour filter.

Wherein, the molded section contacts the annular support, and the fringe region of the colour filter bottom surface does not expose Other than the lateral surface of the annular support.

Wherein, the outer profile of the top surface of the molded section is and the matched unfilled corner square of the PCB surface shape Shape.

Wherein, the electronic component and the metal wire are not provided in the area with the unfilled corner of the wiring board Domain.

Wherein, the top surface of the molded section has unfilled corner section corresponding with the unfilled corner, the minimum widith of the unfilled corner section For 0.15-0.35mm.

Wherein, the unfilled corner rectangle only has a unfilled corner；Or there are two unfilled corners for the unfilled corner rectangle tool, and the two Unfilled corner is in position diagonal each other or adjacent position.

Wherein, the molded section and the wiring board form assembly, and the assembly has lateral surface, the lateral surface Comprising the retraction face being retracted to the sensitive chip direction, and the one end in the retraction face is located at the bottom surface of the wiring board.

Wherein, the retraction face is set to the position corresponding to the unfilled corner.

Other side according to the present utility model provides a kind of camera module, comprising:

Lens assembly comprising tubular microscope base and optical lens；And

The bottom surface of photosensory assembly described in any of the above one, the tubular microscope base bears against and is fixed on the wiring board Surface.

Another aspect according to the present utility model provides a kind of camera module, comprising:

Lens assembly comprising tubular microscope base and optical lens；And

The bottom surface of photosensory assembly described in any of the above one, the tubular microscope base bears against and is fixed on the molded section Top surface.

Wherein, the sidewall thickness of the tubular microscope base is respectively adapted to the unfilled corner of the wiring board to unevenly.

Still another aspect according to the present utility model provides a kind of terminal device, comprising:

Shell, with rounded rectangular shape；And

Camera module described in any of the above one, is installed in the shell, wherein an institute of the wiring board State the position for the fillet that unfilled corner is arranged in corresponding to the shell.

Compared with prior art, the utility model has at least one following technical effect:

1, the utility model can reduce photosensitive region center at a distance from mobile phone frame fillet, improve screen accounting, and Improve the whole visual effect of mobile phone front.

2, the utility model can be reduced mould group height (along the size of optical axis direction), facilitate the mirror of camera module Head evacuation display panel, to improve screen accounting.

3, the utility model can make camera lens optical path closer to mobile phone frame fillet, to improve screen accounting, and improve The whole visual effect of mobile phone front.

4, the utility model can ensure that the stable structure of the optical path of camera module is reliable, be suitable for scale of mass production.

5, the utility model can be realized based on mature process means, help to promote product yield.

6, the utility model can cover at least part fringe region of color filter surfaces by molded section, and by camera lens Component bears against and is fixed on the top surface of the molded section, to reduce ultimate attainmently photosensitive region center to mobile phone frame fillet away from From to obtain optimal mobile phone front entirety visual effect.

Detailed description of the invention

Exemplary embodiment is shown in reference attached drawing.Embodiment and attached drawing disclosed herein should be considered illustrative , and not restrictive.

Fig. 1 shows the example that front camera is arranged in the corner of mobile phone；

Fig. 2 shows the shape stereoscopic schematic diagrams of one in the prior art typical camera module；

Fig. 3 shows the schematic top plan view of the photosensory assembly of the utility model one embodiment；

Fig. 4 shows the terminal device (such as mobile phone) of the rounded rectangle of shell；

Fig. 5 is shown the mobile phone when preposition camera module is arranged at fillet, based on Fig. 3 embodiment and is taken the photograph based on tradition As the contrast schematic diagram of the mobile phone of mould group；

The stereoscopic appearance of photosensory assembly and corresponding camera module that Fig. 6 shows the utility model another embodiment is shown It is intended to；

Fig. 7 shows the diagrammatic cross-section of the photosensory assembly of the utility model another embodiment；

Fig. 8 shows the diagrammatic cross-section of the camera module of a comparative example；

Fig. 9 a shows a camera module based on photosensory assembly shown in Fig. 7；

Fig. 9 b shows a kind of outer profile of top surface as the schematic top plan view of the lens assembly microscope base of unfilled corner rectangle；

Figure 10 shows the diagrammatic cross-section of the camera module of the utility model further embodiment；

Figure 11 shows the section signal of camera module of the utility model in one embodiment based on Figure 10 embodiment Figure；

Figure 12 shows the schematic top plan view of the photosensory assembly in the utility model one embodiment；

Figure 13 shows the photosensory assembly schematic top plan view concealed after molded section of the utility model one embodiment；

Figure 14 shows the diagrammatic cross-section at the AA ' section of Figure 13；

Figure 15 shows the diagrammatic cross-section at the AA ' section of the camera module of the photosensory assembly based on Figure 14；

Figure 16 shows the schematic top plan view of the photosensory assembly of the utility model another embodiment；

Figure 17 shows in the utility model one embodiment, bowing after sensitive chip is installed on the surface of the wiring board Depending on schematic diagram；

Figure 18 shows the schematic top plan view of semi-finished product in the utility model one embodiment；

Figure 19 shows the schematic top plan view of semi-finished product in the utility model one embodiment；

Figure 20 shows the signal that the assembly of molded section shown in Figure 19 and wiring board formation is cut or ground Figure；

Figure 21 shows the assembly formed in the utility model one embodiment to molded section and wiring board and cuts or grind The perspective diagram of photosensory assembly after the completion of mill；

Figure 22 shows no perspective top schematic diagram corresponding with Figure 21；

Figure 23 shows the assembly formed in another embodiment of the utility model to molded section and wiring board and has cut The perspective diagram of photosensory assembly after；

Figure 24 shows no perspective top schematic diagram corresponding with Figure 23；

Figure 25, which is shown in the utility model one embodiment, has unfilled corner rectangle outer profile by what moulding technology was formed Molded section；

Figure 26 shows the schematic top plan view of the photosensory assembly behind the partial region of removal wiring board；

Figure 27 shows the wiring board for having unfilled corner in the utility model one embodiment and is arranged in the photosensitive of its surface Chip, electronic component and metal wire；

Figure 28 shows the signal for molding depanning modeling portion in the utility model one embodiment on the wiring board for have unfilled corner Figure；

Figure 29 shows the schematic top plan view of motherboard of circuit board in the utility model one embodiment；

Figure 30 shows in the utility model one embodiment multiple assemblys being respectively installed to the motherboard of circuit board Each wiring board region after schematic diagram；

Figure 31, which is shown, passes through moulding technology in the surface shape of the motherboard of circuit board in the utility model one embodiment Schematic diagram after integral molding molding layer；

Figure 32 shows the group for forming the motherboard of circuit board and the molding layer in the utility model one embodiment Zoarium is cut into the schematic diagram of the photosensory assembly semi-finished product of monomer；

Figure 33 shows the outer profile for making the surface of photosensory assembly in the utility model one embodiment by removal technique In the schematic diagram of unfilled corner rectangle；

Figure 34 shows the foreign steamer for making the surface of photosensory assembly in another embodiment of the utility model by removal technique Exterior feature is in the schematic diagram of unfilled corner rectangle；

Figure 35 shows the side sectional view of the mobile phone in the utility model one embodiment.

Specific embodiment

Various aspects of the reference attached drawing to the application are made more detailed description by the application in order to better understand.It answers Understand, the only description to the illustrative embodiments of the application is described in detail in these, rather than limits the application in any way Range.In the specification, the identical element of identical reference numbers.Stating "and/or" includes associated institute Any and all combinations of one or more of list of items.

It should be noted that in the present specification, the first, second equal statement is only used for a feature and another feature differentiation It comes, without indicating any restrictions to feature.Therefore, discussed below without departing substantially from teachings of the present application First main body is also known as the second main body.

In the accompanying drawings, for ease of description, thickness, the size and shape of object are slightly exaggerated.Attached drawing is merely illustrative And it is and non-critical drawn to scale.

It will also be appreciated that term " comprising ", " including ", " having ", "comprising" and/or " including ", when in this theory In bright book use when indicate exist stated feature, entirety, step, operations, elements, and/or components, but do not exclude the presence of or It is attached with one or more of the other feature, entirety, step, operation, component, assembly unit and/or their combination.In addition, ought be such as When the statement of at least one of " ... " appears in after the list of listed feature, entire listed feature is modified, rather than is modified Individual component in list.In addition, when describing presently filed embodiment, use " can with " indicate " one of the application or Multiple embodiments ".Also, term " illustrative " is intended to refer to example or illustration.

As it is used in the present context, term " substantially ", " about " and similar term are used as the approximate term of table, and Be not used as the term of table degree, and be intended to illustrate by by those skilled in the art will appreciate that, measured value or calculated value In inherent variability.

Unless otherwise defined, otherwise all terms (including technical terms and scientific words) used herein all have with The application one skilled in the art's is generally understood identical meaning.It will also be appreciated that term (such as in everyday words Term defined in allusion quotation) it should be interpreted as having and their consistent meanings of meaning in the context of the relevant technologies, and It will not be explained with idealization or excessively formal sense, unless clear herein so limit.

It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

Fig. 3 shows the schematic top plan view of the photosensory assembly of the utility model one embodiment.As shown in figure 3, this is photosensitive Component includes sensitive chip 103 and wiring board 104.Wherein, the sensitive chip 103 is installed on the surface of the wiring board 104, The outer profile 1041 on the surface of the wiring board 104 is in unfilled corner rectangle, and the unfilled corner rectangle has at least one unfilled corner 1042.In the present embodiment, the unfilled corner 1042 is chamfering and the chamfering is suitable for and the terminal device 10 of the rounded rectangle of shell Fillet adaptation.Fig. 4 shows the terminal device 10 (such as mobile phone) of the rounded rectangle of shell.With reference to Fig. 4, work as wiring board When the outer profile 1041 on 104 surface is in unfilled corner rectangle, camera module 20 be can be set more close to the position of the fillet of mobile phone Set place.Fig. 5 is shown the mobile phone when preposition camera module is arranged at fillet, based on Fig. 3 embodiment and is imaged based on tradition The contrast schematic diagram of the mobile phone of mould group 30.Wherein, the left side of Fig. 5 is the mobile phone based on traditional camera module 30, and the right side of Fig. 5 is Mobile phone based on Fig. 3 embodiment, it can be seen that in the mobile phone based on Fig. 3 embodiment, camera module 20 is obvious more close to mobile phone Fillet, so as to improve the screen accounting of mobile phone, and improve the whole visual effect of mobile phone front.It may be noted that described lack Angle 1042 is not limited to chamfering.For example, Fig. 6 show the utility model another embodiment photosensory assembly and corresponding camera shooting The stereoscopic appearance schematic diagram of mould group.As can be seen that the unfilled corner 1042 of wiring board 104 can be in square in the embodiment of Fig. 6 The unfilled corner 1042 being cut on shape wiring board 104 along oblique line.In the present embodiment, cutting can be shearing, sawing, punching or laser Cutting.It may be noted that the wiring board 104 of mobile phone camera module is connect typically also through flexible link belt with a connector, connector Corresponding interface for the other parts (such as mainboard) with mobile phone is electrically connected, the surface of wiring board 104 described herein Outer profile 1041, which refers to, removes flexible link belt and connector with the outer profile 1041 on 104 surface of wiring board of outer portion.

Further, Fig. 7 shows the diagrammatic cross-section of the photosensory assembly 50 of the utility model another embodiment.Fig. 7 Shown section is a section with the axis parallel of photosensory assembly 50, is and sense by the sectional view of appearance hereinafter The section of the axis parallel of optical assembly 50, repeats no more.With reference to Fig. 7, photosensory assembly 50 includes wiring board 104, sensitive chip 103, colour filter 101, annular support 102, metal wire 105 (such as gold thread) and electronic component 107.Wherein, wiring board 104 The outer profile 1041 on surface is in unfilled corner rectangle.The schematic top plan view of the photosensory assembly 50 of the present embodiment still referring to FIG. 3, it may be noted that To make simplified form, the components such as colour filter 101, metal wire 105 and electronic component 107 are not showed that in Fig. 3.The sensitive chip 103 have in the photosensitive region 1031 of rectangle and around the non-photo-sensing region 1032 of the photosensitive region 1031, the non-photo-sensing Region 1032 is equipped with weld pad 1033, and the weld pad 1033 is electrically connected by metal wire 105 with the wiring board 104.Annular branch Support body 102 is arranged in the surface of the sensitive chip 103 and is centered around around the photosensitive region 1031.Colour filter 101 is logical The annular support 102 is crossed to be fixed together with the sensitive chip 103.Annular support 102 can be by photoresist or solid The DAF glue of change is formed.Wherein DAF glue refers to chip adhesive film moulding material, or is properly termed as chip adhesive film magma, and chip is viscous Conjunctiva English name is Die Attach Film, is abbreviated as DAF.Electronic component 107 is set to 104 surface of wiring board, leads to For often, the outside of metal wire 105 is arranged in electronic component 107.Electronic component 107 can be capacity cell, be also possible to electricity Resistance element can also be other electron component 107 needed for camera module circuit.In one embodiment, the supporter It is formed using cured DAF glue, such as the annular brace based on DAF glue is made on colour filter 101 by silk-screen printing technique Body 102 (102 precuring of annular support at this time, but still viscosity can be restored by high temperature hot pressing technique), then again by colour filter Piece 101 and sensitive chip 103 align and cover the surface in sensitive chip 103, then by high temperature hot pressing, baking and etc. make DAF glue and 103 surface bonding of sensitive chip, so that colour filter 101 (annular support 102 based on DAF glue) be made to pass through attaching In 103 surface of sensitive chip.The contact area of the supporter and the sensitive chip 103 is less than the supporter and the filter The contact area of color chips 101.In the axis (surface of the axis perpendicular to sensitive chip 103) by the sensitive chip 103 Section on, the supporter 102 forms the shape of inverted trapezoidal.On the one hand, the inverted trapezoidal design in the present embodiment can be effective Ground, which avoids or reduces in shaping process, supports shape to be destroyed, it is possible to reduce small formed in shaping process Grain pollutes sensitive chip 103, to improve product yield.On the other hand, the inverted trapezoidal in the present embodiment designs also The lower surface for helping reduce supporter, makes it easier for the Microcell being precisely directed between weld pad 1033 and photosensitive region 1031 Domain so that it is bad to avoid or reduce product caused by due to colour filter 101 aligns inaccurately with sensitive chip 103, while also being fitted Answer the diminishing development trend in non-photo-sensing region 1032 of current sensitive chip 103.Further, the supporter 102 can Think black glue material, the veiling glare for reflexing to 103 surface of sensitive chip can be reduced in this way, it can in combination with the design of above-mentioned inverted trapezoidal To be further reduced veiling glare, to improve image quality.

In another embodiment, the annular support 102 can also be omitted, colour filter 101 is shown consideration for by transparent adhesive tape Invest the surface of sensitive chip 103.

Further, in one embodiment, the fringe region of 101 bottom surface of colour filter is by the top surface of annular support 102 It is covered, so that the fringe region of 101 bottom surface of colour filter is not exposed to other than the lateral surface of annular support 102.It is wherein " not sudden and violent Dew " is it is to be understood that the size that is exposed to other than the lateral surface of annular support 102 of the fringe region of 101 bottom surface of colour filter is small In preset threshold value (threshold value can be determined according to the precision and/or tolerance of corresponding manufacture craft).Above-mentioned " not exposing " sets Meter can prevent the upper surface of the fringe region of 101 bottom surface of colour filter, the lateral surface of annular support 102 and wiring board 104 Fringe region between form narrow semiclosed gap.If above-mentioned semiclosed gap is formed, in mould-forming process In, moulding material, which pours this semiclosed gap and may cause colour filter 101, to arch upward, and this arch upward can cause to bear to imaging effect Face is rung, and the pressure head for being easy to be used for moulding technology while also result in colour filter 101 crushes.Therefore, the scheme of the present embodiment has The image quality for helping ensure camera module, helps to improve the production yield of photosensory assembly and camera module.

In the embodiment of Fig. 7, colour filter 101 is designed using sunk type, and this scheme can further decrease photosensitive area 1031 center of domain to mobile phone fillet distance, to make camera module 50 more close to the fillet of mobile phone, and then improve mobile phone Positive entirety visual effect.Meanwhile this scheme additionally aids the height for reducing camera module 50.Currently, consumer opponent The image quality requirement of machine camera module is higher and higher, and colour filter 101 has become the standard configuration of mainstream mobile phone products.Preferably to show The difference of the present embodiment and traditional scheme out introduces a comparative example below and is illustrated.

Fig. 8 shows the diagrammatic cross-section of the camera module of a comparative example.As shown in figure 8, the camera shooting mould of the comparative example Group 60 includes lens assembly 601 and photosensory assembly 602, and wherein photosensory assembly 602 includes a conventional microscope base 6021, i.e. colour filter 101 are attached at microscope base 6021, hereon referred to as the bottom surface of colour filter microscope base 6021, the colour filter microscope base 6021 is cylindrical in shape and is attached at 104 surface of wiring board.3021 upper surface of microscope base (i.e. top surface) has a camera lens mounting surface, and lens assembly 601 is installed on microscope base Camera lens mounting surface.6021 top of microscope base extends (extend to the central axes of photosensory assembly 602) inwardly, is formed for installing The extension 60211 of colour filter 101,60211 center of extension have light hole.The bottom surface of lens assembly 601 is installed on filter The top of color chips microscope base 6021.Colour filter microscope base 6021 generally use Shooting Technique production, be limited to colour filter Mirror base mould at The limitation of type, microscope base necessarily have molding thickness, and the height of photosensitive mould group is caused (to refer to the ruler along photosensory assembly central axes direction It is very little) increase, and the lateral dimension for being unfavorable for reducing photosensory assembly 602 (refers to the ruler perpendicular to photosensory assembly central axes direction It is very little).First, since colour filter microscope base 6021 needs to avoid electronic component 107 and gold thread 105, the bottom surface of extension 60211 It necessarily is greater than 105 top of electronic component 107 and gold thread, and reserves certain safe distance, to avoid damage electronic component 107 With gold thread 105.Second, in order to form reliable and stable support to colour filter 101, extension 60211 is needed with certain thickness (extension 60211 is referring to the size on the direction of photosensory assembly central axes).The above two o'clock causes the height of photosensory assembly 602 to increase Add, and then the height of camera module 60 is caused to increase.Third in the scheme of Fig. 8, is needed single colour filter with intake mechanism 101 are precisely located and are installed on extension 60211.Since technique limits, the area of colour filter 101 cannot too small, thickness not Can be too thin, this also causes the height of photosensory assembly 602 to increase, simultaneously as microscope base 6021 not only supports camera lens, also needs to attach and filter Color chips 101, therefore the lateral dimension of microscope base 6021 is limited to the width of 101 mounting surface of camera lens mounting surface and colour filter, and then leads The lateral dimension of photosensory assembly 602 is caused to increase.Further, in the scheme of Fig. 8, colour filter 101 will necessarily be greater than photosensitive core The photosensitive region 1031 of piece 103, and periphery will reserve certain 101 mounting area of colour filter, further, in more peripheral area Domain, the top surface of colour filter microscope base 6021 also need to reserve the mounting area of installation lens assembly, this causes from photosensitive region The distance of 1031 edges to microscope base side is difficult to reduce, and therefore, it is difficult to make to take the photograph by way of making unfilled corner 1042 (or chamfering) As 1031 center of photosensitive region (or optical centre) of mould group 60 is further close to the fillet of mobile phone.

Fig. 9 a shows a camera module based on photosensory assembly 50 shown in Fig. 7.In the present embodiment, colour filter 101 is logical Cross the annular support 102 that DAF glue or photoresist are formed and be attached at sensitive chip 103, can reduce colour filter 101 area and Thickness.Also, colour filter microscope base 6021 as shown in Figure 8 is needed in the present embodiment, no longer so as to reduce photosensory assembly Highly, so reduce camera module height.In one embodiment, due to eliminating colour filter microscope base, the bottom of lens assembly Seat can directly bear against 104 surface of wiring board (as illustrated in fig. 9).

In another embodiment, the camera module also may further include one only for supporting the lens assembly (no Patch needs attached colour filter 101) lens assembly microscope base, lens assembly bears against the top surface of lens assembly microscope base.Due to the present embodiment In microscope base no longer need to support colour filter 101, to release the segment space of microscope base top surface its script to support colour filter The region of piece 101 can be to support lens assembly, therefore its height and lateral dimension can be less than traditional microscope base, to drop The height of low photosensory assembly and the lateral dimension for reducing photosensory assembly.Since the present embodiment can reduce the transverse direction of photosensory assembly Size, and can reduce the height of photosensory assembly, while colour filter 101 is set to 103 surface of sensitive chip, without occupying mirror Seat top wall-attached surface, therefore the picture glue width that microscope base top is attached for microscope base is guaranteed, so that microscope base quilt Be designed to further decrease 1031 center of photosensitive region to mobile phone fillet distance, to make camera module more close to mobile phone Fillet, and then improve mobile phone front whole visual effect.Lens assembly microscope base 6021 can be with injection molding, lens assembly mirror The outer profile of the top surface of seat 6021 can be circle and be also possible to unfilled corner rectangle (it be scarce that Fig. 9 b, which shows a kind of outer profile of top surface, The schematic top plan view of the lens assembly microscope base 6021 of angular moment shape), to be adapted to the outer profile 1041 on 104 surface of wiring board.

Further, Figure 10 shows the diagrammatic cross-section of the camera module of the utility model further embodiment.This reality The characteristics of applying is with the molded section 106 made by moulding technology, to further reduce the lateral ruler of photosensory assembly It is very little.Specifically, the difference of the present embodiment and embodiment shown in Fig. 7 is to include molded section 106.The center of molded section 106 With the optical window for corresponding to photosensitive region 1031.Molded section 106 is formed in 104 surface of wiring board by moulding technology, encloses Extend around the sensitive chip 103 and to the sensitive chip 103 and contacts the sensitive chip 103, and the molded section 106 can contact the side of the colour filter 101.The top surface of the molded section 106 is the flat surface suitable for bearing against microscope base, it can To be the flat surface formed by mold pressing, and the top surface of the molded section 106 can be higher than the colour filter 101 Upper surface can also be flushed with the upper surface of the colour filter 101.In one embodiment, the molded section 106 can also be covered Cover at least part fringe region of the colour filter 101.The molded section 106 can be with overlay electronic element 107 and metal Line 105.In one embodiment, the molded section 106 can also contact the annular support 102.In molding, upper mold Tool, wiring board 104, sensitive chip 103, annular support 102 and colour filter 101 collectively form forming cavity, and lower mold is born against In 104 bottom surface of wiring board, to form pressing (molding) with upper mold.Liquid molding material is injected into shape chamber, in turn Form molded section 106 shown in Fig. 10.

Further, Figure 11 shows camera module of the utility model in one embodiment based on Figure 10 embodiment Diagrammatic cross-section.In the present embodiment, lens assembly bears against the top surface of molded section 106.With reference to Figure 11 as can be seen that the present embodiment In, the microscope base of lens assembly does not need evacuation electronics member (i.e. perpendicular on the direction of photosensory assembly central axes) in a lateral direction Part 107 and metal wire 105, therefore the lateral surface of lens assembly can be more nearly the center of photosensitive region 1031.Based on this reality Example is applied, the installation site of microscope base can also be further mobile (i.e. towards the side of photosensory assembly central axes) inwardly.In the limit In the case where, the bottom surface of microscope base can (such as sensitive chip 103 be non-with the fringe region of colour filter 101 or sensitive chip 103 Photosensitive region 1032) it partly overlaps.Here it partly overlaps and refers to the bottom surface for seeing microscope base in a top view and colour filter 101 or photosensitive The fringe region part of chip 103 is overlapped.Therefore, the present embodiment can help lateral surface (the i.e. outside of microscope base of lens assembly Face) ultimate attainmently close to the center of photosensitive region 1031.

Further, Figure 12 shows the schematic top plan view of the photosensory assembly in the utility model one embodiment.Figure 12 In show molded section 106, and illustrate with dashed lines the portion of being molded 106 covering sensitive chip 103 outer profile.The present embodiment In, the outer profile of the top surface of the molded section 106 of photosensory assembly is and the matched unfilled corner rectangle of the PCB surface shape. The concept of unfilled corner rectangle is consistent with the unfilled corner rectangle of wiring board outer profile, repeats no more.In one embodiment, the molded section (such as corresponding to the width at unfilled corner 1042, the top surface of the molded section 106 corresponds to unfilled corner to the minimum widith of 106 top surface 1042 section is referred to as unfilled corner section) it is 0.15-0.35mm.Due to the minimum widith one of the top surface of the molded section 106 As be located at the unfilled corner section, so it can be appreciated that the minimum widith of unfilled corner section be 0.15-0.35mm.In molded section 106 On the basis of every advantage, the present embodiment can further make 1031 center of photosensitive region close to the fillet of mobile phone, to make It obtains mobile phone front appearance and has more visual impact.

Further, the photosensory assembly vertical view concealed after molded section that Figure 13 shows the utility model one embodiment is shown It is intended to.As shown in figure 13, electronic component 107 and metal wire 105 are not provided with having the unfilled corner in the wiring board 104 1042 region.In this way, unfilled corner can be formed convenient for molded section 106, to make 1031 center of photosensitive region ultimate attainmently close to mobile phone The fillet of frame.Further, Figure 14 shows the diagrammatic cross-section at the AA ' section of Figure 13.As can be seen that in unfilled corner position Place, due to not having electronic component 107 and metal wire 105, the width of the top surface of molded section 106 (refers to perpendicular to photosensory assembly axis The size in line direction) it can further decrease.Further, Figure 15 shows the camera module of the photosensory assembly based on Figure 14 Diagrammatic cross-section at AA ' section.It can be seen from fig. 15 that the bottom surface of microscope base can be with filter at the position for corresponding to unfilled corner The fringe region (such as non-photo-sensing region 1032 of sensitive chip 103) of color chips 101 or sensitive chip 103 partly overlaps, camera lens The lateral surface of component can also be flushed with the lateral surface of molded section 106.In this way, center (the optics of camera lens of photosensitive region 1031 Center or optical axis generally align the center of photosensitive region 1031) it can be ultimate attainmently close to the fillet of mobile phone, so that mobile phone is just Face appearance has more visual impact.And as a comparison, in comparative example shown in Fig. 8, due to the extension 60211 of colour filter microscope base There is the gap for avoiding electronic component 107 and metal wire 105 between wiring board 104, to colour filter microscope base corner regions Cutting sensitive chip 103 may be made to be exposed to the external world, cause photosensory assembly bad, therefore can not pass through and form the unfilled corner 1042 come make 1031 center of photosensitive region ultimate attainmently close to mobile phone frame fillet.On the other hand, if first thickening colour filter mirror Seat is cut again, then is unable to reach the center of photosensitive region 1031 ultimate attainmently close to the effect of the fillet of mobile phone.

In above-described embodiment, the unfilled corner rectangle only has a unfilled corner, but the utility model is not limited to this.For example, Figure 16 shows the schematic top plan view of the photosensory assembly of the utility model another embodiment.With reference to Figure 16, wiring board 104 or mould The outer profile in modeling portion 106 forms unfilled corner rectangle, and there are two unfilled corners 1042 for the unfilled corner rectangle tool, and the two unfilled corners 1042 are in Position diagonal each other.The center of photosensitive region 1031 of this scheme in addition to making camera module is gone back closer to the fillet of mobile phone Screen accounting and visual effect can be further increased in order to avoid display screen.In other embodiments, unfilled corner rectangle can also have There are more unfilled corners 1042.

Further, in one embodiment, the molded section 106 and the wiring board 104 formation assembly, described group Zoarium has a lateral surface, and the lateral surface includes the retraction face 1041 that is retracted to 103 direction of sensitive chip, and the contracting It is located at the bottom surface of the wiring board 104 into the one end in face.The retraction face 1041 is set to the position corresponding to the unfilled corner.Hand For machine shell in addition to having fillet in a top view, often its frame is also arc-shaped in side view or has arcuate segments.Figure 35 Show the side sectional view of the mobile phone in the utility model one embodiment.The design in figure as can be seen that above-mentioned retraction face It can be interfered to avoid the bottom of arcuate segments and camera module, to make the center of the photosensitive region 1031 of camera module more Add the frame close to mobile phone, so can further make camera module photosensitive region 1031 center close to mobile phone circle Angle.Above-mentioned retraction face can be made up of the various removal techniques such as cut or polish.The retraction face can be step-like bending Face is inclined-plane.The retraction face can only be made of the face being located on the wiring board 104 and (such as only cut off wiring board 104 a part and the bottom surface of molded section 106 does not expose), by the face that is located on the wiring board 104 and can also be located at described The face of molded section 106 collectively forms (such as excision wiring board 104 and a part of bottom surface exposure for making molded section 106), can be with (such as 104 part of wiring board and molded section are cut off simultaneously across the interface between the wiring board 104 and the molded section 106 106 parts and the retraction face formed).

Further, in one embodiment, camera module includes lens assembly and photosensory assembly.Lens assembly includes cylinder Shape microscope base and the optical lens being installed on the inside of tubular microscope base.The bottom surface of tubular microscope base bears against and is fixed on the described of photosensory assembly The top surface of molded section 106.Wherein the sidewall thickness of tubular microscope base is respectively to unevenly to be adapted to the wiring board 104 and molded section 106 unfilled corner 1042, so that 1031 center of photosensitive region (or optical centre of camera lens) be made more to be close to the circle of mobile phone Angle.In another embodiment, photosensory assembly can not have molded section 106, and the bottom surface of tubular microscope base bears against and is fixed at this time On the wiring board 104 of photosensory assembly, wherein the sidewall thickness of tubular microscope base is respectively adapted to the institute of the wiring board 104 to unevenly Unfilled corner 1042 is stated, so that 1031 center of photosensitive region (or optical centre of camera lens) be made more to be close to the fillet of mobile phone.

Further, in one embodiment, a kind of terminal device (such as mobile phone) is provided comprising shell and camera shooting Mould group, the shell have the shape of round rectangle, and camera module is installed in the shell, wherein the wiring board 104 The position of a fillet corresponding to the shell is arranged in one unfilled corner 1042.

Further, according to the utility model one embodiment, a kind of photosensory assembly production method is additionally provided.This is photosensitive Assembly making method includes the following steps:

1) prepare the wiring board 104 that surface outer profile is rectangle, wherein at least one angle on the surface of the wiring board 104 It is arranged to reserved area 1043, and the reserved area 1043 is not routed.

2) sensitive chip 103 is installed on the surface of the wiring board 104, wherein it is in rectangle that the sensitive chip 103, which has, Photosensitive region 1031 and around the non-photo-sensing region 1032 of the photosensitive region 1031.Figure 17 shows the utility model one Schematic top plan view in embodiment, after sensitive chip 103 is installed on the surface of the wiring board 104.

3) removing the reserved area 1043 makes the outer profile on the surface of the wiring board 104 be in unfilled corner rectangle, described to lack Angular moment shape includes at least one unfilled corner.In one embodiment, the reserved area 1043, cutter can be removed by cutting Skill can use shearing, sawing, punching or laser cutting.It in another embodiment, can be described reserved by grinding removal Region 1043 makes the unfilled corner rectangle have chamfering.

In one embodiment, step 2) may include sub-step 21) and 22).Step 21) and 22) as follows:

21) colour filter 101 is attached at the sensitive chip 103 by annular support 102, wherein the annular brace Body 102 is arranged in the surface of the sensitive chip 103 and is centered around around the photosensitive region 1031.

22) colour filter 101 is installed to the surface of the wiring board 104 with the assembly of the sensitive chip 103, Wherein the back side of the sensitive chip 103 is attached at the surface of the wiring board 104.

In one embodiment, complete step 22) afterwards, execute step 3) before, step 2a can also be performed).Figure 18 Show step 2a in the utility model one embodiment) after the completion of semi-finished product schematic top plan view.With reference to Figure 18, step It is 2a) as follows:

2a) between the weld pad 1033 and the wiring board 104 connect metal wire 105 so that the wiring board 104 with The sensitive chip 103 is electrically connected, and the metal wire 105 avoids the reserved area 1043.

In one embodiment, complete step 22) afterwards, execute step 3) before, step 2b can also be performed).Figure 19 Show step 2b in the utility model one embodiment) after the completion of semi-finished product schematic top plan view.With reference to Figure 19, step It is 2b) as follows:

Molded section 106 2b) is formed on the surface of the wiring board by moulding technology, the molded section 106 is around described Sensitive chip 103 simultaneously extends to the sensitive chip 103 and contacts the sensitive chip 103, and the molded section 106 covers At least part fringe region of the upper surface of the electronic component 107 and the metal wire 105 and the covering colour filter； And the top surface of the molded section 106 is the flat surface formed by mold pressing, and the top surface of the molded section 106 is higher than The upper surface of the colour filter.

In one embodiment, the step 3) further include: the molded section 106 and the wiring board 104 are formed Assembly is cut or is ground, so that the outer profile of the top surface of the molded section 106 is formed and the 104 surface shape of wiring board The matched unfilled corner rectangle of shape；And at the position of the unfilled corner 1042, the lateral surface and the wiring board of the molded section 106 104 lateral surface flushes.Figure 20 show to molded section 106 shown in Figure 19 and wiring board formation assembly carry out cutting or The schematic diagram of grinding.The processing line 1045 of removal technique is shown.The removal technique can be cutting or grinding.Figure 21 shows Go out after the completion of the assembly cutting or grinding formed in the utility model one embodiment to molded section 106 and wiring board 104 Photosensory assembly perspective diagram, electronic component 107 and metal wire 105 is shown.Figure 22 shows corresponding with Figure 21 Without perspective top schematic diagram, wherein electronic component 107 and metal wire 105 has been not shown, actually electronic component 107 and metal Line 105 is molded portion 106 and is covered.In embodiment shown in Figure 21 and Figure 22, the unfilled corner that is processed by removal technique 1042 be chamfering.Figure 23 shows the combination formed in another embodiment of the utility model to molded section 106 and wiring board 104 The perspective diagram of photosensory assembly after the completion of body cutting, is shown electronic component 107 and metal wire 105.Figure 24 is shown Corresponding with Figure 23 no perspective top schematic diagram, wherein electronic component 107 and metal wire 105 has been not shown.Figure 23 and Figure 24 Shown in embodiment cut surface be inclined-plane.

In another embodiment, the step 2b) it can be executed after step 3), and step 2b) further include: it is logical It crosses moulding technology the outer profile of the top surface of the molded section 106 is directly formed and matched with 104 surface shape of wiring board Unfilled corner rectangle.Figure 25, which is shown in the utility model one embodiment, has unfilled corner rectangle foreign steamer by what moulding technology was formed Wide molded section 106.The unfilled corner rectangle outer profile can be based on the formation of mold.It is possible to further along shown in Figure 25 The partial region of the removal wiring board 104 of chamfering manufacture craft line 1045.After Figure 26 shows the partial region of removal wiring board 104 Photosensory assembly schematic top plan view.

In another embodiment, the wiring board 104 of unfilled corner 1042 can also be first produced, i.e. surface outer profile is scarce The wiring board 104 of angular moment shape, is then molded to molded section 106 again, and outer profile has and 104 surface shape of wiring board The unfilled corner rectangle matched.Figure 27 shows the wiring board 104 for having unfilled corner in the utility model one embodiment and is arranged in its table Sensitive chip 103, electronic component 107 and the metal wire 105 in face are wherein pasted with colour filter and form sense on sensitive chip 103 The assembly of optical assembly and colour filter is illustrative simplicity, colour filter is not shown in Figure 27.Figure 28 shows the utility model one The schematic diagram in depanning modeling portion 106 is molded in embodiment on the wiring board 104 for having unfilled corner.Particularly, it is shown in FIG. 28 and sets Set the pressing side 1046 of 104 fringe region of assist side.The pressing side 1046 be close stitching state is formed in moulding technology and Setting.In moulding process, upper mold can bear against mutually with the pressing side 1046 and closely press, to form the use of sealing In the forming cavity for forming molded section 106.Liquid moulding material can be prevented to be leaked to 104 bottom surface of wiring board in this way, while can also To ensure, obtained 106 shape of molded section meets expection after molding.Further, pressing portions side 1046 can pass through cutting Technique excision, to reduce camera module in the size perpendicular to optical axis direction.

Further, another embodiment according to the present utility model additionally provides another photosensory assembly production method, Comprising:

10) prepare motherboard of circuit board 1040.Figure 29 shows motherboard of circuit board 1040 in the utility model one embodiment Schematic top plan view.With reference to Figure 29,1040 surface of motherboard of circuit board includes 104 region of wiring board of multiple rectangles, wherein each At least one angle in 104 region of wiring board is arranged to reserved area, and the reserved area is not routed.It is also shown in Figure 29 Connecting band 104a and connector 104b.

20) colour filter 101 is attached at sensitive chip 103 by annular support 102, obtain colour filter 101 with it is photosensitive The assembly of chip 103 surrounds the photosensitive region wherein the sensitive chip 103 has the photosensitive region 1031 in rectangle 1031 non-photo-sensing region 1032, the non-photo-sensing region 1032 are equipped with weld pad 1033, and the annular support 102 is arranged in institute It states the surface of sensitive chip 103 and is centered around around the photosensitive region 1031.

30) assembly of multiple colour filters 101 and the sensitive chip 103 is respectively installed to the wiring board mother 104 region of each wiring board of plate 1040, wherein the back side of the sensitive chip 103 is attached at the motherboard of circuit board 1040 Surface.Figure 30 shows in the utility model one embodiment multiple assemblys being respectively installed to the motherboard of circuit board 1040 104 region of each wiring board after schematic diagram.

40) metal wire 105 is connected between 104 region of the weld pad 1033 and the wiring board so that each route 104 region of plate is electrically connected with the corresponding sensitive chip 103, and the metal wire 105 avoids the reserved area 1043.

50) electronic component 107 is installed in each 104 region of wiring board, and the electronic component 107 avoid it is described Reserved area 1043.

60) integrally formed molding layer is formed on the surface of the motherboard of circuit board 1040 by moulding technology, wherein institute The top surface for stating molding layer is the flat surface formed by mold pressing, and the top surface of the molded section 106 is higher than the colour filter The upper surface of piece 101；The molding layer has multiple optical windows for corresponding respectively to each sensitive chip 103；Also, for each 104 region of wiring board, the molding layer extend and contact around the corresponding sensitive chip 103 and to the sensitive chip 103 The sensitive chip 103, and molding layer covering is installed on the electronic component 107 in 104 region of wiring board and described Metal wire 105 and cover the corresponding colour filter 101 in 104 region of wiring board upper surface at least part fringe region. Figure 31 shows in the utility model one embodiment and forms one on the surface of the motherboard of circuit board 1040 by moulding technology Schematic diagram after body formed molding layer.

70) according to the line of demarcation in 104 region of wiring board, the group that the motherboard of circuit board 1040 is formed with the molding layer Zoarium is cut into the photosensory assembly semi-finished product of monomer, and the photosensory assembly semi-finished product of the monomer include wiring board 104 and are attached to The molded section 106 on its surface, and the outer profile 1041 on the surface of the photosensory assembly semi-finished product of the monomer is in rectangle.Figure 32 shows Go out in the utility model one embodiment and has cut the motherboard of circuit board 1040 and the assembly that the molding layer 106 is formed At the schematic diagram of the photosensory assembly semi-finished product of monomer.

80) for the photosensory assembly semi-finished product of monomer, part is done to the wiring board 104 according to the reserved area 1043 Removal, and the molded section 106 for being attached to the reserved area 1043 is removed, so that the foreign steamer on the surface of obtained photosensory assembly Exterior feature 1041 is in unfilled corner rectangle, and the unfilled corner rectangle has at least one unfilled corner 1042.Figure 33 shows one reality of the utility model Apply in example makes the outer profile on the surface of photosensory assembly in the schematic diagram of unfilled corner rectangle by removal technique.In the embodiment, to every A photosensory assembly semi-finished product are individually cut.Figure 34 is shown in another embodiment of the utility model to be made by removal technique The outer profile on the surface of photosensory assembly is in the schematic diagram of unfilled corner rectangle.In the embodiment, by multiple photosensory assembly semi-finished product with pre- Determine angle arrangement, the outer profile by once cutting to obtain multiple surfaces is in the photosensory assembly of unfilled corner rectangle.

Above description is only the better embodiment of the application and the explanation to institute's application technology principle.Art technology Personnel should be appreciated that utility model range involved in the application, however it is not limited to which the specific combination of above-mentioned technical characteristic forms Technical solution, while should also cover do not depart from the utility model design in the case where, by above-mentioned technical characteristic or its etc. The other technical solutions for carrying out any combination with feature and being formed.Such as features described above and (but being not limited to) disclosed herein Technical characteristic with similar functions is replaced mutually and the technical solution that is formed.

Claims (19)

1. a kind of photosensory assembly characterized by comprising

Sensitive chip；And

Wiring board, the sensitive chip are installed on the surface of the wiring board, and the outer profile on the surface of the wiring board is in unfilled corner Rectangle, and the unfilled corner rectangle has at least one unfilled corner.

2. photosensory assembly according to claim 1 characterized by comprising the unfilled corner is chamfering, wherein the chamfering Suitable for being adapted to the fillet for the terminal device for overlooking the rounded rectangle of profile.

3. photosensory assembly according to claim 2, which is characterized in that the sensitive chip has the photosensitive area in rectangle Domain, and

The photosensory assembly further include:

Colour filter is attached at the surface of the sensitive chip；And

Lens assembly microscope base is mounted or formed at the PCB surface, and the center of the lens assembly microscope base has through-hole, Annular bottom surface of the top surface of the lens assembly microscope base suitable for bearing against lens assembly, and the top surface of the lens assembly microscope base The shape adaptation of the outer profile on the surface of the shape of outer profile and the wiring board.

4. photosensory assembly according to claim 3, which is characterized in that

The lens assembly microscope base is molded section, is formed in the PCB surface, around described photosensitive by moulding technology Chip simultaneously extends to the sensitive chip and contacts the sensitive chip；And

The photosensory assembly further include:

Annular support is arranged in the surface of the sensitive chip and is centered around around the photosensitive region, and described Colour filter is attached at the surface of the sensitive chip by the annular support.

5. photosensory assembly according to claim 4, which is characterized in that the molded section contacts the side of the colour filter, And the top surface of the molded section is the flat surface suitable for bearing against microscope base.

6. photosensory assembly according to claim 4, which is characterized in that the sensitive chip, which has, surrounds the photosensitive region Non-photo-sensing region, the non-photo-sensing region is equipped with weld pad, and the weld pad passes through metal wire and the circuit board electrical connection.

7. photosensory assembly according to claim 6, which is characterized in that the photosensory assembly further includes electronic component, is set It is placed in the PCB surface, and the molded section covers the electronic component and the metal wire.

8. photosensory assembly according to claim 5, which is characterized in that the top surface of the molded section is pressed by mold The flat surface of formation, and the molded section covers at least part fringe region of the upper surface of the colour filter.

9. photosensory assembly according to claim 4, which is characterized in that the molded section contacts the annular support, and And the fringe region of the colour filter bottom surface is not exposed to other than the lateral surface of the annular support.

10. the photosensory assembly according to any one of claim 4-9, which is characterized in that the top surface of the molded section Outer profile be and the matched unfilled corner rectangle of the PCB surface shape.

11. photosensory assembly according to claim 7, which is characterized in that the electronic component and the metal wire are not set It is placed in the region with the unfilled corner of the wiring board.

12. photosensory assembly according to claim 4, which is characterized in that the top surface of the molded section has and the unfilled corner Corresponding unfilled corner section, the minimum widith of the unfilled corner section are 0.15-0.35mm.

13. photosensory assembly according to claim 1, which is characterized in that the unfilled corner rectangle only has a unfilled corner；Or There are two unfilled corners for the unfilled corner rectangle tool, and the two unfilled corners are in position diagonal each other or adjacent position.

14. the photosensory assembly according to any one of claim 4-9, which is characterized in that the molded section and the line Road plate forms assembly, and the assembly has lateral surface, and the lateral surface includes the contracting being retracted to the sensitive chip direction Into face, and the one end in the retraction face is located at the bottom surface of the wiring board.

15. photosensory assembly according to claim 14, which is characterized in that the retraction face is set to corresponding to the unfilled corner Position.

16. a kind of camera module characterized by comprising

Lens assembly comprising tubular microscope base and optical lens；And

The bottom surface of photosensory assembly described in claim 1,2,3 or 13, the tubular microscope base bears against and is fixed on the wiring board Surface.

17. a kind of camera module characterized by comprising

Lens assembly comprising tubular microscope base and optical lens；And

Photosensory assembly described in any one of claim 4-12 and 14-15, the bottom surface of the tubular microscope base bear against and fix In the top surface of the molded section.

18. camera module according to claim 17, which is characterized in that the sidewall thickness of the tubular microscope base is respectively to unevenness The even unfilled corner to be adapted to the wiring board.

19. a kind of terminal device characterized by comprising

Shell, with rounded rectangular shape；And

Camera module described in claim 16,17 or 18, is installed in the shell, wherein an institute of the wiring board State the position for the fillet that unfilled corner is arranged in corresponding to the shell.